What AEMtec does

AEMtec GmbH is a Berlin-based B2B contract manufacturer of complex micro- and optoelectronic modules, founded in 2000 as a spin-off from a technology group and owned by the Berlin private equity firm capiton AG since October 2018. The company operates a 9,000 square-meter site in Berlin-Adlershof, including 3,000 square meters of cleanroom certified to ISO 5–8 across four classifications, with a 2022-completed extension building. Its portfolio spans wafer back-end services (UBM, solder balling, wafer dicing up to 300 mm), flip-chip technologies down to 50 µm pitch, chip-on-board/on-glass, fan-out wafer-level packaging, surface mount technology, opto-packaging with ±0.5 µm placement accuracy in ISO 5 environments, and full system integration. Through the December 2024 acquisition of aSpect Systems GmbH (Dresden), AEMtec also offers FPGA-based custom test and automation solutions from wafer probing to end-of-line testing.

The business model is custom, project-based contract manufacturing services sold via direct enterprise sales and technical consultation. Engagements run from design support and industrialization through prototyping (NPI), qualification, series production, supply chain management, and after-sales support, with quote-based pricing per project. A US Tech Center (AEMtec USA Inc., opened August 2021 in the Boston University Photonics Center) provides local technical engagement and rapid prototyping for North American customers. The company is ISO 13485-certified for medical device manufacturing.

Customers span five verticals: MedTech and BioTech (primary, including imaging, implants, wearables, and diagnostics), AI and Communication (optical transceivers, routers), Industry and Automation (sensors and MEMS), Semiconductor Equipment (for example, flip-chip processing for ASML lithography systems), and Aerospace and Defense (for example, GPS receivers for the European Space Agency Swarm satellite program). Headcount is 101–250; operations are run by three Managing Directors (Robert Giertz, Thomas John, Jan Trommershausen), with IPMA-certified project management and a dedicated Mikrotechnologe apprenticeship pipeline.

Revenue is not publicly disclosed.

Name

AEMtec

Legal name

AEMtec GmbH

Website

http://www.aemtec.com/

Company type

Private

Founded year

2000

Operating status

Operating

Headcount range

101–250 employees

Short description

AEMtec is a Berlin-based B2B contract manufacturer of complex micro- and optoelectronic modules and systems, serving MedTech, semiconductor equipment, aerospace, automation, and communications customers from ISO 5–8 cleanrooms.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

SIC

Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Industrial Electronics Manufacturing Services (EMS) (IMAGAGAA), Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF)

Keywords

• Microelectronic packaging services
• Optoelectronic module assembly
• Semiconductor wafer packaging
• Fan-out wafer-level packaging
• Contract microelectronic manufacturing

Headquarters

HQ city

Berlin

HQ country

Germany

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Infrastructure, Personnel, Technology or R&D, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Contract Manufacturing Services: Full-service B2B manufacturing including design support, industrialization, prototyping (NPI), qualification, series production, and supply chain management for complex micro- and optoelectronic modules and systems.
2. Technology Services: Specialized services including wafer back-end processing, chip-level integration, testing, and qualification services performed in cleanroom environments with ISO 13485 certification.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

AEMtec is a B2B contract manufacturer specializing in development, industrialization, and series production of complex micro- and optoelectronic modules and complete systems. Operating from a 9,000 square meter Berlin facility with 3,000 square meters of ISO class 5-8 cleanroom space, the company delivers wafer back-end services, chip-level integration, and system-level packaging, complemented by project management, qualification/testing, and supply chain management services. It serves customers in MedTech/BioTech, AI & Communication, Industry & Automation, Semiconductor, and Aerospace & Defense markets.

Product overview

AEMtec is a B2B company specializing in complex micro- and optoelectronic modules and complete systems. The company offers an integrated portfolio combining core manufacturing technologies (Wafer Back-End Services, Custom Test & Automation Solutions, SMT, Chip & Wire Bonding, Flip-Chip, Placement Accuracy, Opto-Packaging, Fan-Out Wafer-Level Packaging, and System Integration) with comprehensive services (Project Management, Qualification/Test & Analysis, Operations, and Logistics/SCM). The company operates from ISO-classified cleanrooms (ISO 5-8) and serves markets including MedTech & BioTech, AI & Communication, Industry & Automation, Semiconductor, and Aerospace & Defense.

