Kaynes Semicon

What Kaynes Semicon does

Kaynes Semicon Private Limited is an India-based Outsourced Semiconductor Assembly and Test (OSAT) platform and a wholly-owned subsidiary of publicly listed Kaynes Technology India Limited (NSE: KAYNES). Incorporated in 2024 and headquartered in Sanand, Gujarat, the company operates a phased OSAT facility comprising a 1,200 sq m operational pilot and 19,000+ sq m of cleanroom infrastructure under development, structured across three units. Its core offering spans assembly, packaging, test, and reliability engineering for power semiconductors and advanced modules, including Quad Flat No-leads (QFN), Small Outline Transistor (SOT), Transistor Outline (TO), Ball Grid Array (BGA), Flip Chip BGA (FCBGA), Flip Chip CSP (FCCSP), Multi-Chip Modules (MCM), System in Package (SiP), and Co-Packaged Optics (CPO). The company shipped India's first commercial Multi-Chip Module (IPM5, integrating 17 dies) to Alpha & Omega Semiconductor in October 2025, and the facility was formally inaugurated by the Prime Minister on March 31, 2026, with a targeted capacity of over 6.3 million chips per day.

Name

Kaynes Semicon

Legal name

Kaynes Semicon Private Limited

Website

https://kaynessemicon.com

Company type

Private

Founded year

2024

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Kaynes Semicon is an India-based OSAT platform providing advanced semiconductor assembly, packaging, testing, and reliability engineering for power electronics, automotive, industrial, and security-sensitive applications, with a flagship Sanand facility and an anchor customer pipeline concentrated in Japan and the US.

Ownership category

akta.pro rank

Product category

Semiconductor Backend Manufacturing (OSAT)

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)

Keywords

• Semiconductor assembly services
• OSAT packaging solutions
• Chip testing validation
• Multi-chip module manufacturing
• Post-quantum cryptography personalization

Headquarters

HQ city

Sanand

HQ country

India

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Infrastructure, Technology or R&D, Supply Chain, Personnel, Operations

Revenue model

1. Semiconductor Assembly and Test Services: OSAT services for outsourced semiconductor assembly, packaging, testing, and reliability engineering. Capacity of over 2 billion units annually with targeted revenue of $60 million for FY27 and order pipeline of Rs 8,300 crore.
2. GaN Fabrication and Micro-LED Joint Ventures: Future revenue streams from planned GaN fabrication facility and micro-LED joint venture under ISM 2.0 evaluation

Go-to-market motion2 records

Distribution channels3 records

Marketing channels8 records

Core offering

Kaynes Semicon provides Outsourced Semiconductor Assembly and Test (OSAT) services spanning semiconductor packaging, assembly, testing, and reliability engineering for industrial-scale semiconductor programs. The company manufactures advanced packaged products including Intelligent Power Modules (MCMs), System-in-Package (SiP), Co-Packaged Optics (CPO), and discrete packaging platforms (QFN, SOT, TO, BGA, FCBGA, FCCSP). It also delivers post-silicon engineering, reliability testing and failure analysis, design services through its Systems Solutions Group and ODM arm, and India's first operational post-quantum cryptography chip personalization service via its SEALKAYNESQ joint venture with SEALSQ.

Product overview

Kaynes Semicon operates as an advanced semiconductor backend manufacturing platform offering Outsourced Semiconductor Assembly and Test (OSAT) services through its facility in Sanand, Gujarat. The company's integrated portfolio spans packaging platforms (QFN, SOT, TO packages), semiconductor modules (BGA, FCBGA, FCCSP), and specialized solutions including Multi-Chip Modules (MCM), System in Package (SiP), and Co-Packaged Optics (CPO). Supporting engineering services include R&D, Post-Silicon Engineering, Reliability Engineering & Failure Analysis, Systems Solutions Group (SSG), and Original Design Manufacturer (ODM) capabilities. A key differentiator is the SEALKAYNESQ joint venture with SEALSQ for Post-Quantum Cryptography Personalization services. The company manufactures Intelligent Power Modules for electric vehicles, industrial automation, and clean energy applications, having achieved India's first commercially manufactured multi-chip module in October 2025.

