What Semiconductor Equipment does

Semiconductor Equipment Corporation (SEC) is a privately held, California-based designer and manufacturer of manual and semi-automatic back-end semiconductor equipment, founded in 1975 and headquartered in Moorpark. The company's portfolio spans wafer mounting and backlap applicators (including 12-inch-capable systems), die bonders, die handlers, UV curing systems, flip-chip placement tools, rework stations, and ultrasonic dry cleaning systems. SEC also operates as an authorized North American distributor for Nitto Denko bonding tapes and Hugle Electronics cleaning products, bundling consumables with its equipment offering. With 11–50 employees and 46+ years of operating history, the firm serves customers in photonics, semiconductor, hybrid, and PCB end-markets, with named direct users including Waymo, Deep Space Systems, and FUTEK.

The firm's business model combines direct equipment sales in the United States with international fulfillment through a network of regional distributors covering Europe, Israel, India, and Asia Pacific (e.g., Chip Hua Equipment, whose end-customers include Micron, Halliburton, REC, Panasonic, and Flex). Revenue mechanics are anchored by capital-equipment sales at typical ASPs for the manual/semi-automatic segment, supplemented by recurring consumables pull-through from Nitto and Hugle distribution, plus an online webstore channel for accessories and smaller purchases. The product positioning targets R&D, prototyping, and low-volume production environments where fully-automatic high-end tools are uneconomical.

Strategic activity in the public record is dominated by incremental product launches and channel expansion rather than M&A, funding events, or major restructuring. Recent moves include the Model 3300 Wafer/Backlap Applicator launch (2025) adding 12-inch capability, continued promotion of Hugle cleaning products (2025), the Model 865 Die Bonder competitive positioning (2023), the Model 365 UV Curing System (2017), and the 2020 expansion of the online webstore. Geographic buildout proceeds via distributor partnerships rather than capital-intensive direct sales investment.

Name

Semiconductor Equipment

Legal name

Semiconductor Equipment Corporation

Website

https://semicorp.com

Company type

Private

Founded year

1975

Operating status

Operating

Headcount range

11–50 employees

Short description

Privately held manufacturer founded in 1975 that designs and builds manual and semi-automatic back-end semiconductor equipment — wafer mounters, die bonders, UV cure systems, and flip-chip placement tools — while distributing Nitto Denko tapes and Hugle cleaning systems globally.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM), Etchants & Cleaning Formulations (RCA, Piranha, Specialty Cleans) (IMAEAKAF)

Keywords

• Semiconductor assembly equipment
• Wafer dicing tapes
• Die bonding systems
• Flip chip placement
• FOUP cleaning systems

Headquarters

HQ city

Moorpark

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Equipment Sales: SEC designs and manufactures manual and semi-automatic assembly, rework, handling, and test equipment for semiconductor and electronics packaging industries. Core products include wafer mounters, die bonders, die handling systems, UV exposure systems, pick-and-place systems, and rework stations.
2. Dicing Tape and Consumables: SEC distributes semiconductor dicing tape including heat release tape (Revalpha), UV curable tape, standard dicing tape, and high purity tape. Also distributes film frames, adhesive products, and cleaning agents.
3. Authorized Distribution - Nitto Denko: Authorized distributor for Nitto Denko products including dicing and back-grinding tapes, REVALPHA heat-release tape, and semi-automatic and fully automatic wafer mounters and de-mounters.
4. Authorized Distribution - Hugle: Official distributor for Hugle International cleaning systems for FOUPs, RSPs, wafer cassettes, and dry-cleaning equipment for display and precision substrate applications.
5. Spare Parts and Service: SEC services everything they sell, providing spare parts, service support, training at their facility, and on-site installation and training at customer locations. Online store offers spare parts for mounters, bonders, and rework equipment.

Go-to-market motion3 records

Distribution channels4 records

Marketing channels5 records

Core offering

Semiconductor Equipment Corporation designs and manufactures manual and semi-automatic back-end semiconductor equipment, including die bonders, wafer tape applicators, UV exposure systems, pick-and-place systems, die ejectors, and rework stations. The company also distributes semiconductor dicing tapes and consumables (including Nitto Denko's REVALPHA heat-release tape) and FOUP/wet cleaning systems from Hugle International, serving the photonics, semiconductor, hybrid, and printed circuit industries with precision assembly, handling, rework, and test equipment.

