Advanced Materials Technology & Engineering

What Advanced Materials Technology & Engineering does

Advanced Materials Technology & Engineering, Inc. (AMTE / Yiwen Technology / 邑文科技) is a privately held Chinese semiconductor front-end equipment manufacturer founded in 2011 and headquartered in Wuxi, Jiangsu Province, with a manufacturing subsidiary (Jiangsu Yiwenn Microelectronics) in Nantong. The company designs and produces equipment used in the front-end stages of semiconductor wafer fabrication, focused on etching and thin-film deposition processes. Its core self-developed portfolio, marketed under the SINO Plasma brand, covers ICP and CCP etching (for silicon, dielectric, metal, deep silicon/SiC, GaN, GaAs, and AlN), atomic layer deposition (ALD) including high-aspect-ratio TSV coating, plasma-enhanced chemical vapor deposition (PECVD), plasma stripping, UV curing, and rapid thermal processing (RTP). Equipment is qualified for 6-inch, 8-inch, and 12-inch wafers and is targeted at compound-semiconductor (SiC, GaN, GaAs) and MEMS specialty-process applications, as well as mainstream logic and memory production.

AMTE's revenue is generated primarily through hardware sales of new front-end equipment, complemented by equipment refurbishment services for legacy platforms from Applied Materials (P5000, Endura 5500, Centura 5200), Lam Research (TCP, Rainbow), Gasonics, and Mattson, plus spare parts and on-site technical services. The company sells directly to tier-1 Chinese semiconductor fabs including SMIC, SK Hynix (Wuxi), Hua Hong Semiconductor, and BYD Semiconductor, with marquee 12-inch tool deliveries completed at Hua Hong's Wuxi FAB9 in March 2026 and BYD Semiconductor's Chengdu fab in 2025. Go-to-market relies on direct enterprise field sales, technical demonstrations, participation in industry exhibitions such as SEMICON China and CSEAC, and WeChat-based technical content marketing, supported by a nationwide service network with 7x24 response capability. The business is reinforced by a National High-Tech Enterprise designation (2017), ISO9001 certification (2015), and National Intellectual Property Advantage Enterprise recognition (2023), and is backed by a Series D funding round of approximately $70.5M closed in January 2024 led by CICC Jiacheng Investment Management and Haitong New Energy.

Name

Advanced Materials Technology & Engineering

Legal name

Advanced Materials Technology & Engineering, Inc.

Website

http://www.amteglobal.cn

Company type

Private

Founded year

2011

Operating status

Operating

Headcount range

251–500 employees

Short description

Advanced Materials Technology & Engineering (AMTE / Yiwen Technology) is a privately held Chinese manufacturer of front-end semiconductor process equipment, specializing in self-developed SINO Plasma ICP/CCP etching, ALD, PECVD, stripping, and RTP tools, plus legacy equipment refurbishment, serving tier-1 domestic fabs including SMIC, SK Hynix, Hua Hong, and BYD Semiconductor.

Ownership category

akta.pro rank

Product category

Semiconductor Front-End Process Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)

akta.pro secondary industries

Wafer Handling, Automation & Robotics (AMHS) (HDAHAEAI), Epitaxy Materials & Services (Epi Wafers/MBE/MOCVD) (HDAHAGAC)

Keywords

• Semiconductor equipment manufacturing
• Front-end process equipment
• Plasma etching systems
• Thin film deposition
• Atomic layer deposition

Headquarters

HQ city

Wuxi Shi

HQ country

China

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Infrastructure, Marketing or Sales, Operations

Revenue model

1. Semiconductor Equipment Sales: Sale of front-end semiconductor process equipment including etching systems (ICP, CCP), thin film deposition (ALD, PECVD, PVD), stripping, and RTP equipment. Equipment sales include both newly manufactured systems and refurbished platforms from major OEMs.
2. Technical Services and Support: Comprehensive technical services including customer communication support, process control, equipment testing at Nantong remanufacturing center, product upgrades (hardware/software customization), and nationwide on-site service support with 7*24 response capability.
3. Spare Parts Supply: Supply of spare parts and consumables for semiconductor equipment including process kits for P5000 series etchers and PECVD systems.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

Advanced Materials Technology & Engineering (AMTE/邑文科技) is a Chinese semiconductor front-end equipment manufacturer that designs, produces, and services its own SINO Plasma series of etching equipment (ICP, CCP, metal, TSV), atomic layer deposition (ALD) systems, PECVD thin-film deposition tools, plasma strippers, UV curing equipment, and rapid thermal processing (RTP) systems for 6/8/12-inch wafers. The company also refurbishes legacy semiconductor platforms from major OEMs and supplies spare parts and on-site technical services to fabs across China.

