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LiGenTec

Full company profile

uuid0003zl9

Namestring
LiGenTec
Legal namestring
LIGENTEC SA
Websiteurl
ligentec.com
Company typeenum
Private
Founded yearint
2016
Descriptiontext

LIGENTEC SA (LiGenTec) is a Swiss B2B deep-tech company that manufactures Photonic Integrated Circuits (PICs) on a proprietary Silicon Nitride (SiN) waveguide platform with heterogeneous integration of Thin-Film Lithium Niobate (TFLN) and III-V materials. The company operates a 200mm CMOS fab-scale, automotive-qualified production line that achieves ultra-low propagation losses below 0.5 dB/m and high-Q resonators exceeding 20 million, positioning its process among the low-loss leaders in the integrated photonics foundry market. Founded around 2016 and headquartered in Lausanne, Switzerland, LiGenTec employs 51-100 people and serves a horizontal customer base of photonic system designers.

LiGenTec's revenue model is built on four service streams: Multi-Project Wafer (MPW) prototyping runs (approximately 15 per year) that lower the entry barrier for mid-market and academic customers; dedicated foundry services for volume production; Process Design Kit (PDK) and design enablement tools; and custom integration / R&D partnerships through its LIGENTEC LABS division. Pricing is quote-based across all streams with no public price list, reflecting bespoke commercial terms. The company targets approximately 10 application segments with 4 primary use cases spanning datacom, quantum computing, sensing, and neuromorphic computing.

The company is a co-founder of the Swiss PIC manufacturing center, inaugurated in November 2025, which gives it a dedicated European production footprint. LiGenTec is also an active partner in the P4Q European photonic-quantum consortium and in an expanded partnership with X-FAB for SOI and TFLN process integration. These ecosystem positions, combined with its in-house fab and growing product portfolio (TFLN modulators, III-V heterogeneous integration), indicate a foundry positioning that bridges academic prototyping and industrial volume production within the European photonic supply chain.

Short descriptiontext

LIGENTEC SA is a Swiss manufacturer of Photonic Integrated Circuits using a proprietary low-loss Silicon Nitride waveguide platform, serving B2B customers across datacom, quantum computing, sensing, and neuromorphic computing applications via MPW prototyping and dedicated foundry services.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
51–100
akta.pro rankint
HeadquartersLausanne, Switzerland
HQ citystring
Lausanne
HQ countrystring
Switzerland
HQ regionstring
Europe
Markets served

Serves global market

Offices2 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
photonic integrated circuits, silicon nitride photonics, photonic foundry services, multi-project wafer runs, thin-film lithium niobate
Industry2 codes
1Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser)
CodeHDAHACAGPrimaryYes
2Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification)
CodeHDAHACAJPrimaryNo
NAICS code1 code
  • Semiconductor and Other Electronic Component Manufacturing33441
SIC code1 code
  • Semiconductors & Related Devices3674
Product category
Photonic Integrated Circuit Manufacturing
GTM motion2 records

Each record includes

Type, Description, Source

Revenue model4 records
1Dedicated Foundry Services
TypeOne Time License
Description

High-volume manufacturing of photonic integrated circuits through automotive-qualified 200mm SiN foundry. Provides unparalleled performance with ultra-low propagation losses and high-Q resonators, uncompromising quality with optical/morphological testing, certifications and SPC, and industrial scalability.

ligentec.com
2Multi-Project Wafer (MPW) Program
TypeOne Time License
Description

Cost-effective prototyping service with approximately 15 runs per year. Allows customers to share wafer costs and access advanced PIC development. Includes photodetector integration and TFLN modulators through LIGENTEC LABS.

ligentec.com
3Design Enablement Services
TypeProfessional Services
Description

Technical guidance, design optimization, troubleshooting, PDK access, and expert support throughout the design process. Includes comprehensive PDKs for major software providers with DRC rules and validated models.

ligentec.com
4Custom Integration and R&D Partnerships
TypeProfessional Services
Description