Product overview

Semiconductor Equipment Corporation (SEC) is a designer and manufacturer of manual and semi-automatic back-end semiconductor equipment serving the photonics, semiconductor, hybrid, and printed circuit industries since 1975. The product portfolio includes SEC-designed die bonders (Model 850, Model 450), pick and place systems (Model 835), die handling equipment (Model 4750, Model 4800, Model 1810), UV exposure systems (Model 365), wafer tape applicators (Models 300, 3100, 3150), backlap applicators (Models 3200, 3250, 3300), and dicing tapes (Heat Release/Revalpha, High Purity, Standard, UV Curable). As an authorized distributor, SEC also offers Hugle container cleaning systems (IA-8, IF-12, SC-8, SR-EUV, UPC-12500 SORA, Ultrasonic Dry Cleaner) and Nitto Denko products (MSA840-II, dicing and back-grinding tapes including REVALPHA). The portfolio focuses on precision assembly, handling, rework, and test equipment for microelectronic device production.

Differentiator

Problem solved

Functional benefit

Products and services

• Heat Release Tape (Revalpha) Thermal release tape that adheres like normal adhesive but releases when heated, available in single-sided and double-sided configurations using polyester film base. Used for temporary holding of parts in polishing, mounting, and dicing processes.
• High Purity Tape High purity pressure sensitive expandable tape with low ionic impurities for clean room applications. Flexible PVC with synthetic acrylic adhesive for wafer sawing, scribing, and expanding operations.
• Standard Dicing Tape and Ink Jet Cover Tape Standard semiconductor dicing tape for wafer dicing and ceramic hybrid substrate sawing with various tack levels (low, medium, high) and thicknesses for different applications.
• UV Curable Dicing Tape High adhesive strength UV curable tape for wafer dicing with easy removal after UV exposure. Available in expandable and non-expandable polyolefin formulations for various wafer types including BGA and ceramic.
• Unibond Adhesive and Cleaning Agents (Aquabond) Water-soluble adhesive system for bonding quartz, fused silica, sapphire, ceramics and other materials without chemicals. Uses hot water debonding with environmentally friendly cleaning agents, achieving 100% water solubility at 80 degrees C allowing sewer discharge of spent cleaning solution.
• Wafer Film Frames Metal film frames for 6 inch and 8 inch diameter wafers, made from 400 series stainless steel with electropolish finish.
• Model 3100 Wafer/Film Frame Tape Applicator Manual tape applicator for up to 6 inch wafers with bubble-free mounting, temperature control up to 75 degrees C, captive roller assembly, and CE certification. Applies tape with optimal control of temperature and pressure parameters producing uniform bubble-free mounting for wafer dicing.
• Model 3150 Wafer/Film Frame Tape Applicator Manual tape applicator for wafers up to 8 inches with same features as Model 3100, including motorized take-up system option.
• Model 300 Wafer/Film Frame Tape Applicator Tape applicator for 300mm wafers with heated vacuum stage up to 60 degrees C, bubble-free application, and adjustable spring loaded platen for repeatable mounting pressure.
• Model 3200 Wafer/Backlap Applicator Protective tape applicator for wafers prior to backlapping with 4-8 inch capability, heated blade assembly, and optional deTaper for removing backgrinding tape.
• Model 3250 Wafer/Backlap Applicator Protective tape applicator for backlapping operations with bubble elimination and uniform tape tension.
• Model 3300 Wafer/Backlap Applicator Protective tape applicator with up to 12 inch wafer capability for protective tape application prior to backlapping.
