Infineon Technologies

What Infineon Technologies does

Infineon Technologies AG is a German semiconductor designer and manufacturer, headquartered in Neubiberg, Bavaria, and listed on the Frankfurt Stock Exchange (DAX 40, ticker IFX). Founded in 1999 as a spin-off from Siemens AG, the company operates 71 R&D sites and 15 manufacturing locations worldwide with a workforce of approximately 58,000+, serving automotive, industrial, AI/data center, consumer, communications, and security customers globally. Its core technology stack spans four pillars: (1) power semiconductors, including silicon IGBTs and MOSFETs (OptiMOS, CoolMOS), wide-bandgap CoolSiC silicon carbide (400V-3300V classes) and CoolGaN gallium nitride (HEMT transistors, bidirectional switches, integrated-driver variants), with the latter protected by approximately 450 patent families; (2) automotive and industrial microcontrollers, including AURIX TriCore (ASIL-D functional safety), TRAVEO T2G, PSOC, XMC, and MOTIX motor-control SoCs/SiPs; (3) the XENSIV sensor portfolio covering radar (24/60/77-79 GHz), ToF 3D image, pressure, gas, magnetic, and MEMS microphones; and (4) embedded security and smart-card ICs under the OPTIGA (TPM with NIST-standardized post-quantum cryptography, eSIM, Trust, Authenticate) and SECORA (Pay, ID, Connect X wearable payments, Blockchain) brands, plus AIROC wireless connectivity (Wi-Fi 4-7, Bluetooth).

Infineon's business model is primarily a hardware-led B2B model: it designs, manufactures and sells proprietary semiconductor components, modules and reference designs via direct enterprise sales, an extensive distributor network (Mouser, Digi-Key and others via the 'Where to buy' portal), OEM/embedded integrations (NVIDIA Jetson Thor, Siemens SENTRON 3QD2, Fox ESS PQ3-Ultra, iSOFT DRIVECORE), and self-service channels (online sampling, IPOSIM Lifetime Estimation Service on Stripe subscription). Pricing is quote-based and not publicly disclosed; recurring and one-time revenue also flows from software platforms (ModusToolbox, DRIVECORE for software-defined vehicles, iMOTION for motor control, DEEPCRAFT AI Suite), licensing royalties (security IP, MTCOS/eID-OS for government IDs), and engineering services around high-reliability and NewSpace products. The company is pursuing a deliberate pivot toward AI infrastructure power semiconductors, supported by the €5 billion Dresden Smart Power Fab (largest single investment in its history, opening July 2026 with ~€1 billion EU Chips Act subsidies), portfolio expansion through acquisitions (GaN Systems 2023, 3db Access 2023, ams OSRAM non-optical sensor portfolio 2026), and price increases on automotive/industrial power semiconductors effective July 1, 2026 alongside STMicroelectronics and Vishay.

Name

Infineon Technologies

Legal name

Infineon Technologies AG

Website

https://infineon.com

Company type

Public

Founded year

1999

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Infineon Technologies AG is a German semiconductor company that designs and manufactures power semiconductors (silicon, SiC, GaN), automotive and industrial microcontrollers, sensors, embedded security ICs, and wireless connectivity ICs for automotive, industrial, AI/data center, and consumer customers globally.

Ownership category

akta.pro rank

Product category

Power Semiconductors & Automotive Microcontrollers

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN) (HDAHAAAK)

akta.pro secondary industries

Power Modules (IGBT/MOSFET/SiC/GaN Modules) (HDAHAHAH), Advanced SoCs & Application Processors (HDAHAAAB), Optoelectronic Components (LEDs, photodiodes, optocouplers, optical sensors) (IMAGAJAF)

Keywords

• Power semiconductors
• Automotive microcontrollers
• Silicon carbide
• Gallium nitride
• Embedded security

Headquarters

HQ city

Neubiberg

HQ country

Germany

HQ region

Europe

Offices11 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Infrastructure, Supply Chain, Personnel, Marketing or Sales, Operations

