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SEMES

Full company profile

uuid000a32u

Namestring
SEMES
Legal namestring
세메스(주)
Websiteurl
semes.com
Company typeenum
Private
Founded yearint
1993
Descriptiontext

SEMES is a South Korea-headquartered semiconductor equipment manufacturer founded in 1993 and based in Cheonan, operating as a private company with 1,001–5,000 employees. The company designs and produces proprietary front-end and back-end wafer processing equipment organized around five core process modules: CLEAN (wafer surface cleaning), PHOTO (photolithography), ETCH (pattern formation), TEST (electrical/functional testing), and PACKAGE (chip separation and packaging). Beyond its semiconductor portfolio, SEMES manufactures display manufacturing equipment and line automation systems for fab logistics. Its differentiated technology includes the MPGA Prober, a high-precision HBM chip inspection device achieving sub-5-micrometer alignment accuracy and throughput exceeding three times the industry average.

The company monetizes through direct B2B sales of capital equipment to global semiconductor manufacturers, supported by its SCSS (SEMES Customer Service System) aftermarket platform covering parts supply, equipment modification, and customer training. Pricing is not publicly disclosed, consistent with enterprise contract norms in the semicap industry. SEMES is identified as a key player in the global Coater and Developer for Wafer Processing market, valued at $2,863M in 2025 and projected to reach $4,479M by 2032 (6.7% CAGR), with Asia-Pacific representing approximately 68% of regional demand. The company is expanding R&D capacity through a new large-scale Dongtan research base and pursuing overseas market presence through initiatives such as SEMICON China 2026 participation.

Recent strategic activity in 2026 — including a 5,000-unit cumulative prober shipment milestone, the MPGA Prober HBM inspection launch, the Dongtan R&D expansion, and the SEMES AI Forum 2026 — signals an offensive push to broaden product depth (especially in HBM-related test equipment) and globalize the customer base. Governance and ownership information is limited: CEO 심상필 (Shim Sang-pil) is the only named executive, no parent company or institutional investor is disclosed, and certifications are limited to ISO 14001 (environmental) and ISO 45001 (occupational health and safety).

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
1,001–5,000
akta.pro rankint
HeadquartersCheonan, South Korea
HQ citystring
Cheonan
HQ countrystring
South Korea
HQ regionstring
Asia
Markets served

Serves global market

Offices1 record

Each record includes

City, Country, Type, Description, Source

Keyword5 values
semiconductor manufacturing equipment, wafer processing equipment, photolithography equipment, HBM chip inspection, display manufacturing equipment
Industry3 codes
1Test, Probe & Burn-In Equipment (Wafer Sort/Final Test)
CodeHDAHAEAJPrimaryYes
2Etch & Strip Equipment (Dry/Wet/Ashing)
CodeHDAHAEACPrimaryNo
3Wafer Cleaning & Surface Preparation Equipment
CodeHDAHAEAGPrimaryNo
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Special Industry Machinery (No Metalworking Machinery)3550
Product category
Semiconductor Manufacturing Equipment
Social media profiles1 record
Marketing channels3 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Supply Chain, Technology or R&D, Personnel, Operations, Infrastructure
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 2 records shown
1SCSS
Description

SEMES Customer Service System - customer service portal for product support, parts, and modification services.

semes.com
+1 more record
Core offering1 text field

SEMES manufactures semiconductor manufacturing equipment for front-end and back-end wafer processing, including cleaning (CLEAN), photolithography (PHOTO), etching (ETCH), testing (TEST), and packaging (PACKAGE) equipment. The company also produces display manufacturing equipment and line automation solutions for semiconductor and display fabrication facilities.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 2 values shown
  • Throughput over three times the industry average for HBM chip inspection
+1 more record
Product overview1 text field

SEMES is a semiconductor equipment manufacturer offering a comprehensive portfolio of manufacturing equipment for the semiconductor industry. The main product lines include Semiconductor Equipment (covering front-end processes: CLEAN for wafer surface cleaning, PHOTO for photolithography, ETCH for pattern formation, TEST for electrical testing, and PACKAGE for back-end chip separation and packaging), Display Equipment, and Line Automation systems. SEMES is identified as a key player in the global coater and developer for wafer processing market. The company also developed the MPGA Prober for high-precision HBM chip inspection.

Product and service9 records
1Semiconductor Equipment
CategorySemiconductor Manufacturing Equipment
Description

Core semiconductor manufacturing equipment portfolio for front-end and back-end wafer processing, used by semiconductor manufacturers in fab production lines.

