SK Hynix

What SK Hynix does

SK hynix Inc. is a top-tier South Korean semiconductor manufacturer specializing in DRAM and NAND flash memory, headquartered in Icheon, Gyeonggi-do and publicly listed on the Korea Exchange (KRX: 000660) with a planned Nasdaq ADR listing (ticker SKHY) beginning July 10, 2026. The company commands 29% global DRAM market share (Q1 2026, second only to Samsung's 38%) and approximately 60% global share of High Bandwidth Memory (HBM), making it the world's leading supplier of memory for AI accelerators, with NVIDIA as the primary HBM3E/HBM4 customer.

The company's core product stack spans DRAM (DDR5, LPDDR5X, 1c LPDDR6, GDDR, HBM3E/HBM4/HBM4E, SOCAMM2), NAND flash (up to 321-layer QLC, 238-layer TLC 4D NAND), enterprise and client SSDs (PEB110 E1.S, PCB01, ZUFS 4.1), CXL memory modules (CMM, CMM-Ax), Processing-in-Memory (PIM) AI accelerators, multi-chip packages, and CMOS image sensors. Manufacturing leverages EUV lithography at the 1c/10nm-class node, with production campuses in Icheon, Cheongju, and Yongin (Korea), Wuxi and Chongqing (China), and a $3.9 billion Indiana packaging facility under construction in the United States. The company also owns Solidigm (US NAND subsidiary) and completed the $9 billion acquisition of Intel's NAND/SSD business including the Dalian, China fab (first closed December 2021, final closing 2025).

Revenue is generated primarily through bilateral hardware sales of memory components under multi-year strategic supply agreements with tier-1 enterprise customers including NVIDIA, Google, Microsoft, HPE, Qualcomm, Anthropic, and OpenAI/Broadcom. Pricing is negotiated bilaterally rather than publicly disclosed, with HBM shifting toward fixed-price multi-year contracts (sold out through 2027). Distribution combines direct enterprise field sales, OEM/embedded integration into customer reference platforms, and channel partnerships with TSMC, Foxconn, and HPE. Customer segments span AI data center/hyperscaler, mobile device, enterprise server/cloud, PC/consumer electronics, automotive (ASIL-D certified LPDDR5X), and networking/telecom. SK hynix is part of the SK Group conglomerate and reported $63.765 billion in 2025 sales and approximately $28 billion in 2025 profit, with Q1 2026 revenue growing 198% year-over-year at a 79% gross margin.

Name

SK Hynix

Legal name

SK hynix Inc. (SK하이닉스㈜)

Website

http://www.skhynix.com

Company type

Public

Founded year

1983

Operating status

Ipo

Headcount range

5,001–10,000 employees

Short description

SK hynix is a South Korean semiconductor manufacturer specializing in DRAM and NAND flash memory chips, holding 29% global DRAM share and approximately 60% global HBM share. It serves AI hyperscalers (NVIDIA, Google, Microsoft), OEMs (HPE, Qualcomm), and emerging AI ASIC developers through multi-year strategic supply agreements.

Ownership category

akta.pro rank

NAICS

Computer Storage Device Manufacturing (334112), Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Computer Storage Devices (3572), Semiconductors & Related Devices (3674)

akta.pro primary industry

Memory & Storage (DRAM/NAND/Non-Volatile) (HDAHAAAC)

akta.pro secondary industries

Memory Modules & Subsystems (DIMM/SO-DIMM/HBM stacks) (HDAHAKAH), AI Memory & Storage for Training (HBM/DDR/SSD/Object Storage) (HDAAAAAF), DRAM (DDR/LPDDR/HBM) (HDAHAKAA), Embedded & Managed NAND (eMMC/UFS/eMCP) (HDAHAKAG), Storage Controllers (SSD/UFS/eMMC) (HDAHAKAD), Storage & Interface Controllers (SSD/NVMe/UFS/USB/PCIe) (HDAHABAG), Memory & Storage Components (Industrial-grade DRAM/Flash/EEPROM, storage modules) (IMAGAJAJ)

Keywords

• DRAM memory chips
• NAND flash storage
• High bandwidth memory
• Semiconductor manufacturing
• Enterprise SSD

Headquarters

HQ city

Icheon

HQ country

South Korea

HQ region

Asia

Offices11 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Infrastructure, Technology or R&D, Personnel, Operations

