What Micro Precision Technologies does

Micro-Precision Technologies, Inc. (MPT), founded in 1987 and headquartered in Salem, New Hampshire, is a US contract manufacturer specializing in thick film ceramic substrate hybrid microelectronics and multi-chip modules for military, aerospace, space, medical, and industrial customers. Its core technology involves screening conductor, insulator, and resistor materials onto ceramic substrates (alumina, aluminum nitride, and beryllium oxide) and firing them at 850°C, with capabilities spanning multi-layer substrates up to 10 conductor layers, ultra-fine 5-mil line/space resolution, laser-trimmed resistors, filled or plated vias, and Class 100/10,000 cleanroom assembly. The product portfolio includes custom thick film substrates, hybrid microcircuits, semiconductor packaging, obsolete semiconductor replacement, reverse engineering, standard products (Terrella 6 and V12 heading/motion sensors, plus 60+ government NSN microcircuits), and — following the October 2025 acquisition of Stellar Manufacturing — printed circuit board assembly and box-build services. MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, AS9100D/ISO 9001:2015 certified, and ITAR registered, and supplies directly to US government agencies including the Missile Defense Agency, Defense Supply Center Columbus, and Defense Logistics Agency, as well as to defense contractors and commercial aviation integrators.

MPT generates revenue primarily through project-based custom manufacturing with quote-driven pricing, supplemented by build-to-order NSN parts and a small standard sensor product line. The go-to-market is enterprise field sales supported by a regional sales representative network, a quote-request portal on the corporate website, and content marketing through technical articles and downloadable resources. The company is privately held, has been a subsidiary of Aerospace Semiconductor, Inc. (ASI) of Lawrence, MA since February 2020, and received a private equity investment from Great River Capital Partners in mid-2024. The combination of regulatory qualifications, niche specialty manufacturing, and recent PE-backed inorganic growth positions MPT as a small, defense-anchored microelectronics platform executing a roll-up strategy.

Name

Micro Precision Technologies

Legal name

Micro-Precision Technologies, Inc.

Website

https://micropt.com

Company type

Private

Founded year

1987

Operating status

Operating

Headcount range

1–10 employees

Short description

Micro-Precision Technologies is a Salem, NH-based contract manufacturer of thick film ceramic substrate hybrid microelectronics and multi-chip modules, serving military, aerospace, space, and industrial customers with MIL-PRF-38534 Class H qualified US production.

Ownership category

akta.pro rank

Product category

Contract Manufacturing of Hybrid Microelectronics & Thick-Film Ceramic Substrates

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451)

SIC

Semiconductors & Related Devices (3674), Electronic Components, Nec (3679), Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Sensors, MEMS & Imaging ICs (HDAHAAAG)

akta.pro secondary industries

MEMS Actuators & Micro-Mechanisms (Micromirrors/Microfluidics) (HDAHALAJ), Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes) (IMAGAJAE)

Keywords

• Hybrid microelectronics manufacturing
• Thick film ceramic substrates
• Military grade microcircuits
• Semiconductor packaging services
• Defense aerospace electronics

Headquarters

HQ city

Salem

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Supply Chain, Operations, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Custom Thick Film Ceramic Substrate Manufacturing: Manufacture of custom metalized thick film ceramic substrates to customer specifications. Process includes design, layout, screening, firing, and testing. Revenue is project-based with custom per-part pricing based on complexity and volume.
2. Hybrid Microcircuit Assembly Services: Assembly services including surface mount, die attachment, wire bonding, and packaging of hybrid microcircuits. Quick turnaround for prototypes and in-time production. Cleanroom assembly in Class 10,000 facility.
3. Custom Semiconductor Packaging: Repackaging of standard or customized die into different packages to improve thermal performance, pinout, electrical performance, or mechanical form factor. Custom engineering services for specialized packaging solutions.
4. Obsolete Semiconductor Replacement Manufacturing: Design and manufacture of pin-to-pin compatible replacements for obsolete semiconductor parts. Solutions include acquiring original raw die and repackaging, developing new circuits from available die, or creating custom die. Revenue from custom manufacturing projects.
5. Reverse Engineering Services: Deconstruction of legacy components to generate blueprints, schematics, and bills of materials. MPT reconstructs and replicates components as necessary. Small-lot manufacturing capability for replicated parts.
6. Standard Products (Terrella Sensors and NSN Parts): Standard heading/motion sensors (Terrella 6 and Terrella V12) and over 60 government NSN products available from stock or built to order. Stock items with delivery or build-to-order with varying lead times.
7. PCB Manufacturing and Assembly (via Stellar Manufacturing): Printed circuit board assemblies (PCBA) and PCB manufacturing from acquired Stellar Manufacturing subsidiary. Services include SMT, thru-hole assembly, box builds, and functional testing. 100% US-based manufacturing.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels5 records

Core offering

Micro-Precision Technologies is a US contract manufacturer of high-reliability thick-film ceramic substrates, hybrid integrated circuits, and multi-chip modules for defense, aerospace, space, medical, and industrial applications. The company screens conductor, resistor, and dielectric materials onto ceramic substrates (alumina, aluminum nitride, beryllium oxide), assembles hybrid microcircuits in Class 10,000 cleanrooms, and produces MIL-PRF-38534 qualified microcircuits plus the Terrella heading/motion sensor line. It also offers obsolete semiconductor replacement, reverse engineering, semiconductor packaging, and (post-2025) PCBA services via the acquired Stellar Manufacturing business.

