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MediaTek

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uuid00024yt

Namestring
MediaTek
Legal namestring
MediaTek Incorporated
Websiteurl
mediatek.com
Company typeenum
Public
Founded yearint
1997
Descriptiontext

MediaTek Incorporated is a Taiwanese fabless semiconductor company founded in 1997 and listed on the Taiwan Stock Exchange (TWSE: 2454), headquartered at Hsinchu Science Park. The company designs system-on-chip (SoC) platforms spanning smartphones (Dimensity 5G, Helio 4G), smart TVs (Pentonic), Chromebooks and tablets (Kompanio), Wi-Fi connectivity (Filogic), IoT and edge AI (Genio), automotive cockpits (Dimensity Auto), and custom data-center ASICs. Its architecture combines Arm-based CPU cores, in-house MediaTek NPUs, integrated GPUs, 5G modems, and proprietary technology layers including HyperEngine (gaming), MiraVision (display), Imagiq (camera), and CorePilot (power/thermal), with NeuroPilot as the AI software platform integrated into Google LiteRT. MediaTek's chipsets power more than 2 billion devices annually and ship in products from Xiaomi, Oppo, Vivo, Samsung, OnePlus, Lenovo, Dell, HP, Microsoft, Amazon, Sony, and VinFast, among others. The company is the world's #1 smartphone chipset supplier and a market leader in smart home, Arm-based Chromebooks, and Android tablets.

MediaTek's revenue model is primarily unit sales of SoCs to OEMs (hardware_sales), supplemented by custom ASIC/royalty revenue from cloud and data-center customers such as Google (TPU I/O co-design), NVIDIA (RTX Spark, Vera CPU, NVLink Fusion), and Microsoft (Project Solara). Pricing is unit-based and not publicly disclosed; the company recently issued an official price hike notice to customers for mature-process products and H2 2026 flagship chips, with the Dimensity 9600 Pro reportedly priced at ~$216 per unit (vs. $180–$200 for the prior Dimensity 9500 generation), reflecting rising TSMC wafer and packaging costs. Go-to-market is direct OEM/ODM sales to global device manufacturers, complemented by regional distributors (e.g., Braemac in ANZ for Genio IoT) and industrial system integrators (Kontron, ADLINK, Grinn). The company has launched a hiring spree in 2026 to expand engineering capacity for AI chips, cloud computing, and data-center solutions, targeting $2 billion in data-center revenue and 10–15% share of an estimated $80 billion addressable market by 2027.

Short descriptiontext

MediaTek is a Taiwanese fabless semiconductor company designing system-on-chip platforms for smartphones, smart TVs, Chromebooks, Wi-Fi, IoT, automotive cockpits, and data-center ASICs, shipping to global OEMs and powering more than 2 billion devices annually.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
5,001–10,000
akta.pro rankint
HeadquartersHsinchu, Taiwan
HQ citystring
Hsinchu
HQ countrystring
Taiwan
HQ regionstring
Asia
Markets served

Serves global market

Offices1 record

Each record includes

City, Country, Type, Description, Source

Keyword5 values
system on chip design, fabless semiconductor, 5G smartphone chipsets, edge AI processors, wireless connectivity SoCs
Industry6 codes
1Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS)
CodeHDAHABAAPrimaryYes
2Audio, Imaging & Multimedia SoCs (ISP/Codec/Display)
CodeHDAHABAHPrimaryNo
3System-on-Chip (SoC) Platforms (Mobile/Consumer/Embedded)
CodeHDAHAJACPrimaryNo
4Networking & Data Center Silicon (Switch/NIC/DPU/SerDes)
CodeHDAHABABPrimaryNo
5Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC)
CodeHDAHABACPrimaryNo
6Mobile Chipsets & Modems (Smartphone SoCs, Baseband)
CodeCRACALACPrimaryNo
NAICS code5 codes
  • Computer and Peripheral Equipment Manufacturing33411
  • Other Communications Equipment Manufacturing33429
  • Telephone Apparatus Manufacturing33421
  • Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services5182
  • Computer Systems Design and Related Services54151
SIC code3 codes
  • Electronic Computers3571
  • Computer Communications Equipment3576
  • Household Audio & Video Equipment3651
Product category
Fabless Semiconductor / System-on-Chip Design
Social media profiles2 records
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model3 records
1System-on-Chip (SoC) Sales
TypeHardware Sales
Description

Primary revenue stream from designing and selling fabless semiconductor chipsets (Dimensity, Helio, Pentonic, Kompanio, Genio, Filogic) to OEMs globally; powers more than 2 billion devices annually.

mediatek.com
2Custom ASIC / Data Center Silicon
TypeLicensing Royalties
Description

Custom-designed silicon for cloud, AI and data-center customers (including Google TPU I/O and NVIDIA RTX Spark co-developed CPU); targeting approximately $2 billion data center revenue with ~$80 billion addressable market and 10–15% share goal by 2027.

mediatek.com
3Product Pricing Adjustments (Mature Process)
TypeHardware Sales
Description

Price adjustments for network communication, connectivity, consumer electronics, and specialized chips starting July; products facing supply constraints and flagship chips launching H2 expected to see increases amid rising upstream wafer foundry, packaging, and material costs.

digitimes.com
Marketing channels10 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels5 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure
Pricing details3 tiers
1Dimensity 9600 Pro flagship smartphone SoC
ModelUnit PricingBilling cadencePay-as-you-go
Notes

Reported approximately $216 per unit, up from $180–$200 range of previous Dimensity 9500 models; increase attributed to 2nm N2P process node costs.

androidheadlines.com
2Mature process product lines (network communication, connectivity, consumer electronics)
ModelUnit PricingBilling cadencePay-as-you-go
Notes

Realtek and MediaTek raising prices for mature process products starting July, with Realtek increases over 10%; MediaTek adjusting prices for H2 2026 flagship chips.

bitget.com
3Supply-constrained products (semiconductor chipsets)
ModelUnit PricingBilling cadencePay-as-you-go
Notes

Products facing supply constraints expected to see price increases first; broader semiconductor industry price wave described as 'chip inflation.'

digitimes.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 8 records shown
1MediaTek Dimensity
Description

Flagship and premium 5G smartphone chipset family.

