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Revasum

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uuid0004jpw

Namestring
Revasum
Legal namestring
Revasum
Websiteurl
revasum.com
Company typeenum
Private
Founded yearint
2016
Descriptiontext

Revasum designs and manufactures semiconductor capital equipment focused on Silicon Carbide (SiC) single-wafer processing, with product lines spanning grinding, polishing, and chemical mechanical polishing (CMP). Its current portfolio is anchored by the 6EZ Silicon Carbide Polisher — described as the world's first fully-automated, single-wafer, dry-in-dry-out polisher built specifically for SiC, featuring cassette-to-cassette handling, single-side and two-sided polish, and three tables with dedicated carriers, pad conditioners, and pad cleaners — and the 7AF-HMG Silicon Carbide Grinder, which incorporates a self-dressing grind process and real-time performance monitoring. The company also sells re-manufactured pre-owned equipment that includes the latest software license and a six-month parts-and-labor warranty. Revasum is built on a significant SiC-focused intellectual property portfolio acquired and developed since the 2016 acquisition of Strasbaugh.

The company's customers are global semiconductor device manufacturers producing substrates and devices for power electronics, electric vehicles, RF communications, LED, MEMS, and solar applications — segments where hard SiC material handling, yield, and cost-of-ownership are critical pain points. Revasum operates an enterprise field-sales motion with direct and independent sales and service offices in the United States, China, Europe, Japan, Korea, and Taiwan, supported by consultative custom-system development for large semiconductor manufacturers. Revenue is generated through capital equipment sales (new and remanufactured) plus service, parts, and software licensing tied to the installed base.

Conflict note: the firm's general firmographic record lists IPO status as public with ticker ASX:RVS, while a separate enrichment block describes the company as privately held, and no public-market filings, listing date, or market capitalization is confirmed in the source data. The funding history — debt and equity raises from SQN Venture Partners and Firsthand Technology Value Fund totaling roughly $17.8M between 2018 and 2023 — is more consistent with a small privately held or thinly listed specialty equipment vendor.

Short descriptiontext

Revasum designs and manufactures semiconductor capital equipment for Silicon Carbide single-wafer processing, including the 6EZ Polisher and 7AF-HMG Grinder, selling to global semiconductor device manufacturers serving power electronics, EV, RF, LED, MEMS, and solar markets via direct and independent sales offices across the US, China, Europe, Japan, Korea, and Taiwan.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
51–100
akta.pro rankint
HeadquartersSan Luis Obispo, United States
HQ citystring
San Luis Obispo
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices2 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
semiconductor capital equipment, silicon carbide processing, wafer grinding equipment, chemical mechanical polishing, substrate manufacturing equipment
Industry3 codes
1Wafer Cleaning & Surface Preparation Equipment
CodeHDAHAEAGPrimaryYes
2Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim)
CodeHDAHACAHPrimaryNo
3Compound Semiconductor Wafers & Substrates (SiC/GaN/GaAs/InP/Sapphire)
CodeHDAHAGABPrimaryNo
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Semiconductors & Related Devices3674
Product category
Semiconductor Capital Equipment
Social media profiles2 records
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model3 records
1Capital Equipment Sales
TypeHardware Sales
Description

Revasum generates revenue primarily through the sale of capital equipment including grinders, polishers, and CMP systems for semiconductor manufacturing. The company also offers re-manufactured pre-owned equipment.

revasum.com
2Service and Support
TypeProfessional Services
Description

The company provides service, parts, and support for its equipment, with dedicated contact channels for service requests.

revasum.com
3Software Licensing
TypeLicensing Royalties
Description

Re-manufactured equipment includes a full license for the latest version of software available.

revasum.com
Marketing channels4 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels2 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Operations, Personnel, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure
Pricing details2 tiers
1New Equipment - 6EZ Polisher and 7AF-HMG Grinder
ModelOne time/ perpetual licenseBilling cadenceMulti-year contract
Notes

Pricing not publicly disclosed; direct sales approach with custom quotes for semiconductor capital equipment.