2CLEAN Equipment (Cleaning Equipment)
CategorySemiconductor Manufacturing Equipment
Description

Wafer surface cleaning equipment that removes particles, metals, organic materials, and native oxide films using chemical treatment, gases, and physical methods to improve yield and reliability. Used by semiconductor manufacturers.

3PHOTO Equipment (Photolithography/Phototrack Equipment)
CategorySemiconductor Manufacturing Equipment
Description

Photolithography equipment that transfers fine circuit patterns from masks onto wafer surfaces using light exposure, requiring precise, high-level technology. Used by semiconductor manufacturers.

4ETCH Equipment (Etching Equipment)
CategorySemiconductor Manufacturing Equipment
Description

Etching equipment that forms semiconductor circuit patterns by corroding and removing exposed material with liquid or gas etchants, leaving patterns defined by the photolithography step. Used by semiconductor manufacturers.

5TEST Equipment (Semiconductor Testing Equipment)
CategorySemiconductor Manufacturing Equipment
Description

Test equipment that inspects finished semiconductor devices by applying various voltages, electrical signals, temperature, and humidity conditions to measure electrical characteristics, functional characteristics, and operating speed. Used by semiconductor manufacturers.

6PACKAGE Equipment (Back-end Packaging Equipment)
CategorySemiconductor Manufacturing Equipment
Description

Back-end packaging equipment that separates wafer-level chips into individual units, connects cut chips to substrates, and performs package molding to protect chips from external environments. Used by semiconductor manufacturers.

7Display Equipment
CategoryDisplay Manufacturing Equipment
Description

Display manufacturing equipment for processing flat panel displays, used by display manufacturers in fab production lines.

8Line Automation
CategoryFactory Automation Equipment
Description

Factory automation equipment for logistics and material handling in semiconductor and display manufacturing facilities. Used by semiconductor and display manufacturers.

9MPGA Prober (HBM Chip Inspection Device)
CategorySemiconductor Inspection Equipment
Description

High-precision physical contact inspection device (MPGA Prober) for HBM chip quality inspection with sub-5-micrometer alignment accuracy and throughput exceeding three times the industry average. Used by HBM memory manufacturers.

Scale indicator5 records

Each record includes

Type, Value, Description, Source

Recent move5 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight4 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Japanese semiconductor equipment maker and the dominant global supplier of coater/developer (track) systems. Directly competes with SEMES' Photo and adjacent Clean/Etch/Test equipment, with comparable fab-wide portfolio breadth.

TypeDirect peer
Description

Japanese equipment maker and global leader in semiconductor wafer cleaning equipment. Directly comparable to SEMES' Clean product line and shares exposure to memory/fab customers in Asia-Pacific.

TypeBroad incumbent
Description

US-based incumbent and global leader in etch and deposition semiconductor equipment. Overlaps directly with SEMES' Etch portfolio and competes for the same memory and logic fab capex dollars.

TypeBroad incumbent
Description

Largest global semiconductor equipment maker with broad portfolio across deposition, etch, inspection, and CMP. Competes with SEMES across multiple process steps and represents the broad-incumbent benchmark for portfolio scale.

TypeBroad incumbent
Description

Dominant supplier of photolithography systems. While SEMES' Photo (track/coater) equipment complements ASML scanners, both compete for advanced-node fab qualification and capex allocation.

TypeDirect peer
Description

Global leader in semiconductor inspection and metrology. KLA is the most direct competitor to SEMES' MPGA Prober for HBM chip inspection and a benchmark for the inspection-tool segment SEMES is targeting.

TypeDirect peer
Description

Japanese equipment maker with exposure to semiconductor metrology, inspection, and processing tools. Comparable to SEMES across test/inspection and selected process steps, with similar memory-customer exposure.

TypeEmerging player
Description

China-based single-wafer wet cleaning equipment specialist with growing global footprint. Closest emerging competitor to SEMES' Clean product line, particularly in Asia-Pacific memory and Chinese fabs.

TypeEmerging player
Description

Chinese semiconductor equipment maker with broad portfolio across etch, thermal, and cleaning. Comparable in portfolio breadth to SEMES and a key emerging competitor for non-leading-edge equipment in Asia.