mediatek.com
+7 more records
Core offering1 text field

MediaTek designs and sells fabless system-on-chip (SoC) platforms that integrate Arm-based CPU cores, in-house NPUs for on-device AI, GPUs, and 5G/Wi-Fi modems. Its portfolio spans Dimensity and Helio smartphone chipsets, Pentonic smart TV SoCs, Filogic Wi-Fi 7/8, Genio IoT platforms, Kompanio Chromebook/tablet SoCs, Dimensity Auto automotive platforms, and custom data center ASICs co-developed with NVIDIA and Google.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 7 values shown
  • Up to 12x faster AI inference vs CPU and 10x faster vs GPU on MediaTek NPU
+6 more records
Product overview1 text field

MediaTek operates a platform-plus-modules architecture rather than a single unified product. The portfolio is organized around distinct SoC families — Dimensity (5G smartphones), Helio (4G smartphones), Pentonic (smart TVs), Filogic (Wi-Fi 7/8), Genio (IoT/edge AI), Kompanio (Chromebooks/tablets), Dimensity Auto (automotive), and the Data Center/ASIC business — which are integrated with a shared set of MediaTek technology platforms including HyperEngine (gaming), MiraVision (display/video), Imagiq (camera), CorePilot (power), and NeuroPilot (AI SDK). Standalone connectivity products (M90 5G modem, M60 RedCap modem, T930 5G broadband, Ethernet, voice-assistant and audio SoCs, BLU-RAY/DVD/STB/ODD chips, and commercial-display SoCs) round out the catalog, and a Generative AI capability layer (demonstrated with Llama 2 and Phi-3.5-mini) runs across the NPUs in the Dimensity, Genio, and Kompanio families. Partner-enabled offerings such as the NVIDIA RTX Spark personal AI supercomputer extend the platform into desktop AI computing.

Product and service10 records
1MediaTek Dimensity 5G Flagship & Premium Smartphone SoCs
CategorySmartphone SoCs
Description

Flagship and premium 5G smartphone SoC family including Dimensity 9500, 9500 Super Edition, 9500s, 9600, 9400, 8500, 7400, 7100, 6300 and 6100+. Integrates the APU 890 NPU, Generative AI, HyperEngine gaming, Imagiq camera ISP, MiraVision display, and CorePilot power management. Targeted at premium and mass-market 5G handset OEMs.

2MediaTek Helio 4G Smartphone SoCs
CategorySmartphone SoCs
Description

Mainstream 4G smartphone SoC family including Helio G200, Helio G200 Ultimate, Helio G100 Ultimate, Helio G81, and Helio G81 Ultra, targeted at 4G mid-range handset OEMs.

3MediaTek Pentonic Smart TV SoCs
CategorySmart TV SoCs
Description

Smart TV SoC family (including Pentonic 700) combining AI picture quality, high-refresh-rate display, voice control, and MiraVision video processing for premium and mainstream TV manufacturers.

4MediaTek Filogic Wi-Fi & Connectivity SoCs
CategoryConnectivity SoCs
Description

Wi-Fi 7 and Wi-Fi 8 connectivity SoC family (Filogic 8000 series and Filogic 8800) targeting home networking, broadband gateways, retail routers, and CPE platforms.

5MediaTek Genio IoT & Edge AI Platforms
CategoryIoT SoCs
Description

IoT and edge-AI SoC platform family including Genio 360, 510, 520, 700, 720, 1200, and Genio Pro 5100 (3nm, 50+ TOPS). Supports Linux and Android, multi-display, and NPU-accelerated on-device AI for industrial, retail, smart home, and commercial use cases.

6MediaTek Kompanio Chromebook & Tablet SoCs
CategoryPersonal Computing SoCs
Description

Arm-based Chromebook and tablet SoC family including Kompanio 500, 520/528, and Kompanio 540, targeting mainstream and education Chromebooks and Android tablets.

7MediaTek Dimensity Auto Automotive Cockpit & Connectivity Platform
CategoryAutomotive SoCs
Description

Automotive SoC family for cockpit, in-vehicle infotainment, telematics, and connectivity. Includes Dimensity Auto Cockpit C-X1 (3nm, up to 400 TOPS, combining MediaTek semiconductor/connectivity with NVIDIA GPU/AI), MT8678, MT8676, MT8115, MT8126, and the T930 platform.

8MediaTek Data Center / Custom ASIC Silicon
CategoryData Center ASICs
Description

Custom ASIC and compute platform business for hyperscale data centers and cloud customers, leveraging partnerships with NVIDIA (NVLink Fusion, Vera CPU, DGX Spark, RTX Spark), Google (TPU v7 Triggerfish and v9/v10 Icefish), Synopsys, and TSMC.

9NVIDIA RTX Spark Personal AI Supercomputer
CategoryPersonal Computing / AI PC
Description

Personal AI supercomputer co-developed with NVIDIA, powered by a 20-core Arm Grace CPU designed by MediaTek and Blackwell RTX GPU. Targeted at developers and AI PC use cases.

10MediaTek 5G Modems (M90, M60 RedCap)
CategoryConnectivity Modems
Description

Standalone 5G modem platforms: M90 5G modem and M60 RedCap Modem for mobile, IoT, and satellite (NTN) connectivity.

Scale indicator9 records

Each record includes

Type, Value, Description, Source

Partnership26 partners
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2026-06-18
Description

MediaTek co-investor (via UMC Capital) and strategic manufacturing partner for HyperLight's TFLN Chiplet Platform on both 6-inch and 8-inch wafers for high-volume foundry production of TFLN photonics.

Strategic tierFlagshipTypeStrategic or Co-development Partner
Description

Multi-pronged deep strategic alliance: (1) co-designed 20-core Arm Grace CPU for NVIDIA RTX Spark superchip and N1/N1X processors for Windows PCs and laptops shipping fall 2026 in devices from Dell, HP, ASUS, Lenovo, MSI, and Microsoft Surface; (2) co-development of NVIDIA Vera CPU on 3nm for data center targeting $20B revenue; (3) DGX Spark collaboration with NVIDIA Grace Blackwell GB10; (4) NVIDIA TAO integration with NeuroPilot SDK for IoT AI development; (5) NVLink Fusion ASIC partnership for custom data center silicon; (6) NVIDIA Drive Hyperion 10 collaboration for automotive Level 4 AD via VinFast partnership.

Strategic tierFlagshipTypeStrategic or Co-development Partner
Description

MediaTek collaborates with Google on: (1) TPU v7 and TPU v9 'Triggerfish' AI accelerator co-design (handling I/O and back-end design while Google retains processor core design); (2) Icefish TPU v10 design with TSMC and Samsung split manufacturing targeting 2028 mass production; (3) Project Treble for Automotive first-mover adoption on MT8678 and MT8676 providing 4+ years firmware updates; (4) Googlebook Chromebook program with MediaTek Dimensity processors; (5) LiteRT NeuroPilot Accelerator integration for unified on-device AI runtime across MediaTek NPUs.

