PHIX
PHIX is a Netherlands-based packaging foundry that assembles photonic integrated circuits (PICs) for AI, telecom, automotive, medical, and quantum customers, offering prototyping packages, volume packaging, contract manufacturing, and fiber array products across all major PIC material platforms.
- Company typePrivate
- Founded2017
- HeadquartersEnschede, Netherlands
- Headcount51–100
- GTM typeB2B
- OfferingServices
What PHIX does
PHIX B.V. (operating as PHIX Photonics Assembly) is a European contract manufacturer and packaging foundry for photonic integrated circuits (PICs), headquartered in Enschede, Netherlands, with an additional manufacturing site in Bozeman, Montana (United States). Founded in April 2017, the company specializes in hybrid assembly and packaging of PICs across all major material platforms — silicon photonics (SiPh), indium phosphide (InP), silicon nitride (SiN), lithium niobate (LiN), gallium arsenide (GaAs), and ion-exchanged glass — using proprietary processes such as multi-chip edge-coupling integration, alignment waveguide loops, and Nanoscribe two-photon polymerization 3D microlens printing.
The company's product portfolio spans the PIC commercialization lifecycle. Standardized prototyping tools include the PHIX Characterization Package (an open-architecture, off-the-shelf platform priced at roughly €3,000-€6,000 per unit for standard configurations) and supporting accessories such as a 20W thermoelectric cooling carrier. Volume production offerings include Large Area Goldbox packages and LCP air cavity strip-level packages (in partnership with RJR Technologies) capable of supporting 100,000+ units/month. Complementary products include standard v-groove fiber arrays, spot size converter fiber arrays (in ion-exchanged glass and SiN), and 3D-printed lensed fiber arrays — many available via a dedicated e-commerce storefront (fiberarrays.eu). The company also sells contract-manufacturing services (flip-chip die bonding, wire/ribbon bonding, hybrid assembly, fiber attachment) on its automated equipment fleet, including ASMPT Amicra Nano and ficonTEC die-to-wafer tools.
PHIX generates revenue through four streams: (1) professional services for custom PIC packaging projects from prototype to volume; (2) one-time sales of standardized prototype packages and accessories; (3) hardware sales of fiber array products through direct e-commerce; and (4) 3D microfabrication services for microlens printing. Go-to-market is direct enterprise sales targeting photonic chip developers across AI/HPC, telecommunications, automotive (LiDAR), medical devices, quantum, aerospace/defense, and industrial sensing. The company is ISO 9001:2015 certified (June 2025) and operates from a 1800 sqm ISO 5 cleanroom facility in Enschede. Funding has come from PhotonDelta, the Netherlands National Growth Fund (€23M across short- and long-term tranches as part of a €1.1B ecosystem program), Innovation Industries, OostNL, and Rabobank.
PHIX firmographics
Firmographics- Name
- PHIX
- Legal name
- PHIX B.V.
- Website
- https://phix.com
- Company type
- Private
- Founded year
- 2017
- Operating status
- Operating
- Headcount range
- 51–100 employees
- Short description
- PHIX is a Netherlands-based packaging foundry that assembles photonic integrated circuits (PICs) for AI, telecom, automotive, medical, and quantum customers, offering prototyping packages, volume packaging, contract manufacturing, and fiber array products across all major PIC material platforms.
- Ownership category
- akta.pro rank
PHIX industry classification
Industry- Product category
- Photonics Packaging Services
- NAICS
- Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Other Communications Equipment Manufacturing (33429)
- SIC
- Industrial Instruments For Measurement, Display, And Control (3823), Optical Instruments & Lenses (3827)
- akta.pro primary industry
- System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)
Keywords
Where PHIX is headquartered
LocationHeadquarters
- HQ city
- Enschede
- HQ country
- Netherlands
- HQ region
- Europe
Offices2 records
Markets served
PHIX business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Personnel, Infrastructure, Technology or R&D, Operations, Marketing or Sales
Revenue model
- PIC Packaging Services: Contract manufacturing services for photonic integrated circuit packaging, including prototype packages and volume production packages. Customers outsource their assembly process or use PHIX as a secondary manufacturer.