Revenue model

1. Semiconductor hardware sales: Primary revenue stream: sale of proprietary semiconductor components, modules, and reference designs (power MOSFETs/IGBTs/SiC/GaN, microcontrollers, sensors, security controllers, wireless, transceivers, USB-C/PD controllers) shipped globally to automotive, industrial, AI/data center, consumer, communications, and security customers via direct sales and channel partners. Infineon's website states ~€15Bn in annual revenue.
2. Design-in licensing, software tools and SDKs: Recurring and one-time revenue from embedded software platforms (ModusToolbox™, DRIVECORE™, iMOTION™, DEEPCRAFT™ AI Suite), reference designs, evaluation kits, IPOSIM online simulation tools, IPOSIM Lifetime Estimation Service (with Stripe payment processing), and SECORA™ Wallet/Token Requestor software stacks that ship with hardware.
3. Licensing royalties and design-services: Revenue from licensed security IP, MTCOS and eID-OS operating systems for government IDs, embedded security IP for smart cards, and engineering/custom services around high-reliability and NewSpace products, often packaged with hardware sales.
4. After-sales pricing actions and capacity-driven revenue uplift: Infineon issued a fresh round of price increases on power semiconductors effective July 1, 2026 (alongside STMicroelectronics and Vishay), and is raising planned capex to €2.7B and AI data-center revenue guidance to ~€1.5B in FY2026 and ~€2.5B in FY2027, indicating ASP/mix-driven upside on top of unit volumes.

Pricing tiers

Go-to-market motion1 record

Distribution channels7 records

Core offering

Infineon Technologies AG designs and manufactures semiconductor solutions spanning power semiconductors (silicon IGBTs/MOSFETs, CoolSiC silicon carbide, CoolGaN gallium nitride), automotive and industrial microcontrollers (AURIX TriCore, PSOC, TRAVEO T2G, XMC, MOTIX motor control SoCs), sensors (XENSIV radar, pressure, gas, ToF, MEMS microphones), embedded security controllers (OPTIGA TPM, SECORA payment/ID), and wireless connectivity (AIROC Wi-Fi/Bluetooth). The portfolio targets automotive, industrial, AI data center, consumer electronics and security customers globally.

Product overview

Infineon Technologies AG operates a broad semiconductor and system solutions platform organized around four major technology pillars: power semiconductors (including the CoolSiC™ silicon carbide, CoolGaN™ gallium nitride, OptiMOS™, IGBT and EasyPACK/HybridPACK power module families), automotive and industrial microcontrollers (AURIX™ TriCore™, PSOC™, TRAVEO™ T2G, XMC™, MOTIX™ motor control SoCs), security and smart card ICs (OPTIGA™ embedded security, SECORA™ payment/ID/ticketing solutions, Calypso® and CIPURSE™ products), and wireless connectivity (AIROC™ Bluetooth/Wi-Fi). The portfolio is unified by software development platforms such as ModusToolbox™, DRIVECORE™ for automotive software-defined vehicles, iMOTION™ for motor control, and the DEEPCRAFT™ AI Suite for edge AI. Manufacturing is anchored by the €5 billion Smart Power Fab in Dresden (opening July 2, 2026), while recent acquisitions (ams OSRAM non-optical sensor portfolio, GaN Systems, 3db Access, NoBug Consulting) extend Infineon's reach in GaN power, UWB, IoT engineering, and analog/mixed-signal sensors.

Differentiator

Problem solved

Functional benefit

Brands

• CoolSiC™: Silicon carbide (SiC) MOSFETs, Schottky diodes, and power module product family targeting EVs, AI data centers, and industrial power conversion.
• CoolGaN™
• AURIX™
• TRAVEO™
• PSOC™
• XMC™
• OPTIGA™
• SECORA™
• AIROC™
• XENSIV™
• iMOTION™
• MOTIX™
• OPTIREG™
• DRIVECORE™
• DEEPCRAFT™
• CIPURSE™
• Calypso®
• CoolSET™
• CIPOS™
• ISOFACE™
• SEMPER™
• TEGRION™
• LITIX™
• OptiMOS™
• EZ-PD™
• EZ-USB™
• HybridPACK™
• EasyPACK™
• SmartLEWIS™
• my-d™
• NRG™
• EXCELON™