revasum.com
2Re-Manufactured Equipment
ModelOne time/ perpetual licenseBilling cadenceMulti-year contract
Notes

Pre-owned equipment goes through rigorous remanufacturing process with six-month warranty on parts and labor.

revasum.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 2 records shown
16EZ Polisher
Description

The world's first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for Silicon Carbide (SiC). Features cassette-to-cassette handling, single wafer processing for excellent wafer-to-wafer control, single-side and two-sided polish, with three tables featuring dedicated carriers, pad conditioners, and pad cleaners.

revasum.com
+1 more record
Core offering1 text field

Revasum designs and manufactures semiconductor capital equipment focused on Silicon Carbide (SiC) single-wafer processing. Its flagship products are the 6EZ Silicon Carbide Polisher and the 7AF-HMG Silicon Carbide Grinder, providing a fully automated single-wafer grind and polish toolset configurable for SiC wafers 200mm and below. The company also sells re-manufactured pre-owned equipment and provides service, parts, and software licensing supporting the installed base.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 5 values shown
  • 7AF-HMG extends wheel life by 9 times
+4 more records
Product overview1 text field

Revasum offers a unified portfolio of semiconductor capital equipment centered on Silicon Carbide (SiC) single-wafer processing. The core product line consists of the 6EZ Polisher (the world's first fully-automated single-wafer dry-in-dry-out SiC polisher) and the 7AF-HMG Grinder (high-performance SiC grinder with self-dressing technology). Together, these products provide an optimized, fully automated single-wafer grind and polish toolset configurable for SiC wafers 200mm and below. The company also offers Re-Manufactured Equipment for customers seeking pre-owned alternatives.

Product and service3 records
16EZ Silicon Carbide Polisher
CategorySemiconductor Capital Equipment
Description

The world's first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for Silicon Carbide (SiC). Features cassette-to-cassette handling, single wafer processing for excellent wafer-to-wafer control, single-side and two-sided polish, three tables with dedicated carriers, pad conditioners, and pad cleaners. Targeted at semiconductor device manufacturers processing SiC substrates for power electronics, EV, RF, LED, MEMS, and solar applications.

27AF-HMG Silicon Carbide Grinder
CategorySemiconductor Capital Equipment
Description

Silicon Carbide grinding solution that extends wheel life by nine times, increases uptime by 10%, boosts wafer output by 15%, and reduces cost of ownership by seven times. Features real-time grind performance monitoring, self-dressing grind process, support for dual fine grind, dual coarse grind, and standard coarse/fine grind processing, with wafer flipping available for double-side grinding applications. Targeted at SiC substrate manufacturers.

3Re-Manufactured Semiconductor Equipment
CategorySemiconductor Capital Equipment
Description

Pre-owned semiconductor equipment that goes through a rigorous remanufacturing process including inspection, cleaning, repair, and testing by the original equipment manufacturing engineers. Includes a full license for the latest software version and a six-month warranty on parts and labor. Targeted at semiconductor manufacturers seeking cost-efficient alternatives to new equipment.

Scale indicator1 record

Each record includes

Type, Value, Description, Source

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight4 records

Each record includes

Type, Description

Peers8 records
TypeDirect peer
Description

Ebara is a major manufacturer of CMP equipment for semiconductor wafer planarization, including tools used in SiC and compound semiconductor processing. It competes head-to-head with Revasum in CMP and post-grind polishing tools used at SiC substrate fabs.

TypeBroad incumbent
Description

Hitachi High-Tech produces semiconductor metrology, CMP, and surface-inspection equipment used at advanced fabs, including SiC and compound semiconductor manufacturers. As a broad Japanese equipment incumbent, it competes with Revasum in adjacent wafer-processing steps at the same global customer base.

TypeDirect peer
Description

Tokyo Seimitsu (Accretech) manufactures wafer dicing, grinding, polishing, and CMP equipment for semiconductor and SiC substrate manufacturers. It directly competes with Revasum in single-wafer SiC grinding and polishing and has a much larger global service network.

