Egide

What Egide does

Egide SA is a French publicly listed company (headquartered in Trappes; manufactured in Bollène, France, and Cambridge, Maryland, USA) that designs and manufactures custom hermetic packaging solutions for sensitive micro-electronic and optical components. Its core technology stack is vertically integrated in-house: Glass-to-Metal-Seal (GTMS), Ceramic-to-Metal-Seal (CerTMS), High Temperature Co-fired Ceramic (HTCC) alumina processes with up to 13–14 layer stack-ups, CuMo and CuW alloy packaging for thermal management, in-house electrolytic and electroless plating, and high-frequency design and simulation (RF transitions validated up to ~100 GHz). The product portfolio spans thermal imaging, optoelectronic, power, microwave/RF, TOSA/ROSA/ICR/TROSA, FPA/MEMs, chip-carrier/SMD/flange and TO-style packages, supported by sealing/brazing, precision machining and plating services.

The company sells quote-based, custom-engineered solutions to OEMs in aerospace, defense, space, telecommunications (5G, coherent optics), industrial, energy, medical, infrared and sensor markets. It holds AS9100 certification and ITAR registration at its US site, has components deployed on the Mars Rover, and is a member of the Heatpack European consortium for space-qualified thermal packaging. Distribution is via direct sales out of France and Cambridge, MD, supplemented by an independent sales-representative network covering North America, EMEA (across 10+ countries) and APAC (India, South Korea, China). H1 2025 revenue was €15.58M (+1% YoY) with EBITDA of €182K (positive versus prior-year losses) and a net loss of €2.04M driven by exceptional items, against a backdrop of consolidating US operations by closing the Santier (San Diego) subsidiary in April 2026.

Name

Egide

Legal name

EGIDE SA

Website

https://egide-group.com

Company type

Public

Founded year

1986

Operating status

Operating

Headcount range

101–250 employees

Short description

Egide SA is a French publicly listed designer and manufacturer of custom hermetic packaging — GTMS, CerTMS, HTCC and precision-plated housings — for sensitive micro-electronic and optical components, serving aerospace, defense, space, telecom, industrial, infrared and medical OEMs from facilities in Bollène, France, and Cambridge, Maryland.

Ownership category

akta.pro rank

Product category

Hermetic Microelectronic and Optical Packaging

NAICS

Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing (334416)

SIC

Semiconductors & Related Devices (3674)

akta.pro industry

PRIMARYHDAHANAE

EMI/RFI Suppression Components (Ferrite Beads/Cores/Filters)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Passive Electronic Components (Resistors/Capacitors/Inductors)

SECONDARYHDAHALAO

Sensor Fusion, Interface ICs & Modules (AFE/Readout/Packaging/Calibration)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Sensors, MEMS & Optoelectronics

Keywords

• Hermetic microelectronic packaging
• Glass-to-metal sealing
• HTCC ceramic packaging
• Optoelectronic packaging solutions
• High-frequency RF packages

Headquarters

HQ city

Bollène

HQ country

France

HQ region

Europe

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Custom hermetic package sales: Sells custom-designed hermetic package solutions (chip carriers, SMD & flange packages, TOSA/ROSA/ICR/TROSA, FPA/MEMs packages, TO and power SMD) to OEMs in aerospace, defense, medical, opto-electronics, infrared, sensors, RF and communications. Revenue is generated per project/program from these custom engineering builds.
2. High-reliability engineered micro-electronic packaging (US operations): Sales of high-reliability hermetically sealed micro-electronic packaging solutions from the Cambridge, Maryland facility, serving aerospace, military and commercial markets; previously also produced at the Santier subsidiary in San Diego, which is being closed and consolidated into Cambridge in 2026.

Go-to-market motion4 records

Distribution channels5 records

Marketing channels8 records

Core offering

Egide designs and manufactures custom hermetic packaging solutions that protect sensitive micro-electronic and optical devices, organized into product families including thermal imaging, optoelectronic, power, microwave/RF, chip-carrier/SMD/flange, TOSA/ROSA/ICR/TROSA, FPA/MEMs, TO and power-SMD packages. Production is centered at Bollène (France) and Cambridge, Maryland (USA) using in-house Glass-to-Metal-Seal, Ceramic-to-Metal-Seal, High-Temperature Cofired Ceramic (HTCC) alumina, CuMo/CuW alloy thermal management, plating and high-frequency RF design capabilities. Customers include aerospace, defense, space, telecommunications, industrial, medical, infrared and sensor OEMs, served through direct sales and a global network of independent sales representatives.

