Tuojing Technology
- Company typePublic
- Founded2010
- HeadquartersShuijiao, China
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
Tuojing Technology firmographics
Firmographics- Name
- Tuojing Technology
- Legal name
- 拓荆科技股份有限公司
- Website
- https://piotech.cn
- Company type
- Public
- Founded year
- 2010
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Ownership category
- akta.pro rank
Tuojing Technology industry classification
Industry- Product category
- Semiconductor Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Electronic Components, Nec (3679)
- akta.pro primary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
Keywords
Where Tuojing Technology is headquartered
LocationHeadquarters
- HQ city
- Shuijiao
- HQ country
- China
- HQ region
- Asia
Offices9 records
Markets served
Tuojing Technology business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Infrastructure, Supply Chain, Operations, Marketing or Sales
Revenue model
- Semiconductor Equipment Sales: Sale of semiconductor thin film deposition equipment (PECVD, ALD, SACVD, HDPCVD, Flowable CVD) and 3D IC bonding equipment to semiconductor wafer fabs and integrated circuit manufacturers. Equipment sales are capital expenditures for customers with long sales cycles and high average deal values.
- Technical Services: After-sales technical support and services including 24/7 technical support (7 days a week, 24 hours a day) provided through technical service centers.
Go-to-market motion1 record
Distribution channels2 records
Marketing channels8 records
Tuojing Technology product offering
Product offeringCore offering
Tuojing Technology designs, manufactures and sells semiconductor thin-film deposition equipment and 3D integration (hybrid bonding) equipment used by integrated circuit manufacturers to build logic and memory chips. The portfolio covers PECVD, ALD, SACVD, HDPCVD, Flowable CVD systems plus Wafer-to-Wafer and Die-to-Wafer hybrid bonding tools and supporting metrology equipment, deployed in 100+ Chinese production lines across 30+ provinces. Revenue is generated through one-time capital-equipment sales to fabs plus recurring after-sales technical service contracts.
Product overview
Piotech, Inc. (拓荆科技) is a semiconductor equipment company offering a comprehensive portfolio of thin film deposition equipment for integrated circuit manufacturing. The core product line includes PECVD (Plasma Enhanced CVD), ALD (Atomic Layer Deposition), SACVD (Sub-Atmospheric CVD), HDPCVD (High Density Plasma CVD), and Flowable CVD equipment for depositing dielectric films. The company has expanded into 3D integration equipment including W2W/D2W hybrid bonding systems and supporting metrology tools. Products are applied in logic chips, memory chips, advanced packaging, HBM, MEMS, Micro-LED and Micro-OLED displays. The company also developed the Hesper HDPCVD platform featuring a hexagonal reactor design with industry-leading throughput. Products have been deployed in over 100 production lines across 30+ provinces in China.
Differentiator
Problem solved
Functional benefit
Products and services
- PECVD Series (Plasma Enhanced Chemical Vapor Deposition Series / PECVD系列) Plasma-enhanced chemical vapor deposition equipment used to deposit dielectric thin films during integrated circuit fabrication, targeting semiconductor wafer fabs and integrated circuit manufacturers for STI, ILD, IMD and passivation dielectric layers.
- ALD Series (Atomic Layer Deposition Series / ALD系列) Atomic layer deposition equipment for ultra-thin, highly uniform film deposition at the atomic level, including China's first domestically-produced 12-inch PEALD platform for 28nm and above ICs, OLED, and advanced packaging (TSV) applications.
- SACVD Series (Sub-Atmospheric Chemical Vapor Deposition Series / SACVD系列) Sub-atmospheric chemical vapor deposition equipment that operates at near-atmospheric pressure for specialized dielectric film deposition in semiconductor manufacturing.
- HDPCVD Series / Hesper (High Density Plasma CVD Series) High-density plasma CVD equipment featuring the Hesper TS-300S hexagonal platform with 5 reaction chambers, used for STI, ILD, IMD and passivation trench dielectric filling in advanced semiconductor manufacturing, with industry-leading throughput efficiency and leading domestic market share.
- Gap Fill Series / Flowable CVD (Gap Fill系列) Ultra-high aspect ratio trench filling equipment using Flowable CVD technology for advanced gap fill applications in semiconductor manufacturing.
- 3D IC Series / Hybrid Bonding Equipment (3D IC系列 / 混合键合设备) Wafer-to-Wafer (W2W) and Die-to-Wafer (D2W) hybrid bonding equipment for 3D IC integration and advanced packaging, enabling chip connection points to scale from hundreds to millions with bandwidth improvement up to 10,000x; applied to HBM, advanced packaging, Micro-LED and Micro-OLED display packaging.
- Metrology / Measurement Equipment (量测设备) Measurement and inspection equipment for process control and quality assurance in semiconductor manufacturing, supporting the film deposition and bonding equipment product lines.
