Name

XMC

Legal name

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Website

https://xmcwh.com

Company type

Private

Founded year

2006

Operating status

Operating

Headcount range

1,001–5,000 employees

Ownership category

akta.pro rank

Product category

Semiconductor Foundry

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344), Semiconductor and Related Device Manufacturing (334413), Computer Storage Device Manufacturing (334112)

SIC

Computer Storage Devices (3572)

akta.pro primary industry

Custom/ASIC & Foundry-Adjacent IDM Services (HDAHAAAL)

akta.pro secondary industries

Analog & Mixed-Signal ICs (HDAHAAAD), Power Management & Power ICs (HDAHAAAE)

Keywords

• Semiconductor foundry services
• Wafer fabrication
• NOR flash memory
• 3D IC integration
• Specialty memory manufacturing

Headquarters

HQ city

Wuhan

HQ country

China

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Infrastructure, Technology or R&D, Operations, Personnel, Supply Chain

Revenue model

1. 12-inch Wafer Foundry Services: XMC provides diversified semiconductor wafer foundry services based on various technology nodes and process platforms (3D IC, digital & analog, specialty memory) for global customers. Revenue is generated through wafer fabrication services at 40nm and above nodes, covering NOR Flash, CIS, MCU, RF-SOI, and Logic technologies. The company operates two mass production fabs and serves customers through MPW (Multi-Project Wafer) services, design support, and photomask services.
2. Own-Brand SPI NOR Flash Products: XMC launched its own-brand SPI NOR Flash product series in 2017, selling products directly to customers in categories including 16Mbit to 1Gbit densities under the XM25QxxxC and XM25LU128C brands. Revenue from product sales includes both packaged products and KGD (Known Good Die) solutions for SiP applications. Customers include Espressif (IoT modules), TP-LINK (network communication), and automotive electronics manufacturers.
3. Outsourcing and Value-Added Services: Professional back-end supply chain management services including photomask production, material testing, packaging and final-testing, and reliability assurance services. Design support services including PDK, IPs, libraries, and EDA design solutions are provided as part of foundry services.

Pricing tiers

Go-to-market motion3 records

Distribution channels3 records

Marketing channels5 records

Core offering

XMC provides 12-inch wafer foundry services across multiple specialty semiconductor process platforms including NOR Flash, CMOS Image Sensors (CIS), RF-SOI, MCU (ESF3), and 3D IC integration (S-stacking®, M-stacking®, Hi-stacking®). The company also manufactures and sells its own-brand SPI NOR Flash memory products launched in 2017, with density tiers from 16Mbit to 1Gbit serving IoT, automotive, consumer electronics, industrial, and communication markets.

Product overview

XMC (Wuhan Xinxin Semiconductor Manufacturing) is a leading 12-inch wafer foundry offering semiconductor specialty technologies. The company operates a platform-plus-services model built around three core foundry technology platforms: Specialty Memory Platform (centered on its proprietary SPI NOR Flash products launched in 2017, covering 16Mb–1Gbit capacities with 50nm and 55nm processes), 3D IC Platform (S-stacking®, M-stacking®, and Hi-stacking® wafer-level stacking and heterogeneous integration technologies), and Digital & Analog Platform (CIS and RF-SOI processes). These platforms are supported by supplementary services including Multi-Project Wafer (MPW) tape-out services and Value-added Services spanning design support (PDK, IPs), mask services, material testing, and packaging/final testing. XMC also offers its own-brand SPI NOR Flash products directly to customers under brand names including XNOR™.