Product overview

Advanced Materials Technology & Engineering (AMTE) is a semiconductor front-end equipment manufacturer specializing in etching and thin-film deposition equipment. The company offers a comprehensive portfolio including: (1) Self-developed SINO Plasma series equipment for ICP etching (Plasma2000ICP, Plasma6000CCP for dielectrics, Plasma7000Metal for metals, Plasma200TSV for deep silicon), ALD atomic layer deposition (R200 for R&D, P200 for batch production, C200 for stacked coatings), PECVD thin-film deposition (Plasma2000), plasma stripping (Plasma100/1000 Strip), UV curing (Plasma100 UV), and rapid thermal processing (Plasma100 RTP); (2) Equipment refurbishment services for legacy platforms including Lam TCP/Rainbow/Centura, AMAT P5000/Endura, Gasonics, and Mattson Aspen II; and (3) Spare parts and technical services including customer communication, process control, equipment testing, and product upgrades.

Differentiator

Problem solved

Functional benefit

Products and services

• SINO Plasma2000ICP ICP Etcher ICP etcher for silicon, polysilicon, silicon nitride, silicon oxide, SiC, GaN, GaAs, AlN, and optical waveguide etching on 8-inch and 12-inch wafers. Used by semiconductor fabs for front-end etching processes.
• SINO Plasma200TSV Deep Silicon Trench Etcher Deep silicon trench etching machine designed for silicon and silicon carbide applications, including deep trench and through-silicon via (TSV) etching processes.
• SINO Plasma7000Metal Metal Etcher Metal etcher for aluminum, titanium, molybdenum, tungsten, titanium oxide, titanium nitride, and aluminum nitride etching used in semiconductor front-end interconnect processes.
• SINO Plasma6000CCP Dielectric Etcher CCP dielectric etcher for Contact/Via, Spacer, Passivation, Hardmask, SAB, and Etch Back processes used in advanced semiconductor manufacturing.
• SINO ALD R200 R&D and Small Batch ALD System R&D and small batch atomic layer deposition system for thin film deposition, targeting process development and pilot production in semiconductor and MEMS fabs.
• SINO ALD P200 Batch ALD System Batch atomic layer deposition system for moisture barrier protective layers, optical coatings, and functional films used in volume production environments.
• SINO ALD C200 Stacked Coating ALD System Stacked coating ALD system for high-k dielectric gates, deep trench MIM structures with aspect ratios over 200, and TSV deep hole coating in advanced semiconductor manufacturing.
• SINO Plasma2000 PECVD System Plasma Enhanced Chemical Vapor Deposition system for α-Si, SiO2, SixNy, PSG, and BPSG thin film deposition used in silicon-based, compound semiconductor, MEMS, filter, and microdisplay applications.
• SINO Plasma100 Strip Plasma Stripper ICP plasma stripping system for photoresist removal on wafers up to 8 inches.
• SINO Plasma1000 Strip ICP Plasma Stripper ICP plasma stripping system for photoresist stripping, low-temperature stripping, bottom film deposition, carbon film removal, and plasma cleaning.
• SINO Plasma100 RTP Rapid Thermal Processing System Rapid thermal processing system supporting RTP, RTO, RTA, and RTN processes for wafers up to 8 inches across silicon, SiC, GaN, GaAs, sapphire, and quartz substrates.
• SINO Plasma100 UV Curing System UV curing equipment for photoresist curing and adhesive curing on wafers up to 8 inches across silicon, SiC, GaN, GaAs, sapphire, and quartz substrates.
• P5000 Series Equipment Refurbishment Refurbished Applied Materials P5000 platforms with Mark II, MxP, MxP+, and Super-E chambers for etch and CVD applications, provided to legacy 6/8-inch fabs.
• Endura5500 Series Equipment Refurbishment Refurbished Applied Materials Endura 5500 platforms for PVD and MOCVD applications in legacy fabs.
• Centura 5200 Series Equipment Refurbishment Refurbished Applied Materials Centura 5200 platforms for DPS, eMax, Super-E, and CVD applications in legacy fabs.
• Gasonics Series Equipment Refurbishment Refurbished Gasonics A1000, A2000, L3510, and PEP3510 platforms for stripping applications in legacy fabs.
• Rainbow Series Equipment Refurbishment Refurbished Lam Research Rainbow 4420, 4520, and 4720 plasma etchers for 8-inch and below wafers.
• TCP 9400/9600 Series Equipment Refurbishment Refurbished Lam Research TCP 9400/9600 plasma etchers for oxide, nitride, polysilicon, silicon, and metal etching.
• Mattson Aspen II Series Equipment Refurbishment Refurbished Mattson Aspen II ICP strippers for 6-8 inch semiconductor wafer production lines.
• Semiconductor Equipment Spare Parts Spare parts and consumables including process kits for Metal Etch P5000, Mxp+ Etch P5000, PECVD P5000, and Poly Etch P5000 platforms.
• Technical Service and Support Comprehensive technical services including customer communication, process control, equipment testing at the Nantong remanufacturing center, hardware/software upgrades, and 7x24 nationwide on-site service support.

