What Shengmei Semiconductor Equipment does

Shengmei Semiconductor Equipment (盛美半导体设备（上海）股份有限公司), the operating subsidiary of U.S.-listed ACM Research (NASDAQ: ACMR) and dual-listed on the Shanghai STAR Market (688082), designs, manufactures, and sells advanced semiconductor wet processing equipment. Founded in 2005 in Shanghai by ACM Research founder Dr. Hui Wang, the company has grown from a single-product supplier of SAPS megasonic cleaning tools into a broad wet-processing platform serving front-end wafer fabs, advanced packaging facilities, and compound semiconductor manufacturers. Core proprietary technologies include Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) megasonic cleaning, the Tahoe single-wafer/tank hybrid cleaning platform, single-wafer high-temperature SPM, multi-anode electrochemical plating for damascene copper at 55/40/28 nm and below, and a vacuum-based panel-level negative pressure cleaning system. The product portfolio extends beyond cleaning and plating into photoresist track (Ultra Lith KrF and Ultra Lith BK curing), vertical furnace systems including thermal ALD and PEALD tube furnaces (Ultra Fn A), PECVD, wet etch, stress-free polishing, compound-semiconductor electrochemical de-plating (Ultra ECDP), and panel-level equipment (Ultra ECP ap-p horizontal electroplating, Ultra C bev-p edge etcher).

The company sells exclusively through direct enterprise field sales to semiconductor manufacturers, supported by offices in Shanghai (HQ, R&D, manufacturing, Asia-Pacific innovation center), Fremont, California (group HQ), Seongnam and Icheon in South Korea, and Hsinchu, Taiwan. Pricing is quote-based B2B and not publicly disclosed. Named enterprise customers include SMIC, Hua Hong Semiconductor, SK Hynix (key account since 2009, major supplier to Wuxi facility), YMTC (3D NAND since 2015), a Singapore-based global OSAT, a North American top technology company, and a Taiwan-based leading panel manufacturer; wet cleaning chambers have been delivered to more than 4,000 chambers across global fabs and ECP chambers passed 1,500 in July 2025. The equipment covers roughly 95% of cleaning process steps in semiconductor manufacturing, with quantified outcomes including 75% sulfuric acid reduction (Tahoe), >50% improvement in wet etch uniformity (Ultra C wb with N2 bubbling), throughput above 300 WPH on KrF track, WIWNU/WTWNU below 1.5% for copper damascene plating, and ±5% UV curing uniformity with ±0.1°C plate temperature control on Ultra Lith BK.

Name

Shengmei Semiconductor Equipment

Legal name

盛美半导体设备（上海）股份有限公司

Website

https://acmrcsh.com.cn

Company type

Public

Founded year

2005

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Shengmei Semiconductor Equipment (ACM Research Shanghai) designs, manufactures, and sells advanced wet processing equipment, including proprietary SAPS/TEBO megasonic cleaners, electrochemical platers, ALD/PECVD furnaces, and KrF track systems, to global semiconductor foundries, IDMs, OSATs, and panel manufacturers for sub-28nm logic, 3D NAND/DRAM, and advanced packaging applications.

Ownership category

akta.pro rank

Product category

Semiconductor Wafer Fabrication Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

Keywords

• Semiconductor wet cleaning equipment
• Megasonic cleaning technology
• Electrochemical plating equipment
• Advanced packaging equipment
• Semiconductor wafer fabrication

Headquarters

HQ city

Shanghai

HQ country

China

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Equipment Sales: 盛美上海 designs, manufactures, and sells high-end semiconductor wet processing equipment (cleaning, plating, track, PECVD, ALD, etching) to global semiconductor manufacturers. Revenue is generated through equipment sales with associated installation, calibration, and after-sales service. The company has a significant installed base across leading foundries and IDMs worldwide.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels5 records

Core offering

Shengmei Semiconductor Equipment designs, manufactures, and sells high-end semiconductor wet processing equipment for advanced integrated circuit manufacturing, advanced wafer-level packaging, and large silicon wafer production. Its core offerings include single-wafer megasonic cleaning (SAPS, TEBO), Tahoe hybrid cleaning, electrochemical plating systems (Ultra ECP ap-p), track photoresist coating/development (Ultra Lith KrF), advanced curing (Ultra Lith BK), PECVD, ALD furnace, wet etching, stress-free polishing, and post-CMP cleaning equipment, all based on self-developed proprietary IP.

