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Tageos

Full company profile

uuid0008fdl

Namestring
Tageos
Legal namestring
Tageos SAS
Websiteurl
tageos.com
Company typeenum
Private
Founded yearint
2007
Descriptiontext

Tageos SAS is a French-headquartered global manufacturer of RFID inlays and tags, founded in 2007 and operating as a wholly-owned subsidiary of Fedrigoni Group since 2022. The company designs and produces passive and battery-assisted inlays spanning RAIN RFID (UHF), NFC/HF, dual-frequency (HF+UHF), Bluetooth Low Energy (BLE), and passive sensor technologies, sourcing integrated circuits from Impinj, NXP Semiconductors, EM Microelectronic, Pragmatic Semiconductor, and Wiliot. Its 12 billion-unit annual production capacity is distributed across facilities in Montpellier (France, HQ), Fletcher, North Carolina (USA), and Guangzhou (China), with a 700+ m² Innovation Center of Excellence in Munich (Germany) opened in April 2025 for antenna, BLE, flexible-battery, and Engineering-as-a-Service R&D. Tageos holds ARC Quality Certification from Auburn University's RFID Lab across multiple retail specifications, ISO 9001:2015 and ISO 14001:2015 certifications, and Impinj and NXP Gold Partner status.

The company sells its inlays primarily through indirect channels — converters, service bureaus, and system integrators who embed the inlays into finished label and smart packaging solutions — alongside direct enterprise sales to retailers, brand owners, and industrial manufacturers. End applications span retail (apparel, food and beverage, QSR, beauty), industrial manufacturing and logistics (Bosch kanban deployment), healthcare and pharmaceutical traceability, automotive parts tracking, and premium-goods authentication. The portfolio is anchored by differentiated products including the EOS-241 M830 (first 42x16mm inlay ARC-certified for Specs R and Y2), the EOS-654 BLE G3 ambient-IoT inlay with Wiliot, the EOS-920 and EOS-620 Seal authentication inlays with EM Microelectronic, and the world's first FlexIC-based paper NFC inlay family (EOS Lite, EOS Zero Lite) co-developed with Pragmatic Semiconductor. Revenue is generated through volume-based B2B hardware sales with negotiated per-order pricing; revenue figures are not publicly disclosed.

Short descriptiontext

Tageos is a French-headquartered global manufacturer of RFID inlays and tags — spanning RAIN UHF, NFC, dual-frequency, BLE, and sensor products — sold primarily through converters and system integrators to retailers, brand owners, and industrial manufacturers worldwide.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
501–1,000
akta.pro rankint
HeadquartersMontpellier, France
HQ citystring
Montpellier
HQ countrystring
France
HQ regionstring
Europe
Markets served

Serves global market

Offices7 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
RFID inlay manufacturing, RAIN RFID tags, NFC smart labels, BLE IoT sensors, dual-frequency inlays
Industry2 codes
PRIMARYIMALAKAJ
Security, Tamper-Evident & Track-and-Trace Printing
SECONDARYIMALAOAD
Labeling, Coding & Marking Equipment (Labelers, Inkjet, Laser)
NAICS code2 codes
  • Other Paperboard Container Manufacturing322219
  • Packaging and Labeling Services56191
SIC code1 code
  • Paperboard Containers & Boxes2650
Product category
RFID Inlays and Tags
Social media profiles2 records
GTM motion3 records

Each record includes

Type, Description, Source

Revenue model1 record
1RFID Inlays and Tags (Hardware Sales)
TypeHardware Sales
Description

Tageos generates revenue primarily from the design and manufacture of RFID inlays and tags, including RAIN RFID (UHF), NFC/HF, dual-frequency, BLE, and sensor inlays. Products are sold as dry, wet, or paper-face formats to converters, service bureaus, and direct customers. Volume-based pricing applies given high production scale.

tageos.com
Marketing channels5 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels4 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 3 records shown
1EOS Zero
Description

Product family featuring sustainable, paper-based NFC inlays with reduced carbon footprint

businesswire.com
+2 more records
Core offering1 text field

Tageos designs and manufactures RFID inlays and tags spanning RAIN RFID (UHF), NFC/HF, dual-frequency (HF+UHF), BLE (Bluetooth Low Energy), and passive sensor technologies, sold in dry, wet, and paper-face formats. The company offers a comprehensive portfolio of inlays for retail, food service, healthcare, automotive, industrial, and logistics applications, supported by an Innovation Center of Excellence (ICoE) in Munich providing Engineering-as-a-Service prototyping. Tageos produces over 12 billion inlay units annually from manufacturing sites in France, the United States, and China.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 4 values shown
  • Reduced inlay antenna area by more than 55% over two years, decreasing raw material use and carbon footprint
+3 more records
Product overview1 text field