Differentiator

Problem solved

Functional benefit

Products and services

• Wafer Back-End Services Comprehensive wafer processing services including Under Bump Metallization (UBM), solder balling (50-400µm diameters), wafer dicing up to 300mm, wafer grinding, and back-end assembly (Flip Chip, WLP, CoB, CoG) for semiconductor manufacturers.
• Custom Test and Automation Solutions Custom-designed test systems and automation tools covering wafer probing, end-of-line testing, and process automation, including firmware development, FPGA-based control architectures, and optical alignment solutions. Delivered through the aSpect Systems subsidiary.
• Surface Mount Technology (SMT) Surface mount assembly services covering screen printing, adhesive dispensing, SMD mounting (01005 to 75x75mm), AOI (automated optical inspection), and circuit board wash, supporting BGA/LGA with 0.25-3mm ball pitch, PoP stacking, and rigid, rigid-flex, LCP, ceramic, and polyimide substrates.
• Chip & Wire Bonding Chip on Board (CoB) and Chip on Glass (CoG) assembly using soldering, gluing, gold and aluminum wire bonding, and Gloptop/Dam & Fill potting processes for hybrid and optoelectronic modules.
• Flip-Chip Direct chip placement on substrates with active surface down using soldering, bonding, thermosonic, thermocompression, and underfill processes supporting pitches down to 50µm, used for high-density interconnect packages.
• Highest Placement Accuracy Service High-precision die bonding services achieving placement precision up to ±0.5µm in XY and twist angle of 3.5 µrad, performed in ISO class 5 cleanroom environments for demanding micro-optical and semiconductor applications.
• Opto-Packaging Complex optoelectronic module packaging with placement accuracy up to ±0.5µm in cleanroom conditions up to ISO class 5, featuring active and passive alignment for laser diodes, pin diodes, and full optoelectronic systems.
• Fan-Out Wafer-Level Packaging (FOWLP) Advanced semiconductor packaging technology embedding dies in reconstituted wafers with redistribution layers (RDLs), enabling higher performance, greater integration density, and reduced form factor. Offered by AEMtec for low- to mid-volume production in Europe.
• System Integration Assembly of complex optoelectronic modules combining assembly technologies, precision optics integration in mechanical modules, automated active alignment, and strict particle and molecular cleanliness compliance.
• Project Management IPMA-certified project management services providing analysis, advice, and efficient solutions from concept through production with structured target-oriented project execution.
• Qualification, Test & Analysis Comprehensive testing and analysis services including burn-in tests, temperature change tests, vibration tests, functional testing, X-ray inspection, SEM/EDX analysis, and acoustic microscopy for product reliability assurance.
• Logistics / SCM Complete supply chain management covering procurement, quality control, production management, and just-in-time delivery under the QLTCS framework (Quality, Logistics, Technologies, Commercial, Sustainability).

Quantifiable outcome

• Near zero module failure rate after system integration for CT scanner applications
• +1 more outcomes

Named customers2 records

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Fraunhofer IZMcoreStrategic or Co-development PartnerLongstanding research partnership for process development in microelectronics. Fraunhofer IZM developed the electroless Ni-Au plating technology (UBM) that AEMtec licenses and has now implemented in-house. Joint interviews and collaborative technology development in fan-out wafer-level packaging and redistribution layers.
• aspect systems GmbHcoreTechnology or IntegrationAcquired in December 2024, aSpect Systems GmbH specializes in custom test systems and automation solutions. Part of AEMtec Group providing in-house semiconductor testing equipment capabilities.
• EPIC (European Photonics Industry Consortium)minorStrategic or Co-development PartnerEuropean photonics industry consortium member providing networking and industry collaboration opportunities.
• iMAPS (International Microelectronics Assembly and Packaging Society)minorStrategic or Co-development PartnerProfessional society for microelectronics packaging with regular conference participation and presentations by AEMtec engineers.
• IVAM (International Association for Microtechnology)minorStrategic or Co-development PartnerInternational association for microtechnology providing networking and industry collaboration.
• Optec BBminorStrategic or Co-development PartnerRegional photonics and microtechnology network in Brandenburg, Germany.
• SEMI (Semiconductor Equipment and Materials International)minorStrategic or Co-development PartnerGlobal industry association for semiconductor and microelectronics supply chain.

Scale indicators4 records

Recent moves9 records

Expansion highlights6 records

Direct peers

• RoodMicrotec: Dutch-headquartered European independent semiconductor services provider offering wafer test, assembly, and qualification. Closely comparable to AEMtec as a smaller-scale European OSAT/assembly house serving MedTech, aerospace, and industrial customers with similar low-to-mid volume, high-mix orientation.

Broad incumbents

• JCET Group: Major Chinese OSAT with rapidly expanding advanced packaging capabilities including FOWLP and chiplet integration. Provides competitive pressure in advanced packaging technologies where AEMtec operates, especially as Chinese suppliers expand into European accounts.
• Jabil: Global EMS giant with extensive electronics manufacturing services including optical and complex module assembly. Overlaps with AEMtec's EMS-style SMT, system integration, and supply chain offerings at much larger scale.
• Amkor Technology: One of the world's largest OSATs with extensive advanced packaging capacity (FOWLP, 2.5D/3D, flip-chip, wafer-level packaging). Direct overlap with AEMtec in flip-chip and wafer-level packaging but at vastly larger scale and broader geographic footprint.
• Flex: Global contract manufacturer offering design, manufacturing, and supply chain services across multiple industries. Comparable to AEMtec in providing complex electronics assembly but at much higher volume and broader scope.
• ASE Technology Holding: Largest global OSAT offering a full spectrum of packaging and test services including advanced FOWLP, SiP, and flip-chip. Competes with AEMtec on technology overlap, especially for European customers seeking advanced packaging at higher volumes.
• Powertech Technology: Taiwan-based OSAT with strong presence in flip-chip, wafer-level packaging, and integrated module assembly. Overlaps with AEMtec in advanced packaging and serves global semiconductor customers with similar technologies.
• ChipMOS Technologies: Taiwanese OSAT offering assembly, packaging, and test services including advanced wafer-level and flip-chip packaging. Comparable to AEMtec in service portfolio but with significantly higher volume capacity.

Regional players

• TDK-Micronas: European sensor and semiconductor manufacturer with in-house packaging capabilities for MEMS and Hall-effect sensors. Comparable to AEMtec in serving automotive, industrial, and MedTech end markets with miniaturized electronic modules, though operating as an IDM rather than a service provider.
• Fraunhofer IZM: German research institute specializing in microelectronics packaging and system integration. Direct overlap with AEMtec in FOWLP, wafer-level processing, and advanced packaging R&D, with some of AEMtec's process technologies licensed from IZM — making it both a partner and potential competitor for European advanced packaging programs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks7 records

Key highlights7 records

Customer concentration

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles12 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about AEMtec