TypeDirect peer
Description

Axus Technology (now part of Entrepix) specializes in CMP and wafer-surface preparation equipment for SiC, sapphire, GaN, and other compound semiconductor substrates. It is one of the closest direct competitors to Revasum in single-wafer CMP and polishing tools for hard materials.

TypeDirect peer
Description

Engis manufactures precision lapping, grinding, and polishing equipment used in compound semiconductor and SiC substrate production. Its tool portfolio closely matches Revasum's grinding/polishing scope and serves the same SiC and power-electronics customers.

TypeBroad incumbent
Description

Applied Materials is the largest semiconductor capital equipment vendor globally, with significant CMP, polishing, and deposition tools that touch SiC and compound semiconductor processing. While it competes more broadly across the fab, its planarization and polishing portfolio overlaps with Revasum's at large IDMs and foundries.

TypeDirect peer
Description

DISCO is the global market leader in wafer dicing, grinding, and polishing equipment, including SiC-specific grinding tools. It is the most direct competitor to Revasum's 7AF-HMG grinder and 6EZ polisher, serving the same SiC and compound-semiconductor substrate fabs with overlapping product lines and a broader installed base.

TypeBroad incumbent
Description

Lam Research is a top-tier semiconductor equipment incumbent with deep CMP and wafer-conditioning capabilities that already serve SiC substrate manufacturers. It is not SiC-niche, but its scale, R&D budget, and customer relationships make it the most likely long-term competitor to Revasum's installed base.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat3 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Segment2 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile1 record

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature2 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles4 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds4 records

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors2 records

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Revasum

Semiconductor Capital Equipmentrevasum.com

Revasum designs and manufactures semiconductor capital equipment for Silicon Carbide single-wafer processing, including the 6EZ Polisher and 7AF-HMG Grinder, selling to global semiconductor device manufacturers serving power electronics, EV, RF, LED, MEMS, and solar markets via direct and independent sales offices across the US, China, Europe, Japan, Korea, and Taiwan.

What Revasum does

Revasum designs and manufactures semiconductor capital equipment focused on Silicon Carbide (SiC) single-wafer processing, with product lines spanning grinding, polishing, and chemical mechanical polishing (CMP). Its current portfolio is anchored by the 6EZ Silicon Carbide Polisher — described as the world's first fully-automated, single-wafer, dry-in-dry-out polisher built specifically for SiC, featuring cassette-to-cassette handling, single-side and two-sided polish, and three tables with dedicated carriers, pad conditioners, and pad cleaners — and the 7AF-HMG Silicon Carbide Grinder, which incorporates a self-dressing grind process and real-time performance monitoring. The company also sells re-manufactured pre-owned equipment that includes the latest software license and a six-month parts-and-labor warranty. Revasum is built on a significant SiC-focused intellectual property portfolio acquired and developed since the 2016 acquisition of Strasbaugh.

The company's customers are global semiconductor device manufacturers producing substrates and devices for power electronics, electric vehicles, RF communications, LED, MEMS, and solar applications — segments where hard SiC material handling, yield, and cost-of-ownership are critical pain points. Revasum operates an enterprise field-sales motion with direct and independent sales and service offices in the United States, China, Europe, Japan, Korea, and Taiwan, supported by consultative custom-system development for large semiconductor manufacturers. Revenue is generated through capital equipment sales (new and remanufactured) plus service, parts, and software licensing tied to the installed base.

Conflict note: the firm's general firmographic record lists IPO status as public with ticker ASX:RVS, while a separate enrichment block describes the company as privately held, and no public-market filings, listing date, or market capitalization is confirmed in the source data. The funding history — debt and equity raises from SQN Venture Partners and Firsthand Technology Value Fund totaling roughly $17.8M between 2018 and 2023 — is more consistent with a small privately held or thinly listed specialty equipment vendor.

