What ePAK International does

ePAK International, founded in 1999 and headquartered in Austin, Texas, designs and manufactures precision-engineered packaging and handling products for the semiconductor, integrated circuit, and electronic components industries. Its portfolio spans more than 5,000 SKUs across three integrated product lines: wafer handling (eFOUP 300mm Front Opening Unified Pods, eFOSB shipping boxes, ePOD PRO sealed SMIF pods, eLX zero-movement canisters, plus specialty eGaN and eSiC carriers for gallium nitride and silicon carbide substrates); IC shipping and handling (matrix trays with patented eBIN lot identification and V-Cut designs, embossed carrier tape compliant with EIA-481, and IC shipping tubes); and disk drive handling (cassettes, HGA/HSA trays, slider trays). All products are engineered to SEMI standards for seamless integration with customer automated material handling systems (AMHS), with static-dissipative materials, PEEK wafer contacts, and configurable N2 purge architectures supporting contamination-controlled environments. The company is led by co-founders Steve Dezso (CEO), Mao Shi Khoo (COO), and James R. Thomas (CTO), with CTO Thomas holding six patents and additional filings pending.

ePAK operates a sales-led, hardware-sales business model, generating revenue from the sale of standard and customized handling products to semiconductor wafer fabs, IC test and assembly houses, OEMs, and disk drive manufacturers. Pricing is quote-based with no public list pricing; sales are executed through nine direct sales and application engineering offices worldwide (US, Europe, Korea, Taiwan, Philippines, Singapore) supplemented by a network of stocking distributors (Redstone Technical in the US, SPS International in Europe) and sales representatives in Israel, Japan, Thailand, Malaysia, and Australia. The company sells direct and via channel, with the TopLine partnership extending reach to small-volume tray buyers in the Americas and Europe. Customers include Texas Instruments (2024 Supplier Excellence Award recipient among 10,000+ suppliers), Infineon Technologies (Preferred Supplier), Siltronic (Preferred Supplier), and International Rectifier (Distinguished Supplier Award).

The company runs three manufacturing hubs in Shenzhen and Anhui (China) and Penang (Malaysia), supported by a wholly-owned subsidiary network across China, Malaysia, and Singapore, and holds ISO 9001, ISO 14001, IATF 16949, ISO 45001, and ISO 50001 certifications. With 1,001-5,000 employees, 500+ customers, and operations in more than 12 countries, ePAK is a founder-controlled private company with no external institutional investment or PE backing disclosed.

Name

ePAK International

Legal name

ePAK International, Inc.

Website

https://epak.com

Company type

Private

Founded year

1999

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

ePAK International designs and manufactures precision-engineered semiconductor, IC, and disk drive handling products — including FOUPs, FOSBs, wafer carriers, and specialty eGaN/eSiC substrates — selling to global wafer fabs, OSATs, and OEMs through direct offices and a worldwide distributor and representative network.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Handling Products

NAICS

Other Electronic Component Manufacturing (334419), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Semiconductor wafer handling
• FOUP and FOSB carriers
• IC shipping containers
• Semiconductor packaging products
• Disk drive handling trays

Headquarters

HQ city

Austin

HQ country

United States

HQ region

North America

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Handling Hardware Products: ePAK generates revenue through the sale of semiconductor transfer and handling products including FOUPs, FOSBs, wafer carriers, IC shipping containers (trays, carrier tape, tubes), disk drive handling products, and related accessories. Products are sold directly and through channel partners to semiconductor fabs and OEMs globally.

Go-to-market motion1 record

Distribution channels4 records

Marketing channels4 records

Core offering

ePAK International designs and manufactures precision-engineered semiconductor transfer and handling products for the front-end and back-end of the semiconductor supply chain. The product portfolio includes FOUPs, FOSBs, SMIF pods, wafer canisters, shipping boxes, matrix trays, embossed carrier tape, IC shipping tubes, and disk drive handling products. ePAK also produces specialized handling solutions for compound semiconductors including gallium nitride (GaN) and silicon carbide (SiC) wafers.

Product overview

ePAK International is a global leader in precision-engineered semiconductor transfer and handling solutions, founded in 1999. The company offers three integrated product lines: Wafer Handling Products (FOUP, FOSB, SMIF pods, canisters, and specialized carriers for GaN and SiC), IC Shipping & Handling Products (matrix trays, carrier tape, shipping tubes), and Disk Drive Products (cassettes, HGA/HSA trays, slider trays). The wafer handling portfolio centers on the eFOUP 300mm carrier family with modular variants (eFOUP-C), eFOSB shipping boxes, ePOD PRO sealed pods, and specialized solutions for gallium nitride (eGaN) and silicon carbide (eSiC) wafers. IC products include matrix trays with patented eBIN identification, embossed carrier tape in multiple material configurations, and IC shipping tubes. The product ecosystem is unified by shared materials standards (ESD-safe, low-outgassing polymers) and compliance with SEMI industry standards, enabling interoperability across semiconductor manufacturing supply chains.