- Prototype Package Sales: Sale of standardized photonic characterization packages for convenient, quick and affordable prototyping of PIC-enabled modules.
- Fiber Array Products: Fiber arrays and specialty products including spot size converter fiber arrays and lensed fiber arrays available for shipment directly from stock.
- 3D Microfabrication Services: High-precision 3D printing of microlenses on fiber arrays and PICs for free space coupling applications.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Unit Pricing | Pay-as-you-go | PHIX Characterization Package - standard configuration |
Go-to-market motion1 record
Distribution channels2 records
Marketing channels6 records
PHIX product offering
Product offeringCore offering
PHIX is a packaging foundry that supplies the photonics industry with assembly and packaging services for Photonic Integrated Circuits (PICs). The company provides a one-stop shop ranging from standardized prototype packages (e.g., PHIX Characterization Package) and contract manufacturing (die bonding, wire bonding, fiber attachment, hybrid assembly) to high-volume production packages across multiple material platforms including silicon photonics, indium phosphide, silicon nitride, lithium niobate, gallium arsenide, and ion-exchanged glass.
Product overview
PHIX is a European photonic integrated circuit (PIC) packaging foundry offering integrated photonics packaging solutions ranging from single manufacturing steps to complete joint development with manufacturing scale-up. The company's core offerings include the PHIX Characterization Package for prototyping, Volume Packaging Services for large-scale production, and Contract Manufacturing for outsourced assembly. Supporting products include Fiber Arrays (standard and spot size converter variants), Lensed Fiber Arrays with 3D-printed microlenses, and 3D Microfabrication services. PHIX serves markets including LiDAR, Beyond 5G, Medical Devices, and Quantum computing, supporting all major PIC technology platforms (silicon photonics, indium phosphide, silicon nitride, lithium niobate, gallium arsenide, ion exchanged glass).
Differentiator
Problem solved
Functional benefit
Products and services
- PHIX Characterization Package Open architecture prototyping platform for photonic integrated circuits built from standardized off-the-shelf building blocks, offering a quick and affordable way to perform characterization of first chips or system integration tests. Supports PICs of various sizes and material platforms with up to 32 optical I/Os per side.
- Volume Packaging Services Volume production of PIC-enabled modules for telecommunications, industrial, automotive, medical, space, and defense applications. Supports all major material platforms (silicon photonics, indium phosphide, silicon nitride, PLC) and scales production to required volumes, including Large Area Goldbox packages and LCP air cavity packages.
- Contract Manufacturing Outsourced assembly processes and secondary manufacturing support for photonic integrated circuits and MEMS. Services include flip chip die bonding, wire bonding, hybrid assembly, fiber attachment, and other dedicated production steps performed on PHIX equipment.
- Fiber Arrays Standard v-groove optical fiber arrays available for shipment directly from stock. Supports various fiber types including single mode and polarization maintaining fibers.
- Spot Size Converter Fiber Arrays (SSC-FA) Fiber arrays with integrated spot size converters for mode field matching between optical fibers and PICs. Offered in ion exchanged glass (IONext) and silicon nitride (SiN) platforms in 1, 4, 8, and 16 channel configurations.
- Lensed Fiber Arrays (LFAs) V-groove optical fiber arrays with 3D printed microlenses at the ends of fibers, manufactured using Nanoscribe high-precision two-photon polymerization technology. Suitable for free space coupling to fiber arrays, PICs, or other components with mode field conversion capability.
- 3D Microfabrication High-precision 3D printing of microlenses using two-photon polymerization (2PP) technology. Feature sizes down to 100 nanometers with optical grade surface quality, enabling printing on PIC side facets for free space coupling and lens-on-waveguide applications.
