Aerospace Semiconductor
Aerospace Semiconductor (operating as Micro-Precision Technologies) designs and manufactures thick film hybrid microelectronics on ceramic substrates and provides MIL-spec-qualified custom semiconductor packaging, hybrid assembly, and die/wire bonding services for defense and aerospace electronics manufacturers serving harsh-environment applications.
- Company typePrivate
- Founded1998
- HeadquartersLawrence, United States
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Aerospace Semiconductor does
Aerospace Semiconductor (also operating as Micro-Precision Technologies / MPT) designs and manufactures hybrid microelectronics and provides custom semiconductor packaging services for defense and aerospace programs. The company's core technology is thick film hybrid circuitry built on ceramic substrates — alumina, aluminum nitride, and beryllium oxide — which deliver thermal conductivity of 28-280 W/m-K versus 0.8-1.1 W/m-K for standard FR-4 PCB material. This thermal headroom enables operation in extreme heat, high vibration, downhole mining, deep sea, and space environments where conventional PCBs fail. Service offerings span thick film circuit design, FR4-to-ceramic conversion, hybrid microcircuit assembly (manual and automated SMT), semiconductor die attachment, ball and wedge wire bonding, semiconductor repackaging, obsolete component sourcing, reverse engineering, and standard products.
Manufacturing is performed in a Class 10,000 clean room with qualified assembly lines supporting both prototype and production volumes. The firm holds MIL-PRF-38534 Class H qualification continuously since 1998, QML-38534 listing certified by DSCC, AS9100D ISO 9001:2015 certification, and ITAR registration — a credential stack that constrains competition for U.S. defense hybrid microcircuit and qualified semiconductor packaging work.
The business model is project-based B2B contract manufacturing: pricing is quote-based and not publicly disclosed, customers are reached through direct enterprise sales supported by regional sales representatives, and the primary vertical is defense and aerospace electronics manufacturers with secondary exposure to industrial and energy applications. Revenue figures, ownership structure, and headcount trends are not disclosed in the available data; Al Sanchez is identified as founder and the firm is described as having 11-50 employees.
Aerospace Semiconductor firmographics
Firmographics- Name
- Aerospace Semiconductor
- Legal name
- Micro-Precision Technologies
- Website
- https://aerospacesemi.com
- Company type
- Private
- Founded year
- 1998
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Aerospace Semiconductor (operating as Micro-Precision Technologies) designs and manufactures thick film hybrid microelectronics on ceramic substrates and provides MIL-spec-qualified custom semiconductor packaging, hybrid assembly, and die/wire bonding services for defense and aerospace electronics manufacturers serving harsh-environment applications.
- Ownership category
- akta.pro rank
Aerospace Semiconductor industry classification
Industry- Product category
- Semiconductor Packaging Services
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)
- SIC
- Semiconductors & Related Devices (3674), Electronic Components, Nec (3679)
- akta.pro primary industry
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
- akta.pro secondary industries
- Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK), Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF)
Keywords
Where Aerospace Semiconductor is headquartered
LocationHeadquarters
- HQ city
- Lawrence
- HQ country
- United States
- HQ region
- North America
Offices1 record
Markets served
Aerospace Semiconductor business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain
Revenue model
- Custom Semiconductor Packaging & Assembly Services: B2B contract manufacturing for defense and aerospace semiconductor packaging, thick film hybrid assembly, and related engineering services. Services are custom and project-based for government contractors and defense electronics manufacturers.
Go-to-market motion1 record
Distribution channels1 record
Marketing channels3 records
Aerospace Semiconductor product offering
Product offeringCore offering
Aerospace Semiconductor designs and manufactures thick film hybrid microelectronics on ceramic substrates, builds custom semiconductor packages, and provides hybrid assembly services (SMT, wire bonding, die attach, and die repackaging) in a Class 10,000 clean room. The output is highly thermally conductive electronic assemblies (28-280 W/m-K ceramic vs 0.8-1.1 W/m-K FR-4) qualified to MIL-PRF-38534 Class H for harsh-environment applications in defense, aerospace, downhole mining, deep sea, and space.