Revasum firmographics

Firmographics
Name
Revasum
Legal name
Revasum
Website
https://revasum.com
Company type
Private
Founded year
2016
Operating status
Operating
Headcount range
51–100 employees
Short description
Revasum designs and manufactures semiconductor capital equipment for Silicon Carbide single-wafer processing, including the 6EZ Polisher and 7AF-HMG Grinder, selling to global semiconductor device manufacturers serving power electronics, EV, RF, LED, MEMS, and solar markets via direct and independent sales offices across the US, China, Europe, Japan, Korea, and Taiwan.
Ownership category
akta.pro rank

Revasum industry classification

Industry
Product category
Semiconductor Capital Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Semiconductors & Related Devices (3674)
akta.pro primary industry
Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)
akta.pro secondary industries
Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH), Compound Semiconductor Wafers & Substrates (SiC/GaN/GaAs/InP/Sapphire) (HDAHAGAB)

Keywords

  • Semiconductor capital equipment
  • Silicon carbide processing
  • Wafer grinding equipment
  • Chemical mechanical polishing
  • Substrate manufacturing equipment

Where Revasum is headquartered

Location

Headquarters

HQ city
San Luis Obispo
HQ country
United States
HQ region
North America

Offices2 records

Markets served

Revasum business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Operations, Personnel, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

  1. Capital Equipment Sales: Revasum generates revenue primarily through the sale of capital equipment including grinders, polishers, and CMP systems for semiconductor manufacturing. The company also offers re-manufactured pre-owned equipment.
  2. Service and Support: The company provides service, parts, and support for its equipment, with dedicated contact channels for service requests.
  3. Software Licensing: Re-manufactured equipment includes a full license for the latest version of software available.

Pricing tiers

ModelBillingPrice
One time/ perpetual licenseMulti-year contractNew Equipment - 6EZ Polisher and 7AF-HMG Grinder
One time/ perpetual licenseMulti-year contractRe-Manufactured Equipment

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Revasum product offering

Product offering

Core offering

Revasum designs and manufactures semiconductor capital equipment focused on Silicon Carbide (SiC) single-wafer processing. Its flagship products are the 6EZ Silicon Carbide Polisher and the 7AF-HMG Silicon Carbide Grinder, providing a fully automated single-wafer grind and polish toolset configurable for SiC wafers 200mm and below. The company also sells re-manufactured pre-owned equipment and provides service, parts, and software licensing supporting the installed base.

Product overview

Revasum offers a unified portfolio of semiconductor capital equipment centered on Silicon Carbide (SiC) single-wafer processing. The core product line consists of the 6EZ Polisher (the world's first fully-automated single-wafer dry-in-dry-out SiC polisher) and the 7AF-HMG Grinder (high-performance SiC grinder with self-dressing technology). Together, these products provide an optimized, fully automated single-wafer grind and polish toolset configurable for SiC wafers 200mm and below. The company also offers Re-Manufactured Equipment for customers seeking pre-owned alternatives.

Differentiator

Problem solved

Functional benefit

Brands

  • 6EZ Polisher: The world's first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for Silicon Carbide (SiC). Features cassette-to-cassette handling, single wafer processing for excellent wafer-to-wafer control, single-side and two-sided polish, with three tables featuring dedicated carriers, pad conditioners, and pad cleaners.
  • 7AF-HMG Grinder

Products and services

  • 6EZ Silicon Carbide Polisher The world's first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for Silicon Carbide (SiC). Features cassette-to-cassette handling, single wafer processing for excellent wafer-to-wafer control, single-side and two-sided polish, three tables with dedicated carriers, pad conditioners, and pad cleaners. Targeted at semiconductor device manufacturers processing SiC substrates for power electronics, EV, RF, LED, MEMS, and solar applications.
  • 7AF-HMG Silicon Carbide Grinder Silicon Carbide grinding solution that extends wheel life by nine times, increases uptime by 10%, boosts wafer output by 15%, and reduces cost of ownership by seven times. Features real-time grind performance monitoring, self-dressing grind process, support for dual fine grind, dual coarse grind, and standard coarse/fine grind processing, with wafer flipping available for double-side grinding applications. Targeted at SiC substrate manufacturers.
  • Re-Manufactured Semiconductor Equipment Pre-owned semiconductor equipment that goes through a rigorous remanufacturing process including inspection, cleaning, repair, and testing by the original equipment manufacturing engineers. Includes a full license for the latest software version and a six-month warranty on parts and labor. Targeted at semiconductor manufacturers seeking cost-efficient alternatives to new equipment.

