What Broadcom does

Broadcom Inc. is a Delaware-incorporated designer and global supplier of semiconductors and infrastructure software headquartered in Palo Alto, California, with approximately 19,000 employees and a market capitalization of roughly $1.8 trillion as of Q1 2026. The company sells custom AI accelerators (XPUs) and ASICs to hyperscalers — most notably seven generations of Google's TPUs, Meta's MTIA series, OpenAI's Jalapeño processor, and TPU-based compute capacity for Anthropic — alongside Ethernet switching silicon (Tomahawk 6 at 102.4 Tbps), optical DSPs and co-packaged optics, Wi-Fi 8 silicon, broadband PON SoCs, Fibre Channel storage products, automotive electronics, and a large infrastructure software portfolio that includes VMware Cloud Foundation, Symantec Enterprise Security, Carbon Black, mainframe software, and Layer7 API management. Approximately 74% of its workforce is dedicated to R&D and operations, and fiscal 2025 R&D spend reached $11 billion.

Broadcom's go-to-market combines direct enterprise field sales to hyperscalers and OEMs with channel partners and resellers. Its four core technology areas are AI infrastructure (custom accelerators, Ethernet switching, optical interconnects, NICs), wireless connectivity (Wi-Fi 8, FBAR, GNSS), broadband and data center connectivity (PON, Fibre Channel, PCIe, ASICs), and enterprise software (private cloud, security, mainframe, AIOps). Revenue is generated primarily through hardware sales of semiconductors and through subscription-based infrastructure software following Broadcom's 2023 acquisition of VMware for $69 billion.

In Q1 FY2026, Broadcom reported revenue of $19.31 billion (+29% YoY), of which $8.4 billion (+106% YoY) came from AI semiconductors, with a GAAP net margin of 36.57%. Q2 FY2026 revenue is guided to approximately $22 billion (+47% YoY), and management has projected AI chip revenue exceeding $100 billion by FY2027. The company is publicly traded on NASDAQ under AVGO and maintains a ~$10 billion share repurchase program alongside secured leading-edge wafer and HBM capacity at TSMC through 2028.

Name

Broadcom

Legal name

Broadcom Inc.

Website

https://broadcom.com

Company type

Public

Founded year

1991

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Broadcom Inc. designs custom AI accelerators, Ethernet/optical networking silicon, Wi-Fi 8 chips, and infrastructure software (VMware, Symantec, Carbon Black), supplying hyperscalers like Google, Meta, OpenAI, and Anthropic and global enterprises across data center, broadband, automotive, and security markets.

Ownership category

akta.pro rank

Product category

Semiconductor Solutions

NAICS

Computer and Peripheral Equipment Manufacturing (33411), Other Communications Equipment Manufacturing (33429)

SIC

Semiconductors & Related Devices (3674), Computer Communications Equipment (3576), Computer Storage Devices (3572)

akta.pro primary industry

Networking & Data Center Silicon (Switch/NIC/DPU/SerDes) (HDAHABAB)

akta.pro secondary industries

Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC), Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS) (HDAHABAA), Design Services & ASIC/SoC Implementation (EDA-Adjacent) (HDAHAFAL)

Keywords

• Semiconductor solutions
• AI infrastructure
• Custom ASIC design
• Enterprise cybersecurity software
• Data center networking

Headquarters

HQ city

Palo Alto

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Marketing or Sales, Operations

Revenue model

1. Semiconductor Solutions: Semiconductor products including AI networking (Ethernet switches, SerDes, DSP, NICs), custom XPUs/AI accelerators for hyperscalers, wireless connectivity (Wi-Fi, FBAR filters, GNSS), broadband (PON, cable), storage connectivity (Fibre Channel, SAS/SATA), and optical components. Revenue split shows AI semiconductor revenue growing 106% to $8.4B in Q1 FY2026, with custom AI accelerator business growing 140% year-over-year.
2. Infrastructure Software: Enterprise software including VMware private cloud solutions, mainframe software (application development, security, workload automation), Symantec cybersecurity (endpoint, network, email security), Carbon Black threat detection, API management (Layer7), value stream management, service management, and AIOps/observability products.
3. Professional Services: Education services (VMware Learning, Mainframe Software Education, Brocade Education) and professional services partners providing implementation, deployment, and consulting services across Broadcom's product portfolio.

