EV Group
EV Group is a privately held Austrian semiconductor equipment manufacturer specializing in wafer bonding, nanoimprint lithography, maskless exposure, resist processing, layer transfer, and metrology systems for global semiconductor, MEMS, photonics, and advanced-packaging manufacturers.
- Company typePrivate
- Founded1980
- HeadquartersSankt Florian Am Inn, Austria
- Headcount501–1,000
- GTM typeB2B
- OfferingHardware or Manufacturing
What EV Group does
EV Group (EVG) is a privately held Austrian semiconductor equipment manufacturer founded in 1980 by Aya Maria and DI Erich Thallner, headquartered in St. Florian am Inn, Austria. The company designs, produces, and supports wafer-processing equipment used by leading semiconductor, MEMS, photonics, biomedical, and advanced-packaging manufacturers globally. Its product portfolio spans wafer bonding (GEMINI FB integrated production systems, BONDSCALE next-generation fusion bonder, ComBond high-vacuum cluster tool, SmartView face-to-face alignment), lithography (SmartNIL nanoimprint lithography, MLE maskless exposure, LITHOSCALE, optical lithography), resist processing (EVG120 automated coater/developer), layer transfer (IR LayerRelease), and metrology (EVG 40 D2W overlay platform). Multiple of these platforms are industry firsts dating back to 1985 and underpin EVG's category-leadership position in wafer bonding and NIL.
The company runs a B2B enterprise field-sales model with direct sales and technical support teams in eight wholly-owned subsidiaries across the US, Japan, South Korea, China, Taiwan, Singapore, Germany, and Malaysia, and a wider representative network spanning another 15+ countries. Revenue is generated through quote-based, multi-year capital equipment contracts (hardware sales) plus process development and technical expertise services delivered from application labs and cleanrooms in Austria, North America, and Asia. EVG's customer base is described as "nearly every major semiconductor and MEMS manufacturer," with deep co-development relationships including long-standing Imec collaboration and a 2025 strategic partnership with Xanadu Quantum Technologies for photonic quantum systems. The 14-consecutive-year TechInsights Customer Satisfaction "Triple Crown" award through the 2026 survey underscores both the breadth of the customer base and the stickiness of the installed tool base.
Operationally, EVG employs 1,700+ people worldwide with 1,300+ concentrated at the Austrian headquarters, operating ISO 9001:2015 and ISO 14001:2015 certified management systems. The business model is self-funded and family-controlled, with no disclosed external capital raises and revenue figures kept private; product launches between late 2025 and mid-2026 (EVG 40 D2W Overlay Metrology, EVG120, a next-generation lithography system, the EVG880 LayerRelease throughput upgrade, and the 200nm wafer-to-wafer hybrid bonding demonstration with Imec) signal an explicit pivot toward advanced packaging, heterogeneous integration, and emerging applications such as quantum computing.
EV Group firmographics
Firmographics- Name
- EV Group
- Legal name
- EV Group (EVG)
- Website
- https://evgroup.com
- Company type
- Private
- Founded year
- 1980
- Operating status
- Operating
- Headcount range
- 501–1,000 employees
- Short description
- EV Group is a privately held Austrian semiconductor equipment manufacturer specializing in wafer bonding, nanoimprint lithography, maskless exposure, resist processing, layer transfer, and metrology systems for global semiconductor, MEMS, photonics, and advanced-packaging manufacturers.
- Ownership category
- akta.pro rank
EV Group industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)
- SIC
- Electronic & Other Electrical Equipment (No Computer Equip) (3600)
- akta.pro primary industry
- Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)
- akta.pro secondary industry
- Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)
Keywords
Where EV Group is headquartered
LocationHeadquarters
- HQ city
- Sankt Florian Am Inn
- HQ country
- Austria
- HQ region
- Europe
Offices32 records
Markets served
EV Group business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Technology or R&D, Operations, Supply Chain, Marketing or Sales, Infrastructure
Revenue model
- Semiconductor Manufacturing Equipment Sales: EV Group generates revenue through the sale of high-volume manufacturing-ready wafer processing equipment including wafer bonding systems, lithography tools, thin-wafer processing and metrology equipment to semiconductor manufacturers and related electronics industries.