Products and services

• AURIX TriCore MCUs Automotive-grade 32-bit TriCore microcontroller family (TC2x, TC3x, TC4x generations) targeting ADAS, chassis, powertrain and body electronics with ASIL-D functional safety, embedded security, AUTOSAR support, and AURIX DRIVECORE software.
• PSOC MCUs Broad 32-bit Arm Cortex-M microcontroller portfolio including PSOC 4, PSOC 5 LP, PSOC 6, PSOC Edge (Cortex-M55/M33), PSOC Automotive, PSOC Control C3, and PSOC Multitouch lines for industrial, consumer, and automotive applications.
• TRAVEO T2G MCUs Arm Cortex-based automotive microcontroller family for body electronics and instrument cluster applications, including CYT2B, CYT4BB, CYT4BF, CYT6BJ series with AUTOSAR support.
• XMC MCUs 32-bit Arm Cortex-M industrial microcontroller family spanning XMC1000 (Cortex-M0), XMC4000 (Cortex-M4), XMC5000, and XMC7000 (Cortex-M7) for motor control, power conversion, and industrial automation.
• MOTIX motor control SoCs/SiPs System-on-Chip and System-in-Package solutions for BDC and BLDC motor control, including variants with integrated driver and MOSFETs for automotive and industrial motor applications.
• CoolSiC Silicon Carbide MOSFETs Silicon carbide MOSFET and Schottky diode portfolio spanning 400V to 3300V ratings in discretes, modules, and integrated packages, including HybridPACK Drive and EasyPACK automotive power modules targeting EV traction inverters, on-board chargers, DC-DC converters, and AI data center power.
• CoolGaN Gallium Nitride Transistors GaN HEMT and bidirectional switch portfolio including medium-voltage and high-voltage GaN transistors, GaN smart, GaN with integrated driver, and GaN bare dies for high-efficiency power conversion; backed by approximately 450 GaN patent families.
• OptiMOS Power MOSFETs N-channel power MOSFET family spanning 12V to 950V ratings with CoolMOS, OptiMOS, and StrongIRFET variants, plus automotive-qualified and small-signal MOSFET lines for EV powertrains, industrial drives, and power supplies.
• IGBTs and Power Modules Insulated gate bipolar transistor portfolio including automotive IGBT modules, bare dies, discretes, press packs, plus EasyPACK, HybridPACK Drive, and HybridPACK DSC automotive power modules for EV traction and industrial drives.
• CoolSET AC-DC Power Conversion AC-DC integrated power stage family including CoolSET System in Package (SiP), PWM, and Switch variants, plus PFC/LLC combo controllers, hybrid flyback ICs, and synchronous rectification ICs for adapters, chargers, and SMPS.
• OPTIGA Embedded Security Solutions Scalable portfolio of embedded security solutions combining hardware, software, and services including OPTIGA Authenticate, OPTIGA Connect (eSIM), OPTIGA Trust, and OPTIGA Trusted Platform Module (TPM SLB 9672 with post-quantum cryptography support).
• SECORA Security Solutions Security solution family for payment, access, ticketing, government ID, and blockchain including SECORA Blockchain, SECORA ID/ID Key, SECORA Pay/Pay Bio/Pay Green, and SECORA Connect Solutions such as the SECORA Connect X wearable payments platform.
• Calypso Products Open-standard ticketing and access control products supporting Calypso PRIME (transportation and multi-application), Calypso LIGHT (events/access control), and Calypso basic (low-cost paper tickets), ISO/IEC 14443 compliant.
• AIROC Wireless Connectivity Wireless connectivity product family including AIROC Bluetooth LE and multiprotocol, AIROC Wi-Fi + Bluetooth combos (Wi-Fi 4 through Wi-Fi 7), AIROC connected MCUs (e.g., CYW55913), and AIROC Automotive wireless.
• XENSIV Sensors Sensor portfolio covering ToF 3D image sensors, gas sensors (CO2, H2, A2L refrigerants), pressure sensors (BAP, MAP, side crash, TPMS), radar sensors (24/60/77-79 GHz), MEMS microphones, and magnetic position/speed sensors.
• DEEPCRAFT AI Suite End-to-end edge AI software suite including DEEPCRAFT AI Hub, Audio Enhancement, Model Converter, Ready Models (baby cry, cough, fall detection, factory alarm, gesture classification), Studio, and Voice Assistant for embedded ML on Infineon MCUs.
• DRIVECORE Automotive Software Platform Automotive software development platform spanning TRAVEO T2G DRIVECORE, AURIX DRIVECORE, and PSOC Automotive DRIVECORE for software-defined vehicle architectures.
• iMOTION Motor Control Platform Motor control development platform with iMOTION Development Tools (MADK) and embedded software for variable speed drives using field-oriented control on Infineon MCUs.
• ModusToolbox Software Software development platform supporting connectivity, machine learning, security, motor control, and power conversion development for Infineon MCUs, including offline installation and programming tools.

