Evatec

What Evatec does

Evatec AG is a Switzerland-headquartered, privately held manufacturer of production-grade thin-film deposition equipment, serving semiconductor, advanced packaging, optoelectronics, photonics, power device, wireless, and MEMS producers worldwide. The company designs and supplies capital equipment rather than films or consumables, monetizing through direct sales of batch, cluster, and inline platforms (BAK Family evaporators, CLUSTERLINE cluster platforms, HEXAGON, LLS EVO II, and SOLARIS inline systems) complemented by a global spare-parts, retrofit, upgrade, and training service organization across roughly six regional offices. Within those platforms, Evatec integrates its own PVD, PECVD (PLASMABOX), PEALD, etch, and Advanced Process Control technology modules, including differentiated capabilities in Advanced Directional Sputtering and HiPIMS for high-aspect-ratio and 3D device structures. The business is enterprise field-sales led, with quote-based multi-year capital-equipment contracts to tier-1 foundries, OSATs, IDMs, photonics fabs, and selected R&D institutions, and a long-tail service annuity built on its 2,000+ installed BAK and growing CLUSTERLINE base. Customer concentration is diversified across named anchor accounts such as SilTerra, SJ Semiconductor, SkyWater, Silex, Silicon Austria Labs, and Fraunhofer IZM, spanning commercial MEMS, advanced packaging, photonics, and academic research, which provides a hedge across end-market cycles. Headcount of roughly 550 employees worldwide, a 70-year technology heritage, and ISO 9001/14001/45001 plus SBTi-validated emissions commitments underpin credibility with European and Asian tier-1 procurement organizations. Near-term strategic emphasis is on capturing AI-driven demand for photonic, advanced-packaging, and RF substrates, evidenced by the CLUSTERLINE 310 launch, the Onto Innovation PACE partnership, and SAL/Qualcomm engagements on PEALD and PVD.

Name

Evatec

Legal name

Evatec AG

Website

https://evatecnet.com

Company type

Private

Founded year

2004

Operating status

Operating

Headcount range

501–1,000 employees

Short description

Evatec AG is a Switzerland-headquartered, privately held manufacturer of production-grade thin-film deposition platforms (evaporation, sputter, PECVD, PEALD, etch), supplying batch, cluster, and inline systems to semiconductor, advanced-packaging, optoelectronics, photonics, power-device, wireless, and MEMS manufacturers globally.

Ownership category

akta.pro rank

Product category

Thin Film Deposition Equipment

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344)

akta.pro primary industry

Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)

akta.pro secondary industry

Thin-Film Deposition Materials (PVD/CVD/ALD Targets & Precursors) (HDAHAGAH)

Keywords

• Thin film deposition
• Semiconductor manufacturing equipment
• PVD systems
• PECVD technology
• Advanced packaging equipment

Headquarters

HQ city

Trübbach

HQ country

Switzerland

HQ region

Europe

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales

Revenue model

1. Thin Film Production Equipment Sales: Evatec designs and manufactures production systems for thin film technology including batch, cluster and inline platform architectures. Revenue is generated through the sale of capital equipment including BAK Family evaporators, CLUSTERLINE cluster platforms, HEXAGON advanced packaging systems, LLS EVO II sputter tools, and SOLARIS inline platforms.
2. Spare Parts and Service: Global customer service organization provides spare parts, technical support, planned maintenance, retrofits and upgrades, and technical training services throughout the tool lifecycle.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels6 records

Core offering

Evatec designs and manufactures production platforms for thin film deposition, including batch, cluster, and inline platform architectures. The company offers customized engineering solutions equipped with evaporation, sputter, etch, and PECVD process technologies, targeting semiconductor, advanced packaging, optoelectronics, photonics, power device, wireless, and MEMS manufacturers. Evatec also provides global spare parts, technical support, maintenance, retrofits, upgrades, and training services across the equipment lifecycle.

