SUSS MicroTec
SUSS MicroTec SE is a German semiconductor equipment manufacturer specializing in backend lithography, wafer bonding (including hybrid bonding for AI/HBM/chiplet packaging), photomask processing, and coating systems, serving global foundries, OSATs, IDMs, and MEMS manufacturers across more than 20 countries.
- Company typePublic
- Founded1949
- HeadquartersGarching, Germany
- Headcount1,001–5,000
- GTM typeB2B
- OfferingHardware or Manufacturing
What SUSS MicroTec does
SUSS MicroTec SE is a German precision-equipment manufacturer for the semiconductor industry's backend processes. Founded in 1949 in Munich and headquartered in Garching, the company designs and produces systems across four solution areas: photomask processing (cleaning, bake and develop), coating (spin coating and industrial inkjet printing down to 20 micrometers), imaging (mask alignment and full-field UV projection scanning), and wafer bonding (permanent, temporary, and hybrid). Its flagship XBC300 Gen2 platform integrates W2W, collective D2W, and sequential D2W hybrid bonding in a single system, targeting AI, HBM, and chiplet advanced packaging applications, while the MaskTrack Pro Series delivers sub-10nm non-contact particle removal for EUV and ArF photomasks.
The company serves semiconductor foundries, OSATs, IDMs, and MEMS manufacturers globally, with manufacturing facilities in Garching (Germany), Sternenfels (Germany), and Zhubei (Taiwan), complemented by wholly-owned subsidiaries and authorized service partners across the Americas, EMEA, and APAC. Revenue is generated through hardware sales of equipment plus recurring streams from service contracts, preventive maintenance, spare parts, upgrades, training, and consumables; pricing is quote-based and project-specific. SUSS went public on the Frankfurt Stock Exchange in May 1999 (ticker SMHN, Prime Standard) and was promoted to the MDAX in June 2026, reflecting growth from EUR 503.2 million in FY2025 sales and a 2030 management target of EUR 750–900M at 43–45% gross margin.
SUSS MicroTec firmographics
Firmographics- Name
- SUSS MicroTec
- Legal name
- SUSS MicroTec SE
- Website
- https://suss.com
- Company type
- Public
- Founded year
- 1949
- Operating status
- Operating
- Headcount range
- 1,001–5,000 employees
- Short description
- SUSS MicroTec SE is a German semiconductor equipment manufacturer specializing in backend lithography, wafer bonding (including hybrid bonding for AI/HBM/chiplet packaging), photomask processing, and coating systems, serving global foundries, OSATs, IDMs, and MEMS manufacturers across more than 20 countries.
- Ownership category
- akta.pro rank
SUSS MicroTec industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Lithography Equipment (DUV/EUV) (HDAHAEAA)
- akta.pro secondary industry
- Mask/Reticle Manufacturing & Inspection Equipment (HDAHAEAK)
Keywords
Where SUSS MicroTec is headquartered
LocationHeadquarters
- HQ city
- Garching
- HQ country
- Germany
- HQ region
- Europe
Offices9 records
Markets served
SUSS MicroTec business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales
Revenue model
- Equipment Sales: Sale of semiconductor manufacturing equipment including coaters, developers, mask aligners, bonders, scanners, and photomask processing systems for R&D through high-volume production.
- Service and Support: Recurring revenue from service contracts, preventive maintenance, spare parts, repairs, upgrades, and customer support across the equipment lifecycle. Includes training services.
- Consumables and Accessories: Recurring revenue from consumables, replacement parts, and accessories complementing equipment sales.
Go-to-market motion1 record
Distribution channels2 records
Marketing channels4 records
SUSS MicroTec product offering
Product offeringCore offering
SUSS MicroTec manufactures precision-engineered equipment and process solutions for the backend of semiconductor manufacturing. Its portfolio spans lithography (mask aligners and UV scanning exposure systems), wafer bonding (permanent, temporary, and hybrid bonding tools including D2W platforms), coating (spin coaters, spray coaters, and inkjet printers), and photomask processing (cleaning, bake-and-develop, and inspection). Products are sold to semiconductor foundries, OSATs, IDMs, MEMS manufacturers, LED makers, and compound semiconductor producers to enable advanced packaging, 3D integration, MEMS fabrication, and photomask production.