Strategic tierFlagshipTypeStrategic or Co-development Partner
Description

MediaTek is a key silicon partner for Microsoft's Project Solara agentic AI platform for enterprise devices (alongside Qualcomm), powering two reference designs (badge and desk device). Microsoft also co-developed the RTX Spark Surface Laptop Ultra with NVIDIA and MediaTek, and presented joint Azure edge-to-cloud fine-tuning demos at Microsoft Ignite using Phi-3.5-mini on the Dimensity 9400 NPU 890.

Strategic tierCoreTypeTechnology or Integration
Description

MediaTek's primary foundry partner — manufactures Dimensity chipsets, the NVIDIA RTX Spark superchip, Google's TPU, and MediaTek's first 2nm chip on TSMC's N2P process. TSMC's 3nm process is used for RTX Spark and MediaTek's flagship chipsets; 2nm N2P node for Dimensity 9600 Pro and beyond.

Strategic tierCoreTypeTechnology or Integration
Description

Strategic technology partnership validating MediaTek's M90 5G modem platform in industry-first 3Tx 5-layer uplink configuration (670 Mbps throughput) with Samsung's virtualized RAN, Massive-MIMO radios, and Macro radios. Earlier collaboration on 5G RedCap energy efficiency testing. Samsung Galaxy Tab S11/S12 Ultra and other Samsung devices also powered by MediaTek Dimensity chipsets.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

MediaTek and DENSO are collaborating on Automotive SoCs for Advanced Driver-Assistance Systems (ADAS), combining MediaTek's semiconductor expertise with DENSO's automotive electronics leadership.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

MediaTek and NTE are leveraging the advantages of MediaTek's Dimensity Frame Rate Converter (MFRC) and HyperEngine gaming technologies to advance mobile gaming performance in NTE's title.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

MediaTek participated in Ayar Labs' $500 million Series E funding round alongside NVIDIA, AMD, and Alchip. Ayar Labs also joined NVIDIA's NVLink Fusion ecosystem; its co-packaged optics (CPO) integrate with NVIDIA AI infrastructure for hyperscalers.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

Announced collaboration at COMPUTEX 2026 for mobile AI solutions pairing Phison's Pascari aiDAPTIV memory extension and enterprise SSDs with MediaTek mobile platforms.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

E Ink is partnering with MediaTek to develop AI-capable processors for future e-readers using MediaTek MT8115 and MT8126 chips, enabling on-device AI features like real-time translation, document summaries, and voice-to-text.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Multi-year collaboration to integrate MediaTek's Dimensity AX C-X1 platform into premium automotive solutions, combining MediaTek's semiconductor and connectivity with NVIDIA GPU/AI/graphics. 3nm platform delivers up to 400 TOPS of AI computing power.

Strategic tierCoreTypeTechnology or Integration
Description

MediaTek validated Synopsys Multiphysics Fusion solutions (integrating Synopsys EDA tools with Ansys signoff engines accelerated by NVIDIA CUDA-X), achieving up to 3x faster runtimes and up to 10x faster design closure for advanced chip design.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Strategic partnership leveraging MediaTek NPU platforms for up to 176% AI performance improvement across BenQ's smart meeting, smart education, professional monitors and immersive experience product lines.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Partnered with MediaTek to develop the Speedport 7, a class-leading Wi-Fi 7 broadband gateway.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

MediaTek silicon powers ARBOR Technology's Intel Panther Lake-powered IEC-6700 edge AI platform delivering 180 TOPS, showcased at Automate 2026 with multiple AI robotics demonstrations.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

Ezurio partnered with MediaTek to develop the Tungsten HMI, a ready-to-deploy touchscreen interface panel for industrial food and beverage applications, built on the MediaTek Genio 510 platform.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

MediaTek partnered with ADLINK to create the MXA-312M smart display IoT platform, powered by MediaTek Genio 520/720.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Strategic partnership at COMPUTEX 2026 with NVIDIA and Autobrains to develop a next-generation Level 4 autonomous driving platform tailored for Southeast Asia using MediaTek Dimensity Auto silicon.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

World's first Rel-19 5G-Advanced NR-NTN connection over OneWeb LEO satellites — joint announcement demonstrating MediaTek's NR-NTN chipset capability for satellite connectivity on smartphones, cars and IoT devices.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

Partnered with NVIDIA and VinFast at COMPUTEX 2026 to bring Agentic AI software to the next-generation Level 4 autonomous driving platform.

22Grinn
Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Grinn GenioBoard edge AI SBC built on the Grinn GenioSOM-700 powered by MediaTek Genio 700, providing a complete edge-AI IoT single board computer.

mediatek.com
Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Kontron integrates MediaTek Genio IoT platform into its Smart Industry Solutions portfolio, providing industrial customers with validated, production-ready IoT systems.

Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Braemac extends distribution of MediaTek Genio IoT platforms into Australia and New Zealand markets.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Marvell designs a custom networking chip for Google's TPUv8e (Humufish) paired with MediaTek's I/O and back-end design and Intel's 18A/18AP fabrication with EMIB-based packaging; mass production by end of 2027.

Strategic tierCoreTypeOEM/ Whitelabel/ Licensing Partner
Description

NVIDIA system builder partners including Dell, HPE, Lenovo, Supermicro and IBM need increased server, memory, and chip equipment capacity driven by Vera Rubin AI chip platform full production and RTX Spark AI PC chip (co-developed with MediaTek).

Recent move8 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight7 records

Each record includes

Type, Description

Peers10 records
TypeRegional player
Description

Chinese fabless smartphone and baseband SoC designer historically competing in Huawei handsets and 5G base stations. Subject to U.S. export restrictions, HiSilicon represents a constrained regional competitor in China that overlaps with MediaTek's smartphone and networking portfolio.

TypeBroad incumbent
Description

Broad incumbent in CPU and GPU compute competing for the same AI PC and data center sockets MediaTek is targeting through NVIDIA partnerships. AMD participated in Ayar Labs' Series E alongside MediaTek, indicating shared positioning in next-generation optical interconnects for AI infrastructure.

TypeDirect peer
Description

Direct competitor in smartphone SoCs (Snapdragon) with overlapping flagship and premium tier customers including Samsung, Xiaomi, and Oppo. Both compete in 5G modems, on-device AI NPUs, and are expanding into automotive and AI PC, making Qualcomm the closest peer for MediaTek's core mobile business.