Revenue model

1. DRAM Memory Chip Sales: Primary revenue stream - sales of DRAM products including HBM (HBM3E, HBM4, HBM4E), DDR5 server DRAM, LPDDR5X/LPDDR6 mobile DRAM, GDDR graphics DRAM, and consumer/PC DRAM. World's second-largest memory chipmaker with 29% global DRAM revenue share (Q1 2026).
2. NAND Flash & SSD Sales: Sales of NAND flash memory products (up to 321-layer QLC NAND), enterprise SSDs (eSSD), client SSDs, and mobile NAND solutions (UFS, ZUFS). Includes Solidigm subsidiary products and Intel-acquired Dalian NAND fab output.
3. AI Memory Solutions & Custom Solutions: Revenue from specialized AI memory solutions including SOCAMM2, CMM (CXL memory modules), PIM (Processing-in-Memory), and liquid-cooled eSSD co-developed with NVIDIA. Custom memory solutions for hyperscalers and AI factory deployments.
4. Long-Term Supply Agreements (Strategic Contracts): Multi-year strategic customer agreements with hyperscalers and AI companies (NVIDIA, Google, Anthropic, etc.) locking in supply volumes and pricing for HBM, DRAM, and NAND; HBM sold out through 2027 with fixed-price contracts.

Pricing tiers

Go-to-market motion4 records

Distribution channels6 records

Marketing channels10 records

Core offering

SK hynix manufactures and sells semiconductor memory products, primarily DRAM (including HBM3E, HBM4, HBM4E, DDR5, LPDDR5X/LPDDR6, GDDR), NAND flash (up to 321-layer QLC), and SSDs (enterprise eSSD, client SSD, data center E1.S). The company also offers CXL Memory Modules (CMM/CMM-Ax), Processing-in-Memory (PIM) AI accelerators, Multi-Chip Packages (MCP), iHBM thermal solutions, SOCAMM2 modules, and CMOS Image Sensors for AI data center, server, mobile, PC, automotive, networking, and consumer applications.

Product overview

SK hynix is a top-tier global semiconductor supplier offering a portfolio of memory and storage products organized into a platform-plus-modules architecture rather than a single unified product. The core offerings span DRAM (including DDR5, LPDDR5X, LPDDR6, GDDR, and the high-bandwidth HBM family with HBM3E, HBM4, and HBM4E), NAND Flash (including 321-layer QLC NAND and ZUFS 4.1 mobile NAND), and Solid State Drives (enterprise eSSD, PEB110 E1.S, PCB01, and 321-layer QLC cSSD). These are complemented by CMM (CXL Memory Modules) including CMM-Ax with compute functionality for memory-centric AI, Multi-Chip Packages (MCP), Processing-in-Memory (PIM) AI accelerators, the iHBM thermal solution for HBM, SOCAMM2 AI server modules, and CMOS Image Sensors (CIS). The portfolio is segmented across AI, Server, Networking, Mobile, PC, Consumer, and Automotive use cases, with products qualified for use in NVIDIA AI platforms, Intel data center platforms, and Qualcomm Snapdragon mobile platforms.

Differentiator

Problem solved

Functional benefit

Brands

• The Memory Shepherd: Brand campaign by SK hynix for the AI memory era.

Products and services

• DRAM Memory Chips Dynamic Random Access Memory chips spanning multiple generations and form factors including DDR5, DDR4, LPDDR5X, LPDDR6 (1c), GDDR, HBM, and SOCAMM2, serving AI, server, networking, mobile, PC, consumer, and automotive markets.
• HBM (High Bandwidth Memory) Stacked DRAM products including HBM2E, HBM3, HBM3E (12-layer), HBM4 (12-layer), and HBM4E (12-layer samples), designed for AI accelerators and high-performance computing with TSV-based high-stack packaging.
• NAND Flash Memory Flash memory chips including 4D NAND (CTF-based), 176-layer, 238-layer, and 321-layer TLC and QLC variants, for storage applications.
• SSD (Solid State Drive) Solid state drives including enterprise SSDs (eSSD), client SSDs (cSSD), and data center SSDs such as PEB110 E1.S and PCB01 for AI PCs.
• CMM (CXL Memory Module) Compute Express Link (CXL) memory modules based on DDR5, enabling memory pooling and expansion for data center and AI workloads; includes CMM-Ax with compute functionality.
• MCP (Multi-Chip Package) Multi-chip packages integrating DRAM and NAND flash into a single package for mobile and embedded applications.
• PIM (Processing-in-Memory) Next-generation AI accelerator that performs computation inside memory to reduce data movement, developed February 2022.
• iHBM (Integrated HBM Thermal Solution) Integrated thermal management solution for HBM unveiled May 26, 2026 to boost AI accelerator performance.
• SOCAMM2 (192GB) 192GB SOCAMM2 (Small Outline Compression Attached Memory Module) for AI servers, mass production began April 19, 2026.
• CIS (CMOS Image Sensor) CMOS Image Sensors for camera and imaging applications.

