What ASMPT does

ASMPT (ASM Pacific Technology Ltd., HKEX: 0522) is a Singapore-headquartered, publicly listed global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, founded in 1975 and operating with 10,000+ employees across Asia, Europe, and the Americas. The company operates two core business segments. The Semiconductor Solutions segment provides die bonding, wire bonding, encapsulation, laser dicing, and advanced packaging equipment, with particular strength in thermo-compression bonding (TCB) for HBM memory stacking and hybrid bonding for 2.5D/3D chiplet integration critical to AI chip manufacturing. Key products include the AERO PRO wire bonder, ALSI LASER1206 laser dicing platform, CamSpector PRO inspection tool, ASMPT AMICRA ultra-precision die attach systems (submicron ±0.2µm@3s accuracy), and NEXX panel-level deposition equipment (being divested to Applied Materials for $120 million).

The SMT Solutions segment provides surface mount technology equipment including the SIPLACE placement platform family (V, SX, TX, TX micron, X S, CA2), DEK screen printers (TQ, TQ XL, Galaxy, NeoHorizon), Process Lens SPI inspection systems, and the WORKS Software Suite. ASMPT also owns Critical Manufacturing, a subsidiary providing AI-ready Manufacturing Execution Systems (MES) with subscription/licensing economics. Customers include SK hynix and Samsung Electronics for HBM and AI packaging, Texas Instruments and Amkor Technology (both consecutive-year supplier excellence award winners), TATA Electronics, Siemens, Zollner Elektronik, and KATEK, with the company targeting 35-40% share of the global TC bonding equipment market. The company is evaluating strategic options for its SMT Solutions segment and divesting NEXX to concentrate on AI-driven advanced packaging, with revenue mix dominated by quote-based hardware sales supplemented by aftermarket service and subscription software.

Name

ASMPT

Legal name

ASM Pacific Technology Ltd.

Website

https://asmpt.com

Company type

Public

Founded year

1975

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

ASMPT is a global supplier of semiconductor assembly and packaging equipment and SMT solutions, providing TCB and hybrid bonding tools for HBM and AI chip manufacturing, plus SMT placement, printing, and MES software, serving major semiconductor manufacturers, OSATs, and electronics OEMs worldwide.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)

Keywords

• Semiconductor assembly equipment
• Advanced packaging equipment
• Surface mount technology
• Thermo-compression bonding
• Manufacturing execution systems

Headquarters

HQ city

Singapore

HQ country

Singapore

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Assembly & Packaging Equipment: Sale of equipment for die bonding, wire bonding, encapsulation, laser dicing and advanced packaging including TCB and hybrid bonding tools for AI, HBM, and chiplet applications.
2. SMT Solutions Equipment: Surface mount technology equipment including SIPLACE placement platforms, DEK printers, inspection systems, and software for electronics manufacturing.
3. Manufacturing Execution Systems (MES): Critical Manufacturing MES software providing AI-ready Industrial Operations Platform for electronics manufacturers, offered as subscription or license.
4. Service and Support: Aftermarket service, spare parts, training, and technical support for semiconductor and SMT equipment.

Go-to-market motion1 record

Distribution channels3 records

Marketing channels11 records

Core offering

ASMPT designs, manufactures, and services capital equipment and software for semiconductor back-end assembly and packaging (die bonding, wire bonding, encapsulation, laser dicing, advanced packaging including TCB and hybrid bonding) and for electronics Surface Mount Technology (SMT) lines (SIPLACE placement platforms, DEK printers, inspection tools, MES and analytics software). Its tools are supplied to memory makers, foundries, IDMs, OSATs, and electronics OEMs for AI/HBM stacking, 5G, automotive, and consumer applications, supported by an installed-base service business.

Product overview

ASMPT (ASM Pacific Technology Ltd.) is a global technology company providing integrated hardware and software solutions for semiconductor and electronics manufacturing. The company operates two core business segments: Semiconductor Solutions and SMT Solutions. Semiconductor Solutions encompasses wafer-level and panel-level packaging equipment including thermo-compression bonding (TCB) tools, hybrid bonding systems, wire bonders (AERO PRO), laser dicing (ALSI LASER1206), and inspection tools (CamSpector PRO), serving AI, HBM, 5G, automotive, and data center applications. The SMT Solutions segment includes SIPLACE placement platforms (V, SX, TX, TX micron, X S, CA2), DEK screen printers (TQ, TQ XL, Galaxy, NeoHorizon), inspection solutions (Process Lens SPI), and the WORKS Software Suite for intelligent factory management. The company also operates Critical Manufacturing MES (Manufacturing Execution System) subsidiary and ASMPT AMICRA (acquired 2021) for ultra-precision die attach equipment. ASMPT divested its NEXX business to Applied Materials in 2026 and is currently evaluating strategic options for its SMT Solutions segment to focus on high-margin advanced packaging for AI chips.