Product overview

Micro-Precision Technologies is a contract manufacturer of micro-electronics serving Defense, Aerospace, Medical, Industrial, and Commercial markets. The company's core offerings include thick film ceramic substrates and hybrid microcircuits, which are robust alternatives to PCBs for harsh environments. The product portfolio centers on: (1) Thick Film Substrates - ceramic-based circuit boards with multi-layer capabilities up to 10 conductor layers; (2) Hybrid Microcircuit Assembly - attaching components to screened substrates in cleanroom facilities; (3) Semiconductor Packaging - custom die repackaging; (4) Standard Products - Terrella heading/motion sensors (Terrella 6 and V12) and NSN government microcircuits; (5) Assembly Services - wire bonding, die attachment, SMT, and testing; and (6) Acquired services from Stellar Manufacturing - PCB assembly and box builds. The company also offers specialized services including obsolete semiconductor replacement, reverse engineering, FR4-to-ceramic conversions, and component testing. All manufacturing is performed in the USA (Salem, NH) with MIL-PRF-38534 and AS9100D certifications.

Differentiator

Problem solved

Functional benefit

Brands

• Terrella: Heading and motion sensor products including Terrella 6 and Terrella V12 temperature compensated sensors

Products and services

• Thick Film Substrates Custom thick-film ceramic substrates with screened conductor, insulator, and resistor materials for environmentally adverse conditions and high thermal conductivity requirements. Used by defense, aerospace, and industrial customers.
• Hybrid Microcircuit Assembly Contract assembly of hybrid microcircuits in a Class 10,000 cleanroom, including surface mount, die attachment, wire bonding, and packaging onto screened ceramic substrates.
• Semiconductor Packaging Repackaging of standard or customized die into different packages to improve thermal performance, pinout configuration, electrical performance, or mechanical size and shape.
• Substrate Materials (Alumina, Aluminum Nitride, Beryllium Oxide) High-quality ceramic substrate materials in 96-99.6% alumina, aluminum nitride, and 99% beryllium oxide with varying thermal conductivity and dimensional options.
• NSN Products (Government Microcircuits) MIL-PRF-38534 qualified microcircuits, including signal conditioning modules, regulators, resistor networks, amplifiers, converters, and hybrid tracking amplifiers, available via NSN for defense applications.
• Terrella 6 Heading and Motion Sensor Temperature-compensated heading and motion sensor, slightly larger than a AA battery, measuring heading, orientation (Euler angles, quaternions, rotation matrix), translational accelerations, magnetic field, and temperature.
• Terrella V12 Heading and Motion Sensor Temperature-compensated board-level heading and motion sensor for measuring orientation and motion-related parameters.
• Obsolete Semiconductor Replacements Pin-to-pin compatible replacements for legacy semiconductor parts, including ceramic packages, voltage modifications, RoHS solutions, and high-temperature packages, to support long lifecycle defense and aerospace systems.
• Wire Bonding and Die Attachment Services Manual and automated wire bonding and die-attach capabilities including ball and wedge bonding, auto die attach, and auto dispense for epoxy, encapsulate, or optical fluid, performed to MIL-STD-883.
• Surface Mount Technology (SMT) Assembly Manual SMT for small lots under 100 pieces and automated high-speed SMT for larger volumes, compliant to MIL-STD-883, performed as part of MPT's hybrid microcircuit assembly offering.
• Reverse Engineering Services Deconstruction of legacy components to produce blueprints, schematics, and bills of materials, with the ability to reconstruct and replicate the parts in small lots for legacy system sustainment.
• Thick Film Design and Layout Services Circuit design and layout services from design to completed component, with build-to-spec and build-to-print manufacturing capabilities.
• Stellar Manufacturing PCBA Services Printed circuit board assembly (PCBA) services including SMT, thru-hole assembly, box builds, NPI, component sourcing, supply chain management, and calibration, offered under the Stellar Manufacturing brand acquired by MPT in October 2025.
• Critical Component Testing AC, DC parametric, and functional testing for diodes, transistors, linear, LSI, VLSI, and FPGA technologies, including burn-in, temperature cycling, and particle impact noise detection per MIL-STD-883.
• Functional Electrical Testing Manual and semi-automatic functional testing up to 18 GHz, with internal visual inspection, verification tests, and AC/DC output testing per MIL-PRF-38534.
• FR4 to Ceramic Conversions Conversion of single-board computer assemblies from FR-4 to MPT ceramic engineered substrates for improved thermal management in demanding applications.
• Thick Film LED Submounts Ceramic substrate submounts for high-powered LEDs requiring thermal management at 350 milliwatts or more.
• Thick Film Metallization Application of gold, silver, platinum silver, palladium silver, and platinum palladium silver metallization to ceramic substrates through screening, drying, and firing processes.
• Thick Film Resistors Resistors screened directly onto ceramic substrates, fired at 850°C, and laser trimmed to exact tolerances with power handling and wide resistance ranges.
• Multi-Layer Substrates Multi-layer ceramic substrates with up to 10 conductor layers, separated by dielectric layers and connected by filled or plated via holes.