Product overview
SUSS MicroTec is a German semiconductor equipment manufacturer providing precision-engineered systems and process solutions for backend semiconductor manufacturing. The product portfolio consists of four main solution areas: (1) Coating Solutions including coaters, developers, and industrial inkjet printing systems (RCD8, MCS8, LabSpin, HP8, ECD8, AS8, ACS300 Gen2, ACS200 Gen3 series, JETx, LP50); (2) Imaging Solutions encompassing mask alignment systems (MA300 Gen3, MA200 Gen3, MA12 Gen3, MA/BA Gen4 Series, MJB4, NIL-SFT series) and UV scanning (DSC300 Gen3); (3) Bonding Solutions for permanent, temporary, and hybrid bonding (XBC300 Gen2 series, XBS300, XBS200, XB8, SB8 Gen2, DB12T); and (4) Photomask Solutions for cleaning, baking, and developing (HMx Series, MaskTrack Pro Series, ASx Series, Masktrack Smart BD). The company operates globally with manufacturing facilities in Garching (Germany headquarters), Sternenfels (Germany), and Zhubei (Taiwan), serving semiconductor foundries, OSATs, and IDMs with recurring revenue from service contracts and consumables.
Differentiator
Problem solved
Functional benefit
Products and services
- XBC300 Gen2 D2W Hybrid Bonder Automated production platform that performs plasma-activated die-to-wafer hybrid bonding with sub-200 nm placement accuracy for chiplet, 3D NAND, and advanced packaging production. Targeted at foundries, OSATs, and IDMs scaling hybrid bonding from R&D to high-volume manufacturing.
- Wafer-to-Wafer Bonding Systems (Permanent, Temporary, Hybrid) Equipment for permanent, temporary, and hybrid wafer-to-wafer bonding used in 3D integration, MEMS, advanced packaging, and thin-wafer handling. Sold to foundries, OSATs, IDMs, and MEMS manufacturers.
- Mask Aligners (Lithography) Lithography tools (mask aligners and projection exposure systems) for patterning wafers in MEMS, LED, compound semiconductor, and power device manufacturing. Sold to fabs and R&D institutions.
- UV Projection / Scanning Exposure Systems UV-based projection and scanning exposure systems optimized for wafer-level packaging, redistribution layer lithography, and fan-out wafer-level packaging. Sold to foundries and OSATs.
- Spin Coaters and Spray Coaters Equipment for spin coating and spray coating of photoresist and functional materials on wafers. Used in photomask production, MEMS, advanced packaging, and compound semiconductor processes. Sold to fabs and research institutes.
- Inkjet Printing Systems Industrial inkjet printing tools for non-contact deposition of functional materials, including solder mask and redistribution layer patterning. Sold to advanced packaging customers and research institutions.
- Photomask Processing Equipment Photomask cleaning (including non-contact particle removal), bake-and-develop, and inspection systems for semiconductor mask manufacturers and in-house mask shops. Sold to photomask fabs and IDMs.
- Installation, Training, Spare Parts and Field Service Comprehensive field service organization offering installation, training, spare parts, upgrades, and field service contracts supporting an installed base of lithography, bonding, coating, and photomask processing systems. Sold to existing equipment customers.
Quantifiable outcome
- Submicron overlay precision for hybrid bonding applications
- +2 more outcomes
Companies that use SUSS MicroTec
Customer profileNamed customers4 records
Segments3 records
Ideal customer profiles3 records
SUSS MicroTec technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature4 records
SUSS MicroTec partnerships and signals
Strategic signalPartnerships
16 partnerships are on record, tiered minor.
- Adeon Technologies - Inkjet PrintingminorAuthorized service partner for inkjet printing solutions in Netherlands region, providing local customer support and service capabilities.
- SMA - Suministro De Materiales Y Asistencia S.L.minorAuthorized service partner providing equipment service and support in Spain region.
- Electron-Mec S.a.r.lminorService partner covering France and Belgium regions for semiconductor equipment maintenance and support.
- Inseto Europe Ltd.minorAuthorized service partner for UK and Ireland regions, providing equipment service and technical support.
- PicoTechminorService partner for Israel region providing local customer care and support capabilities.
- Electron mec s.r.l.minorAuthorized service partner for Italy region.
- Hilpert electronics AGminorService partner for Switzerland and Liechtenstein regions.
- MEMS Dis Ticaret Ltd. Sti.minorAuthorized service partner for Turkey region.
- Kanematsu PWS LTD.minorService partner for Japan region.
- MOS Technology Inc.minorInkjet printing solutions partner for Taiwan region.
- Gredmann GroupminorInkjet printing solutions partner for Taiwan region.
- ZMC TechnologiesminorAuthorized service partner covering Singapore, Malaysia, and Philippines regions.
- Smart Source Innovation Technology Ltd.minorInkjet printing solutions partner for China region (Suzhou, Jiang Su province).
- Micro-Power (H.K.) Semiconductor Ltd.minorService partner for Hong Kong region.
- Coltronics Systems Pty., Ltd.minorAuthorized service partner for Australia region.
- Saetra (Pty) LtdminorService partner for South Africa region.