Named customers12 records

Segments6 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration4 records

AI capability7 records

Feature12 records

Partnerships

13 partnerships are on record, tiered core, flagship and minor.

• HPE (Hewlett Packard Enterprise)coreStrategic or Co-development Partner · 19 June 2026SK hynix Showcases Tech Leadership as 'Full Stack AI Memory Creator' at HPED 2026, Reaffirming Strong Partnership with HPE for AI-driven IT infrastructure. Co-marketing and joint AI memory solutions for HPE server and storage platforms.
• NVIDIAflagshipStrategic or Co-development Partner · 7 June 2026Multi-year technology partnership announced June 7, 2026 to advance memory for AI Factories. SK hynix is the primary supplier of HBM3E and HBM4 for NVIDIA AI accelerators including GB300 Grace Blackwell GPU. Joint showcase at NVIDIA GTC 2026 (Spotlight on AI Memory theme) with NVIDIA Collaboration Zone featuring memory configurations mounted on GPU-based AI accelerators. Collaboration extends to liquid-cooled eSSD co-developed with NVIDIA and NVIDIA DGX Spark desktop AI supercomputer equipped with SK hynix LPDDR5X.
• FoxconncoreStrategic or Co-development Partner · 4 June 2026Partnership from Chips to AI Systems. SK Group Chairman Chey Tae-won strengthened partnership with Foxconn in June 2026 to integrate SK hynix memory into Foxconn's AI systems and electronics manufacturing services platforms.
• TSMCcoreStrategic or Co-development Partner · 3 June 2026Global AI Chip Partnership solidified June 2026 when SK Group Chairman Chey Tae-won met TSMC Chairman and CEO C.C. Wei in Taiwan. SK hynix presents vision at TSMC Symposium covering memory integration with TSMC foundry platforms for AI chips.
• IntelcoreStrategic or Co-development Partner · 30 December 2021Acquired Intel's NAND flash memory business for $9 billion total (initial $7 billion closing, remaining $2 billion in 2025). Includes NAND memory manufacturing facility in Dalian, China and Intel's SSD business. SK hynix also received industry-first Intel Data Center Certification for 32Gb Die-based 256GB Server DDR5 RDIMM (December 2025), validating compatibility with Intel server platforms.
• MicrosoftcoreStrategic or Co-development PartnerSK hynix and Microsoft Launch Korea's Top AI Training Program ('AI for Impact Training Program with Microsoft'). Joint initiative to develop AI talent in Korea leveraging both companies' AI and cloud expertise.
• SandiskcoreStrategic or Co-development PartnerSK hynix and Sandisk Begin Global Standardization of Next-Generation Memory 'HBF' (High Bandwidth Flash). Joint standardization effort for AI workloads targeting new memory architecture beyond current NAND flash limits.
• Los Alamos National Laboratory (LANL)minorStrategic or Co-development PartnerTwo-year partnership with LANL to develop world's first ordered Key Value Store Computational Storage Device (KV-CSD). Performance testing was performed on LANL's supercomputer, leveraging SK hynix's storage and LANL's HPC expertise.
• SolidigmcoreStrategic or Co-development PartnerSolidigm is SK hynix's US subsidiary focused on NAND and SSD products. Joint demonstration of world's first Penta-Level Cell (PLC) SSD with 25% more data density than QLC at FMS 2022. Solidigm's SVP Sanjay S. Talreja co-presented with SK hynix EVP Jungdal Choi.
• QualcommcoreTechnology or IntegrationCompatibility validation completed October 2023 for LPDDR5T (world's fastest mobile DRAM at the time). LPDDR5T DRAM completed compatibility validation with Qualcomm platforms for next-generation smartphones.
• SK TelecomcoreStrategic or Co-development PartnerSK Telecom invested approximately 738.4 billion KRW (~5.70% of its equity capital) into SK hynix NAND Product Solutions Corp. (US-based subsidiary restructured in January as 'AI Co.'), taking a 0.9% stake. Acquisition scheduled June 25, 2030. Strategic shift from individual subsidiary investments to joint SK Group ecosystem development combining SK hynix's semiconductor capabilities with SK Telecom's telecom, cloud, and AI service expertise.
• OpenAI / BroadcomcoreTechnology or IntegrationSK hynix supplies HBM memory modules for the 'Jalapeño' custom AI inference ASIC chip developed jointly by OpenAI and Broadcom (unveiled June 24, 2026). The chip features six HBM modules in approximately 840mm² die size, scheduled for deployment in gigawatt-class data centers starting late 2026 with mass production in 2027.
• AnthropiccoreStrategic or Co-development PartnerMulti-year memory chip supply agreement signed (June 2026); SK hynix co-invested equity stake in Anthropic alongside Samsung and Micron. Part of Micron's strategic customer agreements (SCA) structure with 5-year terms and Take-or-Pay clauses.

