What Texas Instruments does

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, that designs, manufactures, tests, and sells analog integrated circuits and embedded processors. Its portfolio spans analog signal chain components (amplifiers, data converters, sensors, power management), embedded processing (Arm-based microcontrollers, C2000 real-time MCUs, MSP430, and Jacinto processors), wireless connectivity (Bluetooth LE, Wi-Fi 6, Thread, Zigbee, Matter, Sub-1 GHz), and enabling technologies such as Gallium Nitride (GaN) power devices, Bulk Acoustic Wave (BAW) resonators, and functional-safety-certified (ASIL-D) solutions. TI differentiates through internally owned 300mm wafer fabrication, which delivers approximately 40% lower per-die cost versus legacy 200mm fabs, and through an ecosystem of free developer tools (Code Composer Studio, Edge AI Studio, WEBENCH, PSpice for TI, SimpleLink SDKs) that drive design-in wins.

TI's revenue model is hardware-centric, with the overwhelming majority of revenue coming from catalog and custom semiconductor product sales to OEMs and through a global authorized distributor network. Pricing is publicly listed on TI.com for many catalog parts (e.g., TPS61290 at $0.70/unit, ADS9316 at $27.15/unit, ISO7742U at $2.95/unit at 1ku volume), with enterprise pricing negotiated through direct sales or distributor channels based on volume and project scope. The business model is characterized by long product lifecycles (10+ years of customer support), deep design-in engagement with engineering customers, and a diversified end-market mix across industrial (largest segment), automotive, data center and AI infrastructure, communications, personal electronics, and medical. Q1 2026 revenue reached $4.83 billion, up 18.6% year-over-year, with the company guiding Q2 2026 to $5.0–$5.4 billion.

TI is pursuing a major structural build-out, committing approximately $60 billion in capital expenditures through 2030 to expand 300mm analog manufacturing capacity in the United States, supported by roughly $1.61 billion in CHIPS Act incentives. In February 2026, TI announced an all-cash $7.5 billion acquisition of Silicon Labs (expected to close H1 2027) to add approximately 1,200 wireless connectivity products and projected $450 million in annual synergies. The company maintains 56 consecutive years of dividend payments and 22 consecutive years of dividend increases, reflecting long-term capital discipline alongside an activist engagement by Elliott Investment Management, which disclosed a $2.5 billion stake and proposed strategic capacity-management changes.

Name

Texas Instruments

Legal name

Texas Instruments Incorporated

Website

https://ti.com

Company type

Public

Founded year

1958

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Texas Instruments is a global semiconductor company that designs and manufactures analog integrated circuits and embedded processors, serving industrial, automotive, data center, communications, and consumer OEMs through direct sales, distributors, and TI.com.

Ownership category

akta.pro rank

Product category

Analog Semiconductors

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600), Instruments For Meas & Testing Of Electricity & Elec Signals (3825)

akta.pro primary industry

Advanced SoCs & Application Processors (HDAHAAAB)

akta.pro secondary industries

Application Processors & Microprocessors (MPUs/CPUs) (HDAHAJAB), Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH)

Keywords

• Analog semiconductors
• Embedded processors
• Power management ICs
• Wireless connectivity chips
• Automotive semiconductors

Headquarters

HQ city

Dallas

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Infrastructure, Personnel, Operations, Marketing or Sales

Revenue model

1. Semiconductor Product Sales: TI generates the overwhelming majority of revenue through the sale of analog and embedded semiconductor chips and related components. Products are sold directly to OEMs and through distributors. The business model is characterized by long product lifecycles, deep customer relationships driven by design-in wins, and recurring revenue from the same customers as new end-equipment generations launch.
2. Reference Design and Development Tools: TI provides free development tools (CCStudio, WEBENCH, PSpice for TI) and sells evaluation modules and development kits that support customers in designing with TI products. These tools drive design-in wins and create ecosystem lock-in.

Pricing tiers

Go-to-market motion2 records

Distribution channels4 records

Marketing channels6 records

Core offering

Texas Instruments designs, manufactures, tests, and sells analog and embedded processing semiconductor chips. The portfolio includes amplifiers, data converters, sensors, power management ICs, microcontrollers, and wireless connectivity chips, complemented by development tools (CCStudio, WEBENCH, PSpice for TI) and reference designs. Products are sold directly to OEMs and through a global distributor network for use in industrial, automotive, data center, communications, and personal electronics applications.