Quantifiable outcome
- HDPCVD reaction chamber cumulative installations exceeded 70 units, expected to exceed 100 by end of 2024, with industry-leading throughput efficiency
- +3 more outcomes
Companies that use Tuojing Technology
Customer profileNamed customers2 records
Segments3 records
Ideal customer profiles3 records
Tuojing Technology technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
Tuojing Technology partnerships and signals
Strategic signalScale indicators7 records
Recent moves9 records
Expansion highlights4 records
Tuojing Technology competitors and assessment
Company assessmentBroad incumbents
- Lam Research: Global leader in plasma-enhanced CVD, ALD, and etch. Competes with Piotech in PECVD and HDPCVD for dielectric deposition in DRAM, logic, and advanced packaging, and is a benchmark competitor whose process roadmaps set the bar Piotech must meet.
- Veeco Instruments: Specialty deposition and etch equipment maker with a strong position in MOCVD, ion beam deposition, and advanced packaging/coating tools. Overlaps with Piotech in deposition process technology and serves adjacent advanced packaging and compound semi customers.
- Applied Materials: Global #1 in semiconductor deposition equipment with the broadest portfolio across CVD, PVD, ALD, and epitaxy — including the Producer PECVD and Centura/Endura ALD platforms that are direct functional competitors to Piotech's PECVD, ALD and HDPCVD products across the same fab process steps.
- SCREEN Holdings: Japanese semiconductor equipment leader in single-wafer cleaning, coating, and surface preparation. Overlaps with Piotech at the pre/post-deposition process steps and serves similar memory and advanced packaging customers across Asia.
- Tokyo Electron (TEL): One of the largest Japanese semiconductor equipment makers with major share in CVD, ALD, and coating tools. Directly competes with Piotech in PECVD, SACVD, and ALD for logic and memory customers across global fabs, and is a key reference competitor in advanced packaging deposition.
Direct peers
- ASM International (ASMI): Global specialist in ALD and epitaxy equipment, with the leading installed base of single-wafer ALD tools. Most directly comparable to Piotech's 12-inch PEALD business and the company's stated trajectory in atomic-scale deposition, especially for advanced nodes and 3D NAND.
- ACM Research (ACMR): China-origin semiconductor equipment company with a strong position in cleaning and growing exposure to PECVD/ALD furnaces. Competes with Piotech for the same Chinese customer wallet and shares the same US-listed / China-headquartered dual structure.
- NAURA Technology Group (北方华创): Largest Chinese semiconductor equipment manufacturer, with directly overlapping deposition (PECVD, LPCVD, ALD) and etch product lines serving the same domestic foundry/IDM customers. Both companies compete for inclusion in new Chinese fab tool sets and for share of the same ~100 production lines Piotech serves.
- Advanced Micro-Fabrication Equipment Inc. (AMEC / 中微公司): Leading Chinese semiconductor equipment maker primarily known for etch tools but expanding into CVD/ALD. Targets the same Chinese fab customers and benefits from the same domestic substitution tailwind, making it the closest direct peer for a Chinese deposition specialist like Piotech.
Emerging players
- Shanghai Micro Electronics Equipment (SMEE): State-backed Chinese semiconductor equipment maker primarily known for lithography, with growing deposition ambitions. Competes with Piotech in the broader narrative of Chinese semiconductor self-sufficiency but is at an earlier stage in CVD/ALD commercialization.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights8 records
Customer concentration
Tuojing Technology compliance and trust
Trust signalCompliance4 records
Tuojing Technology financial estimates
Financial estimateRevenue estimate
Valuation estimate
Tuojing Technology leadership team
Management profileNumber of profiles
Profiles15 records
Tuojing Technology subsidiaries and ownership
Company hierarchySubsidiaries9 records
Tuojing Technology funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Tuojing Technology M&A and investment
M&A and investmentM&A
Investments6 records
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Tuojing Technology
What does Tuojing Technology do?
Tuojing Technology designs, manufactures and sells semiconductor thin-film deposition equipment and 3D integration (hybrid bonding) equipment used by integrated circuit manufacturers to build logic and memory chips. The portfolio covers PECVD, ALD, SACVD, HDPCVD, Flowable CVD systems plus Wafer-to-Wafer and Die-to-Wafer hybrid bonding tools and supporting metrology equipment, deployed in 100+ Chinese production lines across 30+ provinces. Revenue is generated through one-time capital-equipment sales to fabs plus recurring after-sales technical service contracts.
Is Tuojing Technology a public or private company?
Tuojing Technology is a public company. It is classified as public and is currently operating.
When was Tuojing Technology founded?
Tuojing Technology was founded in 2010. It employs 101 to 250 people.
Where is Tuojing Technology based?
Tuojing Technology is headquartered in Shuijiao, China, in the Asia region.
How does Tuojing Technology make money?
Two revenue lines are on record. Semiconductor Equipment Sales are the primary driver. The others are technical Services.
Who are Tuojing Technology's main competitors?
Broad incumbents on record are Lam Research, Veeco Instruments, Applied Materials, SCREEN Holdings and Tokyo Electron (TEL). Direct peers are ASM International (ASMI), ACM Research (ACMR), NAURA Technology Group (北方华创) and Advanced Micro-Fabrication Equipment Inc. (AMEC / 中微公司). Shanghai Micro Electronics Equipment (SMEE) is listed as an emerging player.
Does Tuojing Technology have an API?
No public API is recorded for Tuojing Technology.
What industry is Tuojing Technology in?
Tuojing Technology's product category is Semiconductor Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy). Its NAICS code is 333242 and its SIC code is 3679.