Pricing tiers

Go-to-market motion4 records

Distribution channels5 records

Marketing channels5 records

Core offering

Broadcom designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for global organizations' complex, mission-critical needs. The semiconductor portfolio includes custom AI accelerators (XPUs) for hyperscalers (Google TPUs, OpenAI Jalapeño, Meta MTIA), Ethernet switching silicon (Tomahawk series), high-speed optical DSPs and Co-Packaged Optics, Wi-Fi 8 silicon, Fibre Channel and PCIe connectivity, broadband PON SoCs, and automotive Ethernet/isolation products. The infrastructure software portfolio spans VMware Cloud Foundation, Symantec and Carbon Black cybersecurity, Layer7 API management, ValueOps value stream management, mainframe software, and DX NetOps/AIOps observability.

Product overview

Broadcom is a technology leader providing semiconductors and infrastructure software for global organizations' complex, mission-critical needs. The company's product portfolio operates on a platform-plus-modules architecture comprising multiple distinct product lines. The semiconductor portfolio includes: AI Infrastructure Solutions (custom XPUs/AI accelerators like TPU and Jalapeño, Tomahawk Ethernet switches, PCIe solutions, and optical interconnect technologies including Tomahawk 6-Davisson 102.4Tbps CPO switch and Taurus BCM83640 400G/lane DSP); Wireless and Mobile Communications (Wi-Fi 8 silicon ecosystem including BCM6718/BCM6714/BCM6719 for residential, BCM43840/BCM43820 for enterprise, BCM677X family, and integrated 5G/Wi-Fi 8 FWA platform with Samsung); Broadband and Connectivity (BCM68850 50G PON SoC with Edge AI, xPON solutions); Data Center Solutions (StrataXGS switches, Fibre Channel networking via Brocade, RAID controllers, PCIe switches, optical transceivers, Co-Packaged Optics); Automotive Electronics (Ethernet PHYs/switches, optocouplers, LED lighting, motion encoders); Storage Products (Fibre Channel HBAs, RAID controllers, SAS/SATA controllers); Custom Silicon/ASICs; and LED/Display Components. The infrastructure software portfolio includes: VMware Cloud Foundation (private cloud platform); Symantec Enterprise Security (including CBX unified XDR, Carbon Black endpoint protection, identity and access management); API Management (Layer7 API Gateways); ValueOps (value stream management including Clarity, Rally, ConnectALL); Mainframe Software (application development, cybersecurity, workload automation); Network Observability/AIOps (DX NetOps, AppNeta); and Enterprise Automation. These products serve critical markets including AI infrastructure, cloud, data center networking, broadband access, wireless mobile, storage, automotive, and enterprise software.

Differentiator

Problem solved

Functional benefit

Brands

• VMware: Private cloud and enterprise virtualization software platform acquired by Broadcom in 2023.
• Symantec Enterprise
• Carbon Black
• Brocade
• VMware Cloud Foundation
• Tomahawk
• Jericho
• StrataXGS
• Emulex