Product overview
Micro-Precision Technologies (MPT) offers a portfolio of thick film hybrid solutions designed as robust alternatives to traditional PCBs for harsh environment applications. The core product line includes Thick Film Technology (ceramic substrate circuitry with conductor/dielectric layers), Multi-Layer Thick Film, and LED Technologies. These are supported by engineering services including FR4 Conversions (converting FR-4 designs to ceramic), Hybrid Assembly (SMT, wire-bonding, die attach in Class 10,000 clean room), Die Attach & Wire Bonding (ball/wedge bonding, auto dispense), Semiconductor Packaging (die repackaging), Obsolete Semiconductors, Reverse Engineering, and Standard Products. Key material offerings include Substrate Materials (alumina, aluminum nitride, beryllium oxide) and Metallization services. The company serves aerospace, defense, downhole mining, deep sea, and space markets requiring operation in extreme heat, high vibration, and other adverse conditions.
Differentiator
Problem solved
Functional benefit
Products and services
- Thick Film Technology Circuitry screened onto ceramic substrates (alumina, aluminum nitride, beryllium oxide) with conductor layers, dielectric layers, and vias to provide robust, compact, and economical solutions with higher thermal efficiency than FR-4 PCBs for harsh environments.
- FR4 Conversions Service that converts a single-board computer assembly designed on FR-4 to a company-engineered ceramic substrate, delivering more efficient thermal management for products used in harsh conditions.
- Hybrid Assembly Manual and automated surface-mount technology (SMT), wire-bonding, and die attach assembly performed in a Class 10,000 clean room for hybrid microcircuits.
- Die Attach & Wire Bonding Manual and automated wire-bonding and die-attach service including ball and wedge bonding, auto die attach, and auto dispense of epoxy, encapsulate, or optical fluid.
- Semiconductor Packaging Repackaging of standard or customized die into different packages to improve thermal performance, pinout configuration, electrical performance, or mechanical size and shape.
- Obsolete Semiconductors Sourcing and replacement solutions for obsolete semiconductors.
- Reverse Engineering Reverse engineering services for semiconductor and electronic components.
- Standard Products Standard semiconductor and electronic product offerings from the company.
- Multi-Layer Thick Film Multi-layer thick film technology with conductor and dielectric layers for advanced circuit applications on ceramic substrates.
- LED Technologies LED-based solutions integrated with thick film ceramic substrates for various applications.
Quantifiable outcome
- Ceramic thermal conductivity of 28-280 W/m-K compared to FR-4 at 0.8-1.1 W/m-K
Companies that use Aerospace Semiconductor
Customer profileSegments2 records
Ideal customer profiles2 records
Aerospace Semiconductor technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
Aerospace Semiconductor partnerships and signals
Strategic signalScale indicators2 records
Recent moves5 records
Expansion highlights4 records
Aerospace Semiconductor competitors and assessment
Company assessmentBroad incumbents
- Crane Aerospace & Electronics: Crane A&E is a diversified aerospace and defense electronics supplier with hybrid microelectronics and ruggedized electronic assembly capabilities. It competes with MPT at the sub-tier level on aerospace-qualified hybrid packaging programs.
- Honeywell Aerospace: Honeywell operates one of the largest captive hybrid microelectronics and aerospace semiconductor packaging operations globally. It is a competitor where primes source internally or to a Tier 1, and represents both a customer and competitor profile for niche suppliers like MPT.
- Teledyne Technologies: Teledyne's engineered solutions segments include high-reliability microelectronics, packaging, and test for defense and space. As a much larger incumbent, it competes for similar MIL-spec hybrid and semiconductor packaging programs.
- Mercury Systems: Mercury is a larger defense electronics incumbent offering mission-critical sensor, RF, and microelectronic subassemblies. While broader than MPT, it competes for similar defense/aerospace hybrid microcircuit and ruggedized packaging budgets.