Strategic R&D partnerships and custom integration solutions for unique challenges, pioneering new functionalities in integrated photonics.

ligentec.com
Marketing channels8 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels4 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Technology or R&D, Infrastructure, Personnel, Operations, Marketing or Sales
Pricing details4 tiers
1Multi-Project Wafers / Custom Prototyping - 10s to 100s chip volume
ModelUnit PricingBilling cadencePay-as-you-go
Notes

Cost-effective prototyping through shared wafer costs. Volume typically in 10s to 100s of chips.

ligentec.com
2Pilot Production - >2,000 chips
ModelUnit PricingBilling cadenceMulti-year contract
Notes

Pilot production scaling for designs transitioning from prototyping to production.

ligentec.com
3Volume Production - >10,000 chips
ModelUnit PricingBilling cadenceMulti-year contract
Notes

High-volume manufacturing for mass market demand.

ligentec.com
4TFLN Modulator Integration
ModelOtherBilling cadencePay-as-you-go
Notes

Available through MPW-LN runs or dedicated projects for tailored development with Thin-film Lithium Niobate modulators.

ligentec.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 record
1LIGENTEC LABS
Description

Advanced technology division offering Thin Film Lithium Niobate (TFLN) and III-V Heterogeneous integration services.

ligentec.com
Core offering1 text field

LIGENTEC manufactures low-loss Photonic Integrated Circuits (PICs) on a proprietary Silicon Nitride (SiN) platform with heterogeneous Thin-film Lithium Niobate (TFLN) and III-V integration, fabricated at a 200mm automotive-qualified CMOS fab. The company provides a complete foundry offering—from Multi-Project Wafer (MPW) prototyping runs through dedicated volume production—alongside PDK-based design enablement, feasibility studies, layout support, and high-throughput testing for customers building computing, connectivity, and sensing photonic products.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 5 values shown
  • Propagation losses <0.5 dB/m and Q factors >20M for high-precision applications
+4 more records
Product overview1 text field

LIGENTEC is a leading European manufacturer of Photonic Integrated Circuits (PICs) providing access to state-of-the-art technologies through a modular platform architecture. The core offering centers on Silicon Nitride (SiN) PIC manufacturing at 200mm automotive-qualified fabs, complemented by Thin Film Lithium Niobate (TFLN) and III-V heterogeneous integration via LIGENTEC Labs. Customers access the technology via Multi-Project Wafer (MPW) runs for prototyping, Dedicated Foundry Services for volume production, and Design Enablement with comprehensive PDKs compatible with major EDA tools. The platform supports applications across LIDAR, Quantum computing, Biosensing, Datacom/Telecom, Metrology, Neuromorphic computing, AR/VR, and Space.

Product and service8 records
1Multi-Project Wafer (MPW) Program
CategoryPhotonic foundry prototyping service
2Dedicated Foundry Services
CategoryPhotonic foundry volume manufacturing
3Silicon Nitride (SiN) PIC Manufacturing
CategoryPhotonic integrated circuit wafer fabrication
4Thin Film Lithium Niobate (TFLN) Integration
CategoryHeterogeneous photonic integration
5III-V Heterogeneous Integration
CategoryHeterogeneous photonic integration
6Design Enablement & PDK
CategoryEDA design enablement service
7Feasibility & Testing Services
CategoryEngineering services
8InGaAs Photodetectors
CategoryPhotonic active component integration
Scale indicator6 records

Each record includes

Type, Value, Description, Source

Partnership5 partners
Strategic tierStrategicTypeStrategic or Co-development PartnerAnnounced on2026-01-21
Description

LIGENTEC participates as a commercial partner in the Photonics for Quantum (P4Q) consortium, a €50 million European pilot project launching in 2026 across twelve countries. The initiative aims to improve reliability, scalability, and manufacturability of photonic chips for quantum sensing, computing, and secure communications. The consortium develops standards, design kits, and production techniques to transition quantum photonic technologies from lab prototypes to repeatable industrial production. LIGENTEC collaborates with research organizations including Delft University of Technology, Imec, and TNO, and other commercial partners including Quix Quantum and New Origin.