Differentiator

Problem solved

Functional benefit

Brands

• eSiC: Silicon Carbide Wafer Handling Solutions - specialized products for handling silicon carbide wafers in power electronics, renewable energy systems, and electric vehicles.
• eGaN

Products and services

• eFOUP 300mm Wafer Carrier SEMI-compliant 300mm Front Opening Unified Pod for in-fab wafer transport and storage, available in three configurations (eFOUP300-A, eFOUP300-AF, eFOUP300-DF) with different purge options, static dissipative materials, PEEK wafer contacts, and full AMHS compatibility. Designed for semiconductor fabs and OSATs.
• eFOUP-C Modular FOUP System Modular 300mm FOUP system accepting six insert configurations supporting 300mm wafers, 200mm wafers, 276mm film frames, and probe cards within a single 300mm shell footprint, with permanent installation. Designed for semiconductor fabs requiring flexible wafer format handling.
• eFOSB 300mm Wafer Carrier SEMI/FIMS-compliant Front Opening Shipping Box for inter-fab wafer transport, featuring 25 slots, pre-installed filter, ESD-safe carbon fiber filled PC robotic flange, and full AMHS compatibility for 300mm wafers. Designed for semiconductor fabs shipping wafers between facilities.
• ePOD PRO Sealed, purgeable SMIF-style wafer carrier with integrated nitrogen purge ports, washable construction, kinematic coupling, and SEMI E19 compliance for 150mm and 200mm cassette applications. Designed for semiconductor fabs requiring controlled-environment wafer handling.
• eGaN Gallium Nitride Wafer Handling Purpose-built family of carriers and canisters for handling 25mm to 300mm GaN wafers, engineered for the unique mass, brittleness, and surface sensitivity of GaN substrates including bulk GaN, GaN-on-Si, and GaN-on-SiC. Compliant with SEMI E47.1, SEMI E62, ISTA-2A, and IEC 61340 standards. Designed for GaN device manufacturers in power electronics and RF applications.
• eSiC Silicon Carbide Wafer Handling Comprehensive SiC wafer handling solutions covering boule storage, wafering, epitaxial growth, device fabrication, and dicing, with low-shedding materials, hermetic sealing, and contamination control. Designed for high-temperature and high-frequency power electronics, renewable energy systems, and electric vehicle applications.
• eLX Zero-Movement Canisters Patented vertical wafer shipping canisters combining performance features of vertical cassettes and coin-stack shippers, providing zero-inter-wafer movement for maximum wafer breakage protection, bond pad and bump integrity, and lowest cost of ownership. Designed for semiconductor fabs shipping fragile wafers.
• ePRO Shipping Boxes Vertical wafer shipping boxes engineered for 25 wafers per box, available in 4", 5", 6" and 8" sizes with multiple cushion and cassette slot designs. Designed for semiconductor wafer shipping.
• Process Boats and Boxes In-process wafer handling carriers with standard machine interfaces, available in a full range of materials for various process requirements with custom design options. Designed for semiconductor fabs handling wafers during processing.
• Flex Frames and Shippers Metal and plastic flex frames with vacuum-formed and injection molded shipper options, available in single and multiple frame configurations. Designed for shipping and storage of taped wafers on flex frames.
• Hoop Rings and Shippers Full range of hoop ring sizes with vacuum-formed single shippers and injection molded multishippers, with custom colors available. Designed for shipping and storage of wafers on hoop rings.
• Single Wafer Shippers Coinstyle or clamshell wafer shippers for 1, 2, 3, 4, 5, 6, 8, and 12 inch wafers up to 450mm. Designed for shipping individual or small batches of wafers.
• eCT Standard Wafer Canisters Horizontal coin-stack type shippers providing enhanced protection for standard and thinned wafers with cost savings from increased packing density. Designed for high-volume wafer shipping.
• eJR Wafer Jars Full range of wafer jar sizes with foam inserts providing maximum packing density and lowest cost wafer handling. Designed for high-density wafer storage and transport.
• Matrix Trays Precision-molded matrix trays for JEDEC, EIAJ, and custom outlines with ESD-safe materials, featuring patented eBIN lot identification system and V-Cut tray designs for enhanced IC protection. Designed for IC test and assembly houses.
• Embossed Carrier Tape Precision-formed packaging medium with thermoformed pockets for ICs and electronic components, available in tri-laminate and homogeneous materials with EIA-481 compliance, and eVISION designs for automated optical inspection. Designed for IC and component packaging.
• IC Shipping Tubes IC shipping tubes from small-profile to large-format designs with standard and custom cross-sections, including environmentally enhanced and ESD-safe material options. Designed for IC shipping through automated handling.
• Disk Handling Cassettes Disk media and substrate cassettes available in sizes from 27.4mm to 97mm diameter, featuring ultra-clean conductive or natural polycarbonate with low particle generation latch designs. Designed for hard disk drive and data storage manufacturers.
• HGA/HSA Trays Trays for shipping and handling Head Gimble Assemblies (HGA) and Head Stack Assemblies (HSA), manufactured in cleanroom with precision molding and ESD options. Designed for hard disk drive manufacturers.
• Slider Trays Trays for shipping, handling and washing heads/sliders, with custom designs available for specific requirements. Designed for hard disk drive slider manufacturing.
• OverPaks Container shipping products designed to protect enclosed devices during transit, with multiple designs and matrix options available and custom capabilities. Designed for transit protection of semiconductor devices.