- Kyocera (Fine Ceramics / Semiconductor Packaging): Kyocera is a major global supplier of ceramic substrate materials (alumina, AlN) and ceramic package assemblies used in hybrid microelectronics. It competes with MPT at the ceramic substrate and ceramic package level in high-reliability markets.
Others
- CoorsTek: CoorsTek is a leading advanced ceramics manufacturer providing alumina, aluminum nitride, and beryllium oxide substrates — the same materials MPT uses — and is both a potential supplier and competitor in ceramic substrate-based electronic packaging.
Direct peers
- Micross Components: Micross is a leading provider of specialty semiconductor packaging and test services for high-reliability defense, aerospace, and space applications. It is the closest direct competitor to MPT, offering hybrid microcircuit assembly, MIL-spec packaging, and obsolete component services.
- Quantic Electronics: Quantic (formerly known as Cosmo/Pacific Aerospace & Electronics and several acquired firms) specializes in high-reliability hybrid microelectronics, thick/thin film substrates, and RF/microwave components for defense and aerospace — directly overlapping MPT's thick-film hybrid core.
- Hi-Rel Group (part of Quantic): Hi-Rel specializes in MIL-spec hybrid microcircuits and high-reliability electronic assembly for defense and aerospace — a near-direct peer to MPT in terms of product type, customer base, and qualification profile.
- Remtec Inc. Remtec is a niche provider of ceramic substrates, thick-film hybrid microelectronics, and custom packaging for high-reliability applications including aerospace, defense, and RF/microwave — closely comparable to MPT's specialty.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat4 records
Key risks5 records
Key highlights5 records
Customer concentration
Aerospace Semiconductor social profiles
Digital presenceAerospace Semiconductor compliance and trust
Trust signalCompliance4 records
Aerospace Semiconductor financial estimates
Financial estimateRevenue estimate
Valuation estimate
Aerospace Semiconductor leadership team
Management profileNumber of profiles
Profiles1 record
Aerospace Semiconductor funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Aerospace Semiconductor M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Aerospace Semiconductor
What does Aerospace Semiconductor do?
Aerospace Semiconductor designs and manufactures thick film hybrid microelectronics on ceramic substrates, builds custom semiconductor packages, and provides hybrid assembly services (SMT, wire bonding, die attach, and die repackaging) in a Class 10,000 clean room. The output is highly thermally conductive electronic assemblies (28-280 W/m-K ceramic vs 0.8-1.1 W/m-K FR-4) qualified to MIL-PRF-38534 Class H for harsh-environment applications in defense, aerospace, downhole mining, deep sea, and space.
Is Aerospace Semiconductor a public or private company?
Aerospace Semiconductor is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was Aerospace Semiconductor founded?
Aerospace Semiconductor was founded in 1998. It employs 11 to 50 people.
Where is Aerospace Semiconductor based?
Aerospace Semiconductor is headquartered in Lawrence, United States, in the North America region.
How does Aerospace Semiconductor make money?
One revenue line is on record: custom Semiconductor Packaging & Assembly Services.
Who are Aerospace Semiconductor's main competitors?
Broad incumbents on record are Crane Aerospace & Electronics, Honeywell Aerospace, Teledyne Technologies, Mercury Systems and Kyocera (Fine Ceramics / Semiconductor Packaging). CoorsTek is listed as an others. Direct peers are Micross Components, Quantic Electronics, Hi-Rel Group (part of Quantic) and Remtec Inc..
Does Aerospace Semiconductor have an API?
No public API is recorded for Aerospace Semiconductor.
What industry is Aerospace Semiconductor in?
Aerospace Semiconductor's product category is Semiconductor Packaging Services. Its primary akta.pro industry code is HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA), with a secondary code of HDAHAOAK, Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components). Its NAICS code is 33441 and its SIC code is 3674.