What Advanced Dicing Technologies does

Advanced Dicing Technologies (ADT) is a private Israeli manufacturer founded in 1985 and headquartered in Yokneam that develops and produces precision diamond dicing saws, diamond dicing blades, and dicing peripheral equipment for the semiconductor and microelectronics industries. The company's product portfolio spans automatic and fully automatic dicing saws (single, dual, and 4-spindle configurations supporting 2-5 inch blades), a comprehensive blade range (resin bond, sintered metal, nickel bond, hub blades, and the proprietary Novus sintered blade line), and an ecosystem of peripherals including water recycling systems, wafer cleaners, UV curing systems, wafer mounters, spindle chillers, and CO2 injectors. ADT's products serve precision dicing applications across QFN/BGA/LED package singulation, glass and sapphire dicing, ceramic and LTCC substrate processing, MLCC and PZT component manufacturing, PCB and SAW device singulation, and silicon/GaAs wafer dicing.

The company sells through a hybrid direct-and-channel model: direct enterprise sales from its Israel headquarters complemented by direct sales offices in the USA (Horsham, PA and Tempe, AZ), China (Shanghai), and Taiwan (New Taipei City), with an authorized distributor network spanning over 40 countries across Europe, Asia-Pacific, the Middle East, Africa, and the Americas. Revenue is generated primarily through hardware sales of both capital equipment (dicing saws) and consumables (diamond blades, dressing boards, flanges), supplemented by technical support and training services. Pricing is quote-based and not publicly disclosed, consistent with a custom-engineered B2B equipment model. The company is led by founder Yaron Barkan as President and CEO, operates with 51-100 employees, and has no disclosed venture capital or private equity investment, suggesting it is self-funded and profitable. Recent strategic emphasis is on advanced packaging formats (FOPLP, FOWLP) and AI/HPC-related component dicing, positioning ADT to benefit from the projected 9.21% CAGR in the global semiconductor manufacturing equipment market.

Name

Advanced Dicing Technologies

Legal name

Advanced Dicing Technologies Ltd.

Website

https://adt-co.com

Company type

Private

Founded year

1985

Operating status

Operating

Headcount range

51–100 employees

Short description

Advanced Dicing Technologies is a private Israeli manufacturer of precision diamond dicing saws, diamond blades, and dicing peripheral equipment serving semiconductor, IC packaging, automotive electronics, and microelectronics manufacturers globally via direct offices and a 40+ country distributor network.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Precision dicing equipment
• Diamond dicing blades
• Semiconductor wafer dicing
• IC package singulation
• Dicing saw systems

Headquarters

HQ city

Yoqne`am `illit

HQ country

Israel

HQ region

Middle East

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Dicing Saws Equipment Sales: ADT generates revenue through the manufacture and sale of precision dicing saws including automatic, fully automatic, and specialty models. Equipment ranges from entry-level semi-automatic to high-end fully automatic multi-spindle systems. Pricing is quote-based and varies by configuration, spindle count, and automation level.
2. Diamond Dicing Blades: ADT manufactures and sells a comprehensive range of diamond dicing blades including resin bond, sintered metal, nickel electroformed, and hub blades. Blades are sold as consumables with recurring purchase patterns. Pricing varies by blade type, size, and specifications.
3. Dicing Peripherals and Accessories: Sale of dicing peripheral equipment including UV curing systems, wafer mounters, wafer cleaners, CO2 injectors, water recycling systems, spindle chillers, flanges, dressing boards, tools, frames, and cassettes. Also includes customization services and upgrade kits.
4. Technical Support and Training Services: ADT provides technical support services and training through its global support network. The company offers user manuals, technical documentation, and on-site engineering support for process optimization and blade selection.

Pricing tiers

Go-to-market motion2 records

Distribution channels4 records

Marketing channels7 records

Core offering

Advanced Dicing Technologies (ADT) develops and manufactures precision diamond dicing saws (automatic, fully automatic, and dual/multi-spindle configurations) and a comprehensive portfolio of diamond dicing blades (resin bond, sintered metal, nickel electroformed, hub, and proprietary Novus). The company complements this core equipment with peripherals such as UV curing systems, wafer mounters, wafer cleaners, water recycling systems, spindle chillers, and CO2 injectors for semiconductor, microelectronics, and automotive electronics manufacturers.

Product overview

Advanced Dicing Technologies (ADT) offers a comprehensive portfolio of precision dicing solutions for the semiconductor and microelectronics industries. The core offering consists of dicing saws (automatic and fully automatic models with single, dual, and multi-spindle configurations supporting 2"-5" blade diameters) and diamond dicing blades (resin bond, sintered metal, nickel bond, hub, and Novus blades). These are complemented by peripheral equipment (wafer cleaners, mounters, UV curing systems, water recycling, spindle chillers, CO2 injectors) and accessories (flanges, dressing boards, frames, process control tools). The products serve applications including QFN, BGA, LED, ceramic, glass, LTCC, MLCC, PZT, PCB, SAW devices, and silicon/GaAs wafer dicing across automotive, semiconductor, and microelectronics sectors.

