Developer docs
API playgroundTry for free, no card

Search company profiles

Smiths Interconnect

Full company profile

uuid0008xzd

Namestring
Smiths Interconnect
Legal namestring
Smiths Interconnect
Company typeenum
Private
Founded yearint
2007
Descriptiontext

Smiths Interconnect is a global designer and manufacturer of high-reliability electronic interconnect, microwave, optical, and radio frequency components serving mission-critical applications in aerospace, defense, medical, semiconductor test, space, rail, and industrial markets. Its product portfolio spans seven core categories — connectors (including proprietary Hypertac hyperboloid, H-Pin spring probe, and high-speed copper contact technologies), cable assemblies and harnesses, semiconductor test solutions (headlined by the DaVinci Gen V test socket supporting 224 Gbps PAM4), ferrite and passive RF components operating to ~90 GHz, frequency-defined filters, embedded optical transceivers based on Reflex Photonics technology, and diamond-based resistive components — engineered for extreme environment performance including radiation resistance, high mating cycles up to 100,000, and operation across demanding thermal and mechanical ranges. The company holds ISO 13485:2016 medical certification with FDA registration, NASA/ESA space qualification compliance, and SNCF rail standards compliance, which collectively anchor design-in positions across regulated end markets.

The business operates a B2B enterprise model with quote-based pricing through direct field sales, technical application engineers, and a global authorized distributor network spanning the Americas, EMEA, and Asia. Thomas Mino serves as CEO, and the company maintains 21 sales, R&D, and manufacturing facilities across 12 countries. Smiths Interconnect was originally part of UK-listed Smiths Group plc, was divested in 2025 under pressure from activist investor Engine Capital, and was acquired by Molex (a Koch Inc. company) on April 1, 2026 for £1.3 billion at 15.1x headline EBITDA — the largest acquisition in Molex's history — combining Smiths Interconnect with Molex's existing electronics portfolio to form an entity operating over 90 plants across 22 countries with 55,000+ employees.

Short descriptiontext

Smiths Interconnect designs and manufactures high-reliability electronic connectors, cable assemblies, RF/microwave components, optical transceivers, and semiconductor test sockets for aerospace, defense, medical, semiconductor test, space, rail, and industrial customers requiring mission-critical performance in extreme environments.

Operating statusenum
Acquired
Ownership categoryenum
Headcount rangeband
1,001–5,000
akta.pro rankint
HeadquartersThousand Oaks, United States
HQ citystring
Thousand Oaks
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices3 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
high-reliability connectors, semiconductor test sockets, RF microwave components, aerospace defense interconnect, medical cable assemblies
Industry4 codes
1Connectors & Interconnect Components (Industrial connectors, terminals, sockets, backplane)
CodeIMAGAJACPrimaryYes
2Sockets, IC Sockets & Test/Programming Interconnects
CodeHDAHAOAFPrimaryNo
3RF & Microwave Connectors and Coaxial Assemblies
CodeHDAHAOADPrimaryNo
4Test, Probe & Burn-In Equipment (Wafer Sort/Final Test)
CodeHDAHAEAJPrimaryNo
NAICS code4 codes
  • Electronic Connector Manufacturing334417
  • Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals334515
  • Semiconductor and Other Electronic Component Manufacturing33441
  • Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing334416
SIC code4 codes
  • Electronic Connectors3678
  • Instruments For Meas & Testing Of Electricity & Elec Signals3825
  • Electronic Components & Accessories3670
  • Electronic Components, Nec3679
Product category
Electronic Interconnect Components
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model4 records
1Connectors and Interconnects
TypeHardware Sales
Description

High-reliability electrical connectors for signal, power, high speed, fiber optic, filter and RF applications serving aerospace, defense, medical, industrial and semiconductor test markets

smithsinterconnect.com
2Cable Assemblies and Harnesses
TypeHardware Sales
Description

High performance microwave cable assemblies and coaxial components for harsh environments in aerospace, defense, medical and industrial applications

smithsinterconnect.com
3Semiconductor Test Products
TypeHardware Sales
Description

Spring probe based solutions including contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces for burn-in and final test applications

smithsinterconnect.com
4RF and Microwave Components
TypeHardware Sales
Description