Product overview

Evatec is a thin film technology company offering a portfolio of production platforms including batch evaporators (BAK Family), cluster platforms (CLUSTERLINE® Family), inline systems (SOLARIS® Family), and dedicated advanced packaging tools (HEXAGON, LLS EVO II). These hardware platforms are equipped with core deposition technologies: evaporation, sputtering, etch, and PECVD. The portfolio is complemented by enabling technologies including PVD, PECVD (PLASMABOX®), PEALD, APC (Advanced Process Control), and Etch Technologies. Software offerings include XPERIENCE Simulator for desktop-based training and recipe development. Evatec serves core markets of Advanced Packaging, Semiconductor, Optoelectronics, and Photonics, with global service and support capabilities.

Differentiator

Problem solved

Functional benefit

Brands

• CLUSTERLINE: Family of cluster platforms for wafer or panel processing up to 650mm
• BAK Family
• HEXAGON
• LLS EVO II
• SOLARIS
• LAYERS Magazine
• ECL (Evatec Competence Laboratory)
• PLASMABOX

Products and services

• BAK Family Evaporators ranging from 0.5 to 2.0 meters with over 50 years of process know-how. More than 2,000 systems installed globally, making the BAK the industry standard evaporator across semiconductor, optoelectronics and photonics applications.
• CLUSTERLINE Family A family of cluster platforms for wafer or panel processing up to 650mm. Features secure handling and precision processing across Advanced Packaging, Semiconductor, Optoelectronics, Photonics, Power Devices, Wireless, and MEMS applications.
• HEXAGON Production platform for wafer level processes in Advanced Packaging. Processes 300 or 200mm substrates with highest throughput achieving lowest Rc in the industry. Designed for UBM, RDL and Fanout applications.
• LLS EVO II Vertical batch sputter tool for metals, dielectrics and magnetic films. Compact design and flexibility make it cost effective for substrate sizes up to 200 x 230mm.
• SOLARIS Family Fully automated inline solutions for thin film production. Applications include Touch Panels, EMI Shielding, Power Devices, and Photovoltaics. S151 configured for substrates up to 8 inch diagonal; S380 for substrates up to 15 inch diagonal.
• XPERIENCE Simulator Desktop simulation software allowing personnel training, process recipe development and testing, and familiarization with new software updates before working with live equipment.
• Evatec Competence Laboratory (ECL) Thin film coating and characterization services including comprehensive thin film characterization techniques supporting customers with process development.
• Customer Service & Support Global customer service including spare parts, support solutions (remote and on-site), retrofits and upgrades, and technical training.
• CLUSTERLINE 310 Dedicated cluster platform for packaging applications on smaller panel sizes up to 310x310mm, targeting AI and high-performance computing applications.
• CLUSTERLINE 200 BPM CLUSTERLINE 200 BPM dynamic sputter system for Micro LED, Edge Emitting Lasers, and RF filters with award-winning performance in thin film deposition.
• BAK 911 Evaporator Evaporator with easier loading, better vacuum conditions, and higher repeatability.
• MULTI BAK MULTI BAK configuration with up to 4 process modules including load lock and handling for fully automated production.

Quantifiable outcome

• Over 2000 BAK systems installed globally across semiconductor, optoelectronics and photonics applications
• +2 more outcomes