Differentiator

Problem solved

Functional benefit

Products and services

• Outsourced Semiconductor Assembly and Test (OSAT) Backend semiconductor manufacturing service providing assembly, packaging, testing and reliability engineering for industrial-scale semiconductor programs at the Sanand, Gujarat pilot facility (1,200 sq m operational, 19,000+ sq m cleanroom under development).
• Intelligent Power Modules (IPMs) / Multi-Chip Modules (MCM) Multi-chip modules integrating multiple dies (IGBTs, controller ICs, FRDs, diodes) into a single package for electric vehicles, industrial automation, consumer electronics and clean energy systems.
• Quad Flat No-leads (QFN) Packages Substrate-based leadless packaging platform for discrete semiconductor devices used in power electronics and industrial systems.
• Small Outline Transistor (SOT) Packages Surface-mount packaging format for transistors and discrete semiconductors intended for industrial and power applications.
• Transistor Outline (TO) Packages Through-hole and bolt-down packaging platform for discrete power devices such as MOSFETs, IGBTs and rectifiers.
• Ball Grid Array (BGA) Packages Area-array packaging platform supporting higher pin counts and improved electrical/thermal performance for semiconductor modules and emerging compute platforms.
• Flip Chip Ball Grid Array (FCBGA) Packages Flip-chip BGA packaging using bumps for direct die-to-substrate interconnect, supporting high I/O density and high-frequency performance.
• Flip Chip Chip Scale Package (FCCSP) Chip-scale flip-chip packaging for compact, high-performance devices used in mobile, RF, and compute applications.
• System in Package (SiP) System-level integration packaging combining multiple functional blocks (logic, memory, passives) within a single package for compact, high-performance system modules.
• Co-Packaged Optics (CPO) Advanced packaging integrating optical engines alongside switching silicon to deliver high-bandwidth, low-power, low-latency interconnects for AI clusters, hyperscale data centers and networking applications.
• Post-Quantum Cryptography Chip Personalization Secure semiconductor assembly, testing and cryptographic provisioning service delivered through the SEALKAYNESQ JV with SEALSQ Corp, embedding NIST-standardized post-quantum cryptography algorithms into silicon for IoT, identity, government and critical infrastructure customers.
• India's First MEMS Microphone MEMS microphone produced through the Kaynes-Infineon collaboration, combining Infineon's device expertise with Kaynes Semicon's OSAT backend manufacturing.
• R&D and Process Engineering Services Packaging technology and process engineering research and development supporting semiconductor product development from device integration through qualification and production release.
• Post-Silicon Engineering Services Silicon validation and characterization services to understand device behavior after fabrication, supporting customer bring-up and yield optimization.
• Reliability Engineering & Failure Analysis Services Reliability testing and failure analysis services ensuring semiconductor performance under demanding conditions, including HTOL, HAST and temperature cycling tests.
• Systems Solutions Group (SSG) System-level integration and module development services enabling customers to move from silicon to finished system realization, anchored in the Bangalore engineering office.
• Original Design Manufacturer (ODM) Proprietary IP and design services in digital technologies providing customers with custom semiconductor design solutions.

Quantifiable outcome

• India's first commercial multi-chip module shipped to Alpha & Omega Semiconductor
• +3 more outcomes

Named customers5 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Eleven partnerships are on record, tiered core and minor.

• Infineon TechnologiescoreTechnology or Integration · 9 June 2026Partnership for packaging expertise transfer with plans to eventually procure packaged semiconductor components. Also collaborating on India's first MEMS microphone launched by Kaynes and Infineon.
• Trident Techlabs / Techlabs SemiconductorminorStrategic or Co-development Partner · 31 March 2026Strategic partnership through Techlabs Semiconductor wholly-owned subsidiary to offer end-to-end semiconductor solutions combining design services with manufacturing infrastructure. Joint showcase at VLSID 2026.
• SVNIT SuratminorStrategic or Co-development Partner · 26 March 2026MoU for bridging academia-industry gap. Initiatives include skill development through internships, knowledge exchange via industry-led lectures, and curriculum alignment with global packaging practices.
• optoMLminorChannel Partner/ Reseller/ Distributor · 24 February 2026MoU for wafer assembly and testing services. Fabless semiconductor startup with 12nm TSMC tapeout using Kaynes for assembly and testing once wafers are delivered.
• SiMa.aiminorStrategic or Co-development Partner · 15 January 2026Strategic partnership to accelerate Physical AI innovation in India. Co-developing defense-focused AI solutions, designing production reference boards for MLSoC platforms, enabling Make in India electronic systems for industrial automation, robotics, automotive, aerospace, and defense.
• MeitY (Ministry of Electronics and Information Technology)coreOthers · 12 January 2026Alignment with MeitY framework for India Semiconductor Mission. Government partnership for fiscal support and policy framework enabling semiconductor manufacturing development.
• SEALSQ CorpcoreStrategic or Co-development Partner · 9 January 2026Joint venture SEALKAYNESQ Ltd (51% SEALSQ, 49% Kaynes) to establish India's first secure semiconductor design, test, and personalization center focused on post-quantum cryptography at Sanand facility. SEALSQ provides Quantum Shield technology and PQC expertise; Kaynes provides OSAT manufacturing infrastructure. Targets up to 300 million post-quantum secure semiconductors annually.
• Alpha and Omega Semiconductor (AOS)coreChannel Partner/ Reseller/ Distributor · 15 October 2025Anchor customer committed to bulk of initial OSAT output. 5-year agreement for 10 million IPMs annually. First India-made multi-chip modules shipped to AOS headquarters in Sunnyvale, California.
• Mitsui & CocoreStrategic or Co-development Partner · 29 September 2025Strategic partnership for semiconductor back-end manufacturing. Mitsui supports Kaynes OSAT launch, manages raw material procurement, has exclusive rights for product commercialization and market access, with provisions to acquire Kaynes Semicon shares at future stage.
• AOI ElectronicscoreTechnology or Integration · 29 September 2025Japanese technology partner providing OSAT technology transfer and technical expertise for setting up production lines. Supports Kaynes in establishing semiconductor backend manufacturing operations.
• India Semiconductor MissioncoreOthers · 29 September 2025Government program providing fiscal support under semiconductor development framework. Kaynes Semicon signed Fiscal Support Agreement enabling eligible fiscal support as per scheme guidelines.