Ferrite components including isolators, circulators, couplers, filters, and terminations for defense, space, avionics and industrial applications

smithsinterconnect.com
Marketing channels6 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels4 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Supply Chain, Personnel, Technology or R&D, Operations, Infrastructure, Marketing or Sales
Pricing details1 tier
1B2B enterprise pricing through quote requests
ModelOtherBilling cadenceMulti-year contract
Notes

No public pricing available; products sold through authorized distributors and direct sales representatives with quote-based pricing

smithsinterconnect.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 7 records shown
1EMC
Description

Technology brand for high quality solutions required for safety and durability

smithsinterconnect.com
+6 more records
Core offering1 text field

Smiths Interconnect designs and manufactures high-reliability electronic components, connectors, cable assemblies, optical transceivers, RF/microwave passive components, and semiconductor test sockets for mission-critical applications. The company serves aerospace, defense, medical, semiconductor test, space, rail, and industrial markets with technically differentiated products including hyperboloid contact technology, spring probes, EMI/EMP filters, diamond-based resistive components, and high-speed test solutions.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 4 values shown
  • Supports data rates up to 224 Gbps PAM4 for 6G communications
+3 more records
Product overview1 text field

Smiths Interconnect is a leading provider of high reliability connectivity products and solutions serving segments of aerospace and defense, medical, semiconductor test, and industrial markets. The company designs and manufactures technically differentiated electronic components, microwave, optical and radio frequency products and sub-systems that connect, protect and control critical applications. Its portfolio is organized around seven core product categories: Board Test Fixture Probes (spring contact probes for PCB testing), Cable Assemblies & Harnesses (microwave cable assemblies and medical cables), Connectors (backplane, circular, PCB, rectangular, and specialty connectors), Ferrite & Related Passive Components (isolators, circulators, couplers, filters), Frequency Defined Filters (RF filters from 100 KHz to 65 GHz), Optical Transceivers (embedded transceivers using Reflex Photonics technology), Resistive Board Level Components (diamond-based RF components), and Semiconductor Test (test sockets including the DaVinci series). The company also maintains technology brands including Hypertac (hyperboloid contacts), IDI (spring probes), Plastronics (H-Pin contacts), Reflex Photonics (optical transceivers), and RF Labs (microwave components). Smiths Interconnect operates global facilities across multiple countries and was acquired by Molex in April 2026.

Product and service9 records
1Board Test Fixture Probes
CategoryTest Probes
Description

Spring contact probes for testing bare boards, loaded printed circuit boards and surface mount assemblies, ranging from 0.02" (0.51 mm) to 0.187" (4.75 mm) pitch with multiple length, travel, ICT, lead free and rotator options.

2Cable Assemblies & Harnesses
Description

High performance microwave cable assemblies and coaxial components for critical operations including RF flexible cable assemblies, RF semi-rigid cable assemblies, and medical cable assemblies designed for harsh environments in aerospace, defense, automotive, and medical industries.

3Connectors
Description

High reliability electrical connectors including backplane connectors, circular connectors, EMI/EMP filter connectors, high frequency connectors, high power connectors, high speed connectors, hyperboloid contacts, PCB connectors, rectangular connectors, and spring probes for signal, power, high speed, fiber optic, filter and RF applications.

4Ferrite & Related Passive Components
Description

Passive microwave and RF components operating from ~0.2 to ~90GHz including isolators, circulators, couplers, transitions, loads/terminations supplied in waveguide, coaxial, stripline, microstrip and surface mount configurations for defence, space, avionics, and industrial applications.

5Frequency Defined Filters
Description

RF Filters, Multiplexers, Switched Filter Banks, and Integrated assemblies from 100 KHz to 65 GHz, including cavity filters, ceramic filters, discrete filters, and tunable filters for commercial and military applications.

6Optical Transceivers
Description

Embedded transceivers and transceiver modules using Reflex Photonics technology for high-reliability interconnects with high data rate communication, low SWaP (size, weight, and power), and radiation resistance for space, aerospace and defense applications.

7Resistive Board Level Components
Description

Diamond-based RF resistive components including resistors, terminations, and attenuators using thin film process for high-frequency applications with superior thermal performance, featuring Diamond Rf Resistives, Thermopad, fixed attenuators, and space-qualified components.

8Semiconductor Test
CategorySemiconductor Test Solutions
Description

Spring probe based test solutions including contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces for burn-in testing and production test applications, featuring the DaVinci high-speed test socket series supporting speeds up to 224 Gbps.