Named customers12 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration10 records

AI capability7 records

Feature13 records

Partnerships

20 partnerships are on record, tiered flagship, core and minor.

• Silicon Saxony cluster (GlobalFoundries, Bosch, X-FAB, ESMC/TSMC)flagshipStrategic or Co-development Partner · 24 June 2026Infineon is one of the 'Fab Five' anchor companies of the Silicon Saxony cluster alongside GlobalFoundries, X-FAB, Bosch and ESMC (the TSMC-led JV with Bosch and NXP). Cluster showcased at Silicon Saxony Days 2026 (2,000+ participants, up from 1,300 in 2025); Chips Act 2.0 seen as critical to future capacity.
• Amazon Web Services (AWS)flagshipTechnology or Integration · 23 June 2026Infineon and AWS launched a cloud-based platform for virtual evaluation of automotive microcontrollers built on AWS's Virtual Engineering Workbench. Reduces MCU evaluation cycles from weeks to minutes, supports hundreds of concurrent users globally, and includes Infineon's next-generation RISC-V architecture. Available to selected customers from Q3 2026.
• iSOFT Infrastructure Software Co., Ltd.coreStrategic or Co-development Partner · 21 June 2026iSOFT contributed its intelligent-driving OS as the global code baseline for AUTOSAR's Common Adaptive Platform Implementation (CAPI) at the 17th AUTOSAR Open Conference in Shanghai. Infineon highlighted integration of iSOFT middleware with its DRIVECORE platform; iSOFT's middleware is deployed across 25M+ units in 300+ vehicle models.
• Malaysian Pacific Industries Bhd (MPI)coreChannel Partner/ Reseller/ Distributor · 11 June 2026MPI completed the RM327.56 million acquisition of Infineon Technologies (Thailand) Ltd to expand into automotive-grade memory solutions; MPI invested approximately US$65 million in AI server equipment and expects AI-related products to grow from 13% to 20% of revenue, with strategic focus on SiC/GaN wide-bandgap semiconductor technologies.
• VinRoboticscoreStrategic or Co-development Partner · 9 June 2026Infineon signed a Memorandum of Understanding with VinRobotics on June 9, 2026 to explore collaboration on next-generation robotics applications, with plans to establish a co-development competency center for power electronics and control solutions for industrial and service robots.
• CDIL Semiconductors and Kaynes Semicon (India)coreChannel Partner/ Reseller/ Distributor · 9 June 2026Infineon is partnering with Mohali-based CDIL Semiconductors and Sanand-based Kaynes Semicon to transfer packaging expertise and eventually procure packaged semiconductor components from them, complementing its India Semiconductor Mission engagements and Bengaluru R&D hub expansion (3,200 → 4,500 employees by 2029).
• Siemens AGflagshipStrategic or Co-development Partner · 8 June 2026Infineon and Siemens formed a partnership in which Infineon supplies silicon carbide (SiC) power modules to Siemens for its SENTRON 3QD2 semiconductor circuit breakers for data centers, factories, and battery storage systems. The solution interrupts faults in the microsecond range — up to 1,000x faster than electromechanical breakers. Demo at PCIM Europe 2026 in Nuremberg.
• Mastercard and Visa (tokenization integration)coreTechnology or Integration · 8 June 2026Infineon's SECORA Connect X platform integrates with Mastercard and Visa tokenisation services and supports industry standards (Java Card, GlobalPlatform). Pre-certified payment applets designed to accelerate OEM product launches for smart rings, fitness trackers, and sports watches; cited market opportunity of up to 700M wearable devices by 2030.
• Fox ESScoreOEM/ Whitelabel/ Licensing Partner · 6 June 2026Infineon jointly developed the PQ3-Ultra next-generation residential energy storage system with Fox ESS using Infineon's full-SiC SMD solutions, achieving 98.78% PV grid-tied efficiency and 98.47% battery charge/discharge efficiency. Launched at SNEC 2026 in Shanghai; received certifications from TÜV Rheinland, DEKRA and TÜV NORD.