Quantifiable outcome

• Thick film hybrids can be half the size of equivalent PCB circuits
• +4 more outcomes

Named customers4 records

Segments6 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

Two partnerships are on record, tiered core.

• Stellar ManufacturingcoreStrategic or Co-development Partner · 1 October 2025Stellar Manufacturing, a New England-based contract electronics manufacturer (PCBA specialist), was acquired by MPT in October 2025. Acquisition closed in early October. Terms undisclosed. Stellar specializes in low to medium volume PCB manufacturing and box-build projects. The acquisition broadens MPT's service offerings and strengthens manufacturing capabilities for aerospace, defense, energy, and commercial markets. Stellar to be fully integrated into MPT's AS9100D quality system by first half 2026.
• Aerospace Semiconductor, Inc. (ASI)coreStrategic or Co-development Partner · 1 February 2020ASI of Lawrence, MA acquired MPT in February 2020. Company continues to operate under Micro-Precision Technology, Inc. name in Salem, NH. ASI manufactures custom hybrid microelectronic modules, custom semiconductors, and drop-in replacements for legacy electronics. Combined company leverages expanded capabilities and more complete solutions. ASI was formed in 2012 to execute an asset purchase of Sanchez Associates.

Scale indicators6 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Crane Aerospace & Electronics: Crane A&E is a leading manufacturer of hybrid microcircuits and MIL-spec electronic components for defense and aerospace primes. Directly comparable to MPT in target customers (MDA, DLA, defense primes), MIL-PRF-38534-qualified hybrid technology, and ruggedized electronic subsystems.
• Lansdale Semiconductor: Lansdale is a niche US manufacturer specializing in obsolete and end-of-life semiconductor replacement for defense, aerospace, and industrial customers — directly comparable to MPT's obsolete semiconductor replacement franchise and MIL-spec microcircuit business.
• Barry Industries: Barry Industries manufactures thick-film ceramic substrates, resistor networks, and hybrid microcircuits for defense and aerospace — a direct competitor to MPT in thick-film substrates, MIL-spec hybrids, and high-reliability RF applications.
• VPT (HEICO): VPT is a US-based supplier of MIL-spec hybrid power conversion products and ruggedized DC-DC converters. Comparable to MPT in hybrid microcircuit technology, defense/aerospace customer base, and ITAR-registered operations.
• KCB Solutions: KCB Solutions is a small US manufacturer of thick-film hybrids, MCMs, and custom hybrid microcircuits for defense and aerospace. Closely matches MPT in size, technology stack (thick film, ceramic substrates), and customer segment (defense primes).

Broad incumbents

• Microsemi (Microchip Technology): Microchip (via the Microsemi acquisition) is a major supplier of MIL-spec semiconductors, hybrids, and power modules to defense and aerospace customers. Comparable to MPT in defense customer base and MIL-qualified product portfolio, though at far larger scale across a broad semiconductor catalog.
• API Technologies: API Technologies designs and manufactures RF/microwave, microelectronics, and power products for defense, aerospace, and industrial customers. Comparable to MPT in defense hybrid microelectronics and ITAR-registered, MIL-qualified offerings across a wider portfolio.
• Anaren (TTM Technologies): Anaren (now part of TTM) manufactures thick-film resistive products, RF components, and microelectronics for defense, aerospace, and wireless. Comparable to MPT in thick-film technology and defense customers, with broader product breadth.

Emerging players

• Custom MMIC: Custom MMIC is a small US fabless designer of MMICs and RF/microwave components for defense and aerospace — adjacent to MPT in defense microelectronics customer base and hybrid/RF packaging, though focused on MMIC design rather than thick-film hybrids.

Others

• Aerospace Semiconductor, Inc. MPT's parent company (acquired MPT in 2020) and a manufacturer of custom hybrid microelectronic modules, custom semiconductors, and drop-in replacements for legacy electronics — a directly comparable microelectronics peer and majority owner of the subject company.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries1 record

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Micro Precision Technologies