What HANMI Semiconductor does

HANMI Semiconductor Co., Ltd. (한미반도체) is a South Korean semiconductor back-end equipment manufacturer founded in 1980 and headquartered in Incheon, with a regional office in Seoul and a planned US subsidiary (HANMI USA) in San Jose by end of 2026. The company designs and manufactures precision bonding and packaging equipment — principally thermal compression (TC) bonders for high-bandwidth memory (HBM) stacking, flip-chip (FC) bonders for 2.5D AI chip packaging, BOC/COB bonders, vision placement systems, micro saws, and EMI shielding equipment for aerospace and LEO satellite communications. It commands approximately 71.2% global market share in TC bonders and has held the #1 position in EMI shield equipment since entering that market in 2016; its TC Bonder was certified as a Korean World-Class Product by the Ministry of Trade, Industry and Energy in November 2025.

The company's commercial model is direct enterprise sales of high-value capital equipment under negotiated multi-year contracts to leading memory and AI chip manufacturers — primarily SK hynix, Samsung Electronics, and Micron Technology, with new customer traction at Terafab (Elon Musk's vertically integrated AI chip venture) and India's Gujarat ATMP ecosystem. A single 44.2 billion KRW ($28.7M) order from SK hynix for 15 TC Bonder 4.5 Griffin units represented approximately 7.7% of 2025 consolidated revenue, and lead times on TC bonding equipment have stretched beyond 10 months due to AI-driven demand. AI-driven tightness has flipped the historical industry norm of 10% annual cost-down pressure into 3-4% price increases for tier-1 suppliers, materially strengthening unit economics. Hanmi's growth pipeline is anchored in three vectors: (1) HBM4 capacity build-outs at SK hynix and Micron for Nvidia-class AI accelerators, (2) geographic expansion via HANMI USA supporting new US fabs from Intel, Micron, Amkor, SK hynix, and Terafab, and (3) adjacent product expansion into 2.5D system semiconductor packaging (FC Bonder 3.5, Big Die FC Bonder, BOC COB Bonder) and aerospace/LEO satellite EMI shielding.

Name

HANMI Semiconductor

Legal name

한미반도체 주식회사 (Hanmi Semiconductor Co., Ltd.)

Website

https://hanmisemi.com

Company type

Private

Founded year

1980

Operating status

Operating

Headcount range

11–50 employees

Short description

HANMI Semiconductor is a South Korean back-end semiconductor equipment manufacturer holding ~71.2% global market share in TC bonders, serving SK hynix, Samsung, Micron, and emerging US customers with HBM stacking, 2.5D AI chip packaging, and EMI shielding equipment.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging equipment
• Thermal compression bonders
• Flip-chip bonders
• HBM bonding systems
• EMI shielding equipment

Headquarters

HQ city

Sinhyeon

HQ country

South Korea

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Packaging Equipment Sales: Hanmi Semiconductor generates revenue primarily from manufacturing and selling advanced semiconductor packaging equipment, including TC bonders, FC bonders, vision placement systems, micro saws, EMI shields, and other equipment used in HBM memory stacking, AI chip packaging, and aerospace applications. Equipment is sold directly to semiconductor manufacturers such as SK hynix, Samsung Electronics, and Micron.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

HANMI Semiconductor manufactures advanced semiconductor packaging equipment, with a primary focus on thermal compression (TC) bonders used to stack DRAM layers in high-bandwidth memory (HBM) chips for AI accelerators. The company also produces flip-chip (FC) bonders for 2.5D AI chip packaging, 2.5D TC bonders, vision placement systems, micro saw equipment, EMI shield systems for aerospace/LEO satellite applications, and supporting specialty tools. HANMI holds approximately 71.2% global market share in TC bonders and serves leading memory and logic chipmakers including SK hynix, Samsung Electronics, Micron, Intel, and Terafab.

Product overview

HANMI Semiconductor is a South Korean semiconductor equipment manufacturer offering a comprehensive portfolio of equipment for semiconductor packaging. The core product lines include HBM TC BONDERS (TC BONDER 4.5 GRIFFIN, TC BONDER 4.0 TIGER, TC BONDER 1.0 GRIFFIN SB, TC BONDER 1.0 TIGER) for High Bandwidth Memory stacking, FC BONDERS (FC BONDER 3.5, FC BONDER 3.0, FC BONDER 5.0, FC BONDER 75) for flip-chip packaging, 2.5D TC BONDERS (2.5D TC BONDER 120, 2.5D TC BONDER 40 C2S, 2.5D TC BONDER 40 C2W, BOC COB BONDER) for advanced 2.5D packaging, and EMI SHIELD 2.0 X Series for aerospace/satellite applications. Supporting equipment includes VISION PLACEMENT systems, micro SAW precision sawing equipment, META GRINDER, LASER systems, and other specialty equipment. The company dominates the global TC bonder market with approximately 71.2% market share and is expanding into system semiconductor packaging beyond memory applications.

