i3 Electronics

What i3 Electronics does

i3 Electronics is a privately held U.S. electronics manufacturing services provider founded in 1995 and operating through two divisions: i3 Assembly in Binghamton, NY and i3 Microsystems in St. Petersburg, FL. The company delivers vertically integrated manufacturing spanning cable and harness assembly, printed circuit board assembly (PCBA), box builds, electromechanical turnkey system integration, kitting, and reliability/lab services for defense, aerospace, medical, transportation, and commercial/industrial customers. Its i3 Assembly division emphasizes high-mix/low-volume production with 350+ benches, 1,700+ hand tools, three-shift capacity, and over 200 AS9102 first articles per month.

i3 Microsystems, the higher-value division, is accredited as a DMEA Category 1A Trusted Foundry and designated Essential under the Defense Production Act Title III program. It offers advanced semiconductor packaging — wafer-level packaging, flip chip to 125 µm pitch, wirebond to 35 µm pitch, Fan-Out Wafer Level Packaging (FOWLP), and Die Extraction and Reassembly (DER) for obsolete microelectronics — anchored by Heterogeneous System-in-Package (HSiP) technology licensed from Draper Laboratory under a $14M DoD award. The St. Petersburg facility comprises 40,000 sq ft of secure manufacturing space including Class 10, Class 100, and Class 1000 cleanrooms. Named end uses include combat vehicles (M-ATV, Bradley, Stryker), CREW counter-IED systems, WIN-T, FBCB2/BFT, JBC-P, MFoCS, space platforms (AEHF, Europa, ISS), and implantable medical devices.

The business model is enterprise/government contract-based, with no publicly disclosed pricing; manufacturing services are quoted per program and supported by long-tail multi-year contracts. Go-to-market relies on direct enterprise field sales, defense industry events (e.g., AUSA), and technical publication at forums such as GOMAC and IMAPS. The company holds ITAR, DDTC, ISO 9001:2015, AS9100 Rev D, and multiple IPC Class 3 certifications, with a single disclosed acquisition (eV Products, 2009) and strategic alliances with Kulicke & Soffa, Draper, and ClassOne Technology. Revenue is not publicly disclosed and ownership is private with no disclosed institutional investors.

Name

i3 Electronics

Legal name

i3 Electronics Inc.

Website

https://i3electronics.com

Company type

Private

Founded year

1995

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

i3 Electronics is a privately held U.S. defense electronics manufacturer operating through i3 Assembly (cable/harness, PCBA, box builds) and i3 Microsystems (advanced semiconductor packaging and HSiP), serving DoD, aerospace, medical, and industrial customers from facilities in Binghamton, NY and St. Petersburg, FL.

Ownership category

akta.pro rank

Product category

Electronics Manufacturing Services

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Electronic Components, Nec (3679)

akta.pro primary industry

Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD)

Keywords

• Electronics manufacturing services
• Semiconductor packaging
• Cable harness assembly
• Defense electronics manufacturing
• Reliability testing services

Headquarters

HQ city

Endicott

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D

Revenue model

1. Electronics Manufacturing Services: Full turnkey electronic manufacturing including cable and harness assembly, PCBA, box builds, electromechanical system solutions, kitting services, and lab services. Manufacturing ranges from prototype to volume production with 3-shift capability.
2. Semiconductor Packaging: Advanced semiconductor packaging services including flip chip, wirebond, and heterogeneous integration for defense, aerospace, medical, and commercial applications. Revenue generated from wafer level packaging and system-in-package solutions.
3. Lab Services and Reliability Testing: Independent 3rd party test lab providing qualification testing, materials analysis, accelerated testing, and humidity testing for military platforms, supercomputing, medical devices, automotive, and telecommunications.

Pricing tiers

Go-to-market motion2 records

Distribution channels2 records

Marketing channels5 records

Core offering

i3 Electronics is an electronics manufacturing services company operating through two divisions: i3 Assembly (cable & harness assembly, PCBA, box builds, kitting, and turnkey electromechanical system solutions) and i3 Microsystems (advanced semiconductor packaging including flip chip, wirebond, heterogeneous System-in-Package, fan-out wafer level packaging, and die extraction and reassembly). The company also operates an independent third-party lab providing qualification testing, materials analysis, and reliability/failure analysis for defense, aerospace, medical, transportation, and commercial customers.

Product overview

i3 Electronics operates as two divisions: i3 Assembly and i3 Microsystems. i3 Assembly provides cable & harness assembly, PCBA, box build, kitting services, electromechanical system solutions (turnkey), and lab services/reliability testing. i3 Microsystems specializes in advanced semiconductor packaging including flip chip and wire bond, die extraction and reassembly (DER), and heterogeneous System-in-Package (HSiP) using fan-out wafer level packaging (FOWLP). Together, the company serves military, space, medical, transportation, and commercial/industrial markets with a vertically integrated structure from design through manufacturing.