Tageos is a global manufacturer of RFID inlays and tags providing a comprehensive portfolio of RAIN RFID (UHF), NFC, HF, and BLE products. The product portfolio includes: RAIN RFID inlays (EOS-200 through EOS-500 series, EOS-400 and EOS-450 families) using Impinj and NXP chips; dual-frequency inlays (EOS-650, EOS-620 Seal) supporting both HF/NFC and UHF; NFC inlays with cryptographic security (EOS-920, EOS-925 Seal); specialty products including fill-sensing tags (EOS-730 Liqr Stiq) and bottle tags (EOS-233); and the new FlexIC-based EOS Lite and EOS Zero Lite families using Pragmatic Semiconductor's flexible integrated circuits. Products are offered in various delivery formats (dry, wet, paper-face) and target retail, food service, healthcare, logistics, automotive, and industrial applications. The company also provides Engineering-as-a-Service (EaaS) capabilities through its Innovation Center of Excellence in Munich.

Product and service13 records
1EOS-241 M830 RAIN RFID Inlay
CategoryRAIN RFID Inlays
Description

Ultra-compact 42x16mm RAIN RFID inlay featuring the Impinj M830 chip, providing ARC-certified performance for retail apparel (Spec R) and Spec Y2 (e.g., food) applications.

2EOS-450 U9 RAIN RFID Inlay
CategoryRAIN RFID Inlays
Description

RAIN RFID inlay using NXP UCODE 9 IC, ARC Spec Z approved, designed for quick service restaurants (QSRs) and food supply chain applications in dry, wet, and paper-face formats.

3EOS-400 U9xm RAIN RFID Inlay
CategoryRAIN RFID Inlays
Description

RAIN RFID inlay purpose-built for automotive, industrial manufacturing, and logistics, providing robust global performance on high dielectric load materials such as PA and PMMA with large memory capacity.

4EOS-650 EM4425 Dual-Frequency Inlay
CategoryDual-Frequency Inlays
Description

Dual-frequency inlay combining HF/NFC and UHF (RAIN RFID) capabilities, designed for retail and consumer goods applications where NFC enables connected customer experiences and RAIN RFID enables inventory management.

5EOS-920 NFC Inlay
CategoryNFC Inlays
Description

NFC inlay featuring EM Microelectronic's EM4332 chip with cryptographic security functions and a compact 20mm antenna design for product authentication and secure consumer engagement.

6EOS-620 Seal Dual-Frequency Inlay
CategoryDual-Frequency Inlays
Description

Dual-frequency inlay (HF/NFC and RAIN RFID) using EM Microelectronic's EM4425 chip with anti-tamper detection for brand protection and product authentication.

7EOS-932 Zero Lite PR1301 Paper-Based NFC Inlay
CategoryFlexIC-Based Sustainable NFC Inlays
Description

The first sustainable paper-based NFC inlay in the EOS Zero Lite family, using Pragmatic Semiconductor's ultra-thin NFC Connect PR1301 flexible integrated circuit (FlexIC) with paper-based antenna, designed for paper packaging with reduced carbon footprint.

8EOS-730 NTAG 224 DNA SD (Liqr Stiq) Fill-Sensing Tag
CategorySensor NFC Inlays
Description

Encapsulated HF/NFC inlay (9-inch/22.86cm) that measures the fill level of liquor bottles in real time via NFC-enabled smartphone, addressing inventory challenges in hospitality settings.

9EOS-233 M830 Bottle Tag Inlay
CategoryRAIN RFID Inlays
Description

First ARC Spec B2-certified RAIN RFID inlay designed for use on bottled items in retail deployments, including household cleaners, automotive fluids, and nutraceuticals.

10EOS-925 Seal FA NFC Inlay
CategoryTamper-Evident NFC Inlays
Description

Round 25mm diameter NFC inlay with fragile layer that easily breaks the antenna loop when tampered with, designed for customer experience and brand protection/anti-counterfeiting applications.

11EOS-920 Seal I3 TT Tamper Loop Inlay
CategoryTamper-Evident NFC Inlays
Description

50x20mm tamper loop NFC inlay where an intact loop indicates the item is sealed and a broken loop indicates tampering, used for anti-tamper protection in pharmaceuticals, retail food, and beverages.