Differentiator

Problem solved

Functional benefit

Brands

• XNOR: Ultra-small size low-power SPI NOR Flash product brand launched by XMC in 2021
• S-stacking
• M-stacking
• Hi-stacking

Products and services

• SPI NOR Flash Memory Products XMC's own-brand SPI NOR Flash memory products based on floating gate process, with densities from 16Mbit to 1Gbit and product families including XM25QxxxC, XM25QWxxC, and XM25LU128C (XNOR™). Operating voltage 1.2V-3.6V, read speeds up to 166MHz, industrial temperature range -40°C to +125°C. Multiple package options including SOP8, USON8, WSON8, LGA, and WLCSP, plus KGD solutions for SiP integration. Targets IoT, automotive, consumer electronics, industrial, and communication markets.
• 12-inch Wafer Foundry Services Diversified 12-inch (300mm) wafer foundry services at 40nm and above process nodes covering NOR Flash, CMOS Image Sensors (CIS), MCU (ESF3), RF-SOI, Logic, and 3D IC technologies. Operates two mass production fabs and serves global fabless semiconductor customers through direct enterprise agreements, MPW prototyping, design support, and back-end supply chain services.
• Specialty Memory Foundry Platform Specialty memory foundry platform featuring 50nm Floating Gate NOR Flash and 55nm ESF3 (3rd-generation embedded SuperFlash) MCU processes. Largest mainland China NOR Flash wafer manufacturer with nearly 20 years of R&D and mass production experience. MCU process features ultra-low power consumption and high performance, serving consumer electronics to industrial control and automotive electronics applications.
• 3D IC Integration Platform Wafer-level 3D IC technology platform enabling vertical stacking of carriers and functional wafers, and chip-wafer heterogeneous integration through TSV and hybrid bonding. Includes S-stacking® (two-wafer direct bonding), M-stacking® (bumpless Cu-Cu interconnection, 99.5% bonding yield, 20x bandwidth increase, 40% chip thickness reduction vs. traditional HBM), and Hi-stacking® (3D heterogeneous integration for different die sizes/substrate materials).
• Digital & Analog Foundry Platform Digital and analog foundry platform providing CMOS Image Sensor (CIS) full-flow manufacturing with 0.7μm+ pixel capability, BSI and wafer bonding processes for consumer, industrial, medical, and automotive applications. Also includes 55nm RF-SOI process with complete independent IP rights for RF switches, low-noise amplifiers, antenna tuners, and power amplifiers used in smartphones and wireless communication.
• Multi-Project Wafer (MPW) Service Multi-Project Wafer (MPW) tape-out service that allows customers to share masks and engineering wafers across multiple designs, reducing product design and manufacturing costs and enabling more cost-effective wafer services for prototyping and low-volume production.
• Value-Added Foundry Services Comprehensive backend services including design support (PDK, IPs, libraries, EDA collaboration), mask service, material testing (300mm wafer engineering testing, mass production testing, failure analysis, reliability testing), and packaging and final-testing outsourcing. Provided as part of foundry services to deliver one-stop manufacturing support.
• Known Good Die (KGD) Solutions Known Good Die (KGD) products for custom SiP or MCP solutions requiring NOR Flash memory. Supports RDL (Re-Distribution Layer) for customized pad layout, customized I/O number, and complete testing for function, data retention, and endurance.

Quantifiable outcome

• 50+ million units of IoT module NOR Flash shipped in 2020, the largest domestic SPI NOR Flash shipment in this field
• +6 more outcomes

Named customers3 records

Segments6 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

Five partnerships are on record, tiered core and minor.