TypeBroad incumbent
Description

Broad incumbent competing with MediaTek in AI PC (Core Ultra), data center (Xeon), networking, and foundry services. Intel's Panther Lake referenced as the platform powering ARBOR's IEC-6700 edge AI device alongside MediaTek silicon, illustrating the parallel competition in compute platforms.

TypeEmerging player
Description

ASIC design services company also participating in Ayar Labs' Series E. Alchip is a comparable custom-silicon enabler for hyperscalers, making it an emerging player in the same custom data center ASIC space MediaTek is targeting.

TypeDirect peer
Description

Direct competitor in custom ASIC silicon for hyperscale data centers (Google TPU earlier generations, Meta MTIA) and in networking/wireless connectivity. Both target the same hyperscaler custom-silicon opportunity MediaTek is pursuing with its data center ASIC business.

TypeDirect peer
Description

Direct competitor in custom ASIC silicon for hyperscalers (Amazon Trainium, Google TPU networking chips) and in networking/connectivity silicon. Marvell is explicitly identified as MediaTek's partner on Google TPUv8e (Humufish), highlighting how closely the two compete in custom data center silicon.

TypeDirect peer
Description

Chinese fabless smartphone SoC designer competing with MediaTek in entry-level and mid-range 4G/5G handsets, particularly in emerging markets and for Transsion/TECNO and similar customers. Overlaps directly with MediaTek's Helio and Dimensity 6-series portfolio.

TypeDirect peer
Description

Taiwanese fabless semiconductor competitor in Wi-Fi/connectivity, audio, and TV SoCs, with overlapping customer base and recent price hike announcements similar to MediaTek's. Realtek is also actively litigating against MediaTek in U.S. federal court.

TypeDirect peer
Description

Direct competitor through Samsung's Exynos smartphone SoC family and a strategic partner validating MediaTek modems. Samsung is also a foundry partner for MediaTek's Google TPU program, illustrating the dual customer/competitor dynamic in mobile and ASIC silicon.

Market position
Strengths5 records

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Headline, Details, Source

Weaknesses5 records

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Headline, Details, Source

Competitive moat6 records

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Type, Details

Key risks6 records

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Key highlights7 records

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Customer concentration

Classification, Details

Named customers29 records

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Name, Industry, Type, Use case, Source, UUID

Segment7 records

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Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile6 records

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Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
Yes

Docs URL, Description

Integration2 records

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Title, Type, Description, Source

AI capability16 records

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Type, Description, Source

AI maturity
App detail

Has app

Feature13 records

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Core technology
Revenue estimate
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Number of profiles
Profiles13 records

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Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries2 records

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Name, Acquired on, Relationship type, Type, Business focus

Compliance1 record

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Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds1 record

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Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors2 records

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Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A7 records

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Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment47 records

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Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

MediaTek

Fabless Semiconductor / System-on-Chip Designmediatek.com

MediaTek is a Taiwanese fabless semiconductor company designing system-on-chip platforms for smartphones, smart TVs, Chromebooks, Wi-Fi, IoT, automotive cockpits, and data-center ASICs, shipping to global OEMs and powering more than 2 billion devices annually.

What MediaTek does

MediaTek Incorporated is a Taiwanese fabless semiconductor company founded in 1997 and listed on the Taiwan Stock Exchange (TWSE: 2454), headquartered at Hsinchu Science Park. The company designs system-on-chip (SoC) platforms spanning smartphones (Dimensity 5G, Helio 4G), smart TVs (Pentonic), Chromebooks and tablets (Kompanio), Wi-Fi connectivity (Filogic), IoT and edge AI (Genio), automotive cockpits (Dimensity Auto), and custom data-center ASICs. Its architecture combines Arm-based CPU cores, in-house MediaTek NPUs, integrated GPUs, 5G modems, and proprietary technology layers including HyperEngine (gaming), MiraVision (display), Imagiq (camera), and CorePilot (power/thermal), with NeuroPilot as the AI software platform integrated into Google LiteRT. MediaTek's chipsets power more than 2 billion devices annually and ship in products from Xiaomi, Oppo, Vivo, Samsung, OnePlus, Lenovo, Dell, HP, Microsoft, Amazon, Sony, and VinFast, among others. The company is the world's #1 smartphone chipset supplier and a market leader in smart home, Arm-based Chromebooks, and Android tablets.

MediaTek's revenue model is primarily unit sales of SoCs to OEMs (hardware_sales), supplemented by custom ASIC/royalty revenue from cloud and data-center customers such as Google (TPU I/O co-design), NVIDIA (RTX Spark, Vera CPU, NVLink Fusion), and Microsoft (Project Solara). Pricing is unit-based and not publicly disclosed; the company recently issued an official price hike notice to customers for mature-process products and H2 2026 flagship chips, with the Dimensity 9600 Pro reportedly priced at ~$216 per unit (vs. $180–$200 for the prior Dimensity 9500 generation), reflecting rising TSMC wafer and packaging costs. Go-to-market is direct OEM/ODM sales to global device manufacturers, complemented by regional distributors (e.g., Braemac in ANZ for Genio IoT) and industrial system integrators (Kontron, ADLINK, Grinn). The company has launched a hiring spree in 2026 to expand engineering capacity for AI chips, cloud computing, and data-center solutions, targeting $2 billion in data-center revenue and 10–15% share of an estimated $80 billion addressable market by 2027.

MediaTek firmographics

Firmographics
Name
MediaTek
Legal name
MediaTek Incorporated
Website
https://mediatek.com
Company type
Public
Founded year
1997
Operating status
Operating
Headcount range
5,001–10,000 employees
Short description
MediaTek is a Taiwanese fabless semiconductor company designing system-on-chip platforms for smartphones, smart TVs, Chromebooks, Wi-Fi, IoT, automotive cockpits, and data-center ASICs, shipping to global OEMs and powering more than 2 billion devices annually.
Ownership category
akta.pro rank

MediaTek industry classification

Industry
Product category
Fabless Semiconductor / System-on-Chip Design
NAICS
Computer and Peripheral Equipment Manufacturing (33411), Other Communications Equipment Manufacturing (33429), Telephone Apparatus Manufacturing (33421), Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services (5182), Computer Systems Design and Related Services (54151)
SIC
Electronic Computers (3571), Computer Communications Equipment (3576), Household Audio & Video Equipment (3651)
akta.pro primary industry
Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS) (HDAHABAA)
akta.pro secondary industries
Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH), System-on-Chip (SoC) Platforms (Mobile/Consumer/Embedded) (HDAHAJAC), Networking & Data Center Silicon (Switch/NIC/DPU/SerDes) (HDAHABAB), Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC), Mobile Chipsets & Modems (Smartphone SoCs, Baseband) (CRACALAC)