Differentiator

Problem solved

Functional benefit

Products and services

• Cable & Harness Assembly Industry-leading cable and harness assembly services including coax, molded cables, power cables, and high-speed data cables, with DFM capabilities and extensive testing (VSWR, insertion loss, phase matching, HiPot) for defense, aerospace, and transportation customers.
• PCBA (Printed Circuit Board Assembly) Surface mount and pin-through-hole PCB assembly with mixed technologies, large board capability, NPI, quick turn, and full test solutions including flying probe, ICT, functional, burn-in, and ESS for military, medical, and industrial customers.
• Box Build End-to-end system integration including prototyping, robust system integration, and complete product testing and burn-in for radar, communications, and power distribution systems.
• Kitting Services Comprehensive kitting solutions with qualified supply base, modular work cells, and lean material handling for cables, harnesses, and accessories.
• Electromechanical System Solutions (Turnkey) Full system build services including chassis, mechanical, electrical, and cabinet assembly with paint, plating, conformal coating, metal fab, hardware, and software management.
• Lab Services and Reliability Testing Independent 3rd party lab services including qualification testing, materials analysis, accelerated life testing, humidity testing, and failure analysis for military, medical, and industrial applications, with 30 years of proven experience.
• Advanced Semiconductor Packaging Wafer-level, flip chip, and wire bond packaging assemblies from prototype to volume production, including flip chip to 125 μm pitch, heatspreader attach, and multiple dispensing capabilities for defense, aerospace, and medical applications.
• Die Extraction and Reassembly (DER) Die extraction and chip recovery services for obsolete IC replacement, providing planar bonding surfaces suitable for rebond with no voids or trapped contaminants.
• Heterogeneous System-In-Package (HSiP) Fan-out wafer level packaging technology enabling heterogeneous IC integration with up to 7 interconnect metal layers per side, 3D stacking capability, and significant SWaP reductions (up to 27x or greater) for defense, aerospace, and medical applications.

Quantifiable outcome

• Size reduction up to 27x or greater with System-in-Package technology (original PCB size 108 in2 to final SiP size 4 in2)
• +4 more outcomes

Named customers6 records

Segments5 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Two partnerships are on record, tiered core.

• Kulicke & SoffacoreTechnology or Integration · 16 December 2021Kulicke & Soffa collaborated with i3 Microsystems to develop solutions for next-generation advanced microelectronics packaging, focusing on advanced assembly and packaging technologies.
• Draper LaboratorycoreStrategic or Co-development Partner · 30 March 2021Draper Awarded $14M by DoD for Trusted Advanced Packaging Capability Expansion with i3 Microsystems as Major Subcontractor. Draper developed HSiP technology for DoD applications, now available under license to i3 for wider DoD, commercial, or industrial uses.

Scale indicators8 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Amkor Technology: Amkor Technology is one of the world's largest outsourced semiconductor assembly and test (OSAT) providers, with leadership positions in advanced packaging including fan-out wafer-level packaging (FOWLP) and 2.5D/3D integration. i3 is a smaller-scale direct peer because both provide flip chip, FOWLP, and HSiP-style heterogeneous integration services to defense, aerospace, and medical customers.
• ASE Technology Holding: ASE is the largest global OSAT offering flip chip, FOWLP, fan-out chip-on-substrate, and system-in-package assembly across consumer, automotive, and industrial end markets. i3 compares as a direct peer at the HSiP/SIP capability boundary — both bundle advanced packaging with substrate-level integration for high-reliability end applications.
• Creation Technologies: Creation Technologies is a North American-focused EMS provider specializing in high-mix/low-volume and complex PCBA for aerospace, defense, medical, and industrial customers. i3 is a direct peer because both operate secure, certified North American facilities serving defense primes with similar AS9100/ISO-mandated workflows.
• JCET Group: JCET (formerly STATS ChipPAC) is a top-three global OSAT with strong positions in flip chip, FOWLP, and System-in-Package assembly. Like i3, JCET supplies advanced heterogeneous integration services into automotive, communications, computing, and industrial end-markets, making it a direct capability peer despite operating at very different scale.
• National Technical Systems (NTS): NTS provides independent product testing, qualification, and reliability engineering for aerospace, defense, medical, and industrial customers. i3's Lab Services division competes directly with NTS for qualification, materials analysis, and accelerated life testing work on military and medical platforms.
• Sanmina: Sanmina is a global EMS provider with deep aerospace/defense, medical, and industrial verticals offering PCB fabrication, PCBA, cable, and full box-build integration. i3's vertically integrated PCBA-plus-semiconductor-packaging model mirrors Sanmina's Defense/Aerospace/Security segment, making it a direct services peer for U.S. defense program wins.
• Mercury Systems: Mercury Systems is a defense-focused mission-critical electronics provider serving DoD primes with RF, secure processing, and sensor subsystems. It is one of the most direct comparables to i3 because both operate trusted domestic electronics manufacturing for defense primes and compete for similar secure/SWaP-constrained program wins.
• Benchmark Electronics: Benchmark Electronics provides high-mix/low-volume EMS for aerospace, defense, medical, and industrial customers, including complex PCBA, RF, and microelectronics. i3 overlaps with Benchmark across PCBA, cable/harness, box build, and reliability testing specifically for defense and medical, with similar high-mix customer mixes.

Broad incumbents

• Kratos Defense & Security Solutions: Kratos is a defense technology prime that internally develops and manufactures unmanned systems, electronic warfare, and microwave electronics for DoD customers. It is a broader incumbent customer and potential supply-chain competitor to i3 in electronic warfare and secure microelectronic subsystems.
• Curtiss-Wright Defense Solutions: Curtiss-Wright is a diversified incumbent providing ruggedized electronics, mission-critical systems, and embedded computing for defense, aerospace, and industrial markets. While significantly larger and broader than i3, it competes for similar DoD platform electronics and secure computing programs where i3 supplies packaging and assemblies.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/i3-electronics-inc
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Compliance13 records

Revenue estimate

Valuation estimate

Number of profiles

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about i3 Electronics