• TSMC (Dresden ESMC joint venture with Bosch and NXP)flagshipStrategic or Co-development Partner · 4 June 2026Infineon is a local-partner customer of TSMC's Dresden joint venture (ESMC, alongside Bosch and NXP), targeting 12-28nm process nodes for automotive and industrial chip production between 2027 and 2029; total Dresden investment ~€10 billion with ~€5 billion in German government subsidies.
• Ezurio (and Future Electronics)minorGTM or Marketing Partner · 4 June 2026Future Electronics hosted a 'Wi-Fi 6/6E Webinar: Boost Performance in Tough Environments' on May 28, 2026 featuring Infineon AIROC CYW55913 connected MCU, Ezurio Veda IF913 module, and Infineon OPTIGA embedded security solutions.
• NVIDIA (Jetson Thor platform integration)flagshipTechnology or Integration · 3 June 2026Infineon integrated its OPTIGA™ TPM SLB 9672 with NVIDIA's Jetson Thor platform to provide a quantum-resilient hardware root of trust for Physical AI systems (robots, autonomous machines). Includes NIST-standardized post-quantum cryptography, secure key storage, measured boot and remote attestation, aligned with EU Cyber Resilience Act and EU AI Act.
• LITEON TechnologyminorGTM or Marketing Partner · 3 June 2026LITEON will host an Industry Summit Panel at COMPUTEX 2026 featuring executives from NVIDIA, Infineon and GIGABYTE to discuss AI infrastructure trends; LITEON debuted a liquid-cooled 800 VDC Power Rack and 110kW power shelf for next-generation computing platforms including NVIDIA Vera Rubin NVL72.
• IDEX Biometrics ASA and LinxensminorStrategic or Co-development Partner · 3 June 2026Infineon is identified as a major participant in the biometric payment card market alongside IDEX Biometrics, Thales, Visa, Mastercard, and BNP Paribas; recent partnership activity includes Linxens and IDEX Biometrics collaborating on biometric smart-card solutions.
• Moore4Power consortium (62 partners, 15 EU countries)flagshipStrategic or Co-development Partner · 2 June 2026Infineon launched Moore4Power, a €91M three-year EU Chips Joint Undertaking R&D initiative led by Infineon with 62 partners from 15 European countries. Focused on heterogeneous integration of silicon, SiC and GaN technologies plus AI-assisted development tools, digital twins, and Digital Product Passport; expected to shorten development cycles from weeks to ~1 week per datasheet release.
• NVIDIAflagshipStrategic or Co-development Partner · 31 May 2026Infineon entered NVIDIA's MGX AI Factory Ecosystem to support next-generation 800 VDC power delivery architectures for AI infrastructure. The partnership introduces an 800V DC power architecture into NVIDIA's MGX ecosystem to improve energy efficiency, density and electrical infrastructure of AI data centers.
• ams OSRAM GroupflagshipStrategic or Co-development Partner · 8 February 2026Infineon agreed to acquire ams OSRAM's non-optical analog and mixed-signal sensor portfolio for €570 million in a debt-free, cash-free transaction, expected to close in Q2 2026. The acquired business is expected to generate ~€230M of revenue in 2026 and will be immediately accretive to EPS. ~230 employees (primarily R&D and business management) transfer to Infineon.
• 3db Access AGcoreStrategic or Co-development Partner · 4 October 2023Infineon acquired Zurich-based 3db Access AG, a pioneer in secured low-power ultra-wideband (UWB) technology, to enhance its portfolio for secured smart access, localization and sensing supporting IoT applications (security, location tracking, indoor navigation).
• GaN Systems Inc.flagshipStrategic or Co-development Partner · 2 March 2023Infineon acquired GaN Systems Inc. for US$830 million (announced March 2, 2023), enhancing its GaN-based power solutions portfolio and accelerating GaN technology adoption across power systems applications. The acquisition complements Infineon's ~450 GaN patent families.
• NoBug Consulting SRL and NoBug d.o.o.minorImplementation/ SI/ Consulting Partner · 1 July 2022Infineon acquired NoBug Consulting SRL and NoBug d.o.o. (engineering companies in Romania and Serbia) to enhance its IoT expertise and R&D capabilities, accelerate complex IoT product development, and strengthen cybersecurity, AI and connectivity solutions.