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2026-01-19
Description

LIGENTEC and X-FAB expanded their existing collaboration to strengthen their integrated photonics portfolio. The partnership integrates X-FAB's XPH90 Silicon Photonics (SOI) technology into LIGENTEC's photonics platform, creating a unified ecosystem spanning SOI and low-loss SiN technologies. The partners jointly invest in scaling thin-film lithium niobate (TFLN) integration within X-FAB's 200mm wafer foundry ecosystem for high-performance electro-optic capabilities in next-generation communication and quantum computing applications. The collaboration aims to simplify customer access to advanced photonic technologies and strengthen Europe's position in next-generation photonic integration.

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-11-24
Description

LIGENTEC is a co-founder of Swiss PIC, officially inaugurated on November 24, 2025 at Park Innovaare in Villigen, Switzerland. Swiss PIC is a manufacturing center for photonic integration that provides high-precision machines, specialized processes, and expertise to help photonics companies bring light-based microchips to market. The center enables companies to assemble photonic microchips with industry-standard connectors for rapid access to broader applications. Swiss PIC was founded in 2023 by an alliance including PSI, OST, Swissphotonics Association, and companies Ligentec and Polariton Technologies.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

Quix Quantum is a commercial partner in the P4Q consortium alongside LIGENTEC, working on the industrialization of photonic quantum chips.

Strategic tierMinorTypeStrategic or Co-development Partner
Description

New Origin is a commercial partner in the P4Q consortium alongside LIGENTEC, working on the industrialization of photonic quantum chips.

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

US-based public-private partnership operating a 300mm silicon photonics foundry. Large-scale incumbent with broader SOI platform offering competing for similar datacom, quantum, and sensing customers as LiGenTec.

TypeBroad incumbent
Description

Israeli specialty foundry offering silicon photonics platforms (including SiGe and SOI-based PH18) via TowerJazz. Large incumbent with integrated analog+photonics portfolio serving similar datacom and sensing customers.

3AMF (Advanced Micro Foundry)
TypeDirect peer
Description

Singapore-based Silicon Nitride photonic foundry providing MPW and volume manufacturing. Competes directly with LiGenTec in SiN-based PIC services for similar telecom, datacom, and sensing end markets.

TypeDirect peer
Description

Dutch-based photonic integrated circuit foundry specializing in TriPleX (SiN-based) waveguide technology. Closest European direct competitor to LiGenTec, offering MPW runs and custom fabrication with similar low-loss waveguide focus.

TypeEmerging player
Description

Swiss-based TFLN modulator company and co-founder of Swiss PIC alongside LiGenTec. Comparable in niche focus on high-performance electro-optic components, with potential to be both collaborator and adjacent competitor in the TFLN space.

6CSIPL (CompoundTek)
TypeDirect peer
Description

Singapore-based Silicon Nitride (SiN) photonic foundry offering MPW and dedicated wafer services. Direct competitor to LiGenTec in the SiN platform space, serving similar customers in datacom, quantum, and sensing applications.

TypeBroad incumbent
Description

Major semiconductor foundry offering GF Fotonix silicon photonics platform at 200mm/300mm. Large incumbent with bundled SOI+photonics offering that competes with LiGenTec's specialist SiN focus.

TypeDirect peer
Description

European photonic design house and foundry services company, now part of Hitachi. Competes with LiGenTec on photonic circuit design and foundry access across multiple material platforms including SiN and SOI.

TypeBroad incumbent
Description

European specialty foundry (XPH90 Silicon Photonics) and LiGenTec's strategic partner. Broader analog/mixed-signal operating model with silicon photonics as one technology pillar, both partnering and competing for the same customer base.

