What Sahasra Semiconductors Private Limited does

Sahasra Semiconductors Private Limited (SSPL) is India's first private NAND FLASH IC packaging and testing company, operating an ATMP (Assembly, Testing, Marking & Packaging) facility with clean rooms at the ELCINA Electronics Manufacturing Cluster in Bhiwadi, Rajasthan. The company's core technology is conventional semiconductor back-end packaging: it runs COB (Chip on Board), MicroSD Card, eMMC (embedded Multi Media Card), and BGA (Ball Grid Array) packaging lines equipped with Laser Marking, Laser Cutting, Saw Singulation & Pick and Place, Wafer Back Grinder, Dicing Saw, Die Bonder, and microSD Tester equipment. The end products are packaged NAND FLASH memory components serving digital cameras, IoT devices, mobile phones, SSDs, telecom equipment, automotive electronics, dashcams, data servers, and DRAM modules.

SSPL generates revenue through two related channels. The primary channel is fee-for-service NAND FLASH IC packaging and testing sold to Indian and overseas OEM customers, with pricing not publicly disclosed and likely negotiated on a per-project or volume basis. A secondary channel flows through Sahasra Group affiliates that already manufacture USB Drives, Micro SD cards and SSDs and distribute them via e-commerce and retail partners — this provides backward/forward integration but is not directly attributed to SSPL. The company began sample production in March 2023, targeting mass manufacturing from September 2023, and has 27 employees as of the latest firmographic data. SSPL is one of only 2 domestic companies approved by the Government of India under both the PLI Scheme and SPECS for the Specified Electronic Components Segment, and has additionally secured a customized incentive package and land registration approval from the Government of Rajasthan, plus a PLI White Goods approval for LED Driver-IC Packaging. It is a subsidiary of the Sahasra Group (conglomerate founded 2000, 6 businesses) and is led by Mr. Amrit Manwani (CMD, Sahasra Group), Mr. Varun Manwani (Director), Mr. Parvez A. Khan (Director, Design & Engineering), and Mr. Jerry S. Enriquez (Business Unit Head).

Name

Sahasra Semiconductors Private Limited

Legal name

Sahasra Semiconductors Pvt. Ltd.

Website

https://sahasrasemi.com

Company type

Private

Founded year

2000

Operating status

Operating

Headcount range

11–50 employees

Short description

Sahasra Semiconductors is India's first private NAND FLASH IC packaging and testing company, operating an ATMP facility in Bhiwadi, Rajasthan. It provides COB, MicroSD, eMMC, and BGA packaging services to Indian and overseas OEM customers across consumer, automotive, and enterprise storage segments.

Ownership category

akta.pro rank

Product category

Semiconductor IC Packaging Services

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• NAND FLASH IC packaging
• Semiconductor ATMP services
• IC testing services
• Memory packaging solutions
• BGA eMMC packaging

Headquarters

HQ city

Bhiwadi, Distt. Alwar

HQ country

India

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Infrastructure, Personnel, Operations, Supply Chain, Marketing or Sales

Revenue model

1. NAND FLASH IC Packaging Services: Provides IC packaging and testing services for NAND FLASH memory products including COB, Micro SD cards, eMMC, and BGA packages. Revenue is generated through service fees for assembly, testing, marking and packaging operations for third-party semiconductor companies.
2. Memory Product Manufacturing: Through Sahasra Group entities, manufactures USB Drives, Micro SD cards and SSDs for Indian and overseas OEM customers, generating product revenue from direct hardware sales.

Go-to-market motion1 record

Distribution channels3 records

Marketing channels1 record

Core offering

Sahasra Semiconductors provides NAND FLASH IC packaging and testing services through its ATMP (Assembly, Testing, Marking & Packaging) facility in Bhiwadi, Rajasthan. The company packages semiconductor dies into COB (Chip on Board), MicroSD cards, eMMC, and BGA formats, serving OEM customers in digital cameras, IoT, mobile, SSD, telecom, automotive, dashcam, data server, and DRAM module markets. It also leverages backward integration with Sahasra Group entities that manufacture USB drives, MicroSD cards, and SSDs.

Product overview

Sahasra Semiconductors offers NAND FLASH IC packaging and testing services through its ATMP (Assembly, Testing, Marking & Packaging) facility in Bhiwadi, Rajasthan. The company provides a portfolio of products including COB (Chip on Board), MicroSD Cards, eMMC (embedded Multi Media Card), and BGA packaging solutions. These products serve market segments including digital cameras, IoT devices, mobile phones, SSDs, telecom equipment, automotive electronics, dashcams, data servers, and DRAM modules. Sahasra is India's first and only private company to offer NAND FLASH IC packaging services, positioning it uniquely in the domestic semiconductor ecosystem.