Quantifiable outcome

  • 7AF-HMG extends wheel life by 9 times
  • +4 more outcomes

Companies that use Revasum

Customer profile

Segments2 records

Ideal customer profiles1 record

Revasum technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature2 records

Revasum partnerships and signals

Strategic signal

Scale indicators1 record

Recent moves6 records

Expansion highlights4 records

Revasum competitors and assessment

Company assessment

Direct peers

  • Ebara Corporation: Ebara is a major manufacturer of CMP equipment for semiconductor wafer planarization, including tools used in SiC and compound semiconductor processing. It competes head-to-head with Revasum in CMP and post-grind polishing tools used at SiC substrate fabs.
  • Tokyo Seimitsu / Accretech: Tokyo Seimitsu (Accretech) manufactures wafer dicing, grinding, polishing, and CMP equipment for semiconductor and SiC substrate manufacturers. It directly competes with Revasum in single-wafer SiC grinding and polishing and has a much larger global service network.
  • Axus Technology: Axus Technology (now part of Entrepix) specializes in CMP and wafer-surface preparation equipment for SiC, sapphire, GaN, and other compound semiconductor substrates. It is one of the closest direct competitors to Revasum in single-wafer CMP and polishing tools for hard materials.
  • Engis Corporation: Engis manufactures precision lapping, grinding, and polishing equipment used in compound semiconductor and SiC substrate production. Its tool portfolio closely matches Revasum's grinding/polishing scope and serves the same SiC and power-electronics customers.
  • DISCO Corporation: DISCO is the global market leader in wafer dicing, grinding, and polishing equipment, including SiC-specific grinding tools. It is the most direct competitor to Revasum's 7AF-HMG grinder and 6EZ polisher, serving the same SiC and compound-semiconductor substrate fabs with overlapping product lines and a broader installed base.

Broad incumbents

  • Hitachi High-Tech: Hitachi High-Tech produces semiconductor metrology, CMP, and surface-inspection equipment used at advanced fabs, including SiC and compound semiconductor manufacturers. As a broad Japanese equipment incumbent, it competes with Revasum in adjacent wafer-processing steps at the same global customer base.
  • Applied Materials: Applied Materials is the largest semiconductor capital equipment vendor globally, with significant CMP, polishing, and deposition tools that touch SiC and compound semiconductor processing. While it competes more broadly across the fab, its planarization and polishing portfolio overlaps with Revasum's at large IDMs and foundries.
  • Lam Research: Lam Research is a top-tier semiconductor equipment incumbent with deep CMP and wafer-conditioning capabilities that already serve SiC substrate manufacturers. It is not SiC-niche, but its scale, R&D budget, and customer relationships make it the most likely long-term competitor to Revasum's installed base.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat3 records

Key risks6 records

Key highlights7 records

Customer concentration

Revasum social profiles

Digital presence

Revasum financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Revasum leadership team

Management profile

Number of profiles

Profiles4 records

Revasum funding detail

Funding detail

Funding overview

Funding rounds4 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Revasum M&A and investment

M&A and investment

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Revasum

What does Revasum do?

Revasum designs and manufactures semiconductor capital equipment focused on Silicon Carbide (SiC) single-wafer processing. Its flagship products are the 6EZ Silicon Carbide Polisher and the 7AF-HMG Silicon Carbide Grinder, providing a fully automated single-wafer grind and polish toolset configurable for SiC wafers 200mm and below. The company also sells re-manufactured pre-owned equipment and provides service, parts, and software licensing supporting the installed base.

Is Revasum a public or private company?

Revasum is a private company. It is classified as public and is currently operating.