TypeBroad incumbent
Description

Major Belgian independent research center operating a silicon photonics foundry (iSiPP50G) and co-leader in P4Q consortium with LiGenTec. Broader incumbent offering extensive PDKs, design services, and SOI/SiN capabilities.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks7 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Segment10 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile3 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

Integration5 records

Each record includes

Title, Type, Description, Source

AI maturity
App detail

Has app

Feature6 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles3 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance1 record

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds4 records

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors2 records

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

LiGenTec

Photonic Integrated Circuit Manufacturingligentec.com

LIGENTEC SA is a Swiss manufacturer of Photonic Integrated Circuits using a proprietary low-loss Silicon Nitride waveguide platform, serving B2B customers across datacom, quantum computing, sensing, and neuromorphic computing applications via MPW prototyping and dedicated foundry services.

What LiGenTec does

LIGENTEC SA (LiGenTec) is a Swiss B2B deep-tech company that manufactures Photonic Integrated Circuits (PICs) on a proprietary Silicon Nitride (SiN) waveguide platform with heterogeneous integration of Thin-Film Lithium Niobate (TFLN) and III-V materials. The company operates a 200mm CMOS fab-scale, automotive-qualified production line that achieves ultra-low propagation losses below 0.5 dB/m and high-Q resonators exceeding 20 million, positioning its process among the low-loss leaders in the integrated photonics foundry market. Founded around 2016 and headquartered in Lausanne, Switzerland, LiGenTec employs 51-100 people and serves a horizontal customer base of photonic system designers.

LiGenTec's revenue model is built on four service streams: Multi-Project Wafer (MPW) prototyping runs (approximately 15 per year) that lower the entry barrier for mid-market and academic customers; dedicated foundry services for volume production; Process Design Kit (PDK) and design enablement tools; and custom integration / R&D partnerships through its LIGENTEC LABS division. Pricing is quote-based across all streams with no public price list, reflecting bespoke commercial terms. The company targets approximately 10 application segments with 4 primary use cases spanning datacom, quantum computing, sensing, and neuromorphic computing.

The company is a co-founder of the Swiss PIC manufacturing center, inaugurated in November 2025, which gives it a dedicated European production footprint. LiGenTec is also an active partner in the P4Q European photonic-quantum consortium and in an expanded partnership with X-FAB for SOI and TFLN process integration. These ecosystem positions, combined with its in-house fab and growing product portfolio (TFLN modulators, III-V heterogeneous integration), indicate a foundry positioning that bridges academic prototyping and industrial volume production within the European photonic supply chain.

LiGenTec firmographics

Firmographics
Name
LiGenTec
Legal name
LIGENTEC SA
Website
https://ligentec.com
Company type
Private
Founded year
2016
Operating status
Operating
Headcount range
51–100 employees
Short description
LIGENTEC SA is a Swiss manufacturer of Photonic Integrated Circuits using a proprietary low-loss Silicon Nitride waveguide platform, serving B2B customers across datacom, quantum computing, sensing, and neuromorphic computing applications via MPW prototyping and dedicated foundry services.
Ownership category
akta.pro rank

LiGenTec industry classification

Industry
Product category
Photonic Integrated Circuit Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing (33441)
SIC
Semiconductors & Related Devices (3674)
akta.pro primary industry
Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG)
akta.pro secondary industry
Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)

Keywords

  • Photonic integrated circuits
  • Silicon nitride photonics
  • Photonic foundry services
  • Multi-project wafer runs
  • Thin-film lithium niobate

Where LiGenTec is headquartered

Location

Headquarters

HQ city
Lausanne
HQ country
Switzerland
HQ region
Europe

Offices2 records

Markets served

LiGenTec business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Technology or R&D, Infrastructure, Personnel, Operations, Marketing or Sales

Revenue model

  1. Dedicated Foundry Services: High-volume manufacturing of photonic integrated circuits through automotive-qualified 200mm SiN foundry. Provides unparalleled performance with ultra-low propagation losses and high-Q resonators, uncompromising quality with optical/morphological testing, certifications and SPC, and industrial scalability.
  2. Multi-Project Wafer (MPW) Program: Cost-effective prototyping service with approximately 15 runs per year. Allows customers to share wafer costs and access advanced PIC development. Includes photodetector integration and TFLN modulators through LIGENTEC LABS.
  3. Design Enablement Services: Technical guidance, design optimization, troubleshooting, PDK access, and expert support throughout the design process. Includes comprehensive PDKs for major software providers with DRC rules and validated models.
  4. Custom Integration and R&D Partnerships: Strategic R&D partnerships and custom integration solutions for unique challenges, pioneering new functionalities in integrated photonics.