Product overview

Texas Instruments is an analog and embedded processing semiconductor company offering a comprehensive portfolio of ICs, development tools, and software. The product portfolio includes core product categories: Amplifiers, Battery Management ICs, Data Converters, Microcontrollers & Processors, Power Management, Wireless Connectivity, Sensors, and DLP Products. Development ecosystems center on CCStudio IDE with integrated generative AI capabilities, Edge AI Studio for model training/optimization, WEBENCH Circuit Designer for power supply design, and PSpice for TI for circuit simulation. Key wireless connectivity products include the SimpleLink SDKs and CC33xx Wi-Fi/Bluetooth combo ICs (CC3351, CC3350). Automotive and industrial products include the TDA4VM SoC for ADAS with 8 TOPS AI performance and the BQ79826Z-Q1 battery monitor with integrated EIS technology. These products serve industrial automation, automotive, data center, communications, and consumer electronics end markets.

Differentiator

Problem solved

Functional benefit

Brands

• SimpleLink: Wireless connectivity platform supporting protocols including Bluetooth Low Energy, Zigbee, Matter, Thread, Wi-Fi 6, Sub-1GHz, and Wi-SUN
• C2000
• CCStudio
• WEBENCH
• PSpice for TI
• TDA4VM
• BQ79826Z-Q1

Products and services

• CCStudio (Code Composer Studio) IDE Unified suite of free development tools with integrated generative AI to accelerate embedded development across TI's microcontroller and processor portfolio, supporting building, debugging, analyzing, and optimizing embedded applications with direct on-hardware programming.
• Edge AI Studio Graphical and command-line tools for high-performance edge AI development, providing end-to-end capabilities to capture high-quality data, train and optimize models using PyTorch, TensorFlow, and ONNX frameworks with pre-trained models from the model zoo.
• WEBENCH Circuit Designer Online design environment that creates customized power supply and active filter circuits based on system requirements, with end-to-end selection, design, and simulation capabilities including Monte-Carlo and Corner analysis with CAD export.
• PSpice for TI Design and simulation environment leveraging Cadence PSpice technology to evaluate functionality of analog circuits, with full-featured simulation and one of the largest model libraries spanning TI's analog and power portfolio, available at no cost.
• SimpleLink SDKs Consistent and comprehensive software solutions supporting wireless protocols with demonstrations and examples enabling out-of-box connectivity, built on open-source FreeRTOS and Zephyr RTOS with security features for product development.
• CC3351 Wi-Fi/Bluetooth Combo IC SimpleLink dual-band (2.4GHz and 5GHz) Wi-Fi 6 and Bluetooth Low Energy companion IC, a 10th-generation connectivity chip supporting Matter, Bluetooth Core 5.4, with integrated PA delivering up to +20.5dBm output power for cost-sensitive embedded IoT applications.
• CC3350 Wi-Fi IC SimpleLink dual-band (2.4 and 5 GHz) Wi-Fi 6 companion IC, pin-compatible with CC3351, supporting Wi-Fi standards including 802.11ax with OFDMA, MU-MIMO, and TWT for improved efficiency in IoT applications.
• BQ79826Z-Q1 Battery Monitor Industry's first 26-cells-in-series channel battery monitor with integrated electrochemical impedance spectroscopy (EIS) engine for electric vehicles and energy storage systems, tracking 44% more channels than previous generations with best-in-class voltage accuracy below 2mV.
• TDA4VM Automotive SoC System-on-chip built on Jacinto 7 architecture integrating deep learning acceleration, safety-certified compute, and multi-sensor processing for ADAS and autonomous driving at Level 2+, delivering 8 TOPS AI performance through Matrix Multiply Accelerator with ASIL-D certification.
• Amplifiers Broad portfolio of operational amplifiers, instrumentation amplifiers, and specialized amplifiers for signal conditioning across industrial, automotive, and consumer applications.
• Battery Management ICs Comprehensive portfolio including fuel gauges, battery monitors, and chargers for single-cell to multi-cell configurations serving EVs, energy storage, and portable electronics.
• Data Converters Analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) including precision, high-speed, and integrated conversion solutions for industrial and automotive systems.
• Microcontrollers (MCUs) & Processors Arm-based processors, C2000 real-time MCUs, MSP430 microcontrollers, and mmWave radar sensors for embedded applications across industrial, automotive, and IoT markets.
• Power Management DC/DC converters, LDOs, voltage supervisors, and power modules including GaN technology solutions for efficient power conversion across data center, industrial, and automotive applications.
• Wireless Connectivity SimpleLink portfolio including Bluetooth Low Energy, Wi-Fi 6, Sub-1 GHz, Zigbee, Thread, Matter, and proprietary wireless protocols for IoT and industrial applications.
• Sensors Temperature, current sensing, mmWave radar, and specialty sensors for industrial, automotive, and consumer applications including edge AI-enabled sensing solutions.
• DLP Products Digital light processing technology for display, industrial, and automotive applications including heads-up displays and embedded projection systems.
• AFE7950-SEP and ADS9316 AFE7950-SEP radiation-tolerant 4-transmit 6-receive RF-sampling transceiver up to 12GHz, and ADS9316 two-channel 18-bit 3MSPS SAR ADC, added to the product portfolio.
• CC3351MOD Wi-Fi Module Certified module based on the CC3351 IC for design simplicity in Wi-Fi 6 and Bluetooth Low Energy applications.
• Isolated DC/DC Power Modules Two compact isolated DC/DC power modules designed for high-power-density applications in electric vehicles and data centers, providing solutions for managing tighter power budgets and smaller board spaces.