Product overview

Egide Group is a single industrial offering organized as a portfolio of hermetic packaging product families supported by a set of in-house manufacturing technologies and engineering services, rather than a software-style platform-plus-modules architecture. Its core products are the hermetic package families — Thermal imaging packages, Optoelectronic packages, Power packages, Microwave/RF packages, Glass beads & connectors, Cofired Ceramics (HTCC), Chip carrier, SMD & flange packages, TOSA/ROSA/ICR & TROSA, FPA or MEMs packages, and TO and power SMD — all built around the common capability of sealing sensitive micro-electronic and optical components. Underpinning these product families are manufacturing-technology modules (Sealing, Soldering and Brazing Solutions, the Cofired Ceramic HTCC material platform, Precision Machining, and Plating) together with an engineering service (High Frequency Design and Simulation) that is used both to develop Egide's own high-frequency HTCC packaging and to support customer co-design.

Differentiator

Problem solved

Functional benefit

Products and services

• Thermal Imaging Packages Hermetic packaging solutions designed for infrared and thermal imaging detector assemblies, providing environmental protection for sensitive optoelectronic components used in aerospace, defense, industrial and medical imaging applications.
• Optoelectronic Packages Hermetic packages engineered for optoelectronic devices, sealing and protecting laser diodes, photodetectors and similar optical components used in fiber-optic and photonic applications.
• Power Packages Hermetic housings for high-power electronic devices that support thermal dissipation and electrical performance in demanding aerospace, defense, industrial and energy applications.
• Microwave/RF Packages Hermetic packages optimized for microwave and radio-frequency components, addressing signal integrity and shielding requirements for 5G, radar, telecom and high-frequency defense electronics.
• Glass Beads & Connectors Glass-to-metal sealing beads and feedthrough connectors used as hermetic electrical interconnects within Egide's packaging solutions and supplied as components to customers building hermetic assemblies.
• Cofired Ceramics (HTCC) High-Temperature Cofired Ceramic (HTCC) packaging platform used to produce multi-layer hermetic packages, including high-frequency HTCC solutions with 13–14 layer routing density for RF/microwave applications.
• Chip Carrier, SMD & Flange Packages Hermetic chip-carrier, surface-mount device (SMD) and flange-style packages for mounting and protecting integrated circuits in aerospace, defense, telecom and industrial applications.
• TOSA, ROSA, ICR & TROSA Packages Hermetic packages designed for optical sub-assemblies used in fiber-optic transceivers: Transmitter Optical Sub-Assembly (TOSA), Receiver Optical Sub-Assembly (ROSA), Integrated Coherent Receiver (ICR), and Tunable ROSA (TROSA), serving high-speed coherent optical communication networks.
• FPA & MEMs Packages Hermetic packages tailored for Focal Plane Arrays (FPA) and Micro-Electro-Mechanical Systems (MEMs) devices used in imaging, sensing and aerospace applications.
• TO and Power SMD Packages Transistor-Outline (TO) style hermetic packages and power surface-mount device (SMD) housings for discrete and power semiconductor devices.
• High-Frequency Design and Simulation RF/microwave design and electromagnetic simulation engineering service that supports the development of high-frequency hermetic packages for customers in 5G, radar and coherent optical communications.

Quantifiable outcome

• RF transition performance validated by simulation and measurement up to ~100 GHz for HTCC hermetic packages.
• +3 more outcomes

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

14 partnerships are on record, tiered regional representative and flagship r&d consortium.

