Mosaic Microsystems
Mosaic Microsystems is a Rochester, NY-based microelectronics and photonics packaging company that uses proprietary VIAFFIRM® temporary bond technology to produce thin glass substrates and through-glass vias for semiconductor, RF, photonics, MEMS, and defense customers.
- Company typePrivate
- Founded2016
- HeadquartersRochester, United States
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Mosaic Microsystems does
Mosaic Microsystems is a microelectronics and photonics packaging company founded in 2016 in Rochester, NY, specializing in thin glass substrates and through-glass via (TGV) technology for advanced semiconductor packaging. The company's core innovation is the proprietary VIAFFIRM® temporary bond process, which temporarily bonds thin, flexible glass (≤200μm, even below 100μm) to a rigid handle wafer, allowing fragile thin glass to be processed using standard semiconductor manufacturing equipment with bond stability above 400°C and mechanical debonding. Mosaic produces a range of products at varying integration levels: bare thin glass on handle wafers, custom TGV-patterned wafers with via diameters ≤35μm, copper-filled and planarized vias, and fully metallized thin glass wafers in 100mm–300mm formats. The company holds an exclusive license from Corning Incorporated for thin glass handling solutions, which underpins its domestic US supply position for thin glass interposers.
The business operates a B2B enterprise sales model targeting semiconductor, RF/millimeter-wave, photonics, MEMS, sensing, and defense customers. Revenue is generated through three streams: hardware sales of thin glass wafer products at varying levels of integration, custom development services for advanced packaging solutions, and government contracts via DoD SBIR/STTR programs and challenge awards such as the $1M DBX Microelectronics Challenge. Pricing is quote-based and not publicly disclosed. Customers and partners named in public materials are predominantly institutional: the Department of Defense, AIM Photonics (TAP facility in Rochester), GE Research, University of Florida's MnM Lab, and Axus Technology as a process integration partner.
The company has secured approximately $2.45M in disclosed equity and grant funding since 2020 — a $2M seed round led by BlueSky Capital with Corning participation, a $250K investment from Empire State Development's New York Ventures, and a $1M DBX award — alongside multiple NSF, NASA, and AFRL/AFWERX SBIR/STTR awards. With roughly 15–20 employees and operations centered at Eastman Business Park in Rochester, Mosaic is led by CEO Christine Whitman (former CVC Products CEO) with co-founders Shelby Nelson (now Senior Fellow) and Paul Ballentine. The company executed a strategic leadership restructuring in April 2025 promoting David Levy to CTO/VP R&D and Brian Harding to VP Manufacturing, signaling preparation for commercial scale-up.
Mosaic Microsystems firmographics
Firmographics- Name
- Mosaic Microsystems
- Legal name
- Mosaic Microsystems, LLC
- Website
- https://mosaicmicro.com
- Company type
- Private
- Founded year
- 2016
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Mosaic Microsystems is a Rochester, NY-based microelectronics and photonics packaging company that uses proprietary VIAFFIRM® temporary bond technology to produce thin glass substrates and through-glass vias for semiconductor, RF, photonics, MEMS, and defense customers.
- Ownership category
- akta.pro rank
Mosaic Microsystems industry classification
Industry- Product category
- Semiconductor Packaging Substrates
- NAICS
- Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)
- akta.pro primary industry
- Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)
- akta.pro secondary industry
- Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)
Keywords
Where Mosaic Microsystems is headquartered
LocationHeadquarters
- HQ city
- Rochester
- HQ country
- United States
- HQ region
- North America
Offices3 records
Markets served
Mosaic Microsystems business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Technology or R&D, Infrastructure, Operations, Marketing or Sales, Supply Chain
Revenue model
- Thin Glass Product Sales: Sale of thin glass wafers with various integration levels including: thin glass bonded to handle wafers, thin glass with custom TGV patterns, copper-filled/planar vias, and metallized thin glass wafers. Products sold in standard diameters up to 200mm (300mm demonstrated).
- Government Contracts (DoD SBIR/STTR): Revenue from Department of Defense Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) contracts, including Phase I and Phase II awards for developing glass interposer technology for defense applications.