12EOS-654 BLE G3 Dual-Band BLE Inlay
CategoryBluetooth Low Energy (BLE) Inlays
Description

Battery-free BLE inlay with dual-band architecture (2.4 GHz and sub-1 GHz) designed to support Wiliot's Gen3 IoT Pixel sensor and the Wiliot Intelligence Platform for ambient IoT applications.

13Engineering-as-a-Service (EaaS) Prototyping
CategoryCustom Engineering Services
Description

Custom engineering services delivered through the Munich Innovation Center of Excellence (ICoE), providing customer-specific prototyping and industrialization of RFID inlays, special antennas, BLE technologies, and attachment of flexible batteries and sensors.

Scale indicator6 records

Each record includes

Type, Value, Description, Source

Partnership12 partners
Strategic tierCoreTypeTechnology or IntegrationAnnounced on2026-04-15
Description

Tageos and Pragmatic Semiconductor launched the world's first FlexIC-based RFID product lines (EOS Lite and EOS Zero Lite) using Pragmatic's NFC Connect PR1301 flexible chip technology. This is a long-term strategic partnership for sustainable paper-based NFC inlays for smart packaging. Products target consumer engagement, product authentication, and digital connectivity in packaging applications. Pragmatic manufactures chips at its Durham, UK facility; Tageos converts them into inlays at its Montpellier Innovation Center of Excellence.

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2026-01-22
Description

Strategic partnership to accelerate ambient IoT and battery-free BLE sensing. Tageos launched the EOS-654 BLE G3 inlay to support Wiliot's Gen3 IoT Pixel sensor and Wiliot Intelligence Platform. The inlay features dual-band architecture (2.4 GHz and sub-1 GHz) for longer-range energizing and reliable broadcasts. The product was developed at Tageos' Innovation Center of Excellence in Munich.

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-11-21
Description

Tageos and EM Microelectronic co-developed two new RFID inlays: EOS-920 NFC inlay (EM4332 chip) with cryptographic security functions, and EOS-620 Seal dual-frequency inlay (EM4425 chip) with HF/NFC and RAIN RFID capabilities and anti-tamper detection. Both target product authentication, supply chain transparency, and consumer engagement applications.

Strategic tierMajorTypeTechnology or IntegrationAnnounced on2025-10-22
Description

Tageos and Trackonomy formed a strategic partnership to launch the first battery-powered Bluetooth Low Energy (BLE) inlays designed for scalable, mass-market deployment. This targets next-generation BLE sensing and IoT applications.

Strategic tierMinorTypeGTM or Marketing Partner
Description

Bar IQ, a software provider and systems integrator for the hospitality industry, demonstrated the real-time liquid level sensing capabilities of the Liqr Stiq tag (based on Tageos EOS-730 inlay) with its purpose-built API at RFID Journal LIVE! 2025.

Strategic tierMinorTypeGTM or Marketing Partner
Description

Trilliott, specializing in digital warehouse and supply chain management, demonstrated how Tageos RAIN RFID inlays can enhance inventory and asset management systems in healthcare at RFID Journal LIVE! 2025.

Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Market partner for Tageos EOS-920 and EOS-620 Seal inlays targeting anti-counterfeiting and product authentication. ForgeStop has received significant customer interest following the product launches.

Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Market partner for Tageos EOS-920 and EOS-620 Seal inlays for product authentication and supply chain transparency. 4iD Solutions has received significant customer interest following the product launches.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Fedrigoni, majority shareholder of Tageos since 2022, showcases Tageos RFID-based products at Labelexpo Europe 2025. Fedrigoni is a major global supplier of specialty papers and self-adhesive labels, serving luxury, pharmaceutical, wine, food, beauty, and FMCG industries. RFID technology is a strategic priority for Fedrigoni, exploiting synergies with its two businesses of self-adhesives and specialty papers.

Strategic tierCoreTypeTechnology or Integration
Description

Tageos has ARC Quality Certification from Auburn University's RFID Lab for the design and manufacturing of its RFID inlays and tags. Multiple Tageos inlays have received ARC performance certifications for various retail and industrial specifications.

Strategic tierCoreTypeTechnology or Integration
Description

Impinj is a key IC supplier to Tageos, providing the Monza and M800 series chips used in Tageos' RAIN RFID inlay portfolio. Tageos holds Impinj Gold Partner status. Collaboration includes joint product announcements such as the EOS-241 M830 using the Impinj M830 chip.