Quantifiable outcome

• 2024 Supplier Excellence Award from Texas Instruments among 10,000+ suppliers
• +2 more outcomes

Named customers4 records

Segments4 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

Ten partnerships are on record, tiered core and minor.

• Redstone TechnicalcoreChannel Partner/ Reseller/ DistributorePAK stocking distributor in the USA providing local inventory and sales support for ePAK semiconductor handling products
• SPS InternationalcoreChannel Partner/ Reseller/ DistributorePAK stocking distributor in Europe (Netherlands) providing local inventory and sales support
• MYG TechminorChannel Partner/ Reseller/ DistributorePAK sales representative in Israel serving Kiryat Gat region
• Litetronics (S) Pte LtdminorChannel Partner/ Reseller/ DistributorChannel partner in Singapore
• Kanematsu KangawaminorChannel Partner/ Reseller/ DistributorChannel partner in Japan for ePAK semiconductor handling products
• NSI (Thailand) Co., Ltd.minorChannel Partner/ Reseller/ DistributorChannel partner in Thailand
• Jas Pak (S) Pte LtdminorChannel Partner/ Reseller/ DistributorChannel partner in Thailand
• Koike (M) Sdn. Bhd.minorChannel Partner/ Reseller/ DistributorChannel partner in Malaysia
• Micro Materials Pty Ltd.minorChannel Partner/ Reseller/ DistributorePAK sales representative in Australia (Malvern, Victoria)
• TopLineminorChannel Partner/ Reseller/ DistributorAuthorized partner for small volume tray purchases in Americas and Europe, providing access to ePAK products for lower-volume customers

Scale indicators4 records

Recent moves7 records

Expansion highlights4 records

Direct peers

• Entegris: Entegris is a leading US-based supplier of specialty materials and fluid handling products for the semiconductor industry, including 300mm FOUPs, FOSBs, wafer carriers, and contamination-control solutions. It is ePAK's most direct competitor in the wafer-handling market, serving the same fab and OSAT customer base with a broader portfolio.
• Miraial Co., Ltd. Miraial is a Japanese specialty manufacturer of wafer carriers, FOUPs, FOSBs, and reticle carriers serving semiconductor fabs globally. It is one of the established Japanese incumbents competing directly with ePAK in SEMI-compliant 300mm wafer handling, particularly in Asian fabs.
• Gudeng Precision Industrial: Gudeng Precision is a Taiwanese manufacturer of front-opening wafer carriers (FOUPs), FOSBs, and EUV reticle pods serving advanced-node foundries. As a Taiwanese supplier deeply embedded in TSMC's supply chain, it competes head-to-head with ePAK in the 300mm wafer handling category.
• Shin-Etsu Polymer: Shin-Etsu Polymer is a Japanese subsidiary of Shin-Etsu Chemical that manufactures wafer carriers, matrix trays, carrier tape, and semiconductor transfer products. It competes with ePAK across both front-end wafer handling and back-end IC shipping product categories.
• Dainichi Shoji Co., Ltd. Dainichi Shoji is a Japanese manufacturer specializing in wafer carriers, FOUPs, and shipping containers for the semiconductor industry. It is a long-standing niche competitor to ePAK in standard and specialized wafer handling products across Japanese and global fab customers.
• 3S Korea: 3S Korea is a Korean manufacturer of FOUPs, wafer carriers, and semiconductor handling consumables supplying Samsung and SK Hynix. It is a regional peer competing with ePAK in the Korean memory market for advanced-node wafer handling products.

Broad incumbents

• ASMPT (ASMI Pacific Technology): ASMPT is a global leader in semiconductor assembly equipment, packaging materials, and SMT solutions, serving the same OSAT and IDM customer base as ePAK. While focused on assembly machinery rather than consumable carriers, it overlaps with ePAK in serving back-end semiconductor packaging lines.
• TOWA Corporation: TOWA Corporation is a Japanese manufacturer of semiconductor encapsulation/molding equipment and precision-molded plastic components. It overlaps with ePAK's matrix tray and molded carrier businesses through precision polymer manufacturing for the same back-end customer base.
• Cohu, Inc. Cohu is a US-based supplier of semiconductor test handling equipment, test contactors, and inspection solutions serving OSAT customers. While its primary product is capital test equipment rather than consumables, Cohu competes with ePAK for share-of-wallet at the same back-end test and assembly houses.

Emerging players

• Daewon Semiconductor Industrial: Daewon Semiconductor Industrial is a Korean specialty manufacturer of carrier tape, matrix trays, and IC shipping products for the semiconductor industry. It is comparable to ePAK's IC Shipping & Handling division, serving similar back-end assembly customers in Asia.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/epak-international-inc

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles6 records

Subsidiaries6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ePAK International