Scale indicators17 records

Recent moves10 records

Expansion highlights8 records

Direct peers

• Samsung Electronics: Samsung is the world's #1 DRAM supplier (38% global share vs SK hynix 29%) and a direct competitor across DRAM, NAND, and HBM. Samsung is also investing alongside SK hynix at the Yongin Semiconductor Cluster and is pursuing HBM4 qualification with NVIDIA - the most direct and consequential competitor.
• Micron Technology: Micron is the third major memory oligopolist with 22% global DRAM share and a growing HBM business. Co-investor alongside SK hynix and Samsung in Anthropic, with strategic customer agreements (SCA) including Take-or-Pay clauses. Most direct peer in HBM technology and DRAM/NAND product portfolio.
• Kioxia: Kioxia is a leading Japanese NAND flash memory manufacturer and one of SK hynix's principal NAND competitors. Jointly developing standards in the flash memory space and competing in enterprise SSDs and consumer NAND solutions.
• Western Digital / Sandisk: Sandisk (formerly part of Western Digital) is a NAND flash and storage competitor with whom SK hynix is co-developing the next-generation 'HBF' (High Bandwidth Flash) memory standard for AI workloads. Direct competitor in NAND and enterprise SSD segments.

Broad incumbents

• NVIDIA: NVIDIA is SK hynix's largest HBM customer and the broader AI accelerator incumbent. The June 7, 2026 multi-year technology partnership and co-developed liquid-cooled eSSD and DGX Spark LPDDR5X integration make NVIDIA the most consequential partner; in terms of competition, NVIDIA's strategic direction (e.g., the Broadcom/Jalapeño ASIC) shapes SK hynix's HBM opportunity.
• TSMC: TSMC is the foundry partner with whom SK hynix solidified a Global AI Chip Partnership in June 2026. They co-market AI memory solutions and TSMC fabricates the chips that consume SK hynix's HBM - adjacent in the AI stack but not a direct memory competitor.
• Intel: Intel sold its NAND flash business to SK hynix for $9B (Dalian fab and SSD business) and is now a customer for SK hynix server DRAM (industry-first Intel Data Center certification for 256GB DDR5 RDIMM in December 2025). A former NAND competitor and current server/mobile platform partner.

Emerging players

• Broadcom: Broadcom co-developed the 'Jalapeño' AI inference ASIC with OpenAI (unveiled June 24, 2026), for which SK hynix supplies HBM modules. An emerging custom-silicon player that could redirect HBM demand patterns away from NVIDIA.
• AMD: AMD is a leading AI accelerator designer (MI300/MI350 series) and a meaningful HBM consumer. An emerging HBM customer alongside NVIDIA - not a direct memory competitor but a key HBM demand driver and competitive force shaping NVIDIA's behavior.
• YMTC (Yangtze Memory Technologies Corp): YMTC is China's leading NAND flash memory manufacturer and an emerging player under US export controls. Potential long-term competitive threat in NAND segments, particularly for Chinese OEM customers, though currently constrained by US equipment restrictions.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat7 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/user/SKhynix
• LinkedInlinkedin.com/company/19120
• Instagraminstagram.com/skhynix_official
• Xx.com/SKhynix
• Facebookfacebook.com/about

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles12 records

Subsidiaries9 records

Funding overview

Funding rounds5 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A3 records

Investments29 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SK Hynix