- Custom Development Services: Custom design and development services working closely with customers to provide unique solutions for advanced packaging needs, including custom TGV patterns and integration solutions.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quote-based pricing |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels5 records
Mosaic Microsystems product offering
Product offeringCore offering
Mosaic Microsystems manufactures thin glass wafers and substrates for microelectronics and photonics packaging. Using its proprietary VIAFFIRM® temporary bond technology, the company handles ultra-thin glass (≤200μm, down to 100μm) on rigid handle wafers so customers can process them with standard semiconductor equipment. Products are sold at multiple integration levels, including bare thin glass bonded to handle wafers, thin glass with custom through-glass vias (TGV), copper-filled/planar vias, and metallized thin glass wafers in diameters up to 200mm (300mm demonstrated).
Differentiator
Problem solved
Functional benefit
Products and services
- Thin Glass Wafer (Bonded to Handle Wafer)
Quantifiable outcome
- Glass enables order of magnitude reduction in loss performance for radar arrays when combined with innovative metaconductor technology
- +2 more outcomes
Companies that use Mosaic Microsystems
Customer profileNamed customers4 records
Segments5 records
Ideal customer profiles3 records
Mosaic Microsystems technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Mosaic Microsystems partnerships and signals
Strategic signalPartnerships
Four partnerships are on record, tiered core and strategic.
- AIM PhotonicscoreCollaboration on glass-based electronic and photonic interposers under DoD Phase II SBIR contract. Mosaic is working with AIM Photonics' Test, Assembly and Packaging (TAP) facility in Rochester, NY to demonstrate integration of fiber optics, waveguides, and photonic integrated circuits with glass interposers.
- University of Florida (MnM Lab)strategicSTTR Phase I award collaboration to develop ultra-low loss glass-based radar array technology. Combines Mosaic's thin glass handling with Dr. YK Yoon's innovative metaconductor technology for order of magnitude reduction in loss performance.
- Axus TechnologycoreCollaboration on thin glass wafer processing solutions including CMP, wafer thinning, and surface processing. Axus provides Crystal wafer carriers and Capstone CMP system optimized for Mosaic's Viaffirm temporary bond technology and ultra-thin fragile wafers.
- GE ResearchstrategicAFWERX Phase I SBIR collaboration to establish next generation antenna technology in Ka band for enhanced satellite communications. GE Research provides advanced RF module fabrication capabilities.
Scale indicators7 records
Recent moves6 records
Expansion highlights6 records
Mosaic Microsystems competitors and assessment
Company assessmentMarket position
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Mosaic Microsystems social profiles
Digital presenceMosaic Microsystems financial estimates
Financial estimateRevenue estimate
Valuation estimate
Mosaic Microsystems leadership team
Management profileNumber of profiles
Profiles12 records
Mosaic Microsystems funding detail
Funding detailFunding overview
Funding rounds5 records
Investors5 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Mosaic Microsystems M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Mosaic Microsystems
What does Mosaic Microsystems do?
Mosaic Microsystems manufactures thin glass wafers and substrates for microelectronics and photonics packaging. Using its proprietary VIAFFIRM® temporary bond technology, the company handles ultra-thin glass (≤200μm, down to 100μm) on rigid handle wafers so customers can process them with standard semiconductor equipment. Products are sold at multiple integration levels, including bare thin glass bonded to handle wafers, thin glass with custom through-glass vias (TGV), copper-filled/planar vias, and metallized thin glass wafers in diameters up to 200mm (300mm demonstrated).
Is Mosaic Microsystems a public or private company?
Mosaic Microsystems is a private company. It is classified as venture growth investor backed and is currently operating.
When was Mosaic Microsystems founded?
Mosaic Microsystems was founded in 2016. It employs 11 to 50 people.
Where is Mosaic Microsystems based?
Mosaic Microsystems is headquartered in Rochester, United States, in the North America region.
How does Mosaic Microsystems make money?
Three revenue lines are on record. Thin Glass Product Sales are the primary driver. The others are government Contracts (DoD SBIR/STTR) and custom Development Services.
Does Mosaic Microsystems have an API?
No public API is recorded for Mosaic Microsystems.
What industry is Mosaic Microsystems in?
Mosaic Microsystems's product category is Semiconductor Packaging Substrates. Its primary akta.pro industry code is HDAHADAE, Package Substrates & Interposers (ABF/BT, Silicon/Glass), with a secondary code of HDAHACAH, Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim). Its NAICS code is 333242.