Pricing tiers

ModelBillingPrice
Unit PricingPay-as-you-goMulti-Project Wafers / Custom Prototyping - 10s to 100s chip volume
Unit PricingMulti-year contractPilot Production - >2,000 chips
Unit PricingMulti-year contractVolume Production - >10,000 chips
OtherPay-as-you-goTFLN Modulator Integration

Go-to-market motion2 records

Distribution channels4 records

Marketing channels8 records

LiGenTec product offering

Product offering

Core offering

LIGENTEC manufactures low-loss Photonic Integrated Circuits (PICs) on a proprietary Silicon Nitride (SiN) platform with heterogeneous Thin-film Lithium Niobate (TFLN) and III-V integration, fabricated at a 200mm automotive-qualified CMOS fab. The company provides a complete foundry offering—from Multi-Project Wafer (MPW) prototyping runs through dedicated volume production—alongside PDK-based design enablement, feasibility studies, layout support, and high-throughput testing for customers building computing, connectivity, and sensing photonic products.

Product overview

LIGENTEC is a leading European manufacturer of Photonic Integrated Circuits (PICs) providing access to state-of-the-art technologies through a modular platform architecture. The core offering centers on Silicon Nitride (SiN) PIC manufacturing at 200mm automotive-qualified fabs, complemented by Thin Film Lithium Niobate (TFLN) and III-V heterogeneous integration via LIGENTEC Labs. Customers access the technology via Multi-Project Wafer (MPW) runs for prototyping, Dedicated Foundry Services for volume production, and Design Enablement with comprehensive PDKs compatible with major EDA tools. The platform supports applications across LIDAR, Quantum computing, Biosensing, Datacom/Telecom, Metrology, Neuromorphic computing, AR/VR, and Space.

Differentiator

Problem solved

Functional benefit

Brands

  • LIGENTEC LABS: Advanced technology division offering Thin Film Lithium Niobate (TFLN) and III-V Heterogeneous integration services.

Products and services

  • Multi-Project Wafer (MPW) Program
  • Dedicated Foundry Services
  • Silicon Nitride (SiN) PIC Manufacturing
  • Thin Film Lithium Niobate (TFLN) Integration
  • III-V Heterogeneous Integration
  • Design Enablement & PDK
  • Feasibility & Testing Services
  • InGaAs Photodetectors

Quantifiable outcome

  • Propagation losses <0.5 dB/m and Q factors >20M for high-precision applications
  • +4 more outcomes

Companies that use LiGenTec

Customer profile

Segments10 records

Ideal customer profiles3 records

LiGenTec technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Integration5 records

Feature6 records

LiGenTec partnerships and signals

Strategic signal

Partnerships

Five partnerships are on record, tiered strategic, core and minor.