• Model 365 UV Exposure System UV curing system with 5-second cure time, programmable N2 purge, touch screen control, 10,000 hour LED life, no ozone generation. Handles wafers up to 300mm.
• Model 4750 Die Ejector System (Poker Plate) Stand-alone die plating system for quick die removal from wafer mounting tape with only one moving part. Adaptable to most die handling and bonding systems.
• Model 4800 Die Ejector Grid Die loosening system using heat and vacuum to release die from tape, eliminating need for ejector pins or pokers which can break die. Features warming plate and vacuum chamber with temperature controller for 3mm+ die sizes.
• Model 835 Pick and Place System General purpose semi-automatic pick and place system for die and surface mount components with manually controlled Z motion, vacuum pickup, and drop down control arm for tool rotation.
• Model 1810 Die Matrix Expander Semiautomatic expander for 6 inch diced wafers on film frames with adjustable preheat timer, motorized stage stroke up to 90mm, and heated stage up to 100 degrees C.
• Model 850 Flip Chip Placement System Versatile semi-automatic placement system for flip chips, chip scale devices, and bare die with +/- 12 micron accuracy and up to 200 placements per hour throughput. Includes vision system, fluxing station, and optional heated stage and hot gas jet module.
• Model 450 Hot Gas Rework Station Rework station for removing surface mounted components and bonded die using hot gas jet up to 800 degrees C, heated work holder to 350 degrees C, with CE certification.
• Model 865 Die Bonder Die bonder with set-up speed, consistent precision within +/- 3 microns, flexibility for different materials and packages, user-friendly software system, reliability for minimized downtime, and cost-effectiveness compared to alternatives.
• IA-8 SMIF Pod Cleaning System Manually loaded SMIF pod washing system for 8 inch SMIF pods and open cassettes. Features DI water jet washing, hot air knife drying, with 1 set per 15 minute throughput.
• IF-12 FOUP/FOSB Cleaning System High throughput FOUP and FOSB cleaning system with super purity washing, hot air knife drying, and electrostatic discharge protection.
• Model SC-8 Semi-Automatic Cassette and Box Cleaning System Semi-automatic cleaning system for wafer carriers and boxes up to 8 inches with energy efficient design, hot air knife drying, and SEMI/CE/UL compliance.
• SR-EUV/200/150 Fully Automatic Reticle Pod Cleaning System Fully automatic EUV reticle pod cleaning system for RSP-200 and RSP-150 with nanometer particle removal, built-in robot self-cleaning, and compact footprint.
• UPC-12500 SORA Fully Automatic FOUP Cleaning System 300mm FOUP cleaning system with 20% higher throughput than conventional systems, 7 FOUP storage capacity, multi-joint robot, GEM300 compliance, and CLASS 10 or higher cleanliness with 2-fluid high-pressure jet cleaners.
• Ultrasonic Dry Cleaning Systems Non-contact dry cleaning system removing non-magnetic particles down to 1 micron using ultrasonic air, suitable for lithium-ion batteries, fuel cells, and next generation batteries.
• MSA840-II Nitto Denko Semiautomatic Wafer Mounter Semiautomatic wafer mounter distributed from Nitto Denko for semiconductor wafer mounting operations.
• SEC Spare Parts and Service Support SEC services everything they sell, providing spare parts, service support, training at their Moorpark facility, and on-site installation and training at customer locations. Online store offers spare parts for mounters, bonders, and rework equipment including replacement blades, heater elements, and nozzles.

Quantifiable outcome

• Model 850 Flip Chip Placement System achieves up to 200 placements per hour throughput
• +3 more outcomes

Named customers4 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Twelve partnerships are on record, tiered core, major and minor.