When was Revasum founded?

Revasum was founded in 2016. It employs 51 to 100 people.

Where is Revasum based?

Revasum is headquartered in San Luis Obispo, United States, in the North America region.

How does Revasum make money?

Three revenue lines are on record. Capital Equipment Sales are the primary driver. The others are service and Support and software Licensing.

Who are Revasum's main competitors?

Direct peers on record are Ebara Corporation, Tokyo Seimitsu / Accretech, Axus Technology, Engis Corporation and DISCO Corporation. Broad incumbents are Hitachi High-Tech, Applied Materials and Lam Research.

Does Revasum have an API?

No public API is recorded for Revasum.

What industry is Revasum in?

Revasum's product category is Semiconductor Capital Equipment. Its primary akta.pro industry code is HDAHAEAG, Wafer Cleaning & Surface Preparation Equipment, with a secondary code of HDAHACAH, Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim). Its NAICS code is 333242 and its SIC code is 3674.

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Live signals
openPR.comDouble-sided Silicon Carbide Wafer Lapping and Polishing Machine Market Set to Surge - Key Insights You Must KnowValuates published a market research report on the Double-sided Silicon Carbide Wafer Lapping and Polishing Machine market, projecting growth through 2031 for this equipment used in semiconductor manufacturing. The report covers market segmentation by type (semi-automatic, fully automatic) and application (6-inch, 8-inch wafers), identifying key manufacturers including Lapmaster, Revasum, ACCRETECH, Zhejiang Jingsheng, Hunan Yujing, and Speedfam. The article contains placeholder values for market size and CAGR figures, indicating this is a promotional report description rather than a substantive news article.PR NewswireRevasum, Inc. et Saint-Gobain Surface Solutions (SGSS) unissent leurs forces pour innover dans la technologie des plaques de meulage en carbure de siliciumRevasum, Inc. announced a strategic partnership with Saint-Gobain Surface Solutions (SGSS) to develop advanced grinding wheel technology specifically designed for silicon carbide (SiC) wafers, targeting the semiconductor industry's growing demand for high-quality SiC substrates. The collaboration combines Revasum's semiconductor manufacturing equipment expertise with SGSS's advanced abrasive materials to create next-generation surface finishing solutions for SiC wafer production. The partnership aims to support advancements in power electronics, electric vehicles, and renewable energy sectors.PR NewswireRevasum, Inc. y Saint-Gobain Surface Solutions (SGSS) unen sus fuerzasRevasum, Inc. and Saint-Gobain Surface Solutions (SGSS) announced a strategic partnership to develop advanced abrasive wheels specifically for silicon carbide (SiC) wafer grinding. This collaboration aims to enhance the precision, efficiency, and quality of SiC wafer production to support the growing semiconductor power device market. The alliance combines Revasum's semiconductor equipment expertise with SGSS's high-performance material science capabilities.PR NewswireRevasum, Inc. und Saint-Gobain Surface Solutions (SGSS) schließen sich zusammen, um die Schleiftechnologie für Siliziumkarbid-Wafer neu zu definierenRevasum, Inc. and Saint-Gobain Surface Solutions (SGSS) announced a strategic partnership on October 5, 2023, to jointly develop advanced grinding wheels specifically designed for silicon carbide (SiC) wafer production. The collaboration combines Revasum's semiconductor manufacturing equipment expertise with SGSS's cutting-edge abrasive materials to create a new generation of surface processing solutions for SiC wafers. The partnership aims to set new standards in precision, efficiency, and surface quality for the SiC wafer market, which is growing due to increasing demand for power electronics, electric vehicles, and renewable energy applications.PR NewswireRevasum, Inc. and Saint-Gobain Surface Solutions (SGSS) Join Forces to Innovate Silicon Carbide Wafer Grinding TechnologyRevasum, Inc. and Saint-Gobain Surface Solutions (SGSS) announced a strategic