  • Photonics for Quantum (P4Q) ConsortiumstrategicStrategic or Co-development Partner · 21 January 2026LIGENTEC participates as a commercial partner in the Photonics for Quantum (P4Q) consortium, a €50 million European pilot project launching in 2026 across twelve countries. The initiative aims to improve reliability, scalability, and manufacturability of photonic chips for quantum sensing, computing, and secure communications. The consortium develops standards, design kits, and production techniques to transition quantum photonic technologies from lab prototypes to repeatable industrial production. LIGENTEC collaborates with research organizations including Delft University of Technology, Imec, and TNO, and other commercial partners including Quix Quantum and New Origin.
  • X-FABcoreStrategic or Co-development Partner · 19 January 2026LIGENTEC and X-FAB expanded their existing collaboration to strengthen their integrated photonics portfolio. The partnership integrates X-FAB's XPH90 Silicon Photonics (SOI) technology into LIGENTEC's photonics platform, creating a unified ecosystem spanning SOI and low-loss SiN technologies. The partners jointly invest in scaling thin-film lithium niobate (TFLN) integration within X-FAB's 200mm wafer foundry ecosystem for high-performance electro-optic capabilities in next-generation communication and quantum computing applications. The collaboration aims to simplify customer access to advanced photonic technologies and strengthen Europe's position in next-generation photonic integration.
  • Swiss PIC (Swiss Photonics Integration Center)coreStrategic or Co-development Partner · 24 November 2025LIGENTEC is a co-founder of Swiss PIC, officially inaugurated on November 24, 2025 at Park Innovaare in Villigen, Switzerland. Swiss PIC is a manufacturing center for photonic integration that provides high-precision machines, specialized processes, and expertise to help photonics companies bring light-based microchips to market. The center enables companies to assemble photonic microchips with industry-standard connectors for rapid access to broader applications. Swiss PIC was founded in 2023 by an alliance including PSI, OST, Swissphotonics Association, and companies Ligentec and Polariton Technologies.
  • Quix QuantumminorStrategic or Co-development PartnerQuix Quantum is a commercial partner in the P4Q consortium alongside LIGENTEC, working on the industrialization of photonic quantum chips.
  • New OriginminorStrategic or Co-development PartnerNew Origin is a commercial partner in the P4Q consortium alongside LIGENTEC, working on the industrialization of photonic quantum chips.

Scale indicators6 records

Recent moves6 records

Expansion highlights5 records

LiGenTec competitors and assessment

Company assessment

Broad incumbents

  • AIM Photonics: US-based public-private partnership operating a 300mm silicon photonics foundry. Large-scale incumbent with broader SOI platform offering competing for similar datacom, quantum, and sensing customers as LiGenTec.
  • Tower Semiconductor: Israeli specialty foundry offering silicon photonics platforms (including SiGe and SOI-based PH18) via TowerJazz. Large incumbent with integrated analog+photonics portfolio serving similar datacom and sensing customers.
  • GlobalFoundries: Major semiconductor foundry offering GF Fotonix silicon photonics platform at 200mm/300mm. Large incumbent with bundled SOI+photonics offering that competes with LiGenTec's specialist SiN focus.
  • X-FAB: European specialty foundry (XPH90 Silicon Photonics) and LiGenTec's strategic partner. Broader analog/mixed-signal operating model with silicon photonics as one technology pillar, both partnering and competing for the same customer base.
  • IMEC: Major Belgian independent research center operating a silicon photonics foundry (iSiPP50G) and co-leader in P4Q consortium with LiGenTec. Broader incumbent offering extensive PDKs, design services, and SOI/SiN capabilities.

Direct peers

  • AMF (Advanced Micro Foundry): Singapore-based Silicon Nitride photonic foundry providing MPW and volume manufacturing. Competes directly with LiGenTec in SiN-based PIC services for similar telecom, datacom, and sensing end markets.
  • LioniX International: Dutch-based photonic integrated circuit foundry specializing in TriPleX (SiN-based) waveguide technology. Closest European direct competitor to LiGenTec, offering MPW runs and custom fabrication with similar low-loss waveguide focus.
  • CSIPL (CompoundTek): Singapore-based Silicon Nitride (SiN) photonic foundry offering MPW and dedicated wafer services. Direct competitor to LiGenTec in the SiN platform space, serving similar customers in datacom, quantum, and sensing applications.
  • VLC Photonics (Hitachi): European photonic design house and foundry services company, now part of Hitachi. Competes with LiGenTec on photonic circuit design and foundry access across multiple material platforms including SiN and SOI.