Strategic tierCoreTypeTechnology or Integration
Description

NXP Semiconductors supplies the UCODE and NTAG IC families used in Tageos' RAIN RFID and NFC inlay products. Tageos holds NXP Gold Partner status. Key products include EOS-450 U9 (NXP UCODE 9) and multiple NFC inlays (NXP NTAG family).

Recent move8 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Market position
Competitive moat6 records

Each record includes

Type, Details

Key highlights4 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers7 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment6 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile3 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

Integration2 records

Each record includes

Title, Type, Description, Source

AI maturity
App detail

Has app

Feature11 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles9 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance4 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds1 record

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors1 record

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Tageos

RFID Inlays and Tagstageos.com

Tageos is a French-headquartered global manufacturer of RFID inlays and tags — spanning RAIN UHF, NFC, dual-frequency, BLE, and sensor products — sold primarily through converters and system integrators to retailers, brand owners, and industrial manufacturers worldwide.

What Tageos does

Tageos SAS is a French-headquartered global manufacturer of RFID inlays and tags, founded in 2007 and operating as a wholly-owned subsidiary of Fedrigoni Group since 2022. The company designs and produces passive and battery-assisted inlays spanning RAIN RFID (UHF), NFC/HF, dual-frequency (HF+UHF), Bluetooth Low Energy (BLE), and passive sensor technologies, sourcing integrated circuits from Impinj, NXP Semiconductors, EM Microelectronic, Pragmatic Semiconductor, and Wiliot. Its 12 billion-unit annual production capacity is distributed across facilities in Montpellier (France, HQ), Fletcher, North Carolina (USA), and Guangzhou (China), with a 700+ m² Innovation Center of Excellence in Munich (Germany) opened in April 2025 for antenna, BLE, flexible-battery, and Engineering-as-a-Service R&D. Tageos holds ARC Quality Certification from Auburn University's RFID Lab across multiple retail specifications, ISO 9001:2015 and ISO 14001:2015 certifications, and Impinj and NXP Gold Partner status.

The company sells its inlays primarily through indirect channels — converters, service bureaus, and system integrators who embed the inlays into finished label and smart packaging solutions — alongside direct enterprise sales to retailers, brand owners, and industrial manufacturers. End applications span retail (apparel, food and beverage, QSR, beauty), industrial manufacturing and logistics (Bosch kanban deployment), healthcare and pharmaceutical traceability, automotive parts tracking, and premium-goods authentication. The portfolio is anchored by differentiated products including the EOS-241 M830 (first 42x16mm inlay ARC-certified for Specs R and Y2), the EOS-654 BLE G3 ambient-IoT inlay with Wiliot, the EOS-920 and EOS-620 Seal authentication inlays with EM Microelectronic, and the world's first FlexIC-based paper NFC inlay family (EOS Lite, EOS Zero Lite) co-developed with Pragmatic Semiconductor. Revenue is generated through volume-based B2B hardware sales with negotiated per-order pricing; revenue figures are not publicly disclosed.

Tageos firmographics

Firmographics
Name
Tageos
Legal name
Tageos SAS
Website
https://tageos.com
Company type
Private
Founded year
2007
Operating status
Operating
Headcount range
501–1,000 employees
Short description
Tageos is a French-headquartered global manufacturer of RFID inlays and tags — spanning RAIN UHF, NFC, dual-frequency, BLE, and sensor products — sold primarily through converters and system integrators to retailers, brand owners, and industrial manufacturers worldwide.
Ownership category
akta.pro rank

Tageos industry classification

Industry
Product category
RFID Inlays and Tags
NAICS
Other Paperboard Container Manufacturing (322219), Packaging and Labeling Services (56191)
SIC
Paperboard Containers & Boxes (2650)
akta.pro industry
PRIMARYIMALAKAJ
Security, Tamper-Evident & Track-and-Trace Printing
SECONDARYIMALAOAD
Labeling, Coding & Marking Equipment (Labelers, Inkjet, Laser)

Keywords

  • RFID inlay manufacturing
  • RAIN RFID tags
  • NFC smart labels
  • BLE IoT sensors
  • Dual-frequency inlays

Where Tageos is headquartered

Location

Headquarters

HQ city
Montpellier
HQ country
France
HQ region
Europe

Offices7 records

Markets served

Tageos business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

  1. RFID Inlays and Tags (Hardware Sales): Tageos generates revenue primarily from the design and manufacture of RFID inlays and tags, including RAIN RFID (UHF), NFC/HF, dual-frequency, BLE, and sensor inlays. Products are sold as dry, wet, or paper-face formats to converters, service bureaus, and direct customers. Volume-based pricing applies given high production scale.