9DaVinci Gen V High-Speed Test Socket
CategorySemiconductor Test Sockets
Description

Next-generation test socket supporting speeds up to 224 Gbps PAM4 and beyond 100 GHz for 6G communications, designed for AI, data center, automotive, and IoT semiconductor applications; high-power burn-in variant manages up to 2000W with integrated liquid cooling for semiconductor devices with up to 22,000 contacts.

Scale indicator4 records

Each record includes

Type, Value, Description, Source

Partnership3 partners
Strategic tierCoreTypeChannel Partner/ Reseller/ DistributorAnnounced on2026-07-22
Description

FDH Electronics, an FDH Aero division serving the mil-aero market, has been named the 2025 Distributor of the Year by Smiths Interconnect for the second consecutive year. The award recognizes FDH Electronics for outstanding sales growth, strong partnership, and exceptional service delivery to Smiths Interconnect customers throughout the Americas.

Strategic tierFlagshipTypeStrategic or Co-development PartnerAnnounced on2026-04-01
Description

Molex, a global electronics connectivity innovator headquartered in Lisle, Illinois, completed the acquisition of Smiths Interconnect from UK-based Smiths Group plc on April 1, 2026, marking the largest acquisition in Molex's history. The deal integrates Smiths Interconnect's portfolio into Molex's offering, strengthening position in high-reliability interconnect markets including aerospace, defense, medical and semiconductor test industries. The combined entity now operates over 90 plants across 22 countries with more than 55,000 employees.

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2026-03-20
Description

Smiths Interconnect, a Molex company, was awarded an additional £340K in funding from the UK Government's UK Space Agency, enhancing its commitment to space technology advancements.

Recent move9 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

Molex is Smiths Interconnect's parent company following the April 2026 acquisition. As a global electronics connectivity innovator headquartered in Lisle, Illinois, Molex offers a broad portfolio of connectors and interconnect solutions across commercial, automotive, and industrial markets, with significant overlap in connector categories.

TypeBroad incumbent
Description

TE Connectivity is a global leader in connectivity and sensor solutions serving aerospace, defense, medical, and industrial markets. It offers ruggedized connectors, relays, and cable assemblies that directly overlap with Smiths Interconnect's high-reliability product portfolio, including mil-aero and medical segments.

TypeBroad incumbent
Description

Amphenol is one of the largest interconnect manufacturers globally with a broad product range spanning military, aerospace, automotive, and industrial markets. Its high-reliability connector divisions (Amphenol Aerospace, Amphenol Military) directly compete with Smiths Interconnect in mil-aero, defense, and harsh-environment applications.

TypeDirect peer
Description

ITT Inc. designs and manufactures highly engineered components including connectors and motion technologies for aerospace, defense, industrial, and medical markets. Its Cannon brand produces ruggedized connectors that compete head-to-head with Smiths Interconnect's mil-aero and high-reliability connector lines.

TypeDirect peer
Description

Glenair is a privately held specialist manufacturer of military-spec and commercial interconnect products including circular connectors, cable assemblies, and harsh-environment contacts. Glenair is a direct competitor in mil-aero and ruggedized interconnect markets served by Smiths Interconnect.

TypeDirect peer
Description

Radiall is a French-headquartered specialist in RF and microwave interconnect solutions, including coaxial connectors, cable assemblies, and optical transceivers for aerospace, defense, telecom, and industrial markets. Radiall's product portfolio closely aligns with Smiths Interconnect's RF Labs, Reflex Photonics, and SpaceNXT lines.

TypeDirect peer
Description

Harwin manufactures high-reliability connectors, board-to-board interconnects, and EMI/RFI shielding for aerospace, defense, and industrial markets. Its specialty connector lines, particularly in high-pin-count and harsh-environment categories, overlap with Smiths Interconnect's high-reliability connectors and hyperboloid contact technologies.

TypeDirect peer
Description

Yamaichi Electronics is a specialist manufacturer of high-reliability test sockets, burn-in sockets, and IC sockets for semiconductor test applications. It directly competes with Smiths Interconnect's DaVinci series in the semiconductor test socket market, particularly for high-speed memory and logic devices.

TypeDirect peer
Description

Cinch Connectivity Solutions, a Bel Fuse company, manufactures ruggedized connectors, cable assemblies, and custom interconnect solutions for aerospace, defense, and harsh-environment industrial applications. It competes with Smiths Interconnect in mil-aero and rail signal/connectivity markets.