Product overview

Shengmei Semiconductor Equipment (ACM Research Shanghai) is a semiconductor equipment manufacturer offering a comprehensive portfolio of wafer processing solutions for integrated circuit manufacturing, advanced wafer-level packaging, and large silicon wafer manufacturing. The product portfolio centers on wet cleaning equipment (including SAPS and TEBO megasonic technologies, single wafer and tank-type cleaners), electroplating systems (copper damascene, panel-level, and compound semiconductor plating), coating/development/curing track systems, vertical furnace systems (LPCVD, ALD, oxidation, annealing), PECVD, wet etching, stress-free polishing, and post-CMP cleaning. Key proprietary technologies include SAPS (Space Alternated Phase Shift) megasonic cleaning, TEBO (Timely Energized Bubble Oscillation) technology, and Tahoe single-wafer tank combination cleaning, all applied to 28nm and below nodes. The company serves global semiconductor manufacturers with both 300mm wafer-level and panel-level (510x515mm to 600x600mm) packaging solutions.

Differentiator

Problem solved

Functional benefit

Brands

• Smart Megasonix: World-leading wafer cleaning solutions brand featuring SAPS and TEBO megasonic technologies

Products and services

• Ultra C SAPS Megasonic Cleaning Equipment Patented Space Alternated Phase Shift (SAPS) megasonic cleaning equipment that controls the spacing between megasonic transducer and wafer to vary with megasonic phase, achieving uniform megasonic distribution across the wafer surface. Used by advanced IC manufacturers for 28nm and below logic and memory wafer fabrication.
• Ultra ECP Electroplating Equipment Multi-anode localized electroplating equipment applied to 55/40/28nm and below damascene copper metal layer deposition, featuring pulse local plating technology for ultra-thin seed layers. Achieves WIWNU less than 1.5% and WTWNU less than 1.5% uniformity for damascene copper metallization.
• Ultra C vac-p Panel-Level Negative Pressure Cleaning Equipment Panel-level negative pressure cleaning equipment for smaller pitch and SOH chip flux residue cleaning, featuring vacuum environment technology that enhances liquid penetration and cleaning efficiency for 2.5D/3D advanced packaging applications. Cleans bump pitch ≤20μm and SOH ≤20μm.
• Ultra ECP ap-p Panel-Level Horizontal Electroplating Equipment Horizontal panel-level electroplating equipment for advanced packaging, supporting pillar, bump, and RDL processes with copper, nickel, tin-silver, and gold plating capabilities for micro and sub-micron high-density panel packaging applications in FOPLP.
• Ultra C TEBO Megasonic Cleaning Equipment TEBO megasonic cleaning equipment providing stable cavitation with a wide power window for damage-free cleaning of sensitive structures at 28nm and below process nodes, including 3D NAND and 3D DRAM with 500+ layers.
• Ultra C Single Wafer Cleaning Equipment Single wafer cleaning equipment for advanced integrated circuit manufacturing including logic circuits, memory, and power device manufacturing at 28nm and below.
• Ultra C Tahoe Single-Wafer Tank Combination Cleaning Equipment Single-wafer tank combination cleaning equipment combining tank cleaning modules and single wafer cleaning chambers in one SPM equipment, reducing chemical consumption by up to 75% versus conventional single-wafer SPM tools. Achieves average particle count below 6 particles at 26nm particle test.
• Ultra C Backside Cleaning Equipment Backside cleaning equipment for back surface cleaning or wet etching processes on semiconductor wafers.
• Brush Cleaning Equipment Brush cleaning equipment for integrated circuit and wafer-level packaging applications.
• Wet Etching Equipment Wet etching equipment for wafer-level packaging with precise etch control, supporting multiple semiconductor process steps.
