What F&K Delvotec does

F&K Delvotec Bondtechnik GmbH, founded in 1978 and headquartered in Ottobrunn, Germany, manufactures ultrasonic wire bonding machines and laser bonding systems used to interconnect electronic components. Its product portfolio spans two main lines: the M17 ultrasonic wire bonder platform (M17S, M17D, M17L, M17XL) with patented Bond Process Control and exchangeable bond heads, and the LAZ-series laser bonders (DelvoLAZ, MegaLAZ, GigaLAZ) plus M17LSB combination machines developed in cooperation with Fraunhofer ILT Aachen. Applications include wire diameters from 17 to 600 micrometers and ribbon cross-sections up to 2,000 x 300 micrometers, serving semiconductor packaging, power electronics, e-mobility/battery assembly (Cell-to-Module, Cell-to-Pack, Cell-to-Chassis), and automotive electronics customers.

The company operates a direct enterprise sales model with quote-based, customer-configured pricing and quote-based multi-year contracts. Revenue derives from hardware sales of machines (the core stream) complemented by professional services: Bond Academy consulting, structured Basic and Engineer training programs, lifetime service contracts, and RMA-based repair/returns. Wholly-owned subsidiaries in the USA (Foothill Ranch, CA, 1994), Singapore (1989), and China (Shanghai and a Taicang Demo Center) handle regional sales, applications support, and customer demonstrations. Marketing is heavily event-driven, with consistent participation in Semicon (China, Taiwan, Southeast Asia), The Battery Show, PCIM Europe, SMTconnect, automatica, LASERWorldofPHOTONICS, and productronica.

F&K Delvotec has been a wholly-owned subsidiary of Strama Group since 2014/2017, a diversified special-machinery group with 1,700+ employees globally. The company itself operates with 11–50 employees. It holds ISO 9001, ISO 14001, and ISO 45001 certifications and LkSG whistleblower compliance. Management is led by Managing Directors Martin Ebner (M.Sc., MBA) and Uwe Heinrich (recently retired after ~33 years), with Dr. Hans-Georg von Ribbeck heading Bond Academy and Research Projects. Only one named customer logo (Infineon, recognized at the 2023 Wire Bond and Metrology Forum) is disclosed in available materials, and revenue figures are not publicly disclosed.

Name

F&K Delvotec

Legal name

F & K DELVOTEC Bondtechnik GmbH

Website

https://fkdelvotec.com

Company type

Private

Founded year

1978

Operating status

Operating

Headcount range

11–50 employees

Short description

F&K Delvotec, founded 1978 in Germany, manufactures ultrasonic wire bonders and laser bonding systems for semiconductor packaging, power electronics, and EV battery assembly. The company sells globally via direct enterprise sales and wholly-owned subsidiaries in the US, Singapore, and China.

Ownership category

akta.pro rank

Product category

Wire and Laser Bonding Equipment

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Leadframes & Package Interconnect Materials (HDAHADAF)

Keywords

• Ultrasonic wire bonding
• Laser bonding equipment
• Wire bonders
• Battery assembly machines
• Power electronics bonding

Headquarters

HQ city

Ottobrunn

HQ country

Germany

HQ region

Europe

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Wire Bonder Machines: Sale of ultrasonic wire bonding machines including M17S, M17D, M17L, and M17XL models. Machines are configurable for different wire bonding processes and automation levels.
2. Laser Bonder Machines: Sale of laser bonding machines including LAZ series (DelvoLAZ, MegaLAZ, GigaLAZ) and M17LSB combination machines. Advanced connection technology for large conductor cross-sections in power electronics.
3. Service and Maintenance: Service during installation, training of operators and engineers, and ongoing service during entire product lifetime to ensure consistent high quality bonding performance.
4. Training Services: Basic Training (1 day) and Engineer Training (2 days) programs conducted at F&K Delvotec premises in Straubing or on-site at customer facilities. Training covers wire bonding operation, setup, optimization, and process management.
5. Bond Academy: Consulting, services, and analysis for optimized bonding processes. Advisory services for correct design of bond joints and process optimization.
6. Returns and Repairs: RMA (Return Material Authorisation) process for returns and repairs of machines with formal authorization procedures.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels4 records

Core offering

F&K Delvotec designs, manufactures, and services ultrasonic wire bonders (M17 series: M17S, M17D, M17L, M17XL) and laser bonders (LAZ series: DelvoLAZ, MegaLAZ, GigaLAZ, plus M17LSB combination machines) used to contact electronic components in semiconductor, power electronics, and e-mobility/battery applications. The company complements its machines with Bond Academy consulting, training programs, lifetime service, automation integration, and RMA returns processing.