Differentiator

Problem solved

Functional benefit

Brands

• Novus: Cutting-edge sintered dicing blades technology for BGA, LGA, and SIP applications with high stiffness and enhanced durability.

Products and services

• 80Ai Dicing System Fully automatic dual-spindle dicing system supporting blades up to 3" OD, capable of processing products up to 10 mm thick. Designed for AI-related components and advanced packaging applications including DC-to-DC converters, silicon wafers for memory and logic, MEMS, CMOS image sensors, FOPLP/FOWLP/QFN/BGA packaging.
• 8030 Fully Automatic Twin Spindle Dicing Saw High-end fully automatic twin spindle saw with support for up to 12" round products or 12"x12" square chucks. Features dual 2"-3" spindles, UV LED curing station, and stackable magazines holding up to 25 frames.
• 7304 Dicing Saw Fully automatic 4" spindle dicing saw, the only fully automatic 4-spindle dicing saw worldwide. Designed for hard materials such as glass, sapphire, and ceramics with support for up to 5" blade diameter, 10 mm thick workpieces, and high-power 2.5KW spindles.
• 80WT Dicing Saw Fully automatic dual-spindle dicing saw designed for precise step-cut wettable QFN dicing. Supports up to 12" by 12" square workpieces with dual facing 1.8KW spindles.
• AR-927 Water Recycling System Water recycling system for dicing operations providing water recirculation, high-end filtration (self-cleaning filter module), process stabilization, and environmental protection. Achieves 95-99% water recycling rate with flow capacity up to 20 L/min and temperature stability of ±1°C.
• Resin Bond Blades Diamond dicing blades with phenolic resin binder ideal for hard brittle materials including QFN/MLF, thick ceramic substrates, HTCC, and glass applications. Thickness ranges from 75µm to 2500µm.
• Sintered Metal Blades Metal-bonded sintered diamond blades with midrange wear between resin and nickel. Best suited for maintaining package shape and dimensions in BGA, soft alumina, LTCC, and ferrite applications; blade thickness from 80µm to 1500µm with diamond grit size 2µm to 70µm.
• Nickel Bond Blades Electroplated nickel-bonded diamond blades with longer blade life and lower wear rate. Ideal for soft material applications including PCB, silicon, and BGA. Thickness from 50µm (2 mil) to 300µm (12 mil), diamond grit size 3µm to 50µm.
• Hub Blades Diamond hub blades optimized for dicing processes on silicon wafers, gallium arsenide, and other wafer materials. Provide improved cut quality, longer blade life, and higher units-per-hour throughput.
• Novus Sintered Blades Proprietary sintered metal blades for BGA, LGA, and SIP applications. Provide high stiffness, enhanced durability, industry-leading radial wear control, blade life exceeding 15,000 meters, and feed rates up to 250 mm/sec.
• Spindle Chiller 937-A Closed-loop spindle cooling system providing precise temperature control for dicing spindles. Flow capacity up to 5 L/min, cooling capacity of 1000W at 20°C, supporting up to 3 dicing machines.
• Wafer Cleaner 977, 977L Compact post-dicing cleaning solution with adjustable rotating cleaning arms using atomizing or high-pressure nozzles. Supports workpieces up to Ø12" or 12"x12" square.
• CO2 Injector 947, AB-47 CO2 inline injector designed to eliminate particle adhesion and equipment damage caused by static effects by dissolving CO2 into deionized water for consistent resistivity control.
• UV Curing System AV-57L UV debonding system that reduces adhesion strength of UV-sensitive dicing tapes in controlled environments using 365nm UV wavelength with time-controlled process.
• Semi-Auto Wafer Mounter 967, 967L Semi-automatic wafer mounting system for automatic tape lamination supporting workpieces up to 300mm with automatic process control and minimal tape consumption.
• Manual Wafer Mounter 966, 966L Manual wafer mounting system for tape lamination with uniform tape tension, bubble-free mounting, and temperature-controlled chuck heater.

Quantifiable outcome

• Novus blade life exceeding 15,000 meters with superior package size retention for BGA/LGA/SIP applications
• +5 more outcomes

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

15 partnerships are on record, tiered core and minor.