- Process Development Services: Application labs and cleanrooms at headquarters in Austria and in North America and Asia provide process development and technical expertise services to customers from initial development through final integration.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | B2B semiconductor equipment sales with custom pricing based on system configuration and customer requirements |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels7 records
EV Group product offering
Product offeringCore offering
EV Group (EVG) designs, develops and manufactures high-volume manufacturing-ready wafer-processing equipment for the semiconductor, MEMS, photonics, and nanotechnology industries. Its product portfolio spans wafer bonding systems (fusion, hybrid, eutectic, anodic, TLP, metal diffusion, ComBond, temporary bonding/debonding), lithography tools (optical, maskless exposure MLE, SmartNIL nanoimprint), resist processing systems, thin-wafer/layer-transfer systems (IR LayerRelease, EVG880), and metrology equipment, complemented by process development services through application labs and cleanrooms at its Austria headquarters and regional sites.
Differentiator
Problem solved
Functional benefit
Products and services
- GEMINI FB Wafer Bonding System Integrated production wafer bonding system for 300mm wafers, enabling face-to-face alignment and hybrid/fusion bonding for 3D integration and advanced packaging applications. Used by semiconductor and MEMS manufacturers for high-volume production.
- BONDSCALE Fusion Wafer Bonder Next-generation fusion wafer bonder addressing future logic transistor scaling and 3D integration challenges outlined in the IRDS Roadmap. Targeted at advanced semiconductor logic and 3D integration production.
- ComBond High-Vacuum Cluster Tool High-vacuum cluster tool enabling electrically conductive and oxide-free covalent bonds at room temperature for engineered substrate and power device production. Used by MEMS and power device manufacturers.
- EVG880 LayerRelease System Layer-transfer system that doubles the throughput of EVG's Semiconductor Layer Transfer Technology for advanced packaging and thin-layer 3D stacking. Targets advanced packaging manufacturers.
- EVG120 Resist Processing System Next-generation automated coater/developer resist processing platform with 40% higher capacity and 20% smaller footprint, featuring wafer edge exposure, in-situ resist thickness measurement and enhanced high-viscosity dispense. Targeted at advanced packaging, MEMS, image sensors, photonics and power device applications.
- LITHOSCALE Maskless Exposure System First LITHOSCALE systems incorporating EVG's MLE Maskless Exposure Technology, bringing digital lithography benefits to high-volume manufacturing across diverse applications and markets.
- HERCULES NIL Nanoimprint Lithography System HERCULES NIL system ramping SmartNIL nanoimprint lithography into high-volume manufacturing of nanopatterned devices for photonics, sensors, and advanced packaging applications.
- EVG 40 D2W Overlay Metrology Platform Dedicated die-to-wafer overlay metrology platform for advanced packaging applications, addressing hybrid bonding and micro-bump technology requirements.
- Process Development Services
Quantifiable outcome
- Achieved wafer-to-wafer hybrid bonding with 200nm interconnect pitch and Cu pad alignment below 40nm for 100% of dies across 300mm wafers - record overlay accuracy
- +1 more outcomes
Companies that use EV Group
Customer profileNamed customers4 records
Segments5 records
Ideal customer profiles5 records
EV Group technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature9 records
EV Group partnerships and signals
Strategic signalPartnerships
Three partnerships are on record, tiered core and minor.
- ImeccoreImec and EV Group have a long-standing partnership focused on developing advanced wafer bonding technologies. In 2026, they demonstrated wafer-to-wafer hybrid bonding at 200nm interconnect pitch with record-high overlay accuracy achieving Cu pad alignment below 40nm for 100% of dies across 300mm wafers using EVG's GEMINI FB bonding system. This supports imec's CMOS 2.0 scaling paradigm for next-generation system-on-chip architectures.
- Xanadu Quantum TechnologiescoreXanadu and EV Group announced a strategic partnership to develop heterogeneous integration and wafer bonding processes for scaling photonic quantum systems. The collaboration leverages EVG's industrial manufacturing tools to fabricate specialized chips for Xanadu's photonic quantum computers, facilitating transition from lab-scale demonstrations to high-volume production. The goal is to accelerate development of commercially viable, fault-tolerant quantum computers by combining multiple photonic platforms onto unified chips.
- Silicon Austria LabsminorSilicon Austria Labs and EV Group strengthened collaboration in optical technology research, expanding their partnership to advance optical technologies for semiconductor applications.
Scale indicators6 records
Recent moves8 records
Expansion highlights5 records
EV Group competitors and assessment
Company assessmentDirect peers
- SUSS MicroTec: SUSS MicroTec is one of EVG's closest direct competitors in wafer-level processing, offering wafer bonding, lithography, and coating/development equipment used in advanced packaging and MEMS. The two companies have historically split the market for wafer-to-wafer and hybrid bonding systems.