TypeDirect peer
Description

Positronic manufactures high-reliability rectangular and circular connectors for aerospace, defense, medical, and industrial markets. Its specialty power and signal connectors compete with Smiths Interconnect's hyperboloid contact-based D-sub and rectangular connector lines in mission-critical applications.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks5 records

Each record includes

Headline, Details, Source

Key highlights6 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers1 record

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment7 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile4 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature8 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance2 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A2 records

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Smiths Interconnect

Electronic Interconnect Componentssmithsinterconnect.com

Smiths Interconnect designs and manufactures high-reliability electronic connectors, cable assemblies, RF/microwave components, optical transceivers, and semiconductor test sockets for aerospace, defense, medical, semiconductor test, space, rail, and industrial customers requiring mission-critical performance in extreme environments.

What Smiths Interconnect does

Smiths Interconnect is a global designer and manufacturer of high-reliability electronic interconnect, microwave, optical, and radio frequency components serving mission-critical applications in aerospace, defense, medical, semiconductor test, space, rail, and industrial markets. Its product portfolio spans seven core categories — connectors (including proprietary Hypertac hyperboloid, H-Pin spring probe, and high-speed copper contact technologies), cable assemblies and harnesses, semiconductor test solutions (headlined by the DaVinci Gen V test socket supporting 224 Gbps PAM4), ferrite and passive RF components operating to ~90 GHz, frequency-defined filters, embedded optical transceivers based on Reflex Photonics technology, and diamond-based resistive components — engineered for extreme environment performance including radiation resistance, high mating cycles up to 100,000, and operation across demanding thermal and mechanical ranges. The company holds ISO 13485:2016 medical certification with FDA registration, NASA/ESA space qualification compliance, and SNCF rail standards compliance, which collectively anchor design-in positions across regulated end markets.

The business operates a B2B enterprise model with quote-based pricing through direct field sales, technical application engineers, and a global authorized distributor network spanning the Americas, EMEA, and Asia. Thomas Mino serves as CEO, and the company maintains 21 sales, R&D, and manufacturing facilities across 12 countries. Smiths Interconnect was originally part of UK-listed Smiths Group plc, was divested in 2025 under pressure from activist investor Engine Capital, and was acquired by Molex (a Koch Inc. company) on April 1, 2026 for £1.3 billion at 15.1x headline EBITDA — the largest acquisition in Molex's history — combining Smiths Interconnect with Molex's existing electronics portfolio to form an entity operating over 90 plants across 22 countries with 55,000+ employees.

Smiths Interconnect firmographics

Firmographics
Name
Smiths Interconnect
Legal name
Smiths Interconnect
Website
https://smithsinterconnect.com
Company type
Private
Founded year
2007
Operating status
Acquired
Headcount range
1,001–5,000 employees
Short description
Smiths Interconnect designs and manufactures high-reliability electronic connectors, cable assemblies, RF/microwave components, optical transceivers, and semiconductor test sockets for aerospace, defense, medical, semiconductor test, space, rail, and industrial customers requiring mission-critical performance in extreme environments.
Ownership category
akta.pro rank

Smiths Interconnect industry classification

Industry
Product category
Electronic Interconnect Components
NAICS
Electronic Connector Manufacturing (334417), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Semiconductor and Other Electronic Component Manufacturing (33441), Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing (334416)
SIC
Electronic Connectors (3678), Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Electronic Components & Accessories (3670), Electronic Components, Nec (3679)
akta.pro primary industry
Connectors & Interconnect Components (Industrial connectors, terminals, sockets, backplane) (IMAGAJAC)
akta.pro secondary industries
Sockets, IC Sockets & Test/Programming Interconnects (HDAHAOAF), RF & Microwave Connectors and Coaxial Assemblies (HDAHAOAD), Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

Keywords

  • High-reliability connectors
  • Semiconductor test sockets
  • RF microwave components
  • Aerospace defense interconnect
  • Medical cable assemblies

Where Smiths Interconnect is headquartered

Location

Headquarters

HQ city
Thousand Oaks
HQ country
United States
HQ region
North America

Offices3 records

Markets served

Smiths Interconnect business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Personnel, Technology or R&D, Operations, Infrastructure, Marketing or Sales

