What Egis Technology does

Egis Technology Inc. (神盾, 6462.TWO) is a Taipei-headquartered, fabless semiconductor group founded in 2007 by Steve Lo and listed on the Taiwan OTC since 2015. Historically the world's second-largest supplier of capacitive fingerprint sensors, Egis built its reputation on under-display optical and side-mount passive-capacitive sensors used by Samsung Galaxy smartphones and in Hyundai/Kia vehicles (including KIA PAY). The group has reorganized around three business lines: (1) semiconductor products — fingerprint sensors, capacitive touch sensors, U2F dongles and FIDO UAF mobile authentication; (2) connectivity and foundation silicon IP — the only mass-produced UCIe IP in the world (64 GT/s, verified by a US Tier-1 CSP), plus DDR, LPDDR, ONFI (4,800 MT/s on N6/N7), MIPI and D2D IP — delivered mainly through InPsytech, which Egis acquired in January 2024 for approximately NT$4.7 billion; and (3) chiplet and ASIC design services via Alcor Micro, including the Mobius100 Arm Neoverse CSS V3 CPU chiplet platform with CoWoS packaging and 3nm/5nm/6nm process experience for AI HPC and LLM applications.

The business model combines hardware sales (fingerprint ICs/modules to mobile and automotive OEMs), IP licensing and royalties (UCIe, DDR, LPDDR, ONFI, MIPI to chip designers and the TSMC, Samsung Foundry, Intel Foundry and GlobalFoundries ecosystems), and professional design services (chiplet turnkey design and CoWoS packaging through Alcor Micro). Go-to-market is direct enterprise field sales with offices in Taipei, Hsinchu, Suwon (Korea), Tokyo, Nanjing and Herlev (Denmark), supported by participation in MWC, CES, COMPUTEX and OCP events and quarterly investor conferences with J.P. Morgan, BofA, Morgan Stanley, Citi, Goldman Sachs, UBS and Macquarie. Beyond the core stack, Egis Group operates more than ten subsidiaries — Algoltek (AI vision), ENE Technology (UAV), Creative5 (satellite IoT with Viasat and Sateliot), Syncomm (1ms wireless video), iCatch (image processing/PAISB), Egis Vision (always-on AI) and InPsytech (IP) — extending into Physical AI, satellite IoT, dToF sensing (with GlobalFoundries on 55nm) and ultra-low-power edge AI. The group is led by founder/Chairman Steve Lo with a board that includes Acer founder Stan Shih and former senior executives of TSMC, Synaptics, AMD and National Semiconductor, and is the only Taiwan board member of the FIDO Alliance.

Name

Egis Technology

Legal name

Egis Technology Inc.

Website

https://egistec.com

Company type

Public

Founded year

2007

Operating status

Operating

Headcount range

251–500 employees

Short description

Egis Technology (Taiwan OTC: 6462.TWO) is a fabless semiconductor group offering fingerprint sensors, UCIe/DDR/LPDDR/ONFI/MIPI IP through subsidiary InPsytech, and chiplet design services via Alcor Micro, serving mobile OEMs (Samsung), automotive OEMs (Hyundai, Kia) and AI HPC chip designers.

Ownership category

akta.pro rank

Product category

Semiconductor Sensors and IP

NAICS

Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (3345)

SIC

Computer Communications Equipment (3576)

akta.pro primary industry

AI Hardware IP & Chiplet/Packaging for Accelerators (EDA/IP, advanced packaging) (HDAAAAAL)

akta.pro secondary industry

Analog Front-End (AFE) ICs (Sensor/Medical/Industrial AFE) (HDAHAIAJ)

Keywords

• Fingerprint sensor ICs
• Semiconductor IP licensing
• Chiplet design services
• UCIe interconnect IP
• Capacitive biometric sensors

Headquarters

HQ city

Taipei

HQ country

Taiwan

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales

Revenue model

1. Semiconductor Products (Fingerprint Sensors): Sale of fingerprint sensor ICs and modules including under-display optical sensors and side-mount capacitive sensors for mobile phones, automotive, and IoT applications. Revenue generated from direct sales to OEM customers.
2. Semiconductor IP Licensing: Licensing of connectivity IPs including UCIe, DDR, LPDDR, ONFI, MIPI, and Foundation IP to semiconductor companies and foundries. Egis's UCIe IP is the only mass-produced one in the world, verified by American Tier-1 CSP customers.
3. ASIC / Chiplet Design Services: Chiplet-based architectural SoC and package design services through subsidiary Alcor Micro, targeting HPC, datacenters, AI inference, and LLM applications. One-stop service from design to manufacturing including CoWoS packaging.
4. FIDO Authentication Solutions: FIDO UAF server and client solutions providing end-to-end authentication for mobile payment platforms, sold alongside fingerprint sensor hardware.