Emerging players

  • Polariton Technologies: Swiss-based TFLN modulator company and co-founder of Swiss PIC alongside LiGenTec. Comparable in niche focus on high-performance electro-optic components, with potential to be both collaborator and adjacent competitor in the TFLN space.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks7 records

Key highlights7 records

Customer concentration

LiGenTec social profiles

Digital presence

LiGenTec compliance and trust

Trust signal

Compliance1 record

LiGenTec financial estimates

Financial estimate

Revenue estimate

Valuation estimate

LiGenTec leadership team

Management profile

Number of profiles

Profiles3 records

LiGenTec funding detail

Funding detail

Funding overview

Funding rounds4 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

LiGenTec M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about LiGenTec

What does LiGenTec do?

LIGENTEC manufactures low-loss Photonic Integrated Circuits (PICs) on a proprietary Silicon Nitride (SiN) platform with heterogeneous Thin-film Lithium Niobate (TFLN) and III-V integration, fabricated at a 200mm automotive-qualified CMOS fab. The company provides a complete foundry offering—from Multi-Project Wafer (MPW) prototyping runs through dedicated volume production—alongside PDK-based design enablement, feasibility studies, layout support, and high-throughput testing for customers building computing, connectivity, and sensing photonic products.

Is LiGenTec a public or private company?

LiGenTec is a private company. It is classified as founder individual operated bootstrapped and is currently operating.

When was LiGenTec founded?

LiGenTec was founded in 2016. It employs 51 to 100 people.

Where is LiGenTec based?

LiGenTec is headquartered in Lausanne, Switzerland, in the Europe region.

How does LiGenTec make money?

Four revenue lines are on record. Dedicated Foundry Services are the primary driver. The others are multi-Project Wafer (MPW) Program, design Enablement Services and custom Integration and R&D Partnerships.

Who are LiGenTec's main competitors?

Broad incumbents on record are AIM Photonics, Tower Semiconductor, GlobalFoundries, X-FAB and IMEC. Direct peers are AMF (Advanced Micro Foundry), LioniX International, CSIPL (CompoundTek) and VLC Photonics (Hitachi). Polariton Technologies is listed as an emerging player.

Does LiGenTec have an API?

No public API is recorded for LiGenTec.

What industry is LiGenTec in?

LiGenTec's product category is Photonic Integrated Circuit Manufacturing. Its primary akta.pro industry code is HDAHACAG, Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser), with a secondary code of HDAHACAJ, Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification). Its NAICS code is 33441 and its SIC code is 3674.