• Espressif Systems (乐鑫信息科技(上海)股份有限公司)coreStrategic or Co-development Partner · 26 April 2021XMC and Espressif entered a long-term strategic cooperation in 2020, deepened in April 2021, to jointly develop the IoT market. XMC supplies FG 50nm NOR Flash products (16/32/64/128Mbit SPI NOR) to Espressif for IoT chips and wireless communication modules. Products support wide voltage, low power consumption, and withstand up to 105°C for Espressif's full series IoT chips, smart home, and industrial modules. Partnership covers both KGD solutions and packaged products with over 150% annual compound growth rate in shipment and sales.
• TP-LINK (普联技术有限公司)coreStrategic or Co-development Partner · 19 April 2021XMC signed a strategic cooperation agreement with TP-LINK to jointly provide better products and technical solutions for the network communication market. XMC's own-brand NOR Flash products (multiple density tiers) have been integrated into TP-LINK's major product lines since 2021. XMC has been TP-LINK's important NOR Flash vendor and strategic partner, achieving an annual compound growth rate of 108% in shipment.
• Liangzhun (Shanghai) Industrial Co., Ltd. (量准(上海)实业有限公司)coreStrategic or Co-development Partner · 3 July 2020XMC collaborated with Liangzhun (Shanghai) and Huazhong University of Science and Technology to jointly develop and produce a COVID-19 characteristic detection chip. XMC used its 55nm process platform to efficiently manufacture array structure wafers for Liangzhun's Nano SPR (Surface Plasmon Resonance) optical sensing chip. The chip achieved signal amplification over 1000x and higher detection sensitivity than traditional 2D substrate chips. This partnership validated XMC's mature, stable, and customizable 55nm process platform.
• Huazhong University of Science and Technology (华中科技大学)minorStrategic or Co-development Partner · 8 September 2015XMC and Huazhong University of Science and Technology signed a strategic cooperation framework agreement to co-build the Wuhan International Microelectronics College. The collaboration aims to cultivate high-level semiconductor talent through talent introduction, academic exchanges, joint graduate training, professional education, and engineering laboratory development. This addresses XMC's talent needs at both R&D and mass production stages.
• Multiple Domestic and International Testing CompaniesminorChannel Partner/ Reseller/ DistributorXMC has built strategic partnerships with a number of domestic and international testing companies to provide customers with efficient one-stop manufacturing services, covering mask service, material testing, packaging and final-testing, and reliability testing. These partnerships enable XMC to offer comprehensive back-end supply chain services.

Scale indicators11 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• SMIC: China's largest semiconductor foundry, operating 8-inch and 12-inch fabs across logic, memory, and specialty processes. Directly comparable as a Chinese foundry serving domestic and global customers with diversified process platforms.
• Hua Hong Semiconductor: Shanghai-based 8-inch and 12-inch foundry specializing in eFlash, analog, power devices, and specialty processes. Directly comparable as a Chinese specialty-process foundry with both foundry services and emerging IC product lines.
• GigaDevice: Beijing-headquartered fabless/mixed-mode semiconductor company and a leading Chinese NOR Flash supplier alongside MCU products. Directly comparable as a Chinese NOR Flash competitor targeting IoT, automotive, and consumer markets.
• Winbond Electronics: Taiwan-based specialty memory IC maker with leading market share in SPI NOR Flash and DRAM products. Directly comparable as a NOR Flash competitor serving automotive, industrial, and consumer markets globally.
• Macronix International: Taiwan-based non-volatile memory manufacturer specializing in NOR Flash and NAND Flash. Directly comparable as a NOR Flash peer competing for design wins in automotive, industrial, and consumer applications.

Regional players

• YMTC (Yangtze Memory Technologies): Wuhan-based Chinese NAND Flash manufacturer that previously held an investment stake in XMC. Comparable as a domestic Chinese memory leader with shared investor history and geographic proximity, though focused on NAND rather than NOR.
• Shanghai Huali Microelectronics (HLMC): Shanghai-based 12-inch foundry focused on logic and specialty processes, serving domestic Chinese fabless customers. Comparable as a Chinese 12-inch foundry with similar scale, state backing, and customer base focus.

Broad incumbents

• Tower Semiconductor: Israel-based specialty foundry offering RF, analog, power, and CIS processes. Comparable as a specialty-process foundry serving automotive, industrial, and consumer markets with diversified platforms.
• Vanguard International Semiconductor: Taiwan-based specialty IC foundry offering power, analog, and memory processes. Comparable as an Asia-based specialty foundry serving similar customer verticals including automotive and industrial.
• GlobalFoundries: US-headquartered global foundry with broad specialty process offerings including RF-SOI, BCD, and eFlash. Comparable as a foundry offering RF and specialty process platforms serving similar end markets including automotive and IoT.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/xmc-wuhan-xinxin-semiconductor-manufacturing-corp-

Compliance9 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Funding overview

Funding rounds1 record

Investors7 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about XMC