What X-Fab does

X-FAB Silicon Foundries SE is a publicly traded (Frankfurt Stock Exchange: XFAB) pure-play specialty semiconductor foundry founded in 1992 and headquartered in Tessenderlo-Ham, Belgium. The company operates six manufacturing fabs across Europe (Erfurt, Dresden, Itzehoe, Corbeil-Essonnes), North America (Lubbock, Texas), and Asia (Kuching, Malaysia), with approximately 4,300 employees worldwide and regional sales and R&D offices in the US, Korea, Japan, China, Taiwan, and Hong Kong. X-Fab provides wafer manufacturing services for fabless semiconductor companies designing analog/mixed-signal ICs, wide-bandgap power devices, MEMS sensors, and photonic integrated circuits targeting automotive (approximately 50% of chip production), industrial, medical, and consumer electronics markets.

X-Fab's technology portfolio spans modular CMOS and SOI processes from 1.0 micrometer to 110 nanometer nodes, 6-inch silicon carbide (SiC) processing at the Lubbock facility (the first pure-play foundry offering 6-inch SiC), GaN-on-Si dMode devices (XG035 platform) at the 8-inch Dresden facility, the XPH90 silicon photonics SOI platform, MEMS processes at Itzehoe and Erfurt (sensors, micro-mirrors, piezoelectric actuators), and an industry-first 200mm Micro-Transfer-Printing pilot line for heterogeneous 3D integration. Additional capabilities include thin-film lithium niobate (TFLN) integration for electro-optic and quantum applications, RF-SOI at Corbeil-Essonnes, and customized platforms such as the 180nm XP018 used for security and IoT applications.

X-Fab operates a quote-based, direct-sales foundry model with multi-year contracts and no distribution intermediaries. Revenue derives from wafer foundry services (hardware sales) and design support and prototyping services, with a public MPW shuttle service launched in Q4 2025 to broaden access for prototyping and small-volume production. Reported FY2025 revenue was USD 870.3 million (+7% year-on-year), with Q4 2025 revenue of USD 222.3 million (+18% year-on-year) and Q1 2026 guidance of USD 190-200 million. The company holds strategic joint development agreements with IQE (GaN epitaxy), LIGENTEC (silicon photonics, TFLN), and a PhotonixFab-linked partnership with Nvidia targeting AI photonic interconnects, and received EUR 128 million in EU Chips Act grants in December 2025 to construct a new Erfurt facility.

Name

X-Fab

Legal name

X-FAB Silicon Foundries SE

Website

https://xfabulous.com

Company type

Public

Founded year

1992

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

X-FAB is a publicly traded pure-play specialty semiconductor foundry manufacturing analog/mixed-signal ICs, SiC and GaN power semiconductors, MEMS, and silicon photonics wafers for fabless customers in automotive, industrial, medical, and consumer markets.

Ownership category

akta.pro rank

Product category

Semiconductor Foundry Services

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)

akta.pro secondary industries

RF & Compound Semiconductor Foundries (GaAs/GaN/SiGe) (HDAHACAD), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Epitaxy Materials & Services (Epi Wafers/MBE/MOCVD) (HDAHAGAC)

Keywords

• Specialty semiconductor foundry
• Analog mixed-signal ICs
• Wide-bandgap semiconductors
• MEMS wafer fabrication
• Silicon photonics foundry

Headquarters

HQ city

Erfurt

HQ country

Germany

HQ region

Europe

Offices15 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Infrastructure, Personnel, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. Wafer Foundry Services: Pure-play semiconductor foundry manufacturing silicon wafers for customers' analog-digital integrated circuits. Revenue derived from wafer processing services across multiple technology platforms including CMOS, SiC, GaN, MEMS, and silicon photonics. Customers include fabless semiconductor companies designing chips for automotive, industrial, medical, and consumer applications.
2. Design Support and Prototyping Services: Technical design support, prototyping services, and MPW shuttle services enabling customers to develop and test semiconductor devices before full production.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels3 records

Core offering

X-FAB is a pure-play specialty semiconductor foundry providing wafer manufacturing services for analog/mixed-signal integrated circuits, wide-bandgap materials (SiC, GaN), MEMS, silicon photonics, RF-SOI, and 3D integration/wafer-level packaging across nodes from 1.0µm to 110nm. The company operates six fabrication facilities in Europe, North America, and Asia serving fabless semiconductor companies in automotive, industrial, medical, and consumer electronics markets, complemented by technical design support, prototyping, and MPW shuttle services.