• Wet Resist Removal Equipment Wet resist removal equipment for wafer-level packaging applications, removing photoresist after etch and implant steps.
• Vertical Furnace Equipment (LPCVD/Oxidation/Annealing/ALD) Vertical furnace equipment for LPCVD, oxidation, annealing, and ALD (atomic layer deposition) processes used in semiconductor manufacturing.
• Stress-Free Polishing Equipment Stress-free polishing equipment for dual damascene and wafer-level packaging applications, providing an environmentally-friendly alternative to chemical mechanical polishing (CMP) for TSV and fan-out wafer-level packaging.
• PECVD Equipment Plasma-enhanced chemical vapor deposition (PECVD) equipment for depositing dielectric and other thin films in logic and memory chip manufacturing.
• Post-CMP Cleaning Equipment Post-CMP cleaning equipment for silicon wafer and silicon carbide substrate manufacturing processes including post-chemical mechanical planarization cleaning.
• Photoresist Coating Equipment (Coater) Photoresist coating equipment for applying photoresist layers onto semiconductor wafers during lithography processes.
• Tank-Type Wet Cleaning Equipment Tank-type wet cleaning equipment for integrated circuit wet process applications, including batch immersion cleaning for high-throughput requirements.
• Photoresist Development Equipment (Developer) Development equipment for photoresist processing in semiconductor manufacturing, used after exposure in the lithography process.
• Single Wafer Cleaning Equipment for Large Silicon Wafers Single wafer cleaning equipment for large silicon wafer manufacturing, applied to front and back surface cleaning processes for silicon ingot and substrate producers.
• Ultra C bev-p Panel-Level Edge Wet Etching Equipment Panel-level edge wet etching equipment for PLP panel-level edge etching applications, supporting dual-side edge etching and cleaning in copper-related processes for fan-out panel-level packaging (FOPLP).
• Compound Semiconductor Cleaning Equipment Cleaning equipment for compound semiconductor manufacturing applications, supporting SiC, GaAs, and lithium phosphate substrate cleaning processes for power electronics, RF, and wide bandgap device fabrication.
• Ultra Fn A Atomic Layer Deposition (ALD) Furnace Equipment Atomic layer deposition (ALD) furnace equipment including thermal ALD and plasma-enhanced ALD (PEALD) configurations, six-station system processing up to 100 300mm wafers per batch, used for advanced node logic and memory manufacturing.
• Ultra Lith KrF Track Photoresist Coating and Development Equipment KrF process track photoresist coating and development equipment based on ArF platform architecture, with 12 coat and 12 develop chambers and throughput exceeding 300 wafers/hour, integrating patent-pending back particle removal and wafer-level defect detection modules for advanced node manufacturing.
• Ultra ECDP Electrochemical Metal Removal Equipment Electrochemical metal removal equipment for compound semiconductor gold etching, supporting gold bump removal, thin film gold etching, and deep hole gold removal for SiC, GaAs, and Li3PO4 substrates in compound semiconductor manufacturing.
• Ultra Lith BK Advanced Photoresist Curing Equipment Advanced photoresist curing equipment (Baker) with industry-leading UV curing uniformity at ±5% UV intensity and ±0.1°C cold plate temperature uniformity, used for advanced photoresist curing in display panel and semiconductor manufacturing.

Quantifiable outcome

• Tahoe platform reduces sulfuric acid consumption by up to 75%, saving $500,000/year per tool on chemicals alone while reducing environmental waste and meeting stricter environmental regulations.
• +7 more outcomes

Named customers12 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

Five partnerships are on record, tiered core.

