AI Technology (AIT)

What AI Technology (AIT) does

AI Technology (AIT), founded in 1985 and headquartered in Princeton Junction, New Jersey, is a specialty materials manufacturer serving the microelectronics and semiconductor packaging industries. The company's core technology is its flexible-epoxy and engineered polymer chemistry, spanning stress-free flexible adhesive films, compressible phase-change thermal interface materials (TIMs), solderable organic copper-clad flexible circuit substrates (COUPLER), insulated metal substrates (COOL-CLAD), temporary bonding adhesives for wafer thinning and 3-D packaging, and ultra-high-temperature adhesives rated to 300–400 °C. Its portfolio is differentiated by patented insulated metal substrate constructions (8 US patents), MIL-STD 883C and NASA-ESA outgassing qualifications, and a 20+ year reliability track record in military and aerospace programs.

AIT manufactures on a 50,000+ square-foot ISO 9001:2008/2015- and SHARP-certified campus in New Jersey, with scalable clean-room capacity above 10 million square feet of die-attach film per year, and operates a regional facility in Shenzhen, China. It sells through a global technical sales team supported by application engineers and offers custom adhesive formulation services. Product revenue is generated through one-time material sales into semiconductor manufacturers, LED and lighting OEMs, power electronics module makers, electric-vehicle battery packagers, aerospace and defense primes, and solar panel manufacturers; pricing is quote-based and not publicly disclosed. The firm is privately held with no disclosed venture or PE funding, is led by CEO Kevin Chung and President Albert Chung, and has supplemented organic development with the acquisitions of Ormet Circuits (TLPS materials), Coral Industries, and the announced acquisition of AVM Biotechnology.

Name

AI Technology (AIT)

Legal name

AI Technology, Inc.

Website

https://aitechnology.com

Company type

Private

Founded year

1985

Operating status

Operating

Headcount range

51–100 employees

Short description

AI Technology (AIT) is a specialty materials manufacturer founded in 1985 that designs and produces adhesive films, thermal interface materials, and insulated metal substrates for semiconductor packaging, LED, power electronics, EV battery, aerospace, and solar customers.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Materials

NAICS

Adhesive Manufacturing (32552), Paint and Coating Manufacturing (325510), Paint, Coating, and Adhesive Manufacturing (3255)

SIC

Adhesives & Sealants (2891), Coating, Engraving & Allied Services (3470)

akta.pro primary industry

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

akta.pro secondary industries

Tapes, Labels & Pressure-Sensitive Adhesives (IMAEAGAJ), Industrial & Protective Coatings (IMAEAGAB)

Keywords

• Semiconductor packaging materials
• Thermal interface materials
• Die attach adhesives
• Insulated metal substrates
• Wafer processing adhesives

Headquarters

HQ city

Princeton Junction

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Adhesive and Thermal Material Products: AIT generates revenue through the sale of various adhesive films, pastes, thermal interface materials, and electronic packaging solutions to semiconductor, LED, power electronics, and other electronics manufacturers.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

AI Technology (AIT) manufactures and sells specialty adhesive films, pastes, thermal interface materials, insulated metal substrates, and flexible circuit substrates used in microelectronic packaging. The portfolio spans die-attach films and pastes, wafer processing and temporary bonding adhesives, dicing and backgrinding tapes, thermal interface materials (greases, pads, gels, phase-change), insulated metal substrates (COOL-CLAD), flexible circuit substrates (COUPLER), conformal coatings, EMI/RFI shielding, lid-seal solutions, and underfill and glob-top compounds, serving semiconductor, LED, power electronics, EV battery, solar, and defense/aerospace manufacturers.

Product overview

AI Technology (AIT) is a materials science company offering a comprehensive portfolio of specialty adhesive films, pastes, thermal interface materials, and substrates for microelectronic packaging. The portfolio includes: Die Attach Films (DAF) and Pastes for semiconductor die bonding; Wafer Processing Adhesives including temporary bonding solutions (WPA-PRCL-350, WPA-UVR-270) for 3D packaging; Backgrinding and Dicing Tapes; Thermal Interface Materials (TIMs) including COOL SILVER thermal compounds and phase-change pads; Insulated Metal Substrates (COOL-CLAD™) for LED and power modules; Flexible Circuit Substrates (COUPLER™); Conformal Coatings (PRIMA-PROTECT, MOISTSEAL™); EMI/RFI Shielding products; Lid-Seal solutions (SNAP-LID®, COOL-LID®, FLUOROSEAL®); Underfill and Glob-Top compounds; and Custom Adhesives & Materials. The company operates ISO 9001:2015 certified manufacturing facilities in the US and China, serving semiconductor, LED, automotive, solar, and defense/aerospace industries. AIT also completed the strategic acquisition of Ormet Circuits Inc. for TLPS materials.