TypeRegional player
Description

Korean semiconductor equipment maker focused on die-bonding and advanced packaging/test tools. Regional peer serving the same Korean memory customer base as SEMES, with overlap in back-end test and packaging equipment.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat4 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Segment1 record

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile1 record

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI capability1 record

Each record includes

Type, Description, Source

AI maturity
App detail

Has app

Feature1 record

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance2 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

SEMES

Semiconductor Manufacturing Equipmentsemes.com

What SEMES does

SEMES is a South Korea-headquartered semiconductor equipment manufacturer founded in 1993 and based in Cheonan, operating as a private company with 1,001–5,000 employees. The company designs and produces proprietary front-end and back-end wafer processing equipment organized around five core process modules: CLEAN (wafer surface cleaning), PHOTO (photolithography), ETCH (pattern formation), TEST (electrical/functional testing), and PACKAGE (chip separation and packaging). Beyond its semiconductor portfolio, SEMES manufactures display manufacturing equipment and line automation systems for fab logistics. Its differentiated technology includes the MPGA Prober, a high-precision HBM chip inspection device achieving sub-5-micrometer alignment accuracy and throughput exceeding three times the industry average.

The company monetizes through direct B2B sales of capital equipment to global semiconductor manufacturers, supported by its SCSS (SEMES Customer Service System) aftermarket platform covering parts supply, equipment modification, and customer training. Pricing is not publicly disclosed, consistent with enterprise contract norms in the semicap industry. SEMES is identified as a key player in the global Coater and Developer for Wafer Processing market, valued at $2,863M in 2025 and projected to reach $4,479M by 2032 (6.7% CAGR), with Asia-Pacific representing approximately 68% of regional demand. The company is expanding R&D capacity through a new large-scale Dongtan research base and pursuing overseas market presence through initiatives such as SEMICON China 2026 participation.

Recent strategic activity in 2026 — including a 5,000-unit cumulative prober shipment milestone, the MPGA Prober HBM inspection launch, the Dongtan R&D expansion, and the SEMES AI Forum 2026 — signals an offensive push to broaden product depth (especially in HBM-related test equipment) and globalize the customer base. Governance and ownership information is limited: CEO 심상필 (Shim Sang-pil) is the only named executive, no parent company or institutional investor is disclosed, and certifications are limited to ISO 14001 (environmental) and ISO 45001 (occupational health and safety).

SEMES firmographics

Firmographics
Name
SEMES
Legal name
세메스(주)
Website
https://semes.com
Company type
Private
Founded year
1993
Operating status
Operating
Headcount range
1,001–5,000 employees
Ownership category
akta.pro rank

SEMES industry classification

Industry
Product category
Semiconductor Manufacturing Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Special Industry Machinery (No Metalworking Machinery) (3550)
akta.pro primary industry
Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)
akta.pro secondary industries
Etch & Strip Equipment (Dry/Wet/Ashing) (HDAHAEAC), Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

Keywords

  • Semiconductor manufacturing equipment
  • Wafer processing equipment
  • Photolithography equipment
  • HBM chip inspection
  • Display manufacturing equipment

Where SEMES is headquartered

Location

Headquarters

HQ city
Cheonan
HQ country
South Korea
HQ region
Asia

Offices1 record

Markets served

SEMES business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Technology or R&D, Personnel, Operations, Infrastructure

Distribution channels1 record

Marketing channels3 records

SEMES product offering

Product offering

Core offering

SEMES manufactures semiconductor manufacturing equipment for front-end and back-end wafer processing, including cleaning (CLEAN), photolithography (PHOTO), etching (ETCH), testing (TEST), and packaging (PACKAGE) equipment. The company also produces display manufacturing equipment and line automation solutions for semiconductor and display fabrication facilities.

Product overview

SEMES is a semiconductor equipment manufacturer offering a comprehensive portfolio of manufacturing equipment for the semiconductor industry. The main product lines include Semiconductor Equipment (covering front-end processes: CLEAN for wafer surface cleaning, PHOTO for photolithography, ETCH for pattern formation, TEST for electrical testing, and PACKAGE for back-end chip separation and packaging), Display Equipment, and Line Automation systems. SEMES is identified as a key player in the global coater and developer for wafer processing market. The company also developed the MPGA Prober for high-precision HBM chip inspection.