Differentiator

Problem solved

Functional benefit

Brands

• SIPLACE: SMT placement platform solutions including SIPLACE V, SIPLACE SX, SIPLACE TX, SIPLACE TX micron, SIPLACE X S, SIPLACE CA2 for high-precision electronic component placement.
• DEK
• WORKS Software Suite
• Critical Manufacturing
• ASMPT AMICRA
• SMT Analytics
• ALSI

Products and services

• Semiconductor Solutions segment ASMPT's semiconductor segment provides equipment for die bonding, wire bonding, encapsulation, and advanced packaging — including thermo-compression bonding (TCB) and hybrid bonding tools — used by memory makers, foundries, IDMs and OSATs to manufacture AI, HBM, 5G/6G, automotive and data center chips.
• SMT Solutions segment ASMPT's SMT segment provides printing, placement, inspection, and software solutions for electronics manufacturing, including SIPLACE placement platforms, DEK screen printers, Process Lens SPI inspection, WORKS Software Suite and SMT Analytics.
• Critical Manufacturing MES Manufacturing Execution System software that unifies MES, connectivity, automation, analytics, and AI to help electronics manufacturers manage high-mix production and operate intelligent factories. Sold to electronics manufacturers under subscription or license.
• SIPLACE V Next-generation SMT placement platform combining performance, flexibility, and precision with full compatibility to existing SIPLACE lines, designed for further automation, efficient big-data processing and long-term investment security.
• SIPLACE SX High-performance SMT placement machine for flexible electronics manufacturing.
• SIPLACE TX High-speed SMT placement platform with advanced capabilities for precision component placement.
• SIPLACE TX micron Ultra-precision variant of SIPLACE TX for micron-level placement accuracy.
• SIPLACE X S SMT placement solution for high-mix production environments.
• SIPLACE CA2 Dual-side placement platform combining capabilities for complex mixed-technology assemblies.
• DEK TQ Precision SMT screen printer for standard and mid-size PCB applications with high accuracy and stable processes.
• DEK TQ XL Large-format SMT screen printer extending the proven DEK TQ platform, developed specifically for large-format and highly complex PCB applications where conventional solutions reach their limits.
• DEK Galaxy SMT screen printing platform for high-volume production applications.
• DEK NeoHorizon SMT screen printer for next-generation electronics manufacturing.
• Process Lens / Process Lens HD (SPI) Solder Paste Inspection (SPI) systems for verifying print quality in SMT manufacturing.
• WORKS Software Suite Software suite covering WORKS Planning, Logistics, Preparation, Operations, Monitoring, Optimization, Integration, and Programming for intelligent factory management of SMT lines.
• SMT Analytics Analytics software with AI-supported analyses to increase transparency and line throughput, featuring analytics functions and natural language AI interactions.
• Thermo-Compression Bonding (TCB) Equipment Thermo-compression bonding tools for chip-to-substrate and chip-to-wafer HBM stacking, including 12-layer HBM4-capable equipment, sold to memory and AI chip manufacturers.
• Hybrid Bonding Equipment Hybrid bonding tools for 2.5D/3D chip stacking and heterogeneous integration enabling AI accelerator and high-performance computing designs.
• CamSpector PRO Advanced packaging inspection tool for quality verification in semiconductor assembly.
• AERO PRO Wire Bonder Wire bonder for semiconductor packaging serving AI, HPC, and advanced applications.
• ALSI LASER1206 Modular multi-beam laser dicing and grooving platform for semiconductor companies specializing in advanced packaging for AI and smart mobility markets.
• ASMPT AMICRA (CoS, NOVA Pro, NANO die bonders and High Speed Dispensing) Ultra-high precision die attach equipment line including CoS Die Bonder, NOVA Pro, NANO and High Speed Dispensing System, used in photonics, silicon photonics, 3D IC, TSV, TCB, Fan-out/EWLP, automotive sensors and LiDAR applications.
• AEi (Automation Engineering Inc.) Automotive Camera Active Alignment Automated sensor assembly and test equipment focused on automotive camera active alignment, serving security surveillance, drone and LiDAR markets.
• Aftermarket Service, Spare Parts, Training, and Technical Support Aftermarket service, spare parts, training, and technical support for the installed base of semiconductor and SMT equipment, generating recurring service revenue.

Quantifiable outcome

• 146% year-over-year revenue growth in TC bonding machines in 2024
• +3 more outcomes

Named customers12 records

Segments6 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability5 records

Feature10 records

Partnerships

Nine partnerships are on record, tiered core and minor.