Differentiator

Problem solved

Functional benefit

Brands

• COUPLER: Organic copper-clad laminate flexible circuit substrate and pre-preg material for flexible circuits
• COOL-CLAD
• COOL-LID
• COOL-PAD
• COOL SILVER
• SNAP-LID
• FLUOROSEAL
• Solder-Sub
• PRIMA-PROTECT
• MOISTSEAL
• Ormet TLPS

Products and services

• Build-Up Film (BUF) Adhesive Pre-Preg Specialty adhesive pre-preg films designed for 3-D semiconductor and chiplet applications, including low Dk/Df build-up films and films with 8-18 PPM/°C CTE for advanced packaging. Targeted at semiconductor and chiplet packaging manufacturers.
• Die Attach Film (DAF) and Dicing Die Attach Film (DDAF) Adhesives Die-attach adhesive films for semiconductor packaging, including electrically conductive and thermally conductive variants for power devices (e.g., ESP7660-HK-DAF, ESP7666-HK-DAF, ESP8660-HK-DAF, ESP8450-DAF) with bond-line thicknesses as thin as 10 microns. For semiconductor manufacturers and OSATs.
• Die Attach Paste Adhesives Conductive and non-conductive paste adhesives for die bonding, including solder-replacement options, stress-free formulations, and ultra-high temperature variants (MC8880) rated to 350°C. Products include ME8412, ME8456, ME8650-RC, EG8050 series. For semiconductor and power device packaging.
• Wafer Processing Temporary Bonding Adhesives Temporary bonding adhesive solutions for wafer thinning and 3D wafer processing including WPA-PRCL-350 (clean peel-release, up to 350°C) and WPA-UVR-270 (UV clean release, up to 270°C), with options on disposable carriers to multiply wafer throughput. For semiconductor wafer-level packaging manufacturers.
• Backgrinding Wax Adhesive Solutions Wax film adhesives for backgrinding SiC, Sapphire, GaN, and GaAs wafers, maintaining greater than 1000 psi shear bond strength. Includes GD-BGF 7090 and GD-PRCL-200 temporary bonding adhesives with clean peel-release and no residuals. For compound semiconductor wafer processing manufacturers.
• Wafer Dicing and Backgrinding Tapes Dicing tapes including UV and heat releasing variants (DT-UV1200-SE4, DT-UV3200-C1), controlled peel strength tapes (DT-CR1000-SE3), and high-temperature resistant tapes (DT-CR1200-R5) that withstand up to 250°C, plus wafer backgrinding tapes. AIT is the only US company to manufacture its own dicing tapes. For semiconductor wafer dicing and backgrinding operations.
• Thermal Interface Materials (TIMs) Comprehensive TIM portfolio including COOL SILVER G4 thermal compound/grease, COOL SILVER PAD thermal pads, compressible phase-change thermal pads, thermal gels, and thermal pressure sensitive adhesives for power semiconductors, modules, computers, and communication electronics. For power electronics, computing, and communications manufacturers.
• COOL-CLAD™ Insulated Metal Substrates Patented insulated metal substrate laminates for LED and high-power module applications. Features proprietary flexible thermal dielectric insulating layer with thermal conductivity of 3 W/m-°C, dielectric strength greater than 1000 V/mil, and maximum continuous operation temperature of 250°C. Available in single-sided and double-sided copper-clad variants. For LED and power module manufacturers.
• COUPLER™ Flexible Circuit Substrates Solderable organic copper-clad laminate flexible circuit materials with low dielectric constant (3.0 @ 1 KHz), dielectric loss below 0.01, hydrophobic with ultra-low moisture absorption (less than 0.3%), and UL-94-V0 fire-retardant rating. Replaces polyimide and PTFE substrates at 50% lower cost. For high-frequency, RFID, and microwave circuit manufacturers.
• Conformal Coatings (PRIMA-PROTECT) Protective polymer coatings including MOISTSEAL™ waterborne solvent-free coating, UV resistant blocking coatings, and moisture/salt-fog/water immersion barrier coatings for electronics protection in harsh environments. For electronics manufacturers requiring environmental protection.
• EMI/RFI Shielding Products EMI/RFI mitigation materials including compressible gasket sheets, conductive sealants, form-in-place (FIP) conductive gaskets, self-attached shielding covers/cans/lids, and CB8130/CB8253-E solderless EMI shielding adhesives. For electronics manufacturers requiring electromagnetic compliance.
• Lid-Seal and Optical Seal Solutions Lid sealing solutions including SNAP-LID® adhesive preforms, COOL-LID® lid attach with thermal management, and FLUOROSEAL® moisture and corrosive gases barrier for cavity electronic packaging. Includes MC7883 insulating paste and MC8880 conductive paste adhesives. For hermetic and near-hermetic electronic packaging manufacturers.
• Underfill and Glob-Top Compounds Chip protection materials including melt-flow film underfills, capillary liquid underfills, and glob-top compounds for COB protection. UF-MC7880 and UF-MC7883 for flip chip underfill and through-silicon-via filling. For semiconductor and chip-on-board manufacturers.
• Substrate and Component Attach Adhesives Paste and film adhesives for substrate bonding and component attach applications, including products for bonding mismatched CTE substrates and large bonding areas. For electronics assembly manufacturers.
• EV Battery Packaging Materials Thermal, electrical, and mechanical interface materials for electric vehicle battery assembly including thermal gap filling potting gel for cylindrical cell packing and fire-retardant thermal interface pads with high compressibility and thermal conductivity. For EV battery and powertrain manufacturers.
• Solar Energy Products Materials for solar applications including UV-stable protective back sheets, transparent PVDF encapsulating front sheets, instant melt-bonding tabbing solutions, and solar energy enhancement coatings and sealants. For solar PV panel manufacturers.
• LED Thermal Management Solutions Comprehensive thermal management solutions for LED applications including thermal interface materials, substrates, and encapsulants designed for maximum heat dissipation and long use life in LED lighting and displays. For LED lighting and display manufacturers.
• Automotive Electronic Adhesives & TIMs Adhesives and thermal interface materials designed for automotive electronic applications meeting automotive reliability and performance requirements. For automotive electronics Tier-1 and OEM manufacturers.
• Industrial & Consumer Tapes, Adhesives, Coatings & Sealants High-temperature labels, film-tapes, and conformal coatings for protecting electrical and metal parts in industrial and consumer applications. For industrial and consumer product manufacturers.
• Custom Adhesives & Materials Custom adhesive formulations and material solutions developed to meet specific customer application requirements, with engineering and technical sales support for custom material development. For customers requiring engineered-to-order material solutions.
• Ormet TLPS Transient liquid phase sintering (TLPS) materials acquired through the 2024 acquisition of Ormet Circuits Inc., expanding AIT's portfolio for advanced electronic packaging die-attach applications. For advanced electronic packaging manufacturers.