Keywords

  • System on chip design
  • Fabless semiconductor
  • 5G smartphone chipsets
  • Edge AI processors
  • Wireless connectivity SoCs

Where MediaTek is headquartered

Location

Headquarters

HQ city
Hsinchu
HQ country
Taiwan
HQ region
Asia

Offices1 record

Markets served

MediaTek business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

  1. System-on-Chip (SoC) Sales: Primary revenue stream from designing and selling fabless semiconductor chipsets (Dimensity, Helio, Pentonic, Kompanio, Genio, Filogic) to OEMs globally; powers more than 2 billion devices annually.
  2. Custom ASIC / Data Center Silicon: Custom-designed silicon for cloud, AI and data-center customers (including Google TPU I/O and NVIDIA RTX Spark co-developed CPU); targeting approximately $2 billion data center revenue with ~$80 billion addressable market and 10–15% share goal by 2027.
  3. Product Pricing Adjustments (Mature Process): Price adjustments for network communication, connectivity, consumer electronics, and specialized chips starting July; products facing supply constraints and flagship chips launching H2 expected to see increases amid rising upstream wafer foundry, packaging, and material costs.

Pricing tiers

ModelBillingPrice
Unit PricingPay-as-you-goDimensity 9600 Pro flagship smartphone SoC
Unit PricingPay-as-you-goMature process product lines (network communication, connectivity, consumer electronics)
Unit PricingPay-as-you-goSupply-constrained products (semiconductor chipsets)

Go-to-market motion1 record

Distribution channels5 records

Marketing channels10 records

MediaTek product offering

Product offering

Core offering

MediaTek designs and sells fabless system-on-chip (SoC) platforms that integrate Arm-based CPU cores, in-house NPUs for on-device AI, GPUs, and 5G/Wi-Fi modems. Its portfolio spans Dimensity and Helio smartphone chipsets, Pentonic smart TV SoCs, Filogic Wi-Fi 7/8, Genio IoT platforms, Kompanio Chromebook/tablet SoCs, Dimensity Auto automotive platforms, and custom data center ASICs co-developed with NVIDIA and Google.

Product overview

MediaTek operates a platform-plus-modules architecture rather than a single unified product. The portfolio is organized around distinct SoC families — Dimensity (5G smartphones), Helio (4G smartphones), Pentonic (smart TVs), Filogic (Wi-Fi 7/8), Genio (IoT/edge AI), Kompanio (Chromebooks/tablets), Dimensity Auto (automotive), and the Data Center/ASIC business — which are integrated with a shared set of MediaTek technology platforms including HyperEngine (gaming), MiraVision (display/video), Imagiq (camera), CorePilot (power), and NeuroPilot (AI SDK). Standalone connectivity products (M90 5G modem, M60 RedCap modem, T930 5G broadband, Ethernet, voice-assistant and audio SoCs, BLU-RAY/DVD/STB/ODD chips, and commercial-display SoCs) round out the catalog, and a Generative AI capability layer (demonstrated with Llama 2 and Phi-3.5-mini) runs across the NPUs in the Dimensity, Genio, and Kompanio families. Partner-enabled offerings such as the NVIDIA RTX Spark personal AI supercomputer extend the platform into desktop AI computing.

Differentiator

Problem solved

Functional benefit

Brands

  • MediaTek Dimensity: Flagship and premium 5G smartphone chipset family.
  • MediaTek Helio
  • MediaTek Pentonic
  • MediaTek Kompanio
  • MediaTek Filogic
  • MediaTek Genio
  • MediaTek HyperEngine
  • MediaTek NeuroPilot

Products and services

  • MediaTek Dimensity 5G Flagship & Premium Smartphone SoCs Flagship and premium 5G smartphone SoC family including Dimensity 9500, 9500 Super Edition, 9500s, 9600, 9400, 8500, 7400, 7100, 6300 and 6100+. Integrates the APU 890 NPU, Generative AI, HyperEngine gaming, Imagiq camera ISP, MiraVision display, and CorePilot power management. Targeted at premium and mass-market 5G handset OEMs.
  • MediaTek Helio 4G Smartphone SoCs Mainstream 4G smartphone SoC family including Helio G200, Helio G200 Ultimate, Helio G100 Ultimate, Helio G81, and Helio G81 Ultra, targeted at 4G mid-range handset OEMs.
  • MediaTek Pentonic Smart TV SoCs Smart TV SoC family (including Pentonic 700) combining AI picture quality, high-refresh-rate display, voice control, and MiraVision video processing for premium and mainstream TV manufacturers.
  • MediaTek Filogic Wi-Fi & Connectivity SoCs Wi-Fi 7 and Wi-Fi 8 connectivity SoC family (Filogic 8000 series and Filogic 8800) targeting home networking, broadband gateways, retail routers, and CPE platforms.
  • MediaTek Genio IoT & Edge AI Platforms IoT and edge-AI SoC platform family including Genio 360, 510, 520, 700, 720, 1200, and Genio Pro 5100 (3nm, 50+ TOPS). Supports Linux and Android, multi-display, and NPU-accelerated on-device AI for industrial, retail, smart home, and commercial use cases.
  • MediaTek Kompanio Chromebook & Tablet SoCs Arm-based Chromebook and tablet SoC family including Kompanio 500, 520/528, and Kompanio 540, targeting mainstream and education Chromebooks and Android tablets.
  • MediaTek Dimensity Auto Automotive Cockpit & Connectivity Platform Automotive SoC family for cockpit, in-vehicle infotainment, telematics, and connectivity. Includes Dimensity Auto Cockpit C-X1 (3nm, up to 400 TOPS, combining MediaTek semiconductor/connectivity with NVIDIA GPU/AI), MT8678, MT8676, MT8115, MT8126, and the T930 platform.
  • MediaTek Data Center / Custom ASIC Silicon Custom ASIC and compute platform business for hyperscale data centers and cloud customers, leveraging partnerships with NVIDIA (NVLink Fusion, Vera CPU, DGX Spark, RTX Spark), Google (TPU v7 Triggerfish and v9/v10 Icefish), Synopsys, and TSMC.
  • NVIDIA RTX Spark Personal AI Supercomputer Personal AI supercomputer co-developed with NVIDIA, powered by a 20-core Arm Grace CPU designed by MediaTek and Blackwell RTX GPU. Targeted at developers and AI PC use cases.
  • MediaTek 5G Modems (M90, M60 RedCap) Standalone 5G modem platforms: M90 5G modem and M60 RedCap Modem for mobile, IoT, and satellite (NTN) connectivity.