Product overview

X-FAB is a pure-play specialty semiconductor foundry providing manufacturing and design support services for analog/mixed-signal integrated circuits and other semiconductor devices. The company operates a multi-platform technology portfolio including CMOS/Analog-Mixed Signal foundry services (1.0µm to 110nm), Silicon Carbide (SiC) wide-bandgap semiconductors, GaN-on-Si power semiconductors (XG035 dMode platform), Silicon Photonics (XPH90 SOI platform), MEMS technologies, RF-SOI technologies, and Wafer Level Packaging/3D Integration services. X-FAB offers specialized 180nm XP018 platform capabilities and provides comprehensive design support and prototyping services. The company serves automotive, industrial, medical, mobile communication, and consumer electronics markets through six manufacturing facilities in Europe, North America, and Asia.

Differentiator

Problem solved

Functional benefit

Brands

• X-FABulous: Employer brand program used for recruitment and careers website (xfabulous.com).
• XPH90
• XG035
• XP018

Products and services

• CMOS/Analog-Mixed Signal Foundry Services Core semiconductor foundry manufacturing silicon wafers for analog/mixed-signal integrated circuits using modular CMOS and SOI process technologies from 1.0 micrometer to 110 nanometers, including HV-SOI for high-voltage applications. Available to fabless semiconductor companies across automotive, industrial, medical, and consumer electronics markets.
• Silicon Carbide (SiC) Foundry Services Wide-bandgap semiconductor foundry services for silicon carbide power semiconductors with 6-inch wafer processing capabilities at X-FAB Texas (Lubbock). Serves automotive and industrial power applications including traction inverters, onboard chargers, and renewable energy systems.
• GaN-on-Si Foundry Services (XG035 dMode Platform) Gallium Nitride on Silicon technology for dMode devices offering high-voltage HEMT transistors scalable from 100V to 650V for power conversion applications. Available from X-FAB's 8-inch Dresden factory, targeting automotive, AI data centers, renewable energy, and industrial power electronics customers.
• XPH90 Silicon Photonics Platform Silicon Photonics (SOI) technology platform for photonic integrated circuits, enabling next-generation communication and quantum computing applications. Combines with Thin Film Lithium Niobate (TFLN) integration for high-speed electro-optic capabilities.
• MEMS Foundry Technologies Micro-Electro-Mechanical Systems foundry processes for sensors (acceleration, angular velocity, mass flow), micro-mirror scanners, micro-optical systems, and piezoelectric MEMS actuators. Manufactured at dedicated Itzehoe and Erfurt facilities, serving automotive, medical, industrial, and consumer applications.
• Wafer Level Packaging and 3D Integration Services Comprehensive portfolio of 3D integration and wafer-level packaging technologies including Micro-Transfer-Printing (µTP), Through-Silicon Via (TSV), and wafer bonding techniques for heterogeneous integration of CMOS, MEMS, compound semiconductors, and photonic devices. Industry-first pilot line for Micro-Transfer-Printing on 200mm wafers.
• RF-SOI Technologies Radio Frequency Silicon-on-Insulator technologies offered at X-FAB France (Corbeil-Essonnes), providing advanced RF solutions for mobile communication markets and high-frequency applications.
• 180nm XP018 Customized Foundry Platform Customized 180nm semiconductor foundry platform used for specialized applications including security tokens, IoT devices, and other customized semiconductor designs. Serves customers requiring tailored 180nm process capabilities.
• Design Support and Prototyping Services Technical design and prototyping services providing fabless customers with design support, technical hotline, characterization, process development, and Multi-Project Wafer (MPW) shuttle access for prototyping and small-volume production across CMOS, MEMS, SiC, GaN, and silicon photonics technologies.