• Accelonix BVcoreChannel Partner/ Reseller/ DistributorAccelonix BV serves as an authorized distributor for ADT in Belgium, Netherlands, Luxembourg, and the French-speaking area of Switzerland, providing local sales and support for dicing equipment, blades, and peripherals.
• Accelonix SAScoreChannel Partner/ Reseller/ DistributorAccelonix SAS serves as an authorized distributor for ADT in France and the French-speaking area of Switzerland, handling sales of dicing saws, blades, and peripherals.
• Minitron Electronik GmbHcoreChannel Partner/ Reseller/ DistributorMinitron Electronik GmbH serves as an authorized distributor for ADT in Germany, Austria, and the German-speaking area of Switzerland, providing sales and support for dicing solutions.
• Inseto (UK) LimitedcoreChannel Partner/ Reseller/ DistributorInseto (UK) Limited is an authorized distributor for ADT in England, Ireland, Scotland, and Northern Ireland, providing local sales and technical support for dicing equipment.
• Hightec Systems CorporationcoreChannel Partner/ Reseller/ DistributorHightec Systems Corporation serves as ADT's authorized partner for dicing equipment in Japan, providing sales, technical support and application assistance through Mr. Manabu Yamazaki.
• Tomoe Engineering Co., Ltd.coreChannel Partner/ Reseller/ DistributorTomoe Engineering Co., Ltd. serves as ADT's authorized distributor for dicing consumables and blades in Japan, managed by Mr. Tsunehiro Komori.
• Global Marketing Services (GMS)coreChannel Partner/ Reseller/ DistributorGlobal Marketing Services (GMS) serves as ADT's authorized partner in India, providing local sales and support for dicing equipment and blades.
• Millice Pte LtdcoreChannel Partner/ Reseller/ DistributorMillice Pte Ltd is an authorized distributor for ADT in Singapore and Indonesia, handling sales of blades, consumables, and equipment.
• ZETECH ONE (PTY) LTDminorChannel Partner/ Reseller/ DistributorZETECH ONE (PTY) LTD serves as ADT's authorized partner in South Africa, providing local sales and support.
• UD TECHNOLOGYminorChannel Partner/ Reseller/ DistributorUD TECHNOLOGY, represented by Mr. Boonyarit Hom-Udom, serves as ADT's authorized partner in Thailand.
• MEMS Enerji Sistemleri ve Teknoloji SanayiminorChannel Partner/ Reseller/ DistributorMEMS Enerji Sistemleri ve Teknoloji Sanayi ve Dış Tic. Ltd. Şti. serves as ADT's authorized partner in Turkey, located in Ankara.
• PBTminorChannel Partner/ Reseller/ DistributorPBT serves as ADT's authorized partner in Poland and Slovakia, providing local sales and support for dicing equipment.
• TLTSminorChannel Partner/ Reseller/ DistributorTLTS, managed by Harry Le – General Manager, serves as ADT's authorized partner in Vietnam, located in Ho Chi Minh City.
• SMT EuropeminorChannel Partner/ Reseller/ DistributorSMT Europe serves as ADT's authorized partner in Spain, located in Barcelona.
• Electron Mec s.r.lcoreChannel Partner/ Reseller/ DistributorElectron Mec s.r.l serves as ADT's authorized distributor in Italy, Greece, and the Italian-speaking area of Switzerland, handling sales of dicing equipment and blades.

Scale indicators6 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• DISCO Corporation: DISCO is the world's dominant manufacturer of dicing saws and precision grinding equipment, with the largest market share in semiconductor dicing. Both companies sell fully automatic dicing saws and diamond blades targeting the same QFN/BGA/silicon wafer customers.
• Tokyo Seimitsu (Accretech): Tokyo Seimitsu, operating as Accretech, manufactures dicing saws and CMP equipment for semiconductor back-end processing. It is the second major dicing saw brand alongside DISCO and competes head-to-head with ADT across silicon wafer and package singulation applications.
• Kulicke & Soffa Industries: Kulicke & Soffa supplies semiconductor assembly equipment including dicing and wafer preparation products, alongside its dominant wire bonding business. Overlaps directly with ADT in dicing for advanced packaging and IC assembly.
• Hanmi Semiconductor: Hanmi Semiconductor is a Korean back-end equipment maker specializing in sawing, sorting, and die-bonding equipment. It is a direct competitor to ADT in dicing saws for memory and advanced packaging, particularly in Korean IDM and OSAT accounts.
• SUSS MicroTec: SUSS MicroTec is a German manufacturer of advanced packaging equipment including mask aligners, bonders, and dicing/coating tools. It competes with ADT in dicing solutions for MEMS, advanced packaging, and microelectronics customers.

Broad incumbents

• Besi (BE Semiconductor Industries): Besi is a leading supplier of assembly equipment for the semiconductor industry, focused on die bonding, flip-chip, and packaging. While it does not specialize in dicing, it sells complementary back-end equipment into the same customer base and competes indirectly via integrated line solutions.
• ASMPT (ASM Pacific Technology): ASMPT is a global back-end semiconductor equipment supplier offering die bonding, packaging, and SMT solutions. Although dicing is not its core focus, it competes in broader back-end line sales where customers seek single-vendor solutions including dicing.

Others

• Onto Innovation: Onto Innovation supplies inspection, metrology, and lithography equipment for semiconductor and advanced packaging. It is adjacent rather than competitive, but its customers overlap with ADT's and the company is often evaluated alongside dicing equipment in advanced packaging line planning.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/@adtdicing
• LinkedInlinkedin.com/company/advanced-dicing-technologies-adt-international-ltd

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Advanced Dicing Technologies