Products and services

• Tomahawk 6 - Davisson Ethernet Switch World's first 102.4 Tbps Ethernet switch with third-generation Co-Packaged Optics (CPO) and 200G SerDes, designed for AI hyperscale data centers requiring power-efficient high-bandwidth cluster networking.
• Thor Ultra 800G AI Ethernet NIC Industry's first 800G AI Ethernet NIC compliant with Ultra Ethernet Consortium standards, providing high performance, scalability, and reliability for AI scale-out networking.
• Taurus BCM83640 400G/lane Optical DSP 3nm 400G/lane optical PAM-4 DSP optimized for 1.6T transceiver solutions in AI data centers, enabling 102.4T switching capacity in 1RU systems.
• Sian3 DSP 3nm CMOS 1.6T (8:8) PAM-4 transceiver PHY with integrated laser driver for advanced optical interconnects in AI infrastructure.
• Jericho4 Enables distributed AI computing across data centers with advanced routing and forwarding capabilities, shipping for hyperscale AI workloads.
• Jalapeño LLM-Optimized Intelligence Processor OpenAI's first custom AI accelerator designed specifically for LLM inference workloads, delivering better performance per watt than current state-of-the-art, for deployment at gigawatt scale with Microsoft and other partners.
• Wi-Fi 8 Silicon Ecosystem Industry's first complete Wi-Fi 8 silicon ecosystem for residential gateways, enterprise access points, and mobile devices, delivering AI-edge performance, ultra-high reliability, and low latency.
• Symantec CBX Cloud-based unified Extended Detection and Response (XDR) security platform combining Symantec and Carbon Black technologies with AI-driven Incident Prediction for enterprise cyber defense.
• Emulex SecureHBA Fibre Channel Host Bus Adapter with autonomous in-flight encryption, LMS Silicon Root of Trust, AES-GCM-256, and post-quantum cryptography for quantum-resistant data protection in enterprise storage environments.
• BCM68850 50G PON SoC 50G ITU PON/XGS-PON and EPON Gateway system-on-chip with integrated Edge AI for rich service delivery, featuring multicore ARM v8 CPU and Neural Processing Engine.
• VMware Cloud Foundation Unified private cloud platform for traditional, modern, and AI workloads enabling self-service, automation, and workload support across locations with built-in security and governance.
• Symantec Enterprise Security Enterprise cybersecurity solutions including email security, information security, endpoint security and management, and network security under the Symantec brand.
• Carbon Black Cloud-native endpoint protection platform with threat detection, prevention, and response capabilities, now unified with Symantec in Symantec CBX.
• StrataXGS Switch Solutions Enterprise and data center Ethernet switching platforms providing network switching and routing capabilities across enterprise and hyperscale deployments.
• Brocade Fibre Channel Networking Fibre Channel directors and switches for on-demand data center infrastructure with analytics, security, and automation for storage area networks.
• Custom Silicon/ASICs Highly complex, customized system-on-a-chip ASICs for deeply differentiated systems including AI accelerators co-designed with hyperscalers like Google and OpenAI.
• Co-Packaged Optics Integrated optical-electronic packaging solutions for power-efficient, high-bandwidth connectivity in AI data centers, deployed in Tomahawk 6 Davisson switches.
• Layer7 API Gateways API management and security solutions for enterprise API deployment, monitoring, and lifecycle management.
• ValueOps Value Stream Management Value stream management platform including Clarity, Rally, ValueOps ConnectALL, and ValueOps Insights for software delivery optimization.
• Mainframe Software Portfolio Enterprise mainframe solutions including application development, cybersecurity, workload automation, and operations management.
• PCI Express Switches and Retimers ExpressFabric switching solutions providing high-performance PCIe connectivity for data centers and servers.
• Automotive Ethernet PHYs and Switches Automotive semiconductor solutions for Ethernet connectivity and networking in vehicles, supporting ADAS and software-defined vehicle architectures.
• Google Tensor Processing Unit (TPU) Custom AI accelerator chips co-designed with Google through Broadcom's long-term partnership across seven generations, used for AI/ML training and inference workloads across Google's data centers.

Quantifiable outcome

• AI semiconductor revenue of $8.4 billion in Q1 FY2026, up 106% year-over-year
• +4 more outcomes

Named customers5 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

Yes

API docs

API detail

Core technology

AI maturity

App detail

AI capability10 records

Feature10 records

Partnerships

19 partnerships are on record, tiered core, minor and major.