Differentiator

Problem solved

Functional benefit

Products and services

• TC BONDER 4.5 GRIFFIN

Quantifiable outcome

• 71.2% global market share in TC bonder market
• +4 more outcomes

Named customers6 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Four partnerships are on record, tiered core, strategic and minor.

• SK hynixcoreTechnology or Integration · 8 June 2026SK hynix placed a 44.2 billion KRW ($28.7 million) order for approximately 15 TC Bonder 4.5 Griffin units on June 8, 2026 for HBM4 production at Cheongju M15X facility. This marks the first publicly disclosed HBM4-generation bonder contract between the two companies, with delivery by September 2. SK hynix also previously ordered 9.7 billion KRW worth of TC bonders in January 2026 for next-generation HBM4 production. The equipment will be used for Nvidia's Vera Rubin AI accelerator platform where SK hynix holds an estimated 60-70% of initial chip allocation.
• Terafab (Elon Musk's AI Chip Venture)strategicTechnology or Integration · 1 June 2026Hanmi Semiconductor is in final-stage talks to supply advanced packaging equipment including TC bonders for high-bandwidth memory to Terafab, Elon Musk's $119 billion AI chip manufacturing project in Austin, Texas. Full-scale operations are targeted for 2028, primarily serving xAI LLC, SpaceX, and Tesla. This would mark a rare case of Korean front-end and back-end equipment makers participating simultaneously in an AI semiconductor project.
• Micron TechnologycoreTechnology or Integration · 28 February 2026Hanmi Semiconductor attended Micron's official opening of its Sanand, Gujarat facility (India's first advanced memory ATMP operation) on February 28, 2026. Hanmi will deploy its new BOC COB bonder at the Gujarat facility as part of a long-term technical partnership. The $2.75 billion facility could account for up to 10% of Micron's global output at full capacity, producing DDR5 DRAM and enterprise SSDs.
• Government of IndiaminorOthers · 28 February 2026The Indian central government funded 50% of Micron's $2.75 billion Sanand facility, and the Gujarat state funded 20%, creating the context for Hanmi's BOC COB bonder deployment at that location.

Scale indicators8 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• ASMPT (ASM Pacific Technology): Hong Kong-based global leader in semiconductor packaging equipment, including TC bonders and FC bonders for HBM and 2.5D advanced packaging. ASMPT is HANMI's most direct global competitor, particularly in flip-chip bonding for AI chip packaging where both compete for similar customers.
• BE Semiconductor Industries (Besi): Dutch semiconductor assembly equipment specialist and direct competitor in hybrid bonding and TC bonding for advanced packaging. Besi's focus on hybrid bonding technology positions it as both a current peer and a strategic threat to HANMI's TC bonder dominance.
• Toray Engineering: Japanese manufacturer of advanced semiconductor packaging equipment including bonding tools for HBM and 2.5D applications. Toray Engineering competes with HANMI in TC bonders and FC bonders, particularly serving Japanese memory and logic manufacturers.
• SÜSS MicroTec: German supplier of advanced packaging equipment including bonding, lithography, and coating systems for 2.5D/3D packaging. SÜSS MicroTec's temporary wafer bonding and emerging hybrid bonding capabilities overlap directly with HANMI's 2.5D packaging equipment portfolio.
• Hanwha Semitech: Korean semiconductor equipment manufacturer specializing in back-end packaging equipment including bonders and inspection systems. Hanwha Semitech is a domestic Korean peer competing with HANMI for the same Korean memory manufacturer customers.
• Shinkawa: Japanese semiconductor bonding equipment manufacturer with strong heritage in flip-chip bonders and TC bonders for memory and logic packaging. Shinkawa competes with HANMI in TC bonding for HBM and traditional FC bonding applications.

Broad incumbents

• Kulicke & Soffa Industries: Singapore-based broad semiconductor and LED packaging equipment supplier with significant presence in wire bonding, flip-chip bonding, and TC bonding. K&S competes with HANMI in advanced packaging equipment while also serving wider markets.
• Tokyo Seimitsu (Accretech): Japanese manufacturer of semiconductor production equipment including dicing saws, probers, and advanced packaging tools. Accretech's micro-saw and back-end equipment lines overlap with HANMI's supporting product portfolio.
• Hitachi High-Tech: Japanese broad-line semiconductor manufacturing equipment supplier with back-end packaging and inspection systems. Hitachi High-Tech provides competing equipment to HANMI's customer base across multiple packaging process steps.

Emerging players

• SET (Smart Equipment Technology): French specialist in flip-chip and high-precision bonding equipment, particularly for MEMS, sensors, and emerging advanced packaging applications. SET competes with HANMI's FC Bonder product line in niche advanced packaging segments.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

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Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries1 record

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about HANMI Semiconductor