Go-to-market motion3 records

Distribution channels4 records

Marketing channels5 records

Tageos product offering

Product offering

Core offering

Tageos designs and manufactures RFID inlays and tags spanning RAIN RFID (UHF), NFC/HF, dual-frequency (HF+UHF), BLE (Bluetooth Low Energy), and passive sensor technologies, sold in dry, wet, and paper-face formats. The company offers a comprehensive portfolio of inlays for retail, food service, healthcare, automotive, industrial, and logistics applications, supported by an Innovation Center of Excellence (ICoE) in Munich providing Engineering-as-a-Service prototyping. Tageos produces over 12 billion inlay units annually from manufacturing sites in France, the United States, and China.

Product overview

Tageos is a global manufacturer of RFID inlays and tags providing a comprehensive portfolio of RAIN RFID (UHF), NFC, HF, and BLE products. The product portfolio includes: RAIN RFID inlays (EOS-200 through EOS-500 series, EOS-400 and EOS-450 families) using Impinj and NXP chips; dual-frequency inlays (EOS-650, EOS-620 Seal) supporting both HF/NFC and UHF; NFC inlays with cryptographic security (EOS-920, EOS-925 Seal); specialty products including fill-sensing tags (EOS-730 Liqr Stiq) and bottle tags (EOS-233); and the new FlexIC-based EOS Lite and EOS Zero Lite families using Pragmatic Semiconductor's flexible integrated circuits. Products are offered in various delivery formats (dry, wet, paper-face) and target retail, food service, healthcare, logistics, automotive, and industrial applications. The company also provides Engineering-as-a-Service (EaaS) capabilities through its Innovation Center of Excellence in Munich.

Differentiator

Problem solved

Functional benefit

Brands

  • EOS Zero: Product family featuring sustainable, paper-based NFC inlays with reduced carbon footprint
  • EOS Lite
  • EOS Seal

Products and services

  • EOS-241 M830 RAIN RFID Inlay Ultra-compact 42x16mm RAIN RFID inlay featuring the Impinj M830 chip, providing ARC-certified performance for retail apparel (Spec R) and Spec Y2 (e.g., food) applications.
  • EOS-450 U9 RAIN RFID Inlay RAIN RFID inlay using NXP UCODE 9 IC, ARC Spec Z approved, designed for quick service restaurants (QSRs) and food supply chain applications in dry, wet, and paper-face formats.
  • EOS-400 U9xm RAIN RFID Inlay RAIN RFID inlay purpose-built for automotive, industrial manufacturing, and logistics, providing robust global performance on high dielectric load materials such as PA and PMMA with large memory capacity.
  • EOS-650 EM4425 Dual-Frequency Inlay Dual-frequency inlay combining HF/NFC and UHF (RAIN RFID) capabilities, designed for retail and consumer goods applications where NFC enables connected customer experiences and RAIN RFID enables inventory management.
  • EOS-920 NFC Inlay NFC inlay featuring EM Microelectronic's EM4332 chip with cryptographic security functions and a compact 20mm antenna design for product authentication and secure consumer engagement.
  • EOS-620 Seal Dual-Frequency Inlay Dual-frequency inlay (HF/NFC and RAIN RFID) using EM Microelectronic's EM4425 chip with anti-tamper detection for brand protection and product authentication.
  • EOS-932 Zero Lite PR1301 Paper-Based NFC Inlay The first sustainable paper-based NFC inlay in the EOS Zero Lite family, using Pragmatic Semiconductor's ultra-thin NFC Connect PR1301 flexible integrated circuit (FlexIC) with paper-based antenna, designed for paper packaging with reduced carbon footprint.
  • EOS-730 NTAG 224 DNA SD (Liqr Stiq) Fill-Sensing Tag Encapsulated HF/NFC inlay (9-inch/22.86cm) that measures the fill level of liquor bottles in real time via NFC-enabled smartphone, addressing inventory challenges in hospitality settings.
  • EOS-233 M830 Bottle Tag Inlay First ARC Spec B2-certified RAIN RFID inlay designed for use on bottled items in retail deployments, including household cleaners, automotive fluids, and nutraceuticals.
  • EOS-925 Seal FA NFC Inlay Round 25mm diameter NFC inlay with fragile layer that easily breaks the antenna loop when tampered with, designed for customer experience and brand protection/anti-counterfeiting applications.
  • EOS-920 Seal I3 TT Tamper Loop Inlay 50x20mm tamper loop NFC inlay where an intact loop indicates the item is sealed and a broken loop indicates tampering, used for anti-tamper protection in pharmaceuticals, retail food, and beverages.
  • EOS-654 BLE G3 Dual-Band BLE Inlay Battery-free BLE inlay with dual-band architecture (2.4 GHz and sub-1 GHz) designed to support Wiliot's Gen3 IoT Pixel sensor and the Wiliot Intelligence Platform for ambient IoT applications.
  • Engineering-as-a-Service (EaaS) Prototyping Custom engineering services delivered through the Munich Innovation Center of Excellence (ICoE), providing customer-specific prototyping and industrialization of RFID inlays, special antennas, BLE technologies, and attachment of flexible batteries and sensors.