- PHIX Cooling Carrier Optional expansion accessory for the PHIX Characterization Package. Enables temperature control using a 20W thermoelectric cooler (TEC), includes mounting plate for connection to optical table and NTC thermistor for temperature measurement.
- LCP Air Cavity Packages Liquid crystal polymer air cavity packages with injection molded leadframes, offering low cost per unit at high manufacturing volumes through multi-device strip-level assembly for high-volume production of integrated photonics modules.
Quantifiable outcome
- Production capacity exceeding 100,000 units per month
- +2 more outcomes
Companies that use PHIX
Customer profileNamed customers5 records
Segments7 records
Ideal customer profiles5 records
PHIX technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Integration4 records
Feature10 records
PHIX partnerships and signals
Strategic signalPartnerships
Twelve partnerships are on record, tiered core and minor.
- Photon BridgecorePartnership to develop and produce DWDM laser sources for AI data centers, combining photonic integration with advanced packaging capabilities. Aims to drive production of Co-Packaged Optics (CPOs) and high-density interconnects for AI infrastructure.
- LightmattercoreDevelopment partnership where PHIX performs precision fiber array attachment processes for Lightmatter's photonic chips, ensuring optimal optical connectivity, reliability, and scalability for AI and HPC applications.
- ITRI (Industrial Technology Research Institute)coreTaiwan's world-leading applied technology research institute providing system-level validation and integrated photonics development platforms. First comprehensive collaboration between Taiwanese and Dutch integrated photonics ecosystems.
- LigitekcoreTaiwanese optoelectronic component manufacturer and system integrator spanning automotive, advanced packaging, imaging, and high-speed communication with automated mass production capabilities.
- LiveragecoreTaiwan-based optical transceiver developer and manufacturer with expertise in high-speed transceiver design, optical engine integration, and high-frequency signal verification.
- BronkhorstminorPartnership for volume manufacturing of thermal mass flow sensors using PHIX micro-assembly know-how, demonstrating PHIX's ability to contribute to sensor scale-up.
- TERAWAY ConsortiumcoreH2020 5GPPP Phase III project developing THz transceivers for 5G networks. PHIX responsible for packaging including hybrid photonic integration, antenna rod attachment, and thermal management.
- TEEM PhotonicsminorPartnership to offer pre-assembled glass WAFT (Waveguide Array to Fiber Transposer) to Fiber array solutions for spot size converter assembly manufacturing.
- TERA6G ConsortiumcoreEU Horizon Europe project (GA 101096949) developing wireless transceiver modules using integrated RF photonics and advanced beam steering. PHIX serves as advanced packaging partner with 3D module design expertise.
- PHOREVER ConsortiumminorHorizon Europe project developing multi-sensing photonic platform for cancer and cardiovascular disease diagnosis. PHIX contributes PIC packaging and 3D microfabrication capabilities.
- Tyndall InstituteminorPIXAPP Pilot Line coordinator providing training of PHIX engineers on advanced packaging equipment, strengthening photonic ecosystem in Europe.
- Light Trace PhotonicsminorCustomer using PHIX packages (Characterization Package and Large Area Goldbox) for LightPort:Edu educational photonics platform.
Scale indicators7 records
Recent moves8 records
Expansion highlights6 records
PHIX competitors and assessment
Company assessmentRegional players
- Ligentec: Swiss/Netherlands-based silicon nitride (SiN) photonic foundry and PhotonDelta ecosystem member. Competes with PHIX indirectly as a SiN PIC platform provider and partners with PHIX for packaging services in the European ecosystem.
- SMART Photonics: Eindhoven, Netherlands-based indium phosphide (InP) photonic foundry and fellow PhotonDelta ecosystem member. Sits upstream of PHIX as a wafer supplier but adjacent as an InP PIC platform partner, competing for the same Dutch photonic customer base.