Revenue model

  1. Connectors and Interconnects: High-reliability electrical connectors for signal, power, high speed, fiber optic, filter and RF applications serving aerospace, defense, medical, industrial and semiconductor test markets
  2. Cable Assemblies and Harnesses: High performance microwave cable assemblies and coaxial components for harsh environments in aerospace, defense, medical and industrial applications
  3. Semiconductor Test Products: Spring probe based solutions including contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces for burn-in and final test applications
  4. RF and Microwave Components: Ferrite components including isolators, circulators, couplers, filters, and terminations for defense, space, avionics and industrial applications

Pricing tiers

ModelBillingPrice
OtherMulti-year contractB2B enterprise pricing through quote requests

Go-to-market motion1 record

Distribution channels4 records

Marketing channels6 records

Smiths Interconnect product offering

Product offering

Core offering

Smiths Interconnect designs and manufactures high-reliability electronic components, connectors, cable assemblies, optical transceivers, RF/microwave passive components, and semiconductor test sockets for mission-critical applications. The company serves aerospace, defense, medical, semiconductor test, space, rail, and industrial markets with technically differentiated products including hyperboloid contact technology, spring probes, EMI/EMP filters, diamond-based resistive components, and high-speed test solutions.

Product overview

Smiths Interconnect is a leading provider of high reliability connectivity products and solutions serving segments of aerospace and defense, medical, semiconductor test, and industrial markets. The company designs and manufactures technically differentiated electronic components, microwave, optical and radio frequency products and sub-systems that connect, protect and control critical applications. Its portfolio is organized around seven core product categories: Board Test Fixture Probes (spring contact probes for PCB testing), Cable Assemblies & Harnesses (microwave cable assemblies and medical cables), Connectors (backplane, circular, PCB, rectangular, and specialty connectors), Ferrite & Related Passive Components (isolators, circulators, couplers, filters), Frequency Defined Filters (RF filters from 100 KHz to 65 GHz), Optical Transceivers (embedded transceivers using Reflex Photonics technology), Resistive Board Level Components (diamond-based RF components), and Semiconductor Test (test sockets including the DaVinci series). The company also maintains technology brands including Hypertac (hyperboloid contacts), IDI (spring probes), Plastronics (H-Pin contacts), Reflex Photonics (optical transceivers), and RF Labs (microwave components). Smiths Interconnect operates global facilities across multiple countries and was acquired by Molex in April 2026.

Differentiator

Problem solved

Functional benefit

Brands

  • EMC: Technology brand for high quality solutions required for safety and durability
  • Hypertac
  • IDI
  • Lorch
  • Plastronics
  • Reflex Photonics
  • RF Labs

Products and services

  • Board Test Fixture Probes Spring contact probes for testing bare boards, loaded printed circuit boards and surface mount assemblies, ranging from 0.02" (0.51 mm) to 0.187" (4.75 mm) pitch with multiple length, travel, ICT, lead free and rotator options.
  • Cable Assemblies & Harnesses High performance microwave cable assemblies and coaxial components for critical operations including RF flexible cable assemblies, RF semi-rigid cable assemblies, and medical cable assemblies designed for harsh environments in aerospace, defense, automotive, and medical industries.
  • Connectors High reliability electrical connectors including backplane connectors, circular connectors, EMI/EMP filter connectors, high frequency connectors, high power connectors, high speed connectors, hyperboloid contacts, PCB connectors, rectangular connectors, and spring probes for signal, power, high speed, fiber optic, filter and RF applications.
  • Ferrite & Related Passive Components Passive microwave and RF components operating from ~0.2 to ~90GHz including isolators, circulators, couplers, transitions, loads/terminations supplied in waveguide, coaxial, stripline, microstrip and surface mount configurations for defence, space, avionics, and industrial applications.
  • Frequency Defined Filters RF Filters, Multiplexers, Switched Filter Banks, and Integrated assemblies from 100 KHz to 65 GHz, including cavity filters, ceramic filters, discrete filters, and tunable filters for commercial and military applications.
  • Optical Transceivers Embedded transceivers and transceiver modules using Reflex Photonics technology for high-reliability interconnects with high data rate communication, low SWaP (size, weight, and power), and radiation resistance for space, aerospace and defense applications.
  • Resistive Board Level Components Diamond-based RF resistive components including resistors, terminations, and attenuators using thin film process for high-frequency applications with superior thermal performance, featuring Diamond Rf Resistives, Thermopad, fixed attenuators, and space-qualified components.
  • Semiconductor Test Spring probe based test solutions including contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces for burn-in testing and production test applications, featuring the DaVinci high-speed test socket series supporting speeds up to 224 Gbps.
  • DaVinci Gen V High-Speed Test Socket Next-generation test socket supporting speeds up to 224 Gbps PAM4 and beyond 100 GHz for 6G communications, designed for AI, data center, automotive, and IoT semiconductor applications; high-power burn-in variant manages up to 2000W with integrated liquid cooling for semiconductor devices with up to 22,000 contacts.