Quantifiable outcome

• 20+ years proven reliability in military and aerospace applications
• +3 more outcomes

Segments6 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Scale indicators3 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Henkel: Global specialty chemicals leader with a substantial electronic materials adhesives portfolio (Loctite, Bergquist) serving semiconductor packaging, EV battery, and power electronics - directly overlapping with AIT's die attach, thermal interface, and underfill product lines.
• Shin-Etsu Chemical: Diversified Japanese chemical manufacturer with significant semiconductor materials business including wafer processing, packaging materials, and thermal interface compounds that overlap with AIT's wafer dicing tape and temporary bonding products.
• LORD Corporation (Parker Hannifin): Manufacturer of specialty adhesives, coatings, and thermal management materials serving aerospace, defense, and electronics - comparable to AIT in the high-reliability MIL-STD qualified adhesive and thermal interface product space.
• 3M: Global diversified technology company with an electronic materials division offering thermal interface materials, adhesives, and tapes for electronics assembly - overlapping with AIT's COOL SILVER thermal compounds and tape products.

Direct peers

• Resonac (formerly Hitachi Chemical): Major Japanese supplier of semiconductor packaging materials including die attach films, encapsulants, and substrates - competes head-to-head with AIT in advanced packaging adhesives and thermal materials.
• Namics Corporation: Japanese specialty manufacturer of underfills, encapsulants, and die attach adhesives for semiconductor packaging - one of the closest direct competitors to AIT's chip protection and die bonding product lines.
• Master Bond: US-based custom formulator of specialty adhesives, sealants, and coatings for electronic, aerospace, and medical applications - closely comparable to AIT in custom adhesive formulation and small-batch specialty materials.
• Creative Materials: US specialty manufacturer of conductive adhesives, inks, and coatings for electronic applications - comparable niche competitor to AIT in custom electronic materials formulations.
• Kyocera Chemical: Japanese manufacturer of electronic packaging materials including die attach films, underfills, and substrate materials - directly comparable to AIT's semiconductor packaging adhesive portfolio.

Emerging players

• Dymax Corporation: US-based manufacturer of light-curable adhesives, coatings, and maskants for electronics assembly - adjacent competitor to AIT in conformal coatings and electronic assembly adhesives.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• Xx.com/aitechnologyinc
• Facebookfacebook.com/aitechnology.inc
• LinkedInlinkedin.com/company/ai-technology-inc.

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A2 records

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about AI Technology (AIT)