Quantifiable outcome

  • Reduced inlay antenna area by more than 55% over two years, decreasing raw material use and carbon footprint
  • +3 more outcomes

Companies that use Tageos

Customer profile

Named customers7 records

Segments6 records

Ideal customer profiles3 records

Tageos technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Integration2 records

Feature11 records

Tageos partnerships and signals

Strategic signal

Partnerships

Twelve partnerships are on record, tiered core, major and minor.

  • Pragmatic SemiconductorcoreTechnology or Integration · 15 April 2026Tageos and Pragmatic Semiconductor launched the world's first FlexIC-based RFID product lines (EOS Lite and EOS Zero Lite) using Pragmatic's NFC Connect PR1301 flexible chip technology. This is a long-term strategic partnership for sustainable paper-based NFC inlays for smart packaging. Products target consumer engagement, product authentication, and digital connectivity in packaging applications. Pragmatic manufactures chips at its Durham, UK facility; Tageos converts them into inlays at its Montpellier Innovation Center of Excellence.
  • WiliotcoreTechnology or Integration · 22 January 2026Strategic partnership to accelerate ambient IoT and battery-free BLE sensing. Tageos launched the EOS-654 BLE G3 inlay to support Wiliot's Gen3 IoT Pixel sensor and Wiliot Intelligence Platform. The inlay features dual-band architecture (2.4 GHz and sub-1 GHz) for longer-range energizing and reliable broadcasts. The product was developed at Tageos' Innovation Center of Excellence in Munich.
  • EM MicroelectroniccoreTechnology or Integration · 21 November 2025Tageos and EM Microelectronic co-developed two new RFID inlays: EOS-920 NFC inlay (EM4332 chip) with cryptographic security functions, and EOS-620 Seal dual-frequency inlay (EM4425 chip) with HF/NFC and RAIN RFID capabilities and anti-tamper detection. Both target product authentication, supply chain transparency, and consumer engagement applications.
  • TrackonomymajorTechnology or Integration · 22 October 2025Tageos and Trackonomy formed a strategic partnership to launch the first battery-powered Bluetooth Low Energy (BLE) inlays designed for scalable, mass-market deployment. This targets next-generation BLE sensing and IoT applications.
  • Bar IQminorGTM or Marketing PartnerBar IQ, a software provider and systems integrator for the hospitality industry, demonstrated the real-time liquid level sensing capabilities of the Liqr Stiq tag (based on Tageos EOS-730 inlay) with its purpose-built API at RFID Journal LIVE! 2025.
  • TrilliottminorGTM or Marketing PartnerTrilliott, specializing in digital warehouse and supply chain management, demonstrated how Tageos RAIN RFID inlays can enhance inventory and asset management systems in healthcare at RFID Journal LIVE! 2025.
  • ForgeStopminorChannel Partner/ Reseller/ DistributorMarket partner for Tageos EOS-920 and EOS-620 Seal inlays targeting anti-counterfeiting and product authentication. ForgeStop has received significant customer interest following the product launches.
  • 4iD SolutionsminorChannel Partner/ Reseller/ DistributorMarket partner for Tageos EOS-920 and EOS-620 Seal inlays for product authentication and supply chain transparency. 4iD Solutions has received significant customer interest following the product launches.
  • FedrigonicoreStrategic or Co-development PartnerFedrigoni, majority shareholder of Tageos since 2022, showcases Tageos RFID-based products at Labelexpo Europe 2025. Fedrigoni is a major global supplier of specialty papers and self-adhesive labels, serving luxury, pharmaceutical, wine, food, beauty, and FMCG industries. RFID technology is a strategic priority for Fedrigoni, exploiting synergies with its two businesses of self-adhesives and specialty papers.
  • Auburn University RFID LabcoreTechnology or IntegrationTageos has ARC Quality Certification from Auburn University's RFID Lab for the design and manufacturing of its RFID inlays and tags. Multiple Tageos inlays have received ARC performance certifications for various retail and industrial specifications.
  • ImpinjcoreTechnology or IntegrationImpinj is a key IC supplier to Tageos, providing the Monza and M800 series chips used in Tageos' RAIN RFID inlay portfolio. Tageos holds Impinj Gold Partner status. Collaboration includes joint product announcements such as the EOS-241 M830 using the Impinj M830 chip.
  • NXP SemiconductorscoreTechnology or IntegrationNXP Semiconductors supplies the UCODE and NTAG IC families used in Tageos' RAIN RFID and NFC inlay products. Tageos holds NXP Gold Partner status. Key products include EOS-450 U9 (NXP UCODE 9) and multiple NFC inlays (NXP NTAG family).