Product overview

F&K Delvotec is a specialist in assembly and connection technology, offering two main product lines: Ultrasonic Wire Bonders (M17 series: M17S, M17D, M17L, M17XL) and Laser Bonders (LAZ series including DelvoLAZ, MegaLAZ, GigaLAZ, plus M17LSB L and M17LSB XL combination machines). The M17 platform provides a unified basic machine with exchangeable bonding heads and a single software for all bonding processes. The LAZ series, developed in cooperation with Fraunhofer Institute for Laser Technology, combines wire bonding and laser welding for power modules and battery assembly applications. Complementing the hardware, the company offers services including Bond Academy consulting, Training programs, Service support, and RMA returns processing. Founded in 1978, the company is part of Strama Group and serves the semiconductor, automotive, e-mobility, and power electronics industries.

Differentiator

Problem solved

Functional benefit

Brands

• LAZ-Series: Laser bonding machines developed in cooperation with Fraunhofer Institute for Laser Technology, including DelvoLAZ, MegaLAZ, and GigaLAZ for battery assembly applications
• M17 Series
• Bond Academy
• Bond Process Control

Products and services

• M17S Wire Bonder Fully automatic ultrasonic wire bonder with one bond head and compact, space-saving design. Working area: X = 254 mm, Y = 152 mm, Z = 40 mm. Features patented Bond Process Control for continuous monitoring and active control of bonding energy. Versatile automation from manual to inline.
• M17D Wire Bonder Fully automatic wire bonder with two bond heads, the only wire bonder on the market offering combination of thin wire and thick wire in one process on one machine. Working area: X = 254 mm, Y = 153 mm, Z = 40 mm (optional 60 mm). Designed for mass production of power semiconductors and power modules in the automotive industry.
• M17L Wire Bonder Fully automatic wire bonder with the world's largest working range for thin wire bonding. Wire diameter 17 to 600 µm, max. ribbon cross-section 2,000 x 300 µm. Working area: 635 mm (X) x 350 mm (Y), 100 mm (Z). Convertible to deep-access or thick-wire bond heads. Features patented Bond Process Control.
• M17XL Wire Bonder Fully automatic wire bonder with the world's largest working area: 1,130 mm (X) x 700 mm (Y) - almost one square metre. Robot arm guides the bonding head completely vibration-free across the working area. Suitable for bonding large components such as battery modules for electric vehicles or concentrator cells.
• M17LSB L Combination Bonder Combination of laser welding and wire bonding developed with Fraunhofer ILT Aachen. Functionality engages where ultrasonic bonding reaches its technological limits. Allows XYZ position tolerances vs. laser welding via touchdown sensor and image recognition. Suitable for terminal contacting for power modules and battery assembly.
• M17LSB XL Combination Bonder Laser bonding in XL format combining laser bonding of ribbons and laser tab bonding of connectors without conversion. Greater current-carrying capacity from larger conductor cross-sections. Allows XYZ position tolerances via touchdown sensor and image recognition. Developed in cooperation with Fraunhofer ILT Aachen.
• DelvoLAZ Laser Bonder Part of the LAZ-Series. Working area 1,250 x 500 x 100 mm with machine dimensions 1,300 x 2,500 x 2,400 mm (WHD). IR-Fiber Laser (500W-1.5kW), scan range 10 x 10 mm, repeatability < ±10 µm. Welds aluminum, copper, or nickel ribbons using laser energy at low bond forces. Interfaces include TCP/IP, SFTP, PROFINET.
• MegaLAZ Laser Bonder Part of the LAZ-Series providing state-of-the-art solutions for Cell-to-Module, Cell-to-Pack, and Cell-to-Chassis battery applications. Working area 2,400 x 1,500 x 400 mm.
• GigaLAZ Laser Bonder Largest machine in the LAZ-Series. Working area 2,400 x 1,600 x 400 mm. IR-Fiber Laser 500W-1.5kW, spot diameter 35-40 µm, camera-based positioning, repeatability < ±10 µm. Includes conveyor system, robotics, and laser cabin with fire alarm, suction and filter unit. Automatic laser power, focus, and caustic measurement plus Laser Welding Monitor with real-time interface.
• Bond Academy Consulting, services, and analysis for optimized bonding processes. Provides advisory services and support for correct design of bond joints and bonding process optimization, leveraging 45+ years of bonding expertise.
• Training Programs Training courses on wire bonding and operation of F&K Delvotec machines. Basic-Training (1 day) for bond beginners and Engineer-Training (2 days) for setters and process managers. Delivered at F&K Delvotec premises in Straubing or on-site at customer facilities.
• Service & Lifetime Support Service covering the entire product lifetime: pre-sale product development consultation, service during installation (operator training), and ongoing service support to ensure consistent high bonding quality throughout machine life.
• Automation Solutions Customized automation solutions from manual to inline, including conveyor lines for in-line automation and customer-specific indexer systems for components or workpiece carriers. Configured to match the automation depth required for each customer's products (Smartamation concept).