Quantifiable outcome

• SiC wafer shipments increased 195% year-over-year in Q1 2026 to 14,300 units
• +2 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration7 records

Feature7 records

Partnerships

Four partnerships are on record, tiered core and flagship.

• SandgraincoreStrategic or Co-development Partner · 3 March 2026Sandgrain, an Eindhoven-based startup founded in 2019, partnered with X-FAB to manufacture the SGT1001 hardware security token (CyberRock) using X-FAB's customized 180nm XP018 platform. Provides post-quantum-ready protection for connected IoT devices within a secure, traceable European ecosystem aligned with EU Cyber Resilience Act.
• LIGENTECcoreTechnology or Integration · 22 January 2026Expanded collaboration to integrate X-FAB's XPH90 Silicon Photonics (SOI) technology into LIGENTEC's photonics platform, creating unified ecosystem spanning SOI and low-loss SiN technologies. Joint investment in scaling Thin Film Lithium Niobate (TFLN) integration within X-FAB's 200mm wafer foundry ecosystem for high-performance electro-optic capabilities in next-generation communication and quantum computing applications.
• IQE plccoreStrategic or Co-development Partner · 1 April 2025Joint Development Agreement to co-develop a European-based GaN Power device platform. Combines IQE's epitaxy expertise with X-FAB's device manufacturing capabilities for GaN-on-Si technology at the 8-inch Dresden facility.
• NvidiaflagshipTechnology or IntegrationPartnership via PhotonixFab platform for silicon photonics applications. X-FAB identified as key upside catalyst for Nvidia-related photonic interconnects in AI infrastructure.

Scale indicators7 records

Recent moves9 records

Direct peers

• Tower Semiconductor: Specialty analog/RF/mixed-signal foundry with comparable technology portfolio focus; serves similar end-markets including automotive, industrial, and consumer, with similar mature-node positioning and customer overlap.
• SkyWater Technology: US-based pure-play foundry with specialty focus including analog, RF, and emerging semiconductor processes; comparable business model serving fabless customers with specialty process offerings.
• Vanguard International Semiconductor (VIS): Specialty foundry focused on analog, mixed-signal, and power semiconductors using mature nodes; closely comparable business model and customer base, including automotive and industrial.
• GlobalFoundries: Pure-play semiconductor foundry with overlapping specialty/analog, RF-SOI, SiGe, and photonics offerings; also a beneficiary of EU Chips Act funding for Dresden expansion, directly competing for the same European specialty customers as X-FAB.

Broad incumbents

• Taiwan Semiconductor Manufacturing Company (TSMC): Dominant broad-line foundry expanding into specialty RF, GaN, and SiC technologies; though focused on advanced nodes, competes indirectly via customer overlap and pricing pressure on specialty processes.
• United Microelectronics Corporation (UMC): Larger general-purpose foundry with established specialty/analog and RF process offerings that compete for the same fabless automotive and industrial customers, albeit with broader logic/memory exposure.
• Infineon Technologies: European power semiconductor leader with major SiC and GaN investments; overlaps with X-FAB's automotive and industrial customer base and competes for design wins in EV traction and power conversion.
• STMicroelectronics: European IDM with strong SiC power semiconductor franchise (SiC MOSFETs) and significant in-house fab capacity; competes with X-FAB's SiC foundry services for fabless customers targeting automotive and industrial power applications.
• ROHM Semiconductor: Japanese power semiconductor company with expanding SiC capacity; competes for automotive and industrial power design wins that X-FAB's foundry customers target, particularly in 800V EV architectures.

Regional players

• Bosch Semiconductor: German automotive IDM with growing in-house SiC capacity (Roseheim fab expansion) and a major automotive customer for X-FAB; regional overlap in DACH with potential future captive-vs-foundry dynamics.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/@xfabgroup
• LinkedInlinkedin.com/company/x-fab
• Xx.com/xfab_foundry
• Facebookfacebook.com/xfab.corporate

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries6 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about X-Fab