Quantifiable outcome

  • Up to 12x faster AI inference vs CPU and 10x faster vs GPU on MediaTek NPU
  • +6 more outcomes

Companies that use MediaTek

Customer profile

Named customers29 records

Segments7 records

Ideal customer profiles6 records

MediaTek technology and API

Technology

Technology focussed Yes

API detail

Has API
Yes
API docs
API detail

Core technology

AI maturity

App detail

Integration2 records

AI capability16 records

Feature13 records

MediaTek partnerships and signals

Strategic signal

Partnerships

26 partnerships are on record, tiered core, flagship and minor.

  • UMC (United Microelectronics Corporation)coreStrategic or Co-development Partner · 18 June 2026MediaTek co-investor (via UMC Capital) and strategic manufacturing partner for HyperLight's TFLN Chiplet Platform on both 6-inch and 8-inch wafers for high-volume foundry production of TFLN photonics.
  • NVIDIAflagshipStrategic or Co-development PartnerMulti-pronged deep strategic alliance: (1) co-designed 20-core Arm Grace CPU for NVIDIA RTX Spark superchip and N1/N1X processors for Windows PCs and laptops shipping fall 2026 in devices from Dell, HP, ASUS, Lenovo, MSI, and Microsoft Surface; (2) co-development of NVIDIA Vera CPU on 3nm for data center targeting $20B revenue; (3) DGX Spark collaboration with NVIDIA Grace Blackwell GB10; (4) NVIDIA TAO integration with NeuroPilot SDK for IoT AI development; (5) NVLink Fusion ASIC partnership for custom data center silicon; (6) NVIDIA Drive Hyperion 10 collaboration for automotive Level 4 AD via VinFast partnership.
  • Google (Alphabet)flagshipStrategic or Co-development PartnerMediaTek collaborates with Google on: (1) TPU v7 and TPU v9 'Triggerfish' AI accelerator co-design (handling I/O and back-end design while Google retains processor core design); (2) Icefish TPU v10 design with TSMC and Samsung split manufacturing targeting 2028 mass production; (3) Project Treble for Automotive first-mover adoption on MT8678 and MT8676 providing 4+ years firmware updates; (4) Googlebook Chromebook program with MediaTek Dimensity processors; (5) LiteRT NeuroPilot Accelerator integration for unified on-device AI runtime across MediaTek NPUs.
  • MicrosoftflagshipStrategic or Co-development PartnerMediaTek is a key silicon partner for Microsoft's Project Solara agentic AI platform for enterprise devices (alongside Qualcomm), powering two reference designs (badge and desk device). Microsoft also co-developed the RTX Spark Surface Laptop Ultra with NVIDIA and MediaTek, and presented joint Azure edge-to-cloud fine-tuning demos at Microsoft Ignite using Phi-3.5-mini on the Dimensity 9400 NPU 890.
  • TSMCcoreTechnology or IntegrationMediaTek's primary foundry partner — manufactures Dimensity chipsets, the NVIDIA RTX Spark superchip, Google's TPU, and MediaTek's first 2nm chip on TSMC's N2P process. TSMC's 3nm process is used for RTX Spark and MediaTek's flagship chipsets; 2nm N2P node for Dimensity 9600 Pro and beyond.
  • SamsungcoreTechnology or IntegrationStrategic technology partnership validating MediaTek's M90 5G modem platform in industry-first 3Tx 5-layer uplink configuration (670 Mbps throughput) with Samsung's virtualized RAN, Massive-MIMO radios, and Macro radios. Earlier collaboration on 5G RedCap energy efficiency testing. Samsung Galaxy Tab S11/S12 Ultra and other Samsung devices also powered by MediaTek Dimensity chipsets.
  • DENSOcoreStrategic or Co-development PartnerMediaTek and DENSO are collaborating on Automotive SoCs for Advanced Driver-Assistance Systems (ADAS), combining MediaTek's semiconductor expertise with DENSO's automotive electronics leadership.
  • NTE (Neverness to Everness)minorStrategic or Co-development PartnerMediaTek and NTE are leveraging the advantages of MediaTek's Dimensity Frame Rate Converter (MFRC) and HyperEngine gaming technologies to advance mobile gaming performance in NTE's title.
  • Ayar LabscoreStrategic or Co-development PartnerMediaTek participated in Ayar Labs' $500 million Series E funding round alongside NVIDIA, AMD, and Alchip. Ayar Labs also joined NVIDIA's NVLink Fusion ecosystem; its co-packaged optics (CPO) integrate with NVIDIA AI infrastructure for hyperscalers.
  • Phison ElectronicsminorStrategic or Co-development PartnerAnnounced collaboration at COMPUTEX 2026 for mobile AI solutions pairing Phison's Pascari aiDAPTIV memory extension and enterprise SSDs with MediaTek mobile platforms.
  • E InkminorStrategic or Co-development PartnerE Ink is partnering with MediaTek to develop AI-capable processors for future e-readers using MediaTek MT8115 and MT8126 chips, enabling on-device AI features like real-time translation, document summaries, and voice-to-text.
  • FOXTRON Vehicle TechnologiescoreStrategic or Co-development PartnerMulti-year collaboration to integrate MediaTek's Dimensity AX C-X1 platform into premium automotive solutions, combining MediaTek's semiconductor and connectivity with NVIDIA GPU/AI/graphics. 3nm platform delivers up to 400 TOPS of AI computing power.
  • SynopsyscoreTechnology or IntegrationMediaTek validated Synopsys Multiphysics Fusion solutions (integrating Synopsys EDA tools with Ansys signoff engines accelerated by NVIDIA CUDA-X), achieving up to 3x faster runtimes and up to 10x faster design closure for advanced chip design.
  • BenQcoreStrategic or Co-development PartnerStrategic partnership leveraging MediaTek NPU platforms for up to 176% AI performance improvement across BenQ's smart meeting, smart education, professional monitors and immersive experience product lines.
  • Deutsche TelekomcoreStrategic or Co-development PartnerPartnered with MediaTek to develop the Speedport 7, a class-leading Wi-Fi 7 broadband gateway.
  • ARBOR TechnologyminorStrategic or Co-development PartnerMediaTek silicon powers ARBOR Technology's Intel Panther Lake-powered IEC-6700 edge AI platform delivering 180 TOPS, showcased at Automate 2026 with multiple AI robotics demonstrations.
  • EzuriominorStrategic or Co-development PartnerEzurio partnered with MediaTek to develop the Tungsten HMI, a ready-to-deploy touchscreen interface panel for industrial food and beverage applications, built on the MediaTek Genio 510 platform.
  • ADLINKminorStrategic or Co-development PartnerMediaTek partnered with ADLINK to create the MXA-312M smart display IoT platform, powered by MediaTek Genio 520/720.
  • VinFastcoreStrategic or Co-development PartnerStrategic partnership at COMPUTEX 2026 with NVIDIA and Autobrains to develop a next-generation Level 4 autonomous driving platform tailored for Southeast Asia using MediaTek Dimensity Auto silicon.
  • ESA, Eutelsat, Airbus, Sharp, ITRI, R&ScoreStrategic or Co-development PartnerWorld's first Rel-19 5G-Advanced NR-NTN connection over OneWeb LEO satellites — joint announcement demonstrating MediaTek's NR-NTN chipset capability for satellite connectivity on smartphones, cars and IoT devices.
  • AutobrainsminorStrategic or Co-development PartnerPartnered with NVIDIA and VinFast at COMPUTEX 2026 to bring Agentic AI software to the next-generation Level 4 autonomous driving platform.
  • GrinnminorChannel Partner/ Reseller/ DistributorGrinn GenioBoard edge AI SBC built on the Grinn GenioSOM-700 powered by MediaTek Genio 700, providing a complete edge-AI IoT single board computer.
  • KontronminorChannel Partner/ Reseller/ DistributorKontron integrates MediaTek Genio IoT platform into its Smart Industry Solutions portfolio, providing industrial customers with validated, production-ready IoT systems.
  • BraemacminorChannel Partner/ Reseller/ DistributorBraemac extends distribution of MediaTek Genio IoT platforms into Australia and New Zealand markets.
  • Marvell TechnologycoreStrategic or Co-development PartnerMarvell designs a custom networking chip for Google's TPUv8e (Humufish) paired with MediaTek's I/O and back-end design and Intel's 18A/18AP fabrication with EMIB-based packaging; mass production by end of 2027.
  • Dell, HPE, Lenovo, Supermicro, IBMcoreOEM/ Whitelabel/ Licensing PartnerNVIDIA system builder partners including Dell, HPE, Lenovo, Supermicro and IBM need increased server, memory, and chip equipment capacity driven by Vera Rubin AI chip platform full production and RTX Spark AI PC chip (co-developed with MediaTek).