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Live signals
ThequantuminsiderNLM Photonics and LIGENTEC Demonstrate Silicon Nitride Organic Hybrid ModulatorsNLM Photonics and LIGENTEC produced proof-of-concept silicon nitride organic hybrid modulators on LIGENTEC's commercial platform, combining SiN with NLM's organic electro-optic materials. The devices enable active photonics beyond traditional silicon, targeting quantum and sensing applications. The technology is being optimized for future commercial NOH devices.EIN PresswireNLM Photonics and LIGENTEC Build the First Silicon Nitride Organic Hybrid Modulators on a Commercial PlatformNLM Photonics, LIGENTEC, and Spark Photonics built proof-of-concept silicon nitride organic hybrid modulators on a commercial platform. The devices demonstrate viability for quantum and sensing applications, with designs optimized for compact, efficient active SiN devices.PrtimesThin Film Lithium Niobate Optical Modulator Market’s 53.3% CAGR: Top Companies in 2026 – PR TimesIntel Market Research published a report projecting the global Thin Film Lithium Niobate Optical Modulator market to grow from USD 18.6 million in 2024 to USD 416 million by 2032, driven by high-bandwidth optical communication and 5G infrastructure demands. The analysis highlights key industry players such as Fujitsu Limited, HyperLight Corporation, and Ligentec SA, while noting challenges related to manufacturing complexity and supply chain constraints.Photonics SpectraThe Full Spectrum of Photonics Hiring: Where Talent Interest Meets Recruiter DemandBetween January and May 2026, the European Photonics Industry Consortium (EPIC) Jobs in Photonics platform published 5,000 job postings from 500 companies, generating nearly 36,000 active users and revealing both alignment and mismatches between candidate interests and recruiter demands. The data shows that integrated photonics (PIC) roles attracted strong candidate interest despite fewer postings, while procurement and supply chain positions were heavily recruited but less sought by candidates. The article connects these hiring trends to the European Commission's Chips Act 2.0 proposal, noting that companies like LIGENTEC and VLC Photonics face challenges in matching talent to roles due to unclear job titles and role definitions in the photonics sector.openPR.comPhotonic IC Market to Reach USD 24.51 Billion by 2033 as AI Optical Interconnects, Silicon Photonics Scale-Up, and High-Bandwidth Data Center Upgrades Accelerate Commercial AdoptionThe global photonic IC market was valued at USD 10.79 billion in 2025 and is projected to reach USD 24.51 billion by 2033, growing at a 10.8% CAGR, driven by structural shifts in data movement economics as AI clusters and hyperscale data centers scale. Key developments include Marvell's April 2026 acquisition of Polariton Technologies, Lumentum's strategic partnership with NVIDIA, and LIGENTEC's expanded collaboration with X-FAB, signaling the market's transition from research momentum to platform-level deployment for AI infrastructure optics. The market is increasingly defined by manufacturability, platform interoperability, and the ability to support 1.6T, 3.2T, and AI-driven optical connectivity roadmaps.ElectropagesCompanies expand integrated photonics with SOI and thin-film lithium niobate volume scalingLIGENTEC and X-FAB have expanded their collaboration to integrate X-FAB's XPH90 Silicon Photonics (SOI) technology into LIGENTEC's photonics platform, creating a unified ecosystem spanning SOI and low-loss SiN technologies. The partners will jointly invest in scaling thin-film lithium niobate (TFLN) integration within X-FAB's 200mm wafer foundry ecosystem to enable high-performance electro-optic capabilities for next-generation communication and quantum computing applications. The collaboration aims to strengthen Europe's position in next-generation photonic integration and provide a streamlined path from advanced R&D to industrial-scale volume production.Fibre SystemsLigentec X-Fab photonics partnership to scale TFLN for 1.6T networksLigentec and X-Fab announced a partnership to scale TFLN technology for 1.6T networks. The collaboration aims to advance photonics manufacturing for high-capacity network infrastructure.Bits-ChipsUT-led P4Q consortium launches to push industrialization of quantum photonicsThe Photonics for Quantum (P4Q) consortium, coordinated by the University of Twente and backed by a €50 million budget, has launched to advance the industrialization of photonic quantum chips across 29 partners spanning 12 countries. The consortium aims to develop standards and production techniques for scalable, manufacturable quantum devices targeting reduced optical loss and stable cryogenic operation. Commercial partners including Quix Quantum, Ligentec, New Origin, and Thales will collaborate with research organizations such as Delft University of Technology, Imec, and TNO, with the EU funding half the initiative.Photonics SpectraLIGENTEC and X-FAB Expand CollaborationLIGENTEC and X-FAB have expanded their collaboration to integrate X-FAB’s silicon photonics technology into LIGENTEC’s platform, creating a unified ecosystem for both SOI and SiN photonic solutions. The partners will jointly industrialize heterogeneous integration technologies, including thin-film lithium niobate, within X-FAB's foundry ecosystem to scale production from R&D to industrial levels. This initiative aims to streamline customer access to advanced photonic technologies and strengthen Europe's position in next-generation photonic integration.YouTubeThe Future of Integrated Photonics: Markets, Challenges & Opportunities for the Next Decade | PanelIMT Microtechnologies, LIGENTEC, and Chroma Technology participated in an on-demand panel discussion held on July 3, 2025, regarding the strategic outlook for integrated photonics over the next decade. The session analyzed current market adoption trends, technical barriers such as packaging bottlenecks, and commercial opportunities within sectors like LiDAR and quantum computing. Moderated by Europa Science, the event aimed to provide industry leaders with insights to navigate investment and development priorities.