• Nitto DenkocoreChannel Partner/ Reseller/ DistributorSEC is an authorized distributor for Nitto Denko products in North America. Nitto Denko manufactures industry-leading dicing and back-grinding tapes including the innovative REVALPHA heat-release tape, as well as semi-automatic and fully automatic wafer mounters and de-mounters for advanced wafer handling and singulation processes.
• Hugle Electronics (Hugle International)coreChannel Partner/ Reseller/ DistributorSEC is the official distributor for Hugle International (Hugle Electronics) in North America. Hugle designs and manufactures cleaning systems for FOUPs, RSPs, and wafer cassettes, as well as dry-cleaning equipment for display and precision substrate applications, supporting contamination control in high-reliability manufacturing environments.
• Chip Hua Equipment & Tools Pte LtdmajorChannel Partner/ Reseller/ DistributorChip Hua Equipment & Tools Pte Ltd is one of the leading suppliers and service providers for the PCB assembly and semiconductor industries in Asia Pacific. Established in 1984, they represent SEC in Singapore, Malaysia, Indonesia, Thailand, and Taiwan with customers including Micron, Halliburton, REC, Panasonic, and Flex.
• First US Finance LLCminorOthersFirst US Finance provides equipment financing for all manufacturing equipment needs throughout the U.S.A., offering financing options for SEC customers purchasing equipment.
• Gray Gear GraphicsminorImplementation/ SI/ Consulting PartnerGray Gear Graphics provides web design and print design services for SEC's website and marketing materials.
• Alltek USA/ChinamajorChannel Partner/ Reseller/ DistributorAlltek serves as SEC's distributor in China and Hong Kong with offices in Beijing, Shanghai, Shenzhen, Chengdu, Wuhan, and Xi'an covering the entire China market.
• Production Test Systems Ltd.minorChannel Partner/ Reseller/ DistributorProduction Test Systems Ltd. represents SEC in the United Kingdom with coverage for England.
• Ortec MarketingminorChannel Partner/ Reseller/ DistributorOrtec Marketing Equipment & Supply Ltd. represents SEC in Israel covering the Israeli market for semiconductor equipment.
• MPE Nordic ABminorChannel Partner/ Reseller/ DistributorMPE Nordic AB represents SEC in Nordic countries including Sweden, Denmark, and Finland.
• Schubert TechnologiesminorChannel Partner/ Reseller/ DistributorSchubert Technologies represents SEC across Europe including Germany, Austria, Belgium, Holland, Luxembourg, Switzerland, and the Netherlands.
• Fab Finder KoreaminorChannel Partner/ Reseller/ DistributorFab Finder Korea represents SEC in the Korean market with operations in Republic of Korea.
• BSET EQ PHILS, Inc.minorChannel Partner/ Reseller/ DistributorBSET EQ PHILS, Inc. represents SEC in the Philippines covering the Philippine market for semiconductor equipment.

Scale indicators4 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• ASM Pacific Technology (ASMPT): ASMPT is one of the world's largest suppliers of semiconductor assembly equipment, offering die bonders, flip chip bonders, and packaging tools that overlap with SEC's product portfolio at much greater scale and automation level.
• Kulicke & Soffa: Kulicke & Soffa is a major incumbent in die bonding and semiconductor packaging equipment, competing with SEC across manual, semi-automatic, and fully automatic die bonding platforms.
• DISCO Corporation: DISCO is the global leader in wafer dicing and grinding equipment, with complementary dicing tape products that overlap with SEC's wafer mounting and dicing tape distribution offerings.

Direct peers

• West-Bond: West-Bond is a US-based manufacturer of wire bonders, die bonders, and related assembly equipment serving the hybrid microelectronics and semiconductor packaging markets, with a similar product positioning to SEC.
• Palomar Technologies: Palomar Technologies designs and manufactures precision die bonders and packaging equipment for photonics, microwave, and hybrid microelectronics—directly comparable to SEC's focus on VCSEL, laser diode, and hybrid electronics assembly.
• Advanced Dicing Technologies (ADT): ADT specializes in wafer dicing and singulation equipment including UV curable tape solutions, directly comparable to SEC's wafer mounting, dicing tape applicators, and UV cure systems.
• BE Semiconductor Industries (Besi): Besi is a leading global supplier of die bonding, flip chip, and packaging assembly equipment for the semiconductor industry, directly competing with SEC's Model 865 Die Bonder and Model 850 Flip Chip Placement System in the back-end assembly equipment market.
• MRSI Systems (Mycronic): MRSI Systems manufactures high-precision die bonders for photonics, datacom, and semiconductor packaging, directly competing with SEC's precision die and flip chip bonding tools in similar customer applications.
• Hesse Mechatronics: Hesse Mechatronics manufactures wire bonders and die bonders for semiconductor and microelectronics assembly, targeting similar photonics, automotive, and hybrid electronics customers as SEC.

Others

• Nitto Denko: Nitto Denko is SEC's distribution partner for dicing and back-grinding tapes, REVALPHA heat-release tape, and wafer mounters, but is also a manufacturer of similar products, making it both partner and adjacent competitor.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Semiconductor Equipment