Quantifiable outcome

• Successfully entered major 12-inch wafer fabs including SMIC, Hynix, Hua Hong, and BYD Semiconductor
• +2 more outcomes

Named customers4 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Six partnerships are on record, tiered core and minor.

• 方正微电子 & 爱科赛博 (Fangzheng Microelectronics & Aike Cyber)coreStrategic or Co-development Partner · 29 December 2025Jointly established Third-Generation Power Device Semiconductor Equipment Application Industry Chain Joint Laboratory. The three-party collaboration combines core technology advantages and industry positioning to jointly promote SiC technology R&D innovation and industrialization.
• 东北大学 (Northeastern University)coreStrategic or Co-development Partner · 15 May 2025Strategic cooperation signed for semiconductor physics and CVD equipment design and simulation research. The partnership aims to achieve technology breakthroughs in semiconductor equipment through deep collaboration between university research and industry application.
• 信息产业电子第十一设计研究院 (11th Design Institute)coreStrategic or Co-development Partner · 28 June 2023Signed strategic cooperation agreement for resource integration and engineering consulting construction services. The partnership combines AMTE's semiconductor equipment expertise with the design institute's engineering capabilities to support semiconductor facility construction and development.
• 泓芯半导体 (Hongxin Semiconductor)minorStrategic or Co-development PartnerCo-organized the 4th Yiwenn Technology Forum at the Nantong Manufacturing Center, attracting all technical backbone personnel from the R&D center for technical exchange.
• 无锡市集成电路学会 (Wuxi Integrated Circuit Society)minorStrategic or Co-development PartnerParty-building joint activity held at Yiwenn Technology Wuxi headquarters. The collaboration promotes exchange between party organizations and supports integrated circuit industry collaborative development.
• 复旦大学宁波研究院 (Fudan University Ningbo Research Institute)minorStrategic or Co-development PartnerCustomer visit and collaboration exploration activity conducted by the company team at Fudan University Ningbo Research Institute, focusing on customer satisfaction improvement and new opportunity development.

Scale indicators7 records

Recent moves10 records

Expansion highlights6 records

Direct peers

• Advanced Micro-Fabrication Equipment Inc. (AMEC): China's leading domestic etch equipment maker, listed on Shanghai STAR Market; directly competes with AMTE in ICP/CCP etching for logic, memory, and compound semiconductor applications at the same tier-1 Chinese fabs.
• NAURA Technology Group: Largest Chinese semiconductor equipment conglomerate offering etch, CVD/PECVD, PVD, ALD, oxidation, and cleaning tools; broad portfolio directly overlaps AMTE's SINO Plasma etch and deposition products and competes head-to-head at SMIC, Hua Hong, and other Chinese fabs.
• ACM Research (Shanghai ACM): China-listed semiconductor cleaning equipment maker (parent ACM Research US-listed); adjacent in the front-end equipment space serving the same Chinese fab customers and targeting domestic equipment localization, with growing deposition roadmap.
• Piotech: Chinese semiconductor thin-film deposition equipment specialist (PECVD, ALD, HDPCVD); directly competes with AMTE's Plasma2000 PECVD and SINO ALD platforms at Chinese logic and memory fabs.
• Beijing Sevenstar Electronics: Chinese semiconductor equipment maker with capabilities across diffusion, CVD, and etch; comparable front-end equipment supplier serving domestic fabs in the same localization-driven customer base as AMTE.

Emerging players

• SiCarrier (Shenzhen Si Carrier Semiconductor): Rapidly emerging Chinese semiconductor equipment maker backed by Huawei ecosystem, expanding into etch and deposition; competes with AMTE for new domestic equipment qualifications at Chinese fabs.
• Jiangsu Leuven Instruments: China-based semiconductor equipment specialist focused on CVD, ALD, and other deposition tools; closely comparable to AMTE's thin-film deposition business and serving overlapping compound-semiconductor and MEMS customer segments.
• Kingsemi (King Semi Electronics): Chinese semiconductor equipment maker focused on CVD, ALD, and epitaxy systems; directly comparable technology stack to AMTE and competes for the same domestic fab qualifications.

Broad incumbents

• Lam Research: Global leader in etch and deposition equipment, including the Lam Rainbow, TCP, and other platforms that AMTE explicitly refurbishes; benchmark for incumbent competition AMTE faces for advanced-node etch share.
• Applied Materials: Global semiconductor equipment leader whose P5000, Endura5500, and Centura 5200 platforms form the core of AMTE's refurbishment franchise and whose broader deposition/etch portfolio represents the ultimate competitive benchmark for AMTE's self-developed tools.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries1 record

Funding overview

Funding rounds1 record

Investors12 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Advanced Materials Technology & Engineering