• 华东理工大学 (East China University of Science and Technology)coreStrategic or Co-development Partner · 21 July 2025盛美上海 and 华东理工大学 jointly established the '高端半导体装备联合技术创新转移中心' (Joint Innovation Center for Advanced Semiconductor Equipment Technology Transfer) on July 21, 2025, combining ACM's industrial expertise with ECUST's research capabilities for semiconductor equipment innovation.
• 积塔半导体 (Jita Semiconductor)coreStrategic or Co-development Partner · 28 May 2020盛美上海 and 积塔半导体 entered into a strategic cooperation agreement on May 28, 2020, at 积塔半导体's Lingang factory. The partnership focuses on joint development and collaboration in semiconductor equipment and technology for advanced manufacturing processes.
• 上海集成电路研发中心 (Shanghai IC R&D Center)coreStrategic or Co-development Partner · 28 April 2020盛美上海 and Shanghai IC R&D Center conducted a joint technical exchange meeting on April 28 to promote rapid development of the IC industry and foster collaborative innovation in key core technologies. The two parties shared technical expertise and discussed industry trends.
• 积塔半导体 (Jita Semiconductor) / 华虹半导体 / SMIC / 长江存储coreTechnology or Integration · 1 September 2017盛美上海 has established long-term technology partnerships with major Chinese semiconductor manufacturers. Strategic accounts include 积塔半导体 (strategic cooperation 2020), 华虹半导体 (SAPS orders since 2015, recognized as Most Potential Supplier 2019), SMIC (SAPS orders since 2015), and 长江存储 (SAPS orders for 3D NAND since 2015).
• ACM Research Inc. (US Parent)coreOthers · 1 May 1998ACM Research Inc., founded in Silicon Valley in 1998, is the US parent company of 盛美上海. Wang Hui (HUI WANG) serves as Chairman and CEO of both entities. ACM Research is listed on NASDAQ (ACMR). 盛美上海 is the main operating subsidiary in China, listed on Shanghai's STAR Market (688082).

Scale indicators9 records

Recent moves11 records

Expansion highlights7 records

Direct peers

• Screen Holdings: Japanese semiconductor equipment company and the global market leader in single-wafer wet cleaning. Direct head-to-head competitor to Shengmei's SAPS/TEBO/Tahoe cleaning platforms at foundries, memory makers, and OSATs.
• Tokyo Electron (TEL): Major Japanese semiconductor equipment maker with competing wet-cleaning and track/coating/development product lines. Overlaps with Shengmei's Ultra Lith track systems and full wet-processing portfolio across front-end and packaging.
• Naura Technology Group: Largest Chinese semiconductor equipment maker, with competing product lines in etching, cleaning, thermal, and CVD. Directly comparable as a domestic peer serving SMIC, YMTC, and other Chinese fabs with state-backed scale.
• Advanced Micro-Fabrication Equipment Inc. (AMEC): Chinese semiconductor equipment company specializing in plasma etch and CVD. Competes with Shengmei in adjacent process steps and serves the same Chinese foundry/memory customer base.
• SEMES: Korean semiconductor equipment manufacturer (Samsung Electronics subsidiary) specializing in wet cleaning and surface treatment. Competes head-to-head with Shengmei for memory cleaning sockets at Samsung and other Korean customers.
• Kingsemi (KingSemi Semiconductor Equipment): Chinese semiconductor equipment maker focused on advanced packaging and wet processing tools. Directly competes with Shengmei's panel-level and wafer-level advanced packaging equipment at Chinese OSATs and IDMs.

Broad incumbents

• Lam Research: US semiconductor equipment leader in plasma etch and deposition, with selective overlap in wet clean and advanced packaging. A larger incumbent whose installed base and service network compete with Shengmei at leading-edge fabs.
• ACM Research Inc. US-listed parent of Shengmei Semiconductor Equipment (NASDAQ: ACMR), founded in 1998. The two entities share technology, leadership, and customers; ACMR is the group's overseas listing and holds the founder/CEO role for both.
• ULVAC: Japanese vacuum and thin-film equipment maker with deposition, etch, and packaging product lines. Competes with Shengmei's ALD furnace (Ultra Fn A) and PECVD offerings at memory and packaging customers.
• Applied Materials: Global semiconductor equipment leader with broad portfolio including deposition, etch, CMP, and packaging. Overlaps with Shengmei in ECP (applied via AMAT's Black Diamond products) and packaging equipment at leading-edge customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Shengmei Semiconductor Equipment