Differentiator

Problem solved

Functional benefit

Products and services

• COB (Chip on Board) Packaging Chip on Board IC packaging service providing compact integration of semiconductor dies onto substrates for various electronic applications. Targeted at OEMs requiring compact memory integration.
• MicroSD Card Packaging and Testing Micro Secure Digital memory card packaging and testing services for consumer electronics and embedded applications, compliant with SD Association standards. Targeted at OEMs in digital cameras, IoT, mobile, and dashcam segments.
• embedded Multi Media Card (eMMC) Packaging
• BGA (Ball Grid Array) Packaging
• NAND FLASH IC Packaging and Testing Services (ATMP)

Segments3 records

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature3 records

Partnerships

Four partnerships are on record, tiered core, supporting and minor.

• Sahasra Electronics Pvt. Ltd.coreOthersPart of the Sahasra Group conglomerate. Sahasra Electronics Pvt. Ltd. (Unit-1) provides Electronics Manufacturing Services (EMS) and represents backward integration for the semiconductor packaging business.
• Infopower Technologies Pvt. Ltd.supportingOthersPart of the Sahasra Group. Infopower Technologies specializes in PCB Manufacturing and Electronics Manufacturing Services (EMS), providing complementary manufacturing capabilities within the group ecosystem.
• Sahasra Electronic Solutions LimitedsupportingOthersPart of the Sahasra Group. Sahasra Electronic Solutions Limited focuses on IT Products and Motherboards, representing downstream integration within the electronics manufacturing value chain.
• Sahasra Electronics Rwanda Pvt. Ltd.minorOthersPart of the Sahasra Group. Located in Rwanda, this entity focuses on LED Lighting and Solar Systems, representing geographic expansion and diversification within the group.

Scale indicators4 records

Recent moves8 records

Expansion highlights6 records

Emerging players

• Tessolve: India-based semiconductor engineering and test services company (part of Hero Electronix) providing test, packaging, and validation services; an emerging domestic peer overlapping with Sahasra's ATMP and testing capabilities within the Indian ecosystem.
• Kaynes Semicon: India-based semiconductor manufacturing entity of Kaynes Technology focused on OSAT and packaging services for the domestic market; an emerging domestic competitor within India's nascent semiconductor packaging ecosystem.

Broad incumbents

• ASE Technology Holding: World's largest outsourced semiconductor assembly and test (OSAT) provider, offering IC packaging and testing services including BGA and memory packaging directly comparable to Sahasra's offerings but at global scale and with a broader portfolio.
• Powertech Technology (PTI): Taiwan-based OSAT specializing in memory IC packaging and testing, including NAND flash packaging services directly comparable to Sahasra's COB, MicroSD, eMMC, and BGA offerings.
• JCET Group: China's largest OSAT provider offering comprehensive semiconductor packaging and testing services including memory and BGA packages; a major global incumbent with scale advantages in cost-competitive packaging.
• Amkor Technology: Major US-headquartered OSAT provider with extensive advanced packaging capabilities including flip-chip BGA, memory packaging, and test services; a benchmark global incumbent against which Sahasra will compete for OEM packaging contracts.

Others

• Micron Technology: Major global NAND flash memory producer and a potential wafer supplier or customer for Sahasra's NAND IC packaging services; comparable in the NAND memory value chain but operating as an upstream memory device manufacturer rather than a packaging services provider.
• Western Digital (SanDisk): Global NAND flash memory producer through its SanDisk business; a potential wafer supplier or customer for Sahasra's NAND IC packaging services and part of the same NAND memory value chain.

Regional players

• Hana Microelectronics: Thailand-headquartered semiconductor assembly and test services provider with a regional Asia-focused footprint; comparable in offering IC packaging services but operating primarily in a different geography from Sahasra's India base.

Direct peers

• Tata Electronics: Indian semiconductor ATMP and assembly operations being built by Tata Group; the only other domestic company approved by GOI for the Specified Electronic Components Segment under PLI and SPECS, making it the closest direct competitor in the Indian NAND/IC packaging landscape.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/sahasra-semiconductor-private-limited

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Sahasra Semiconductors Private Limited