Scale indicators19 records

Recent moves7 records

Expansion highlights2 records

Direct peers

• STMicroelectronics: STMicroelectronics is a Franco-Italian semiconductor company that competes head-to-head with Infineon across automotive MCUs, power semiconductors (including SiC), MEMS sensors, and security ICs. It was named alongside Infineon and Vishay in the late-May 2026 triple price-hike notices to automakers, confirming its direct competitive overlap in power and automotive.
• NXP Semiconductors: NXP is a leading automotive and industrial semiconductor vendor whose portfolio — automotive MCUs, in-vehicle networking, secure connectivity, and analog — directly overlaps with Infineon's AURIX, TRAVEO, Automotive Ethernet and security offerings. NXP was also cited among the firms that issued power semiconductor price hikes to automakers in 2026.
• Renesas Electronics: Renesas is a top-tier automotive MCU and analog supplier that competes directly with Infineon's AURIX, TRAVEO and PSOC Automotive families. Bernstein cited Infineon and Renesas together as the main beneficiaries of the 'CPU renaissance' and rising AI-driven power semiconductor demand in June 2026.
• ON Semiconductor (onsemi): onsemi is a primary competitor in automotive power semiconductors, SiC, image sensors and analog, overlapping directly with Infineon's CoolSiC, IGBT, and automotive sensor portfolios. onsemi's SiC capacity expansion plans and EV traction wins make it a directly comparable peer for Infineon's automotive power business.
• ROHM Semiconductor: ROHM is a Japanese power semiconductor and analog vendor with a strong SiC, IGBT and discrete power portfolio directly competing with Infineon's CoolSiC, CoolGaN, OptiMOS, and IGBT product families in automotive and industrial power conversion applications.

Broad incumbents

• Texas Instruments: Texas Instruments is the largest US analog and embedded processor vendor, competing with Infineon across power management, signal chain, MCUs and automotive. TI's industrial-heavy mix and scale make it a broad incumbent benchmark for Infineon's Power & Sensor Systems and industrial segments.
• Analog Devices: Analog Devices is a broad-line analog and mixed-signal incumbent serving industrial, automotive, communications and consumer markets — overlapping with Infineon's industrial, sensor, and automotive analog portfolios. ADI's scale and signal-chain strength make it a comparable broad incumbent for valuation benchmarking.
• Microchip Technology: Microchip Technology is a broad incumbent in microcontrollers, analog, FPGA and connectivity, competing with Infineon's PSOC, XMC, AIROC and OPTIGA portfolios across industrial, IoT and embedded segments. Its established design-in base with industrial OEMs provides a useful benchmark for embedded platform economics.

Emerging players

• Wolfspeed: Wolfspeed is a pure-play silicon carbide power semiconductor company that co-developed JEDEC JC-70.2 SiC standards (JEP203, JEP204) with Infineon. As a SiC-focused competitor, it is a direct comparable for Infineon's CoolSiC traction, on-board charger, and DC-DC product lines in EV and AI power applications.
• Innoscience: Innoscience is a Chinese gallium nitride (GaN) power semiconductor company and direct legal adversary of Infineon — it has been on both the winning and losing side of multiple GaN patent infringement rulings against Infineon in Germany, the US and China. As the leading pure-play GaN competitor in Asia, it is the most relevant emerging challenger to Infineon's GaN roadmap.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat7 records

Key risks6 records

Key highlights7 records

Customer concentration

• GitHubgithub.com/infineon
• YouTubeyoutube.com/@InfineonTechnologies
• Facebookfacebook.com/Infineon
• LinkedInlinkedin.com/company/infineon-technologies
• Instagraminstagram.com/infineon_technologies
• Xx.com/Infineon

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles30 records

Subsidiaries4 records

Funding overview

Funding rounds4 records

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A17 records

Investments17 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Infineon Technologies