Quantifiable outcome

• Bond head changeover in less than 15 minutes
• +4 more outcomes

Named customers1 record

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

One partnership is on record.

• Fraunhofer Institute for Laser Technology (ILT) AachencoreStrategic or Co-development PartnerClose cooperation in developing the LAZ-series laser bonding technology. The combination of wire bonding and laser welding was developed in cooperation with Fraunhofer ILT Aachen. This partnership enables advanced laser micro welding solutions for package interconnections in power modules and battery pack assembly.

Scale indicators4 records

Recent moves10 records

Expansion highlights5 records

Broad incumbents

• ASMPT (ASM Pacific Technology): Hong Kong-listed global supplier of semiconductor assembly equipment including wire bonders (via Hesse Mechatronics) and die bonders. ASMPT's acquisition of Hesse creates direct overlap with F&K's core product line in semiconductor and power electronics packaging.
• Kulicke & Soffa Industries: Global market leader in wire bonding equipment with a broad portfolio spanning semiconductor packaging, LED, and power electronics. Much larger incumbent competing head-on with F&K in ultrasonic wire bonding machines and serving many of the same tier-1 customers.
• BE Semiconductor Industries (Besi): Leading supplier of die-bonding equipment and assembly systems for the semiconductor industry. Besi's hybrid bonding and advanced packaging solutions compete for capital budgets alongside F&K's wire and laser bonders, particularly in power electronics and EV applications.
• Panasonic Factory Solutions: Japanese conglomerate offering wire bonders and semiconductor assembly equipment alongside a much broader factory automation portfolio. Competes with F&K in semiconductor packaging equipment while offering significantly broader scale and geographic reach.

Direct peers

• Palomar Technologies: US-based manufacturer of precision wire bonders and die bonders for photonics, RF, and microelectronic packaging. Competes with F&K in microelectronics and specialized packaging niches, particularly MEMS and hybrid assembly.
• Toray Engineering: Japanese manufacturer of wire bonders and semiconductor assembly equipment. Competes with F&K in ultrasonic wire bonding machines, particularly in the Japanese and broader Asian semiconductor packaging markets.
• Questar Products: Manufacturer of automated wire bonders and laser welding equipment for medical device, automotive, and electronic component assembly. Overlaps with F&K in laser-based bonding/welding systems and ultrasonic wire bonding for industrial applications.
• Hesse Mechatronics: German manufacturer of wire bonders (now part of ASMPT) and one of the closest direct competitors to F&K Delvotec. Hesse's thin and heavy wire bonders serve the same semiconductor and power electronics customer base, including EV and battery applications.
• DIAS Automation: Manufacturer of ultrasonic wire and ribbon bonders for power electronics, automotive, and battery applications. Direct competitor to F&K in heavy-wire and ribbon bonding for power modules, including SiC-based power semiconductor packaging.

Emerging players

• TPT Wire Bonder: Germany-based wire bonder specialist focused on research, prototyping, and small-series production. While smaller and more focused on lab/R&D rather than high-volume manufacturing, TPT overlaps with F&K in ultrasonic bonding technology for specialized applications.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about F&K Delvotec