Scale indicators9 records

Recent moves8 records

Expansion highlights7 records

MediaTek competitors and assessment

Company assessment

Regional players

  • HiSilicon (Huawei): Chinese fabless smartphone and baseband SoC designer historically competing in Huawei handsets and 5G base stations. Subject to U.S. export restrictions, HiSilicon represents a constrained regional competitor in China that overlaps with MediaTek's smartphone and networking portfolio.

Broad incumbents

  • AMD: Broad incumbent in CPU and GPU compute competing for the same AI PC and data center sockets MediaTek is targeting through NVIDIA partnerships. AMD participated in Ayar Labs' Series E alongside MediaTek, indicating shared positioning in next-generation optical interconnects for AI infrastructure.
  • Intel: Broad incumbent competing with MediaTek in AI PC (Core Ultra), data center (Xeon), networking, and foundry services. Intel's Panther Lake referenced as the platform powering ARBOR's IEC-6700 edge AI device alongside MediaTek silicon, illustrating the parallel competition in compute platforms.

Direct peers

  • Qualcomm: Direct competitor in smartphone SoCs (Snapdragon) with overlapping flagship and premium tier customers including Samsung, Xiaomi, and Oppo. Both compete in 5G modems, on-device AI NPUs, and are expanding into automotive and AI PC, making Qualcomm the closest peer for MediaTek's core mobile business.
  • Broadcom: Direct competitor in custom ASIC silicon for hyperscale data centers (Google TPU earlier generations, Meta MTIA) and in networking/wireless connectivity. Both target the same hyperscaler custom-silicon opportunity MediaTek is pursuing with its data center ASIC business.
  • Marvell Technology: Direct competitor in custom ASIC silicon for hyperscalers (Amazon Trainium, Google TPU networking chips) and in networking/connectivity silicon. Marvell is explicitly identified as MediaTek's partner on Google TPUv8e (Humufish), highlighting how closely the two compete in custom data center silicon.
  • UNISOC: Chinese fabless smartphone SoC designer competing with MediaTek in entry-level and mid-range 4G/5G handsets, particularly in emerging markets and for Transsion/TECNO and similar customers. Overlaps directly with MediaTek's Helio and Dimensity 6-series portfolio.
  • Realtek: Taiwanese fabless semiconductor competitor in Wi-Fi/connectivity, audio, and TV SoCs, with overlapping customer base and recent price hike announcements similar to MediaTek's. Realtek is also actively litigating against MediaTek in U.S. federal court.
  • Samsung LSI (Samsung Foundry & System LSI): Direct competitor through Samsung's Exynos smartphone SoC family and a strategic partner validating MediaTek modems. Samsung is also a foundry partner for MediaTek's Google TPU program, illustrating the dual customer/competitor dynamic in mobile and ASIC silicon.

Emerging players

  • Alchip Technologies: ASIC design services company also participating in Ayar Labs' Series E. Alchip is a comparable custom-silicon enabler for hyperscalers, making it an emerging player in the same custom data center ASIC space MediaTek is targeting.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

MediaTek social profiles

Digital presence

MediaTek compliance and trust

Trust signal

Compliance1 record

MediaTek financial estimates

Financial estimate

Revenue estimate

Valuation estimate

MediaTek leadership team

Management profile

Number of profiles

Profiles13 records

MediaTek subsidiaries and ownership

Company hierarchy

Subsidiaries2 records

MediaTek funding detail

Funding detail

Funding overview

Funding rounds1 record

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

MediaTek M&A and investment

M&A and investment

M&A7 records

Investments47 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about MediaTek

What does MediaTek do?