• TATA ElectronicscoreStrategic or Co-development Partner · 1 September 2025India-based TATA Electronics partnered with ASMPT in September 2024 to strengthen India's semiconductor supply chain, focusing on workforce training and R&D in wirebond, flip chip, and advanced packaging technologies. This strategic collaboration supports India's semiconductor manufacturing ambitions.
• EV GroupcoreStrategic or Co-development PartnerASMPT and EV Group joined forces to enable the industry's first ultra precision die-to-wafer hybrid bonding solutions for 3D-IC heterogeneous integration. This collaboration combines both companies' expertise in bonding and wafer-level packaging.
• IBM ResearchcoreStrategic or Co-development PartnerASMPT collaborates with IBM Research on AI chip technology, including deepening collaboration to advance bonding methods for chiplet packages designed for AI applications.
• KOKUSAI ELECTRICcoreStrategic or Co-development PartnerASMPT and KOKUSAI ELECTRIC joined forces to accelerate 2.5D and 3D heterogeneous integration technology development, including joint development agreement for hybrid bonding and micro-bump technologies.
• Critical ManufacturingcoreOthersCritical Manufacturing is a subsidiary of ASMPT providing next-generation Manufacturing Execution Systems (MES). At APEX EXPO 2026, ASMPT and Critical Manufacturing jointly demonstrated AI-ready Industrial Operations Platform for electronics manufacturers.
• Applied MaterialscoreOEM/ Whitelabel/ Licensing PartnerApplied Materials acquiring ASMPT's NEXX business unit for $120 million in May 2026. NEXX develops panel-level plating equipment for semiconductor packaging. ASMPT had classified NEXX as discontinued operation in 2025 in anticipation of divestment.
• JOINT3 ConsortiumminorStrategic or Co-development PartnerASMPT joined the JOINT3 consortium to develop next-generation semiconductor packaging technologies through collaborative research.
• Tianshui Huatian Electronic GroupminorChannel Partner/ Reseller/ DistributorTianshui Huatian Electronic Group signed letters of intent worth over $130 million at CIIE for semiconductor assembly equipment and solutions.
• Jiujiang Municipal GovernmentminorOthersAgreement signed to build semiconductor materials plant in Jiujiang Economic and Technological Development Zone in China.

Scale indicators9 records

Recent moves6 records

Expansion highlights7 records

Direct peers

• Kulicke & Soffa Industries: Kulicke & Soffa is a leading global supplier of semiconductor assembly equipment, particularly wire bonders, die bonders, and advanced packaging tools. It is ASMPT's closest direct competitor across multiple bonding equipment categories and serves overlapping OSAT and IDM customers.
• Besi (BE Semiconductor Industries): Besi is a Dutch-headquartered leader in die bonding and hybrid bonding equipment for advanced semiconductor packaging. It competes head-to-head with ASMPT in TCB and hybrid bonding for HBM and chiplet applications serving the same AI memory ecosystem.
• Hanmi Semiconductor: Hanmi Semiconductor is a Korean specialist in TCB equipment for HBM memory stacking and a direct competitor to ASMPT in serving SK hynix and Samsung. It is central to the current Korean patent litigation referenced in ASMPT's market context.
• Hanwha Semitec: Hanwha Semitec (formerly Hanwha Techwin) is a Korean TCB equipment competitor focusing on HBM memory packaging tools. It competes with ASMPT for HBM customer share and is party to the active Korean patent disputes affecting the supply chain.
• DISCO Corporation: DISCO is the global leader in semiconductor dicing and grinding equipment, directly comparable to ASMPT's ALSI laser dicing solutions. It serves the same wafer-level packaging customers and competes in advanced packaging preparation steps.
• Mycronic: Mycronic is a Swedish SMT and assembly equipment supplier, former owner of AEi (acquired by ASMPT). It competes directly with ASMPT's SIPLACE and DEK SMT product lines in surface mount placement and printing equipment for electronics manufacturers.
• Yamaha Motor (Imaging & Sensing Division): Yamaha's SMT solutions division produces surface mount placement equipment competing with ASMPT's SIPLACE platforms. It serves similar electronics manufacturing customers in automotive, consumer, and industrial segments across Asia and globally.

Broad incumbents

• Tokyo Electron (TEL): Tokyo Electron is a broad incumbent semiconductor manufacturing equipment supplier with growing exposure to advanced packaging. While primarily a front-end equipment leader, TEL's expanding back-end portfolio overlaps with ASMPT's bonding and packaging offerings for major foundry and memory customers.
• Applied Materials: Applied Materials is a global semiconductor equipment incumbent that is acquiring ASMPT's NEXX business for $120M, expanding its panel-level advanced packaging portfolio. It competes with ASMPT in deposition equipment and increasingly in advanced packaging adjacent processes.

Emerging players

• EV Group (EVG): EV Group specializes in wafer-level bonding and lithography equipment, including hybrid bonding solutions developed in partnership with ASMPT. While collaborating on die-to-wafer hybrid bonding for 3D-IC, EVG also offers competing bonding capabilities to OSATs and foundries.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/channel/UCPSs3EFBySHKdF7J_p538sg
• Facebookfacebook.com/ASMPTSMTSolutions
• LinkedInsg.linkedin.com/company/asmpt

Compliance12 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A3 records

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ASMPT