Scale indicators7 records

Recent moves7 records

Expansion highlights7 records

Broad incumbents

• Amkor Technology: US-headquartered leading OSAT provider with extensive assembly and test capabilities, particularly strong in advanced packaging for automotive, mobile, and AI applications. Comparable end-to-end backend semiconductor services footprint to Kaynes including flip-chip, BGA, MEMS, and SiP packaging.
• JCET (Jiangsu Changjiang Electronics Technology): China's largest OSAT, formed via STATS ChipPAC acquisition, providing IC packaging and test including flip-chip, BGA, fan-out wafer-level packaging, and 2.5D/3D advanced packaging. Competes with Kaynes in advanced packaging services for global semiconductor customers.
• ASE Technology Holding: Taiwan-based world's largest OSAT provider offering IC packaging, test, and assembly services including advanced packaging platforms (SiP, 2.5D/3D, Fan-Out). Directly comparable in core OSAT offerings to Kaynes Semicon, with significantly greater scale, customer base, and advanced packaging capability.

Direct peers

• UTAC Holdings: Singapore-headquartered OSAT with strong automotive and industrial semiconductor packaging capabilities including QFN, BGA, and power modules. Comparable in target end-markets (automotive, industrial) and in emerging-Asia OSAT positioning relative to Kaynes Semicon.
• SPEL Semiconductor: India-based semiconductor assembly and test provider with established operations in packaging ICs including PDIP, SOIC, and QFN packages. Comparable legacy OSAT service offering to Kaynes' packaging platforms (QFN, SOT, TO) for industrial and consumer applications.
• Powertech Technology Inc. (PTI): Taiwan-based OSAT specializing in IC packaging and test services, with strong presence in memory packaging, BGA, and power semiconductor packaging. Directly comparable in OSAT service model and power semiconductor focus overlapping with Kaynes' IPM and power module work.
• Sahasra Semiconductors: India-based OSAT player operating manufacturing under ISM incentives, focused on semiconductor assembly and packaging for industrial, automotive, and power applications. Direct domestic competitor to Kaynes Semicon targeting the same Indian OSAT opportunity.
• Tongfu Microelectronics (TFME): China-based OSAT providing IC packaging and test including advanced flip-chip, BGA, and fan-out packaging. Competes with Kaynes in offering similar OSAT services to global semiconductor customers and has comparable product portfolio across packaging platforms.
• Tata Electronics (Tata Semiconductor): India-based semiconductor manufacturing subsidiary of Tata Group, building OSAT and assembly operations including a Morigaon facility under ISM. Most direct India-based OSAT competitor to Kaynes, sharing sovereign Indian semiconductor positioning, ISM policy backing, and automotive/industrial customer targets.

Emerging players

• Hana Microelectronics: Thailand-headquartered OSAT providing IC assembly and test including power modules, QFN, BGA, and MEMS packaging. Comparable in mid-tier OSAT service offerings and emerging Asia geographical positioning relative to Kaynes' Japan/APAC export focus.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/kaynessemicon
• LinkedInlinkedin.com/company/kaynes-semicon
• Instagraminstagram.com/kaynessemicon

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Kaynes Semicon