Scale indicators6 records

Recent moves8 records

Expansion highlights5 records

Tageos competitors and assessment

Company assessment

Market position

Competitive moat6 records

Key highlights4 records

Customer concentration

Tageos social profiles

Digital presence

Tageos compliance and trust

Trust signal

Compliance4 records

Tageos financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Tageos leadership team

Management profile

Number of profiles

Profiles9 records

Tageos funding detail

Funding detail

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Tageos M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Tageos

What does Tageos do?

Tageos designs and manufactures RFID inlays and tags spanning RAIN RFID (UHF), NFC/HF, dual-frequency (HF+UHF), BLE (Bluetooth Low Energy), and passive sensor technologies, sold in dry, wet, and paper-face formats. The company offers a comprehensive portfolio of inlays for retail, food service, healthcare, automotive, industrial, and logistics applications, supported by an Innovation Center of Excellence (ICoE) in Munich providing Engineering-as-a-Service prototyping. Tageos produces over 12 billion inlay units annually from manufacturing sites in France, the United States, and China.

Is Tageos a public or private company?

Tageos is a private company. It is classified as corporate owned and is currently operating.

When was Tageos founded?

Tageos was founded in 2007. It employs 501 to 1,000 people.

Where is Tageos based?

Tageos is headquartered in Montpellier, France, in the Europe region.

How does Tageos make money?

One revenue line is on record: RFID Inlays and Tags (Hardware Sales).

Does Tageos have an API?

No public API is recorded for Tageos.

What industry is Tageos in?

Tageos's product category is RFID Inlays and Tags. Its primary akta.pro industry code is IMALAKAJ, Security, Tamper-Evident & Track-and-Trace Printing, with a secondary code of IMALAOAD, Labeling, Coding & Marking Equipment (Labelers, Inkjet, Laser). Its NAICS code is 322219 and its SIC code is 2650.