Quantifiable outcome

• Q1 2026 revenue of $4.83 billion, up 19% year-over-year, with Analog segment up 21.9% and Embedded Processing up ~12%
• +4 more outcomes

Named customers1 record

Segments6 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

Yes

API docs

API detail

Core technology

AI maturity

App detail

Integration4 records

AI capability9 records

Feature10 records

Partnerships

One partnership is on record.

• Silicon LabsflagshipStrategic or Co-development Partner · 4 February 2026Texas Instruments signed a definitive agreement to acquire Silicon Labs in an all-cash transaction valued at approximately $7.5 billion ($231 per share). The acquisition combines Silicon Labs' portfolio of approximately 1,200 wireless connectivity products with TI's analog and embedded processing portfolio and internal manufacturing capabilities, creating a global leader in embedded wireless connectivity solutions. The deal is expected to close in the first half of 2027, subject to regulatory and Silicon Labs stockholder approvals, and is projected to generate approximately $450 million in annual manufacturing and operational synergies within three years post-close.

Scale indicators12 records

Recent moves1 record

Expansion highlights6 records

Direct peers

• Analog Devices: Direct analog IC competitor identified as the other top-2 player in analog semiconductors alongside TI. Competes head-to-head in amplifiers, data converters, power management, and industrial/automotive end markets with comparable product breadth and customer overlap.
• Infineon Technologies: Global semiconductor competitor in power semiconductors, automotive MCUs, and industrial applications. Direct overlap with TI in power management, automotive (especially EV powertrain), and industrial automation, with comparable end-customer engagement models.
• NXP Semiconductors: Direct competitor in automotive and industrial embedded processing, particularly microcontrollers and connectivity. Overlaps with TI in functional safety, automotive ADAS/body electronics, and secure connectivity, often competing for the same OEM design wins.
• STMicroelectronics: Analog and embedded semiconductor competitor with strong automotive and industrial franchises. Direct overlap with TI in power management, MCUs (STM32), and sensor products, with similar IDM manufacturing strategy in Europe.
• Microchip Technology: Direct competitor in microcontrollers (PIC, AVR), analog, and connectivity. Competes with TI's MSP430 and C2000 lines in industrial and embedded applications, with overlapping distributor channels and SMB customer bases.
• ON Semiconductor (onsemi): Power management and analog competitor with strong automotive exposure (especially EV powertrain and ADAS). Direct overlap with TI in SiC/GaN power, automotive image sensors, and industrial power conversion, sharing many of the same OEM customers.
• Renesas Electronics: Automotive and industrial MCU competitor with strong position in Japan and growing global automotive design wins. Competes with TI's C2000 and Arm-based MCUs in motor control, industrial automation, and ADAS, with comparable functional safety (ASIL-D) portfolios.

Broad incumbents

• Qualcomm: Broader semiconductor incumbent with overlapping wireless connectivity products (Bluetooth, Wi-Fi) that compete with TI's SimpleLink portfolio, particularly after the Silicon Labs acquisition closes. Also competes in automotive cockpit and ADAS compute via Snapdragon platforms.
• Broadcom: Broad semiconductor incumbent with industrial, networking, and data center exposure. Overlaps with TI in networking semiconductors, custom silicon for hyperscalers, and industrial connectivity, though Broadcom's portfolio is far broader and less analog-focused.
• Marvell Technology: Data center and networking semiconductor incumbent that overlaps with TI's data center growth thesis. Both serve AI infrastructure buildouts, though Marvell focuses on custom silicon, networking, and storage while TI focuses on power delivery and analog signal chain.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/txinstruments
• Facebookfacebook.com/texasinstruments
• LinkedInlinkedin.com/company/texas-instruments

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries1 record

Funding overview

Funding rounds9 records

Investors3 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A31 records

Investments34 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Texas Instruments