• D-TECH Associates LLCregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative covering New England (Maine, New Hampshire, Massachusetts, Vermont, Connecticut, Rhode Island) for Egide's high-reliability hermetic packaging solutions. Contact: Joe Couture, [email protected].
• FR Designregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in South Africa. Contact: Andrew Hutton, [email protected], based in Cape Town.
• Altaix Electrónica, S.A.regional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Spain and Portugal. Contact: Juan Antonio Vaquero, Edificio PRISMA, Las Rozas, Madrid.
• Nextwave Technologies Ltd.regional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Israel. Contacts: Michal A. Rubin and Mark at Marlin Systems.
• Consystem SRLregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Italy. Contacts: Maurizio Celle and William Urbinati.
• Inseto (UK) Limitedregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in the UK, Republic of Ireland, Denmark, Norway, Sweden and Finland. Contact: Eamonn Redmond, Andover, UK.
• SD Solutions LLCregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Russia, Belarus and Kazakhstan. Contact: Dmitriy Nesterov, St. Petersburg.
• KOLTregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Turkey. Contact: Celil Yagiz, Ankara.
• Al Bara'ah Telecom Co. Ltd.regional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in Saudi Arabia. Contact: Basel Barakat, Riyadh.
• Global Marketing Servicesregional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in India. Contact: MMC Kishore, [email protected].
• Maxum Korearegional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in South Korea. Contact: Sung Min, Um (General Director), Hanamdae-ro, Gyeonggi-do.
• Beijing Bonjour Microelectronics Co., Ltd.regional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in China. Contact: Ms. Lingyan Ji, Changping District, Beijing.
• Spectraline Photonics Technologies Co.regional representativeChannel Partner/ Reseller/ DistributorIndependent sales representative for Egide in China. Contact: Kelvin Luo, Optics Valley, Wuhan.
• Heatpack European consortiumflagship r&d consortiumStrategic or Co-development PartnerEgide is a member of the Heatpack European consortium tackling power dissipation in space applications with new packaging solutions, as featured in EU Research (AUT21/P52).

Scale indicators7 records

Recent moves7 records

Expansion highlights5 records

Broad incumbents

• NGK Insulators: Japanese ceramics manufacturer with a substantial HTCC and electronic packaging business serving semiconductor, RF and automotive customers — competes with Egide in HTCC substrates and ceramic packages, particularly in the telecom and high-frequency segments.
• CoorsTek: Large US-headquartered technical ceramics manufacturer producing HTCC, alumina and ceramic-to-metal packaging for RF, aerospace and semiconductor applications — competes with Egide's HTCC and CerTMS lines, especially in defense and high-frequency markets.
• Kyocera Corporation: Japanese ceramics and electronic packaging conglomerate with extensive HTCC, ceramic-to-metal and hermetic packaging portfolios for semiconductor, RF and optoelectronic applications — a direct technology competitor to Egide's HTCC alumina platform, serving the same telecom and industrial customers globally.
• SCHOTT AG: German specialty glass and hermetic sealing giant whose Electronic Packaging division offers glass-to-metal-seal and hermetic packaging products directly overlapping Egide's GTMS and CerTMS technology lines, serving similar aerospace, defense and RF/microwave customers but at much greater scale.
• Materion Corporation: US specialty materials supplier with a hermetic packaging portfolio including glass-to-metal seals and beryllium/copper-molybdenum thermal management materials, directly comparable to Egide's GTMS and CuMo/CuW alloy offerings for aerospace, defense and power electronics.

Direct peers

• Remtec Inc. US-based specialist in ceramic packages and HTCC substrates for RF/microwave, optoelectronic and aerospace customers — a niche direct competitor to Egide's high-frequency HTCC and ceramic-to-metal-seal packaging lines.
• Hermetic Solutions Group: US specialty hermetic packaging provider (formed via roll-up of Hi-Rel, SRI Hermetics and others) offering glass-to-metal-seal, ceramic-to-metal and custom hermetic packages for aerospace, defense and medical customers — a close direct competitor to Egide in GTMS and CerTMS for defense and space programs.
• Maruwa Co., Ltd. Japanese manufacturer of ceramic substrates and HTCC packages for electronics, RF and power applications — a direct competitor to Egide in co-fired ceramic packaging for RF/microwave and power electronics end-markets.
• APITech (API Technologies): US-based designer and manufacturer of RF/microwave and hermetic packaging components for defense, aerospace and telecom — competes with Egide's microwave/RF and HTCC hermetic packages for high-frequency applications.
• Nishimura Advanced Ceramics Co., Ltd. Japanese specialty ceramics company producing HTCC and custom ceramic packages for semiconductor, optoelectronic and sensor applications — a technology peer to Egide's HTCC platform, particularly for opto-electronic and sensor packages.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/egide-sa

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries2 records

Funding overview

Funding rounds2 records

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Egide