MediaTek designs and sells fabless system-on-chip (SoC) platforms that integrate Arm-based CPU cores, in-house NPUs for on-device AI, GPUs, and 5G/Wi-Fi modems. Its portfolio spans Dimensity and Helio smartphone chipsets, Pentonic smart TV SoCs, Filogic Wi-Fi 7/8, Genio IoT platforms, Kompanio Chromebook/tablet SoCs, Dimensity Auto automotive platforms, and custom data center ASICs co-developed with NVIDIA and Google.

Is MediaTek a public or private company?

MediaTek is a public company. It is classified as public and is currently operating.

When was MediaTek founded?

MediaTek was founded in 1997. It employs 5,001 to 10,000 people.

Where is MediaTek based?

MediaTek is headquartered in Hsinchu, Taiwan, in the Asia region.

How does MediaTek make money?

Three revenue lines are on record. System-on-Chip (SoC) Sales are the primary driver. The others are custom ASIC / Data Center Silicon and product Pricing Adjustments (Mature Process).

Who are MediaTek's main competitors?

HiSilicon (Huawei) is listed as a regional player. Broad incumbents are AMD and Intel. Direct peers are Qualcomm, Broadcom, Marvell Technology, UNISOC, Realtek and Samsung LSI (Samsung Foundry & System LSI). Alchip Technologies is listed as an emerging player.

Does MediaTek have an API?

Yes. MediaTek offers the NeuroPilot SDK as a developer-facing software platform for building, optimizing, and deploying AI/ML applications on MediaTek NPUs (APUs). The SDK includes support for popular model architectures and integrates with third-party AI runtimes. A developer hub is hosted at neuropilot-developer.mediatek.com per the Terms of Use. Developer documentation is at neuropilot-developer.mediatek.com.

What industry is MediaTek in?

MediaTek's product category is Fabless Semiconductor / System-on-Chip Design. Its primary akta.pro industry code is HDAHABAA, Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS), with a secondary code of HDAHABAH, Audio, Imaging & Multimedia SoCs (ISP/Codec/Display). Its NAICS code is 33411 and its SIC code is 3571.

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Live signals
NewsfileOPPO Find X10 Pro Max to Debut Globally with MediaTek's 2nm Flagship Dimensity 9600 ProOPPO announced the Find X10 Pro Max will debut globally with MediaTek's Dimensity 9600 Pro, built on TSMC's 2nm process. The chip offers up to 61% CPU multi-core energy efficiency, 27% higher graphics performance, and 51% faster LLM prefill. Details will be revealed at the upcoming global launch event.AktienOPPO Find X10 Pro Max to Debut Globally with MediaTek's 2nm Flagship Dimensity 9600 ProOPPO announced the Find X10 Pro Max will debut globally with MediaTek's Dimensity 9600 Pro, built on TSMC's 2nm process. The chip delivers up to 61% CPU multi-core energy efficiency, 17% CPU performance, and 27% graphics performance gains. Further details will be revealed at the upcoming global launch event.Laotian TimesOPPO Find X10 Pro Max to Debut Globally with MediaTek’s 2nm Flagship Dimensity 9600 ProOPPO announced the Find X10 Pro Max will debut globally with MediaTek's 2nm Dimensity 9600 Pro, delivering up to 61% CPU multi-core energy efficiency and 17% overall CPU performance improvement. The chip also features a new GPU and dual-NPU design for AI workloads, with further details at the upcoming launch event.FinancialContent Business PageOPPO Find X10 Pro Max to Debut Globally with MediaTek’s 2nm Flagship Dimensity 9600 ProOPPO announced the Find X10 Pro Max will debut globally with MediaTek's Dimensity 9600 Pro, built on TSMC's 2nm process. The chip offers up to 61% CPU multi-core energy efficiency, 17% CPU performance, and 27% graphics performance over the previous generation. Further details will be revealed at the upcoming global launch event.Malaysia Latest NewsOPPO Find X10 Pro Max to Debut Globally with MediaTek’s 2nm Flagship Dimensity 9600 ProOPPO announced the Find X10 Pro Max will debut globally with MediaTek's Dimensity 9600 Pro, built on TSMC's 2nm N2P process. The chip delivers up to 61% better CPU multi-core energy efficiency, 17% overall CPU performance, and 27% higher graphics performance. Further details will be revealed at the upcoming global launch event.Indian Economic ObserverIndia’s semiconductor push, agentic AI set to reshape telecom and connected devices: Industry leadersIndustry leaders see India's semiconductor push and agentic AI reshaping telecom and connected devices. MediaTek's Anku Jain cited the Dimensity 9600 Pro and India Semiconductor Mission, while Accenture's Berjesh Chawla highlighted autonomous network operations and sovereign AI. He also noted 6G could make base stations sensing centers.The TribuneIndia’s semiconductor push, agentic AI set to reshape telecom and connected devices: Industry leadersIndustry leaders see India's semiconductor ambitions and agentic AI reshaping telecom and connected devices. MediaTek's Anku Jain highlighted AI-enabled devices and the India Semiconductor Mission, while Accenture's Berjesh Chawla noted agentic AI's potential to disrupt telecom operations and sovereign AI opportunities. He also pointed to 6G as a future connectivity trend.Ani NewsIndia’s semiconductor push, agentic AI set to reshape telecom and connected devices: Industry leadersIndustry leaders say India's semiconductor push and agentic AI will reshape telecom and connected devices. MediaTek's Anku Jain cited the Dimensity 9600 Pro and India Semiconductor Mission, while Accenture's Berjesh Chawla highlighted autonomous network operations and sovereign AI. He also noted 6G could make base stations sensing centers.The Times of IndiaIndia's semiconductor push, agentic AI set to reshape telecom and connected devices: Industry leaders - The Economic TimesMediaTek India's Anku Jain and Accenture India's Berjesh Chawla discussed how India's semiconductor ambitions and agentic AI will reshape telecom and connected devices. Jain cited the Dimensity 9600 Pro chipset and welcomed the India Semiconductor Mission, while Chawla highlighted autonomous network operations and sovereign AI opportunities. He also noted 6G could make base stations function as sensing centres.PR NewswireAiroha Exhibits Next-Generation 50G-PON at Network X, Delivering 50+50 Gbps Symmetric Transmission and Integrated ConnectivityAiroha Technology and MediaTek are exhibiting a 50G-PON AI Gateway Processor at Network X 2026, delivering 50+50 Gbps symmetric throughput and integrated connectivity. The processor supports Wi-Fi 8, Edge AI, and AI-based fault diagnostics, and has been shortlisted for a Network X Award.