• OpenAIcoreStrategic or Co-development Partner · 24 June 2026Strategic collaboration to develop and deploy OpenAI's Jalapeño AI accelerator - OpenAI's first Intelligence Processor designed from scratch for LLM inference. Developed from design to tape-out in nine months. Multi-generation compute platform for deployment at gigawatt scale with Microsoft and other partners by end of 2026.
• CelesticaminorImplementation/ SI/ Consulting Partner · 24 June 2026Board, rack and system integration partner for OpenAI's Jalapeño processor development alongside Broadcom. Helped industrialize the platform through chip implementation, board, rack system integration, and scalable production systems.
• Google (Alphabet)coreStrategic or Co-development Partner · 7 April 2026Long-term strategic partnership for custom TPU development - Broadcom has been co-designing Google's TPUs since 2016 across seven generations. New five-year agreement through 2031 includes developing and supplying future generations of Google's TPUs and networking components for AI data centers. Broadcom is Google's primary design partner for specialized AI chips.
• AnthropiccoreStrategic or Co-development Partner · 7 April 2026Expanded partnership providing Anthropic access to approximately 3.5 gigawatts of TPU-based AI compute capacity starting in 2027. Anthropic previously had 1 gigawatt commitment in 2026. Deal supports Claude AI model training and inference. Revenue estimated at $21 billion in 2026, $42 billion in 2027. Anthropic also part of Project Glasswing cybersecurity initiative with Broadcom.
• Meta PlatformscoreStrategic or Co-development Partner · 7 April 2026Partnership for Meta's custom MTIA (Meta Training Inference Accelerator) AI chips. Extended partnership to deploy multi-gigawatts of Meta's custom silicon including MTIA 400, 450, and 500 series. Meta claims MTIA 400 is competitive with leading commercial products. Mass deployment planned for 2027.
• AppleminorGTM or Marketing Partner · 7 April 2026Apple is a launch partner in Anthropic's Project Glasswing cybersecurity initiative where Broadcom is also a participant. The initiative deploys Claude Mythos Preview AI model to identify and remediate security vulnerabilities across platforms.
• CiscominorGTM or Marketing Partner · 7 April 2026Launch partner in Anthropic's Project Glasswing cybersecurity initiative alongside Broadcom. Initiative focuses on defensive security using AI capabilities.
• NVIDIAminorGTM or Marketing Partner · 7 April 2026Partner in Anthropic's Project Glasswing initiative and member of 400G Optical MSA consortium alongside Broadcom. Also competes with Broadcom in AI chip market but collaborates on optical interconnect standards.
• CrowdStrikeminorGTM or Marketing Partner · 7 April 2026Launch partner in Anthropic's Project Glasswing cybersecurity initiative. Initiative leverages AI for defensive security against vulnerabilities.
• Palo Alto NetworksminorGTM or Marketing Partner · 7 April 2026Launch partner in Anthropic's Project Glasswing cybersecurity initiative. Project brings together major tech and cybersecurity companies for defensive AI security.
• Amazon Web ServicesminorGTM or Marketing Partner · 7 April 2026Launch partner in Anthropic's Project Glasswing initiative. AWS shares are listed among technology and security companies collaborating on AI cybersecurity defense.
• JPMorgan ChaseminorGTM or Marketing Partner · 7 April 2026Partner in Anthropic's Project Glasswing cybersecurity initiative, representing financial sector involvement in AI defensive security collaboration.
• Linux FoundationminorGTM or Marketing Partner · 7 April 2026Partner in Anthropic's Project Glasswing initiative. Anthropic donated $4 million to the Linux Foundation as part of the initiative's open-source security support.
• Apache Software FoundationminorGTM or Marketing Partner · 7 April 2026Open-source foundation receiving $4 million in donations from Anthropic as part of Project Glasswing initiative to support open-source security.
• 400G Optical MSA Consortium (Cisco, MACOM, NVIDIA, Semtech)majorTechnology or Integration · 16 March 2026Multi-source agreement establishing specifications for 400 Gbps optical interfaces targeting next-generation AI infrastructure. Consortium creates specifications for single-wavelength optical links operating at 400G with reaches up to 500m, targeting AI workloads.
• Optical Compute Interconnect MSA Consortium (AMD, Meta, Microsoft, NVIDIA, OpenAI)majorTechnology or Integration · 1 March 2026Open standards consortium for optical interconnects in AI data centers. Initiative aims to improve scalability, power efficiency, and performance across large AI computing clusters by replacing copper wiring with optical links.
• Dell TechnologiesmajorOEM/ Whitelabel/ Licensing Partner · 1 March 2025Dell integrates Broadcom's Emulex SecureHBAs into PowerStore and PowerEdge servers for post-quantum cryptography encryption. Over 80,000 SecureHBA ports shipped since March 2025. Dell is the only storage and server platform provider offering end-to-end encryption solution with PQC.
• MicrosoftmajorStrategic or Co-development PartnerMajor hyperscaler customer for AI infrastructure. Microsoft is deploying Broadcom's custom AI chips and networking solutions as part of OpenAI infrastructure buildout. Part of multi-partner AI infrastructure ecosystem with gigawatt-scale data center deployments.
• Taiwan Semiconductor Manufacturing (TSMC)coreOEM/ Whitelabel/ Licensing PartnerContract manufacturer for Broadcom's custom ASIC chips. Broadcom has secured leading-edge wafer capacity and high-bandwidth memory supply through 2028 at TSMC, critical for meeting AI chip demand.