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eeNews EuropeFlexIC RFID inlays bring NFC to paper packagingTageos and Pragmatic Semiconductor have expanded their partnership to launch FlexIC-based RFID product lines (EOS Lite and EOS Zero Lite families) for NFC-enabled paper packaging and labels. The EOS-932 Zero Lite PR1301, the first paper-based NFC inlay in the range, uses Pragmatic's ultra-thin flexible chip combined with a paper-based antenna, designed for consumer engagement, product authentication, and brand protection applications. Prototype samples are expected by the end of Q2 2026, with volume orders planned from Q3 2026.RFID JOURNALTageos Launches World’s First FlexIC-based RFID Product LinesTageos and Pragmatic Semiconductor have launched the world's first FlexIC-based RFID product lines, the EOS Lite and EOS Zero Lite, designed for sustainable NFC inlays that enable item-level intelligence and digital connectivity in packaging. The EOS-932 Zero Lite PR1301 combines Pragmatic's ultra-thin NFC Connect chip with a paper-based inlay antenna, offering cost-effective deployment and improved recyclability for retail packaging applications. Prototype samples will be available by the end of Q2, with volume orders expected from Q3 2026, representing a new market opportunity for mass-market smart packaging.AllaboutcircuitsTageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper ChipTageos announced two new NFC inlay product families (EOS Lite and EOS Zero Lite) built around Pragmatic Semiconductor's PR1301 flexible integrated circuit, representing the world's first commercial RFID lines based on FlexIC technology rather than conventional silicon die. The EOS-932 Zero Lite PR1301, featuring a paper substrate and antenna, will be available as samples by the end of Q2 2026 with volume production from Q3 2026, targeting high-volume consumer packaging applications including cosmetics, folding cartons, premium wine and spirits labels, and smart food packaging. Pragmatic manufactures the PR1301 chips at its Durham, UK facility while Tageos converts them into inlays at its Innovation Center of Excellence in Montpellier.PR NewswireTageos lanza las primeras líneas de productos RFID del mundo basadas en FlexICTageos and Pragmatic Semiconductor announced an expanded strategic partnership to launch the world's first RFID product lines based on FlexIC technology, including the EOS Lite and EOS Zero Lite families, with the EOS-932 Zero Lite PR1301 as the first product—a passive NFC inlay on paper substrate featuring Pragmatic's ultra-thin NFC Connect PR1301 chip. The new products leverage sustainable paper substrates, flexible chip designs, and innovative antenna designs to significantly reduce carbon footprint, material use, and costs while enabling scalable integration for smart packaging applications. Prototype samples are expected to be available by the end of Q2 2026, with bulk orders anticipated from Q3 2026.PR NewswireTageos bringt weltweit erste FlexIC-basierte RFID-Produktlinien auf den Markt, die auf Halbleitertechnologie von Pragmatic basierenTageos and Pragmatic Semiconductor announced the expansion of their strategic partnership with the launch of new RFID product lines, EOS Lite and EOS Zero Lite, which are the first FlexIC-based products utilizing Pragmatic's NFC Connect PR1301 chip technology. The products are designed for smart packaging applications with a focus on sustainability, featuring reduced carbon footprint, material consumption, and costs through paper-based NFC inlays and innovative antenna designs. Volume orders are expected to begin in Q3 2026, with prototype samples available from the end of Q2 2026.PR NewswireTageos lance les toutes premières gammes de produits RFID au monde basées sur des FlexIC et grâce à la technologieactivées par la technologie de Pragmatic SemiconductorTageos and Pragmatic Semiconductor announced an extension of their strategic partnership with the launch of new RFID product lines — EOS Lite and EOS Zero Lite — based on Pragmatic's FlexIC technology, marking the world's first paper-based NFC inlays using flexible integrated circuits. The EOS-932 Zero Lite PR1301 inlay is designed for sustainable, low-carbon smart packaging applications, offering discrete integration for consumer engagement, product authentication, and digital experiences. Prototype samples will be available by end of Q2 2026, with volume orders expected from Q3 2026.InkworldmagazineTageos Launches World’s First FlexIC-based RFID Product LinesTageos and Pragmatic Semiconductor have expanded their strategic partnership to launch new RFID product lines—EOS Lite and EOS Zero Lite—based on Pragmatic's flexible NFC Connect PR1301 chip technology, developed at Tageos' Innovation Center of Excellence. The new products feature ultra-thin, flexible chips designed for discreet integration into packaging and curved surfaces, enabling item-level intelligence and digital-physical integration for smart packaging, authentication, and consumer engagement applications. Prototype samples are expected to be available by the end of Q2, with volume orders anticipated from Q3 2026.AijournTageos Launches World’s First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor TechnologyTageos, a global RFID inlay manufacturer headquartered in France, and Pragmatic Semiconductor, a UK-based flexible semiconductor technology company, have expanded their strategic partnership to launch new product lines—the EOS Lite and EOS Zero Lite—featuring Pragmatic's ultra-thin NFC Connect PR1301 chip. The new sustainable paper-based NFC inlays are designed for mass market applications including consumer engagement and product authentication, with prototype samples available by the end of Q2 2026 and volume orders expected from Q3 2026. The products aim to address cost, supply chain, and sustainability challenges in item-level intelligence and smart packaging across retail supply chains.PR NewswireTageos Launches World's First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor TechnologyTageos and Pragmatic Semiconductor announced the expansion of their strategic partnership with the launch of new product lines—EOS Lite and EOS Zero Lite—featuring Pragmatic's NFC Connect PR1301 flexible chip technology. The first product, the EOS-932 Zero Lite PR1301, is a sustainable paper-based NFC inlay designed for paper packaging that reduces carbon footprint, materials, and costs compared to traditional RFID solutions. Prototype samples will be available by the end of Q2 2026, with volume orders expected from Q3 2026.PR NewswireTageos Launches World's First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor TechnologyTageos and Pragmatic Semiconductor launched the EOS Lite and EOS Zero Lite RFID product lines, featuring the NFC Connect PR1301 chip and paper-based inlays. The EOS-932 Zero Lite PR1301 is a sustainable paper-based NFC inlay for packaging and labels. Prototype samples are available by Q2 2026, with volume orders expected from Q3 2026.