Quantifiable outcome

  • Supports data rates up to 224 Gbps PAM4 for 6G communications
  • +3 more outcomes

Companies that use Smiths Interconnect

Customer profile

Named customers1 record

Segments7 records

Ideal customer profiles4 records

Smiths Interconnect technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature8 records

Smiths Interconnect partnerships and signals

Strategic signal

Partnerships

Three partnerships are on record, tiered core and flagship.

  • FDH Electronics (FDH Aero)coreChannel Partner/ Reseller/ Distributor · 22 July 2026FDH Electronics, an FDH Aero division serving the mil-aero market, has been named the 2025 Distributor of the Year by Smiths Interconnect for the second consecutive year. The award recognizes FDH Electronics for outstanding sales growth, strong partnership, and exceptional service delivery to Smiths Interconnect customers throughout the Americas.
  • Molex (Koch Inc.)flagshipStrategic or Co-development Partner · 1 April 2026Molex, a global electronics connectivity innovator headquartered in Lisle, Illinois, completed the acquisition of Smiths Interconnect from UK-based Smiths Group plc on April 1, 2026, marking the largest acquisition in Molex's history. The deal integrates Smiths Interconnect's portfolio into Molex's offering, strengthening position in high-reliability interconnect markets including aerospace, defense, medical and semiconductor test industries. The combined entity now operates over 90 plants across 22 countries with more than 55,000 employees.
  • UK Space AgencycoreStrategic or Co-development Partner · 20 March 2026Smiths Interconnect, a Molex company, was awarded an additional £340K in funding from the UK Government's UK Space Agency, enhancing its commitment to space technology advancements.

Scale indicators4 records

Recent moves9 records

Expansion highlights6 records

Smiths Interconnect competitors and assessment

Company assessment

Broad incumbents

  • Molex: Molex is Smiths Interconnect's parent company following the April 2026 acquisition. As a global electronics connectivity innovator headquartered in Lisle, Illinois, Molex offers a broad portfolio of connectors and interconnect solutions across commercial, automotive, and industrial markets, with significant overlap in connector categories.
  • TE Connectivity: TE Connectivity is a global leader in connectivity and sensor solutions serving aerospace, defense, medical, and industrial markets. It offers ruggedized connectors, relays, and cable assemblies that directly overlap with Smiths Interconnect's high-reliability product portfolio, including mil-aero and medical segments.
  • Amphenol: Amphenol is one of the largest interconnect manufacturers globally with a broad product range spanning military, aerospace, automotive, and industrial markets. Its high-reliability connector divisions (Amphenol Aerospace, Amphenol Military) directly compete with Smiths Interconnect in mil-aero, defense, and harsh-environment applications.

Direct peers

  • ITT Inc. ITT Inc. designs and manufactures highly engineered components including connectors and motion technologies for aerospace, defense, industrial, and medical markets. Its Cannon brand produces ruggedized connectors that compete head-to-head with Smiths Interconnect's mil-aero and high-reliability connector lines.
  • Glenair: Glenair is a privately held specialist manufacturer of military-spec and commercial interconnect products including circular connectors, cable assemblies, and harsh-environment contacts. Glenair is a direct competitor in mil-aero and ruggedized interconnect markets served by Smiths Interconnect.
  • Radiall: Radiall is a French-headquartered specialist in RF and microwave interconnect solutions, including coaxial connectors, cable assemblies, and optical transceivers for aerospace, defense, telecom, and industrial markets. Radiall's product portfolio closely aligns with Smiths Interconnect's RF Labs, Reflex Photonics, and SpaceNXT lines.
  • Harwin: Harwin manufactures high-reliability connectors, board-to-board interconnects, and EMI/RFI shielding for aerospace, defense, and industrial markets. Its specialty connector lines, particularly in high-pin-count and harsh-environment categories, overlap with Smiths Interconnect's high-reliability connectors and hyperboloid contact technologies.
  • Yamaichi Electronics: Yamaichi Electronics is a specialist manufacturer of high-reliability test sockets, burn-in sockets, and IC sockets for semiconductor test applications. It directly competes with Smiths Interconnect's DaVinci series in the semiconductor test socket market, particularly for high-speed memory and logic devices.
  • Cinch Connectivity Solutions (Bel Fuse): Cinch Connectivity Solutions, a Bel Fuse company, manufactures ruggedized connectors, cable assemblies, and custom interconnect solutions for aerospace, defense, and harsh-environment industrial applications. It competes with Smiths Interconnect in mil-aero and rail signal/connectivity markets.
  • Positronic: Positronic manufactures high-reliability rectangular and circular connectors for aerospace, defense, medical, and industrial markets. Its specialty power and signal connectors compete with Smiths Interconnect's hyperboloid contact-based D-sub and rectangular connector lines in mission-critical applications.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