Direct peers
- CompoundTek: Singapore-based silicon photonics foundry offering wafer-level services and ecosystem support to PIC developers. Competes with PHIX for photonic chip developers needing foundry + packaging services in adjacent geographies.
- ficonTEC Service: German-headquartered supplier of automated photonic and optoelectronic assembly equipment and contract manufacturing services. Closest direct competitor to PHIX in hybrid photonic/electronic chip-to-chip assembly, including die-to-wafer bonding lines that overlap with PHIX's contract manufacturing offering.
Broad incumbents
- Coherent: US-based broad incumbent in photonic materials, lasers, and optical networking (formerly II-VI). Competes with PHIX as a large integrated optics supplier with internal photonic packaging capabilities across telecom, industrial, and datacom.
- Tower Semiconductor: Israel-based specialty foundry offering silicon photonics wafer processes (PH18 platform) and analog/RF foundry services. Competes with PHIX as part of larger vertically-integrated photonic platform offerings to global customers.
- GlobalFoundries: US-headquartered global foundry with silicon photonics platforms (GF Fotonix) and packaging capabilities. Competes with PHIX for high-volume PIC manufacturing customers and represents a much larger, established alternative.
- Lumentum: US-based broad incumbent in optical components, lasers, and 3D sensing. Competes with PHIX indirectly as a vertically-integrated optics supplier with in-house packaging for telecom, datacom, and 3D sensing end-markets PHIX serves.
Emerging players
- AIM Photonics: US Department of Defense-backed integrated photonics manufacturing institute offering foundry + packaging services. Competes with PHIX for photonic packaging customers, especially US defense and aerospace programs, and is a comparable emerging public-private packaging platform.
Others
- JePPIX: European pilot-line service broker connecting customers to PIC foundries and packaging providers including PHIX. Functions as a complementary ecosystem channel and indirect competitor to PHIX's direct sales motion in European photonic packaging services.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights6 records
Customer concentration
PHIX social profiles
Digital presencePHIX compliance and trust
Trust signalCompliance1 record
PHIX financial estimates
Financial estimateRevenue estimate
Valuation estimate
PHIX leadership team
Management profileNumber of profiles
Profiles5 records
PHIX funding detail
Funding detailFunding overview
Funding rounds4 records
Investors3 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
PHIX M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about PHIX
What does PHIX do?
PHIX is a packaging foundry that supplies the photonics industry with assembly and packaging services for Photonic Integrated Circuits (PICs). The company provides a one-stop shop ranging from standardized prototype packages (e.g., PHIX Characterization Package) and contract manufacturing (die bonding, wire bonding, fiber attachment, hybrid assembly) to high-volume production packages across multiple material platforms including silicon photonics, indium phosphide, silicon nitride, lithium niobate, gallium arsenide, and ion-exchanged glass.
Is PHIX a public or private company?
PHIX is a private company. It is classified as venture growth investor backed and is currently operating.
When was PHIX founded?
PHIX was founded in 2017. It employs 51 to 100 people.
Where is PHIX based?
PHIX is headquartered in Enschede, Netherlands, in the Europe region.
How does PHIX make money?
Four revenue lines are on record. PIC Packaging Services are the primary driver. The others are prototype Package Sales, fiber Array Products and 3D Microfabrication Services.
Who are PHIX's main competitors?
Regional players on record are Ligentec and SMART Photonics. Direct peers are CompoundTek and ficonTEC Service. Broad incumbents are Coherent, Tower Semiconductor, GlobalFoundries and Lumentum. AIM Photonics is listed as an emerging player. JePPIX is listed as an others.
Does PHIX have an API?
No public API is recorded for PHIX.
What industry is PHIX in?
PHIX's product category is Photonics Packaging Services. Its primary akta.pro industry code is HDAHADAI, System-in-Package (SiP) & Module Assembly (RF modules, power modules). Its NAICS code is 334418 and its SIC code is 3823.