Go-to-market motion3 records

Distribution channels3 records

Marketing channels5 records

Core offering

Egis Technology is a fabless semiconductor group that designs, develops, and sells capacitive and optical fingerprint sensor ICs/modules for mobile, automotive, and IoT applications, licenses connectivity semiconductor IP (UCIe, DDR, LPDDR, ONFI, MIPI, Foundation IP) to chip designers and foundries, and provides chiplet design turnkey services through its Alcor Micro subsidiary for AI HPC and datacenter customers. The group also develops AI vision platforms, satellite IoT gateways, UAV systems, dToF sensors, and ultra-low-latency wireless solutions via dedicated subsidiaries.

Product overview

Egis Technology is a global fabless semiconductor group offering semiconductor products, connectivity IPs, and chiplet design turnkey services. The product portfolio centers on three main areas: (1) Fingerprint sensor solutions including Under Display Optical, Side-Mount Capacitive, and capacitive touch sensors for mobile authentication, payment security, and automotive applications; (2) Semiconductor IP including UCIe (the world's only mass-produced UCIe IP), DDR/LPDDR, ONFI, MIPI, Foundation IP, and Die-to-Die interfaces for AI, HPC, IoT, storage, and automotive markets; and (3) ASIC/Chiplet design services through Alcor for HPC, datacenters, AI inference, and Large Language Model applications, utilizing Arm Neoverse CSS platforms and advanced CoWoS packaging. The group also includes subsidiaries developing AI vision systems, satellite IoT, ultra-low-latency wireless transmission, and ultra-low-power AI chips for edge AI applications.

Differentiator

Problem solved

Functional benefit

Brands

• Algoltek (安格): AI vision and multimodal perception systems subsidiary focusing on edge AI and NVIDIA Jetson-based solutions
• InPsytech (乾瞻)
• Creative5 (神盾衛星)
• Mobius100

Products and services

• Under-Display Fingerprint Sensor Optical fingerprint sensor IC/module designed with unique optical mechanisms under an OLED display panel, providing state-of-the-art fingerprint authentication and verification performance for full-screen smartphones.
• Side-Mount Fingerprint Sensor Smallest size fingerprint sensor in the world with passive capacitive type authentication, suitable for replacing mobile home button or side power button with smart navigation and fast unlock capabilities.
• Capacitive Touch Sensor (Passive) Fast, convenient, and secure capacitive touch sensor enabling payment with one touch. Features dynamic real-time sensor calibration for both wet and dry fingers; the only passive type fingerprint sensor on the market.
• U2F Fingerprint Dongle FIDO Universal 2nd Factor authenticator providing highly secure fingerprint touch sensor authentication with driver-free and software-free operation in a small, portable form factor.
• FIDO UAF Mobile Authentication FIDO certified UAF server and client providing end-to-end authentication for mobile payment with high security. Fingerprint securely stored in secure element for privacy protection.
• Foundation IP

Quantifiable outcome

• UCIe IP achieves data transfer rates up to 64 GT/s with best-in-class power efficiency and latency
• +3 more outcomes

Named customers5 records

Segments4 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability10 records

Feature10 records

Partnerships

Nine partnerships are on record, tiered core and flagship.