Smiths Interconnect social profiles

Digital presence

Smiths Interconnect compliance and trust

Trust signal

Compliance2 records

Smiths Interconnect financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Smiths Interconnect leadership team

Management profile

Number of profiles

Profiles1 record

Smiths Interconnect funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Smiths Interconnect M&A and investment

M&A and investment

M&A2 records

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Smiths Interconnect

What does Smiths Interconnect do?

Smiths Interconnect designs and manufactures high-reliability electronic components, connectors, cable assemblies, optical transceivers, RF/microwave passive components, and semiconductor test sockets for mission-critical applications. The company serves aerospace, defense, medical, semiconductor test, space, rail, and industrial markets with technically differentiated products including hyperboloid contact technology, spring probes, EMI/EMP filters, diamond-based resistive components, and high-speed test solutions.

Is Smiths Interconnect a public or private company?

Smiths Interconnect is a private company. It is classified as corporate owned and is currently acquired.

When was Smiths Interconnect founded?

Smiths Interconnect was founded in 2007. It employs 1,001 to 5,000 people.

Where is Smiths Interconnect based?

Smiths Interconnect is headquartered in Thousand Oaks, United States, in the North America region.

How does Smiths Interconnect make money?

Four revenue lines are on record. Connectors and Interconnects are the primary driver. The others are cable Assemblies and Harnesses, semiconductor Test Products and RF and Microwave Components.

Who are Smiths Interconnect's main competitors?

Broad incumbents on record are Molex, TE Connectivity and Amphenol. Direct peers are ITT Inc., Glenair, Radiall, Harwin, Yamaichi Electronics, Cinch Connectivity Solutions (Bel Fuse) and Positronic.

Does Smiths Interconnect have an API?

No public API is recorded for Smiths Interconnect.

What industry is Smiths Interconnect in?