Differentiator

Problem solved

Functional benefit

Brands

  • SCSS: SEMES Customer Service System - customer service portal for product support, parts, and modification services.
  • 참사랑봉사단

Products and services

  • Semiconductor Equipment Core semiconductor manufacturing equipment portfolio for front-end and back-end wafer processing, used by semiconductor manufacturers in fab production lines.
  • CLEAN Equipment (Cleaning Equipment) Wafer surface cleaning equipment that removes particles, metals, organic materials, and native oxide films using chemical treatment, gases, and physical methods to improve yield and reliability. Used by semiconductor manufacturers.
  • PHOTO Equipment (Photolithography/Phototrack Equipment) Photolithography equipment that transfers fine circuit patterns from masks onto wafer surfaces using light exposure, requiring precise, high-level technology. Used by semiconductor manufacturers.
  • ETCH Equipment (Etching Equipment) Etching equipment that forms semiconductor circuit patterns by corroding and removing exposed material with liquid or gas etchants, leaving patterns defined by the photolithography step. Used by semiconductor manufacturers.
  • TEST Equipment (Semiconductor Testing Equipment) Test equipment that inspects finished semiconductor devices by applying various voltages, electrical signals, temperature, and humidity conditions to measure electrical characteristics, functional characteristics, and operating speed. Used by semiconductor manufacturers.
  • PACKAGE Equipment (Back-end Packaging Equipment) Back-end packaging equipment that separates wafer-level chips into individual units, connects cut chips to substrates, and performs package molding to protect chips from external environments. Used by semiconductor manufacturers.
  • Display Equipment Display manufacturing equipment for processing flat panel displays, used by display manufacturers in fab production lines.
  • Line Automation Factory automation equipment for logistics and material handling in semiconductor and display manufacturing facilities. Used by semiconductor and display manufacturers.
  • MPGA Prober (HBM Chip Inspection Device) High-precision physical contact inspection device (MPGA Prober) for HBM chip quality inspection with sub-5-micrometer alignment accuracy and throughput exceeding three times the industry average. Used by HBM memory manufacturers.

Quantifiable outcome

  • Throughput over three times the industry average for HBM chip inspection
  • +1 more outcomes

Companies that use SEMES

Customer profile

Segments1 record

Ideal customer profiles1 record

SEMES technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

AI capability1 record

Feature1 record

SEMES partnerships and signals

Strategic signal

Scale indicators5 records

Recent moves5 records

Expansion highlights4 records

SEMES competitors and assessment

Company assessment

Direct peers

  • Tokyo Electron (TEL): Japanese semiconductor equipment maker and the dominant global supplier of coater/developer (track) systems. Directly competes with SEMES' Photo and adjacent Clean/Etch/Test equipment, with comparable fab-wide portfolio breadth.
  • SCREEN Holdings: Japanese equipment maker and global leader in semiconductor wafer cleaning equipment. Directly comparable to SEMES' Clean product line and shares exposure to memory/fab customers in Asia-Pacific.
  • KLA Corporation: Global leader in semiconductor inspection and metrology. KLA is the most direct competitor to SEMES' MPGA Prober for HBM chip inspection and a benchmark for the inspection-tool segment SEMES is targeting.
  • Hitachi High-Tech: Japanese equipment maker with exposure to semiconductor metrology, inspection, and processing tools. Comparable to SEMES across test/inspection and selected process steps, with similar memory-customer exposure.

Broad incumbents

  • Lam Research: US-based incumbent and global leader in etch and deposition semiconductor equipment. Overlaps directly with SEMES' Etch portfolio and competes for the same memory and logic fab capex dollars.
  • Applied Materials: Largest global semiconductor equipment maker with broad portfolio across deposition, etch, inspection, and CMP. Competes with SEMES across multiple process steps and represents the broad-incumbent benchmark for portfolio scale.
  • ASML: Dominant supplier of photolithography systems. While SEMES' Photo (track/coater) equipment complements ASML scanners, both compete for advanced-node fab qualification and capex allocation.

Emerging players

  • ACM Research: China-based single-wafer wet cleaning equipment specialist with growing global footprint. Closest emerging competitor to SEMES' Clean product line, particularly in Asia-Pacific memory and Chinese fabs.
  • Naura Technology: Chinese semiconductor equipment maker with broad portfolio across etch, thermal, and cleaning. Comparable in portfolio breadth to SEMES and a key emerging competitor for non-leading-edge equipment in Asia.

Regional players

  • Hanmi Semiconductor: Korean semiconductor equipment maker focused on die-bonding and advanced packaging/test tools. Regional peer serving the same Korean memory customer base as SEMES, with overlap in back-end test and packaging equipment.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

SEMES social profiles

Digital presence

SEMES compliance and trust

Trust signal

Compliance2 records

SEMES financial estimates

Financial estimate

Revenue estimate

Valuation estimate

SEMES leadership team

Management profile

Number of profiles

Profiles1 record

SEMES funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

SEMES M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SEMES

What does SEMES do?