partnership on October 4, 2023, to develop advanced grinding wheels for Silicon Carbide (SiC) wafers. The collaboration combines Revasum's semiconductor equipment expertise with SGSS's abrasive materials to improve precision and efficiency in SiC wafer production. This alliance aims to support the growing demand for high-quality SiC wafers used in power electronics, electric vehicles, and renewable energy sectors.PR NewswireREVASUM obtiene una carta de intención para comprar un sistema CMP de carburo de silicio 6EZ de SENICRevasum (ASX: RVS) received a letter of intent from South Korea-based Senic for the purchase of a 6EZ silicon carbide CMP (chemical mechanical polishing) system, planned for shipment in Q4 2023. The 6EZ system, combined with Revasum's 7AF-HMG SiC grinder, is designed to deliver minimal total thickness variation (TTV) and surface roughness of approximately 1.5 Angstroms, supporting 150 mm and 200 mm SiC substrate production at Senic's facilities in Cheonan, South Korea. The partnership positions both companies to scale SiC wafer production to meet rising global demand for silicon carbide power devices and MOSFETs.PR NewswireREVASUM (ASX: RVS) obtient une lettre d'intention pour l'achat d'un système CMP pour carbure de silicium 6EZ auprès de SENIC, une entreprise leader dans la technologie de fabrication de substrats en cRevasum (ASX: RVS) has received a letter of intent from SENIC for the purchase of a 6EZ chemical mechanical polishing (CMP) system for silicon carbide substrates, with delivery scheduled for Q4 2023 to SENIC's facility in Cheonan, South Korea. The 6EZ system, developed alongside Revasum's 7AF-HMG SiC grinder, achieves minimal total thickness variation and surface roughness of approximately 1.5 angstroms, supporting both 150mm and 200mm SiC substrates. The partnership is framed as a strategic alignment to support growing global demand for silicon carbide devices such as MOSFETs.PR NewswireREVASUM (ASX: RVS) sichert sich eine Absichtserklärung zum Kauf eines 6EZ Siliziumkarbid CMP-Systems von SENIC, einem führenden Unternehmen für die Herstellung von Siliziumkarbid-Substraten in CheonanRevasum (ASX: RVS) has signed a Letter of Intent to purchase a 6EZ Silicon Carbide CMP (Chemical Mechanical Polishing) system from SENIC, with delivery scheduled for Q4 2023. The system will be installed at SENIC's facility in Cheonan, South Korea, enabling the production of 150mm and 200mm SiC substrates. The partnership positions REVASUM's 6EZ platform as a leading solution for SiC substrate manufacturing and wafer surface preparation for power electronics applications.PR NewswireREVASUM (ASX: RVS) secures a Letter of Intent to purchase a 6EZ silicon carbide CMP system from SENIC, a leading silicon carbide substrate manufacturing technology company in Cheonan, South KoreaRevasum (ASX: RVS) has secured a Letter of Intent from SENIC to purchase a 6EZ silicon carbide CMP system, with shipment scheduled for Q4-2023 to SENIC's facility in Cheonan, South Korea. The system, designed for silicon carbide substrate manufacturing, includes a 200mm conversion kit enabling processing of both 150mm and 200mm wafers, and was developed alongside Revasum's 7AF-HMG SiC grinder to achieve minimal total thickness variation and surface roughness of approximately 1.5 Angstroms. Both companies described the agreement as a strategic partnership to address growing global demand for silicon carbide devices and wafers.PR NewswireREVASUM (ASX: RVS) secures a Letter of Intent to purchase a 6EZ silicon carbide CMP system from SENIC, a leading silicon carbide substrate manufacturing technology company in Cheonan, South KoreaRevasum (ASX: RVS) has secured a Letter of Intent to purchase a 6EZ silicon carbide CMP system from Senic, a South Korean SiC substrate manufacturer, with shipment scheduled for Q4 2023. The 6EZ system, which will be equipped with a 200mm conversion kit, will support both 150mm and 200mm SiC substrate manufacturing at Senic's facility in Cheonan, South Korea. The partnership positions Revasum to strengthen its global footprint in the silicon carbide manufacturing supply chain.