Scale indicators11 records
Recent moves8 records
Expansion highlights5 records
SUSS MicroTec competitors and assessment
Company assessmentBroad incumbents
- ASML Holding: Global leader in lithography equipment (DUV/EUV scanners) serving advanced semiconductor fabs. Compares as a broad incumbent in the same semiconductor manufacturing equipment space, where SUSS offers complementary mask-aligner and UV-scanning solutions for backend and packaging applications.
- Tokyo Electron (TEL): Major Japanese supplier of semiconductor production equipment spanning deposition, etch, cleaning, lithography, and advanced packaging. Broad incumbent that overlaps with SUSS in coater/developer, cleaning, and advanced packaging tools.
- Lam Research: Global supplier of deposition, etch, and cleaning equipment with expanding advanced-packaging offerings. Broad incumbent serving many of the same foundries, OSATs, and IDMs as SUSS.
- KLA Corporation: Process control and yield management leader for semiconductor manufacturing, including photomask inspection. Broad incumbent with overlapping presence in photomask quality control where SUSS provides cleaning and bake/develop equipment.
- Applied Materials: Largest semiconductor equipment manufacturer globally, with growing presence in advanced packaging through its Black Diamond and Producer platforms. Broad incumbent competing with SUSS across multiple process steps.
Direct peers
- EV Group (EVG): Specialist in wafer bonding, nanoimprint lithography, and lithography equipment for MEMS, compound semiconductors, and advanced packaging. Closely competes with SUSS in wafer-to-wafer and hybrid bonding, as well as mask alignment.
- BE Semiconductor Industries (Besi): Leading supplier of assembly equipment for advanced semiconductor packaging, including hybrid bonding and die-placement tools. Direct peer to SUSS in hybrid bonding for chiplet and HBM advanced-packaging applications.
- DISCO Corporation: Specialist in dicing, grinding, and precision processing equipment for semiconductor backend manufacturing. Direct peer in the precision backend equipment space alongside SUSS's bonding, coating, and photomask solutions.
- ASM Pacific Technology (ASMPT): Hong Kong-headquartered supplier of assembly and packaging materials and equipment, including advanced bonding tools. Direct peer in advanced semiconductor packaging equipment, competing for similar OSAT and foundry customers.
Regional players
- Ultratech / Veeco Instruments: Veeco (via the Ultratech acquisition) supplies lithography, advanced packaging, and MEMS processing equipment. Comparable to SUSS in niche lithography and advanced packaging, with overlapping product categories in MEMS and LED manufacturing.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks7 records
Key highlights7 records
Customer concentration
SUSS MicroTec social profiles
Digital presenceSUSS MicroTec compliance and trust
Trust signalCompliance1 record
SUSS MicroTec financial estimates
Financial estimateRevenue estimate
Valuation estimate
SUSS MicroTec leadership team
Management profileNumber of profiles
Profiles3 records
SUSS MicroTec subsidiaries and ownership
Company hierarchySubsidiaries8 records
SUSS MicroTec funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
SUSS MicroTec M&A and investment
M&A and investmentM&A2 records
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about SUSS MicroTec
What does SUSS MicroTec do?
SUSS MicroTec manufactures precision-engineered equipment and process solutions for the backend of semiconductor manufacturing. Its portfolio spans lithography (mask aligners and UV scanning exposure systems), wafer bonding (permanent, temporary, and hybrid bonding tools including D2W platforms), coating (spin coaters, spray coaters, and inkjet printers), and photomask processing (cleaning, bake-and-develop, and inspection). Products are sold to semiconductor foundries, OSATs, IDMs, MEMS manufacturers, LED makers, and compound semiconductor producers to enable advanced packaging, 3D integration, MEMS fabrication, and photomask production.
Is SUSS MicroTec a public or private company?
SUSS MicroTec is a public company. It is classified as public and is currently operating.
When was SUSS MicroTec founded?
SUSS MicroTec was founded in 1949. It employs 1,001 to 5,000 people.
Where is SUSS MicroTec based?
SUSS MicroTec is headquartered in Garching, Germany, in the Europe region.
How does SUSS MicroTec make money?
Three revenue lines are on record. Equipment Sales are the primary driver. The others are service and Support and consumables and Accessories.
Who are SUSS MicroTec's main competitors?
Broad incumbents on record are ASML Holding, Tokyo Electron (TEL), Lam Research, KLA Corporation and Applied Materials. Direct peers are EV Group (EVG), BE Semiconductor Industries (Besi), DISCO Corporation and ASM Pacific Technology (ASMPT). Ultratech / Veeco Instruments is listed as a regional player.
Does SUSS MicroTec have an API?
No public API is recorded for SUSS MicroTec.
What industry is SUSS MicroTec in?
SUSS MicroTec's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHAEAA, Lithography Equipment (DUV/EUV), with a secondary code of HDAHAEAK, Mask/Reticle Manufacturing & Inspection Equipment. Its NAICS code is 333242 and its SIC code is 3674.