SEMES manufactures semiconductor manufacturing equipment for front-end and back-end wafer processing, including cleaning (CLEAN), photolithography (PHOTO), etching (ETCH), testing (TEST), and packaging (PACKAGE) equipment. The company also produces display manufacturing equipment and line automation solutions for semiconductor and display fabrication facilities.

Is SEMES a public or private company?

SEMES is a private company. It is classified as unknown and is currently operating.

When was SEMES founded?

SEMES was founded in 1993. It employs 1,001 to 5,000 people.

Where is SEMES based?

SEMES is headquartered in Cheonan, South Korea, in the Asia region.

Who are SEMES's main competitors?

Direct peers on record are Tokyo Electron (TEL), SCREEN Holdings, KLA Corporation and Hitachi High-Tech. Broad incumbents are Lam Research, Applied Materials and ASML. Emerging players are ACM Research and Naura Technology. Hanmi Semiconductor is listed as a regional player.

Does SEMES have an API?

No public API is recorded for SEMES.

What industry is SEMES in?

SEMES's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHAEAJ, Test, Probe & Burn-In Equipment (Wafer Sort/Final Test), with a secondary code of HDAHAEAC, Etch & Strip Equipment (Dry/Wet/Ashing). Its NAICS code is 333242 and its SIC code is 3550.

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Live signals
openPR.comCoater and Developer for Wafer Processing Market Demand Surge: Emerging Opportunities, Trends & Forecast Outlook to 2032QY Research published a market report stating the global Coater and Developer for Wafer Processing market was valued at US$2,863 million in 2025 and is projected to reach US$4,479 million by 2032, growing at a CAGR of 6.7% during 2026–2032. Asia-Pacific is the largest regional market with approximately 68% share, followed by Europe and North America. The report identifies Tokyo Electron, SCREEN SPE, SEMES, SUSS MicroTec, Kingsemi, TAZMO, and Litho Tech Japan Corporation as key players in the market.동아사이언스Korean engineers awarded for HBM testing and SD-WAN advancesJong-seong Park, a Master at Semes, and In-hwa Jeong, a Principal Researcher at Atlas Networks, have been selected as the recipients of the April Engineer of the Year Award, Korea. Park developed a physical contact device (MPGA Prober) enabling high-precision HBM chip quality inspections with sub-5-micrometer alignment accuracy and throughput over three times the industry average. Jeong developed a VPN-based SD-WAN solution and a wireless mobile test automation platform, both recognized for advancing information and communication technology.AsiaeThe Hidden Threat of Foreign Direct Investment: 23 Trillion Won in Industrial Technology Leakage Over Five YearsA report by the Korea Economic Research Institute estimates industrial technology leakage through foreign direct investment in South Korea reached approximately 23.27 trillion won over five years (2020–June 2025), with 110 cases of technology sent overseas and 33 involving national core technologies. Semiconductors accounted for the largest share of leakage at 33%, followed by displays at 20% and electrical/electronics at 8%. Two specific cases were highlighted: China-based Great Wall Motors allegedly established a subsidiary in South Korea to obtain battery technology from Samsung SDI and SK On, and a former employee of Samsung subsidiary SEMES allegedly sold stolen semiconductor cleaning equipment technology to a Chinese company, receiving 7.8 billion won.MacRumorsSuppliers Already Preparing for iPhone 18's CameraSamsung Electronics is expanding image sensor production for Apple's iPhone 18 at its new facility in Austin, Texas, marking its return to Apple's camera sensor supply chain after roughly a decade and potentially challenging Sony's long-standing dominance. Samsung's testing partner Doosan Tesna announced a $123 million investment in test equipment from Advantest, Samsung subsidiary Semes, and Japan Interaction, representing over one-fifth of the company's total assets. The investment reflects how preparations for Apple's future iPhones are already reshaping global semiconductor supply chain investment more than a year before production begins.PR NewswireGlobal Semiconductor Wafer Cleaning Systems Market 2018-2022 with Applied Materials, LAM Research, Screen Holdings, SEMES & Tokyo Electron DominatingResearchAndMarkets.com has released a market research report covering the global semiconductor wafer cleaning systems market for the period 2018-2022, forecasting a compound annual growth rate exceeding 6% despite an anticipated deceleration in year-over-year growth momentum.