- Besi: Besi is a leading supplier of die-to-wafer hybrid bonding and advanced packaging assembly equipment. As hybrid bonding scales into high-volume manufacturing, Besi competes directly with EVG's emerging D2W hybrid bonding roadmap.
Broad incumbents
- Applied Materials: Applied Materials is a broad semiconductor capital equipment incumbent with a growing portfolio in advanced packaging and hybrid bonding (including its Black Diamond and Producer systems). It targets many of the same Tier 1 foundries and IDMs EVG serves, while also competing through partnership and licensing arrangements.
- Tokyo Electron (TEL): Tokyo Electron is one of the largest global semiconductor equipment manufacturers, with significant exposure to advanced packaging, deposition, etch, and lithography tracks. It competes with EVG in coater/developer systems and broader fab equipment used at the same customers.
- Lam Research: Lam Research is a major semiconductor equipment manufacturer with increasing focus on advanced packaging and 3D integration. Its deposition and etch tools overlap with EVG's customer base in memory and logic fabs investing in heterogeneous integration.
- ASML: ASML is the dominant lithography equipment supplier and an indirect competitor through its installed base at the same leading-edge fab customers EVG serves. While not a direct wafer-bonding competitor, ASML's roadmap and customer relationships set the cadence for advanced packaging adoption that EVG benefits from.
- Kulicke & Soffa: Kulicke & Soffa is a major supplier of advanced packaging and semiconductor assembly equipment, including bonding tools. It competes in adjacent advanced packaging equipment categories and shares the same end-customers in OSAT and IDM packaging lines.
- SCREEN Holdings: SCREEN Holdings is a Japanese semiconductor equipment manufacturer with strong positions in coater/developer and cleaning systems. Its track equipment is sold to many of the same leading-edge fabs as EVG's EVG120 resist processing platform.
Regional players
- Disco Corporation: Disco is a leading Japanese supplier of semiconductor dicing, grinding, and thinning equipment used in advanced packaging workflows. Its wafer-thinning and dicing tools are complementary to EVG's temporary bonding/debonding systems in the back-end packaging process flow.
Emerging players
- EVG Competitors in Nanoimprint (e.g., Canon / NIL Technology): Canon and NIL Technology are emerging players in nanoimprint lithography, an area where EVG's SmartNIL and HERCULES NIL compete for photonics, sensor, and advanced packaging applications. While smaller in scale today, they represent the main alternative technology paths for nanopatterning.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
EV Group social profiles
Digital presenceEV Group financial estimates
Financial estimateRevenue estimate
Valuation estimate
EV Group leadership team
Management profileNumber of profiles
Profiles3 records
EV Group subsidiaries and ownership
Company hierarchySubsidiaries19 records
EV Group funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
EV Group M&A and investment
M&A and investmentM&A
Investments2 records
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about EV Group
What does EV Group do?
EV Group (EVG) designs, develops and manufactures high-volume manufacturing-ready wafer-processing equipment for the semiconductor, MEMS, photonics, and nanotechnology industries. Its product portfolio spans wafer bonding systems (fusion, hybrid, eutectic, anodic, TLP, metal diffusion, ComBond, temporary bonding/debonding), lithography tools (optical, maskless exposure MLE, SmartNIL nanoimprint), resist processing systems, thin-wafer/layer-transfer systems (IR LayerRelease, EVG880), and metrology equipment, complemented by process development services through application labs and cleanrooms at its Austria headquarters and regional sites.
Is EV Group a public or private company?
EV Group is a private company. It is classified as family owned and is currently operating.
When was EV Group founded?
EV Group was founded in 1980. It employs 501 to 1,000 people.
Where is EV Group based?
EV Group is headquartered in Sankt Florian Am Inn, Austria, in the Europe region.
How does EV Group make money?
Two revenue lines are on record. Semiconductor Manufacturing Equipment Sales are the primary driver. The others are process Development Services.
Who are EV Group's main competitors?
Direct peers on record are SUSS MicroTec and Besi. Broad incumbents are Applied Materials, Tokyo Electron (TEL), Lam Research, ASML, Kulicke & Soffa and SCREEN Holdings. Disco Corporation is listed as a regional player. EVG Competitors in Nanoimprint (e.g., Canon / NIL Technology) is listed as an emerging player.
Does EV Group have an API?
No public API is recorded for EV Group.
What industry is EV Group in?
EV Group's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHACAH, Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim), with a secondary code of HDAHADAE, Package Substrates & Interposers (ABF/BT, Silicon/Glass). Its NAICS code is 33441 and its SIC code is 3600.