• SateliotcoreStrategic or Co-development Partner · 12 March 2026Creative5 (Egis Group subsidiary) partnered with Sateliot, a European 3GPP standard LEO satellite communications operator, integrating Creative5's Hestia X IoT gateway with Sateliot's 5G NB-IoT satellite network for global hybrid satellite IoT connectivity solutions covering smart agriculture, energy management, logistics monitoring, and public safety.
• ViasatcoreStrategic or Co-development Partner · 6 January 2026Creative5 (Egis Group subsidiary) partnered with Viasat to showcase field-tested smart forestry monitoring combining Viasat's NB-NTN satellite capabilities with terrestrial networks, LoRaWAN, and BLE Mesh. The system enables reliable IoT deployments in remote, infrastructure-limited environments with ultra-low-power design. Creative5 joined Viasat's ELEVATE global partner ecosystem.
• GlobalFoundriescoreTechnology or Integration · 23 September 2025GlobalFoundries and Egis Technology partnered to develop next-generation direct time-of-flight (dToF) sensors built on GF's 55nm platform, featuring a first-generation front-side illuminated SPAD device with best-in-class Dark Count Rate and Near-Infrared Photon Detection Probability. The integrated solution combines high-voltage bias, VCSEL driver, MCU, and ranging core on a single chip, targeting smart mobile, IoT, and automotive applications including laser-assisted autofocus, presence detection, and collision avoidance. SPAD technology is now available for mass production at GlobalFoundries' Singapore facility.
• Fingerprint Cards AB (publ) - PC ExpansioncoreOEM/ Whitelabel/ Licensing Partner · 14 August 2025Egis expanded its partnership with Fingerprint Cards to cover PC product lines in addition to mobile, extending the collaboration into new product categories.
• Intel Foundry Accelerator IP AlliancecoreTechnology or Integration · 14 March 2025InPsytech (Egis Group subsidiary) joined the Intel Foundry Accelerator IP Alliance, bringing its advanced IP offerings (UCIe, ONFI, LPDDR5X, DDR4/5, MIPI D-PHY/C-PHY/A-PHY) to the Intel Foundry ecosystem. This enables mutual customers to design semiconductor products using Intel Foundry's cutting-edge process technologies with InPsytech's high-speed interface IPs.
• ASICLAND Co., Ltd.coreStrategic or Co-development Partner · 5 November 2024Egis Technology signed a strategic partnership with South Korean chip design company ASICLAND to co-develop AI HPC Server Chiplet designs. The collaboration encompasses CPU Die, AI Die, IO Die, IP licensing (UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development for the high-end data center market. Initial phase focuses on developing an IO Die combining Egis's UCIe and LPDDR5 IP with ASICLAND's ASIC design expertise using TSMC's 7nm process, initially targeting the Korean market.
• ArmflagshipStrategic or Co-development Partner · 15 October 2024Egis Group joined Arm Total Design, leveraging Neoverse CSS V3 platform for new chiplet solutions targeting HPC and generative AI markets. Egis contributes UCIe IP as key interconnect for chiplet architecture; Alcor Micro offers advanced CoWoS packaging services. The collaboration enables the group to build scalable, high-performance, power-saving CSS V3 CPU chiplets interfacing with AI accelerators. Both Egis and Alcor Micro participate in the Arm Chiplet ecosystem alongside nearly 30 other companies.
• Fingerprint Cards AB (publ)coreOEM/ Whitelabel/ Licensing Partner · 13 June 2024Egis Technology entered into an exclusive partnership agreement with Fingerprint Cards AB covering the Mobile area, including patent, technology, and product licensing. Under this agreement, Egis took over Fingerprints' mobile device product line and technology, including exclusive patent licensing, technology transfer, and asset acquisition, extending Egis's fingerprint recognition product line and customer base.
• Samsung SAFE IP Partner ProgramcoreTechnology or Integration · 1 May 2024InPsytech joined Samsung's SAFE (Samsung Advanced Foundry Ecosystem) IP Partner Program, one of the highest accolades within Samsung's foundry ecosystem. This partnership emphasizes InPsytech's ONFI solutions and provides access to Samsung's advanced foundry processes for mutual customers.

Scale indicators9 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Goodix Technology: China's leading fingerprint sensor vendor and Egis's primary direct competitor in the fingerprint/biometric IC market. Subject of Egis's patent infringement suit and competing across under-display optical, capacitive, and side-mount sensor categories for the same smartphone OEMs.
• Fingerprint Cards AB: Swedish fingerprint sensor specialist that historically competed with Egis in mobile, now an exclusive licensing partner following the 2024 mobile agreement (expanded to PC in 2025). Directly comparable product line and customer base in mobile biometric authentication.
• Synaptics: US-based human-interface semiconductor company offering biometric/fingerprint, touch, and display driver ICs for smartphones, PCs, and automotive. Direct competitor in fingerprint and capacitive touch sensor categories, and an Egis board member previously served as VP at Synaptics Taiwan.
• Alphawave Semi: UK-based connectivity IP company specializing in UCIe/die-to-die, PCIe, and high-speed SerDes IP — a direct peer for Egis/InPsytech's UCIe IP business targeting hyperscalers and AI accelerator vendors on advanced nodes.
• Marvell Technology: US fabless semiconductor vendor with a leading custom-silicon/ASIC business (formerly Marvell Custom Solutions) that competes directly with Alcor Micro's chiplet/ASIC design services targeting hyperscalers and AI accelerator vendors.

Broad incumbents

• Synopsys: Largest EDA and semiconductor IP vendor globally, with an extensive UCIe, DDR, MIPI, and Foundation IP portfolio. Competes with Egis/InPsytech across the full IP stack and bundles IP with mainstream EDA design flows that Egis lacks.
• Cadence Design Systems: US EDA and IP giant offering UCIe, DDR, and high-speed interface IP, as well as design services through its Chiplet Design Service. A broad incumbent peer to Egis's IP-plus-chiplet-services offering, with significantly larger sales coverage.
• MediaTek: Taiwan-headquartered fabless semiconductor leader in mobile SoCs, connectivity, and increasingly AI/chiplet designs. A broadly comparable Taiwan-listed fabless incumbent with overlapping design, IP licensing, and chiplet go-to-market motions.
• Realtek Semiconductor: Taiwan fabless semiconductor vendor with a diversified portfolio spanning communications, connectivity, audio, and mixed-signal ICs. Closely comparable in scale, listing status, and Taiwan-rooted fabless business model, though less focused on fingerprint/biometric or UCIe IP specifically.

Emerging players

• ChipOne Technology: Chinese fabless IC designer in fingerprint sensors, display drivers, and mixed-signal components with growing share among Chinese smartphone OEMs. An emerging peer competing on cost/performance in the same fingerprint sensor category as Egis.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat4 records

Key risks7 records

Key highlights7 records

Customer concentration

• Xx.com/egistec
• LinkedInlinkedin.com/company/egistec

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles11 records

Subsidiaries9 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A2 records

Investments5 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Egis Technology