Scale indicators10 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Texas Instruments: Texas Instruments is a direct peer in analog and mixed-signal semiconductors, particularly in automotive, industrial, and broadband. It overlaps with Broadcom's isolation, LED, and connectivity product lines at automotive Tier 1s and industrial OEMs.
• Marvell Technology: Marvell is the closest direct peer — a fabless designer of custom ASICs (notably Amazon Trainium and Google networking silicon), data center networking silicon, and optical DSPs. It competes head-to-head with Broadcom in custom AI accelerator design and SerDes/DSP for AI infrastructure.
• Coherent (formerly II-VI / Finisar): Coherent is a direct peer in optical components and transceivers (VCSELs, pluggables, CPO modules). It competes with Broadcom's optical interconnect business for AI data center interconnect sockets, including the emerging 1.6T transceiver and CPO market.
• Qualcomm: Qualcomm is a direct peer in mobile and wireless connectivity SoCs (Wi-Fi, Bluetooth, GNSS, RF front-end). Both companies supply connectivity silicon into smartphones, automotive, and IoT, and compete for Wi-Fi 7/8 sockets at OEMs and carriers.
• NXP Semiconductors: NXP is a direct peer in automotive semiconductors (Ethernet PHYs, connectivity, secure car access, ADAS). It competes with Broadcom's automotive Ethernet and isolation portfolios at OEMs and Tier 1 suppliers.

Broad incumbents

• Advanced Micro Devices (AMD): AMD offers merchant AI accelerators (MI300/MI350 series) and is co-developing optical interconnect standards alongside Broadcom. It competes with Broadcom's custom ASIC business via its merchant GPU roadmap and partners with Broadcom in the Optical Compute Interconnect MSA.
• Intel: Intel competes across multiple Broadcom segments — Ethernet networking silicon, custom ASIC foundry services (Intel Foundry), Wi-Fi, and AI accelerators (Gaudi). As a vertically integrated IDM-plus-foundry, Intel is a broad incumbent and alternative supply-chain option to Broadcom-TSMC for hyperscalers.
• Cisco Systems: Cisco is a broad incumbent in enterprise networking and a customer of Broadcom's silicon (it co-developed 400G Optical MSA). It competes downstream with Broadcom's Tomahawk/Jericho switching portfolio via its own Catalyst and Silicon One ASIC-driven switches.
• NVIDIA: NVIDIA is the dominant merchant AI accelerator supplier (GPUs) and also competes via NVLink networking and Spectrum-X Ethernet switches. It is a broad incumbent that competes with Broadcom's custom AI ASICs (TPUs, MTIA, Jalapeño) and Tomahawk-class Ethernet switches, while also partnering in optical interconnect standards.

Emerging players

• MACOM Technology Solutions: MACOM is an emerging player in high-speed optical and RF semiconductors, and a co-founding member of the 400G Optical MSA with Broadcom. It competes in PAM-4 DSPs, optical drivers, and GaN-on-SiC for AI and 5G infrastructure, increasingly targeting AI fabric sockets.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/Broadcom
• Facebookfacebook.com/Broadcom
• LinkedInlinkedin.com/company/broadcom

Compliance11 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries5 records

Funding overview

Funding rounds1 record

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A42 records

Investments11 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Broadcom