Smiths Interconnect's product category is Electronic Interconnect Components. Its primary akta.pro industry code is IMAGAJAC, Connectors & Interconnect Components (Industrial connectors, terminals, sockets, backplane), with a secondary code of HDAHAOAF, Sockets, IC Sockets & Test/Programming Interconnects. Its NAICS code is 334417 and its SIC code is 3678.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales
Live signals
YahooSmiths Group H2 Earnings Call HighlightsSmiths Group reported fiscal 2026 organic revenue growth of 1.2% to £1.9 billion and operating margin expansion to 20.6%. The company sold Smiths Interconnect and Detection for £3.3 billion, acquired DRC Heat Transfer for £165 million, and plans £1.5 billion in share repurchases. Fiscal 2027 guidance expects about 4% organic revenue growth and a 21% operating margin.LinkedInA detailed analysis of the size of the RF Tunable Filter market and the projected 9.1% CAGR growth from 2026 to 2033BioClinical Metrics released a market analysis projecting that the global RF Tunable Filter market will grow at a 9.1% CAGR from 2026 to 2033, driven by 5G adoption and IoT expansion. The report identifies key industry players including Analog Devices, Dover Corporation, and Smiths Interconnect as major contributors to this growth through innovation and strategic partnerships.GlobeNewswireFDH Electronics Named 2025 Distributor of the Year by Smiths Interconnect, a Molex CompanyFDH Electronics, an FDH Aero division serving the mil-aero market, has been named the 2025 Distributor of the Year by Smiths Interconnect, a Molex company, marking the second consecutive year it has received this recognition. The award recognizes FDH Electronics for outstanding sales growth, strong partnership, and exceptional service delivery to Smiths Interconnect customers throughout the Americas. Smiths Interconnect designs and manufactures high-reliability connectivity products serving aerospace, defense, medical, semiconductor test, and industrial markets.Business InsiderFDH Electronics Named 2025 Distributor of the Year by Smiths Interconnect, a Molex CompanyFDH Electronics, an FDH Aero division serving the mil-aero market, has been named the 2025 Distributor of the Year by Smiths Interconnect, a Molex company, marking the second consecutive year it has received this recognition. The award specifically recognizes FDH Electronics for outstanding performance, strong partnership, and exceptional service delivery to Smiths Interconnect customers throughout the Americas, as well as impressive sales growth achieved over the past year. Smiths Interconnect designs and manufactures technically differentiated electronic components and connectivity products serving aerospace, defense, medical, semiconductor test, and industrial markets.Pulse 2.0Molex: Acquisition Of Smiths Interconnect Expands High-Reliability Connectivity PortfolioMolex has completed its acquisition of Smiths Interconnect, marking the largest acquisition in the company's history and significantly expanding its capabilities in high-reliability connectivity solutions across aerospace and defense, medical, industrial, and semiconductor test markets. The transaction adds complementary technologies including ruggedized custom connectors, RF components, optical transceivers, and semiconductor test solutions, while extending Molex's global footprint to over 90 manufacturing plants across 22 countries with more than 55,000 employees. The combined organization aims to capitalize on growing demand driven by AI infrastructure and next-generation computing, building on Molex's prior 2024 purchase of AirBorn to deepen its presence in aerospace and defense sectors.PR NewswireMolex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity SolutionsMolex has completed its acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group plc, marking the largest acquisition in Molex's history. The deal integrates Smiths Interconnect's portfolio of ruggedized connectors, RF components, optical transceivers and semiconductor test capabilities into Molex's offering, strengthening its position in high-reliability interconnect markets including aerospace, defence, medical and semiconductor test industries. The combined entity now operates over 90 plants across 22 countries with more than 55,000 employees.Smiths GroupCompletion of Smiths Interconnect saleSmiths Group plc has completed the sale of its subsidiary Smiths Interconnect to Molex Electronic Technologies Holdings, LLC, a Koch company, for approximately £1.3 billion in cash proceeds. Smiths intends to return £1 billion of these proceeds to shareholders via a share buyback programme and use the remainder to invest in growth opportunities and reinforce its balance sheet.MolexMolex Completes Acquisition of Smiths InterconnectMolex, a global electronics leader headquartered in Lisle, Illinois, has completed the acquisition of Smiths Interconnect from UK-based Smiths Group plc on April 1, 2026, marking the largest acquisition in Molex's history. The deal adds Smiths Interconnect's capabilities in ruggedized custom connectors, semiconductor test, and medical interconnect solutions while expanding Molex's global footprint to over 90 plants across 22 countries with more than 55,000 employees. The combined entity is positioned to strengthen Molex's presence in high-reliability interconnect markets spanning aerospace and defense, medical, industrial, and semiconductor test industries.DIGITIMES AsiaSmiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026Smiths Interconnect, a global leader in semiconductor test sockets, announced its participation in DesignCon 2026 at the Santa Clara Convention Center from February 24-26, 2026, where it will showcase its next-generation test solutions for AI, data center, automotive, and IoT applications. The company will feature the DaVinci Gen V High-Speed Test Socket, supporting speeds up to 224 Gbps PAM4 and beyond 100 GHz for 6G communications, along with a high-power burn-in socket capable of managing up to 2000 W with integrated liquid cooling for next-generation semiconductor devices with up to 22,000 contacts.FortunebusinessinsightsRF Interconnect Market Size, ShareThe global RF interconnect market was valued at USD 33.99 billion in 2024 and is projected to reach USD 59.20 billion by 2032, growing at a CAGR of 7.2%, driven by 5G network expansion, IoT adoption, and increased demand for high-speed data transmission across communications, aerospace, defense, and automotive sectors. North America led the market with a 47.98% share in 2024, while Asia Pacific is emerging as a key growth region. Key industry developments include Molex signing an agreement to acquire Smiths Interconnect in October 2025, alongside product launches and partnerships from HUBER+SUHNER, PEI-Genesis, and Teledyne Storm Microwave.