Named customers7 records

Segments7 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Silicon Austria Labs (SAL)coreStrategic or Co-development Partner · 17 June 2026SAL expanded its research capabilities in Villach with a second Evatec CLUSTERLINE 200 system. The new system enables advanced thin-film processes for wireless, power, and MEMS applications. The partnership is formalized through a Memorandum of Understanding for strategic cooperation. The system includes advanced etching, sputtering, and high-temperature process capabilities with HiPIMS technology.
• C2MI (Centre de Collaboration MiQro Innovation)minorStrategic or Co-development Partner · 2 March 2026C2MI expanded its R&D capabilities with installation of two Evatec CLUSTERLINE 300 systems, enabling advanced thin film processes for MEMS and next-generation Advanced Packaging applications.
• Qualcomm/RF360 Europe GmbHcoreStrategic or Co-development Partner · 28 November 2024Collaboration under SAL's CHIP2SYS program to develop PEALD and PVD technology for next-generation Radio Frequency Front End (RFFE) components. SAL leads the project using PEALD and PVD for thin film layer deposition, Evatec provides hardware development support, and RF360 benchmarks processes and evaluates production readiness.
• Onto InnovationcoreTechnology or Integration · 6 September 2024Evatec partnered with Onto Innovation in the newly opened Packaging Applications Center of Excellence (PACE) in Wilmington, Massachusetts. The partnership aims to accelerate R&D in Panel Level Packaging (PLP) and enable 2.5D and 3D chiplet architectures and AI packaging. Evatec contributes its CLUSTERLINE 600 panel level PVD technology and thin film process expertise.
• STMicroelectronics, U Sound, EV Group (MUSIC Project)coreStrategic or Co-development Partner · 5 April 2024The MUSIC project combines expertise from Evatec, SAL, STMicroelectronics, U Sound, and EV Group to develop innovative MEMS-based microspeakers. Evatec contributes thin film deposition and etching technology to revolutionize the MEMS audio device field.
• Northeastern University SMART CenterminorStrategic or Co-development Partner · 3 September 2020The SMART Center added an Evatec CLUSTERLINE 200 to its nanofabrication capability for research on high-performance piezoelectric micro and nano systems. The partnership enables prototyping of cutting-edge sensing, computing, and communication devices.
• Fraunhofer IZM (Panel Level Packaging Consortium PLC 2.0)coreStrategic or Co-development Partner · 19 December 2019Evatec participates in the PLC 2.0 consortium with Fraunhofer IZM and 16 other companies focused on reaching the next level in Fan-Out Panel Level Packaging (FOPLP). The consortium addresses ultra-fine line processing, migration effects, and large-area panel challenges. Evatec provides CLUSTERLINE 600 technology for panel sizes up to 650x650mm.

Scale indicators4 records

Recent moves10 records

Expansion highlights6 records

Direct peers

• Veeco Instruments: US-based thin film deposition and etch equipment supplier focused on compound semiconductors, photonics, MEMS, and advanced packaging. Highly comparable business model and end-market overlap with Evatec, particularly in optoelectronics and RF.
• SPTS Technologies (KLA): KLA's plasma etch and deposition division serving advanced packaging, MEMS, RF, and photonics. Competes head-to-head with Evatec's CLUSTERLINE in wafer-level packaging, MEMS, and RF filter deposition.
• Aixtron: Specialist MOCVD/CVD deposition equipment supplier for LED, laser, power electronics, and photonics. Closely comparable in optoelectronics, Micro-LED, and compound semiconductor end-markets where Evatec also sells thin-film platforms.
• Ulvac: Japanese vacuum and thin-film equipment maker serving semiconductors, displays, and solar. Directly comparable to Evatec in evaporation, sputtering, and PECVD systems, with strong overlap in Asian customer base and MEMS/power device applications.
• ASM International: Specialist in atomic layer deposition (ALD) and epitaxy equipment for semiconductor manufacturing. Closest direct peer to Evatec's PEALD franchise and competes head-to-head in advanced-node dielectric and ALD film deposition.

Broad incumbents

• Lam Research: Major semiconductor equipment maker with leading positions in deposition and plasma etch. Competes with Evatec in PECVD, ALD, and advanced packaging deposition for memory and logic customers, with substantially larger scale and R&D budget.
• Applied Materials: Largest global supplier of semiconductor deposition (PVD/CVD/ALD) and adjacent process equipment. Directly competes with Evatec in PVD and advanced packaging, but serves a much broader process portfolio and customer base across leading-edge logic, memory, and display.
• Tokyo Electron (TEL): One of the largest Japanese semiconductor production equipment manufacturers, competing across deposition, etch, and cleaning. Overlaps directly with Evatec's PVD, PECVD, and ALD offerings across logic, memory, and packaging.

Regional players

• NAURA Technology Group: China's largest domestic semiconductor equipment manufacturer, expanding into PVD, PECVD, and ALD tools. Regional competitor to Evatec inside China, particularly for advanced packaging customers seeking domestic supply chains.

Emerging players

• SÜSS MicroTec: Specialist in advanced packaging, MEMS, and compound semiconductor equipment. Overlaps with Evatec in wafer-level and panel-level packaging process tools, though SÜSS is more focused on lithography/coating rather than deposition.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

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Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles13 records

Subsidiaries5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Evatec