Circuits Integrated

What Circuits Integrated does

Circuits Integrated Hellas (CI) is a privately held Greek semiconductor company founded in October 2018 and headquartered in Kifissia, Athens, that designs analog, RF, and mmWave integrated circuits, modules, and boards for satellite communications, defense, aerospace, 5G, and IoT applications. The company's core technology centers on a proprietary 3D Antenna-in-Package (AiP) and System-in-Package (SiP) architecture that vertically integrates III-V compound semiconductors (GaAs and GaN) with silicon technologies, targeting over 60% reduction in size, weight, power, and cost (SWaP-C) relative to legacy flat panel antenna implementations.

The product portfolio is anchored by the Kythrion platform, a Ka-band chipset that unifies transmit, receive, and antenna functionality in a single 3DIC stack, and by the newer CI-ONE family of Ka-band integrated switch power amplifiers (PA + SPDT modules) offering 5 ns switching speeds at substantially smaller footprint and lower cost than discrete implementations. Circuits Integrated also supplies standalone MMIC modules and a design services practice spanning CMOS, BiCMOS, FDSOI, GaAs, and GaN processes across 20+ foundry nodes, supported by an internal IP library of 10+ products and 30+ tape-outs. Patents protect the Kythrion packaging architecture, and the company has been recognized through the EDN 2025 Product of the Year, the Paris Space Week 2025 Innovation Challenge, and the ESA EPIC European-Singaporean Space Start-up Competition.

Circuits Integrated monetizes through three channels: direct chip and module sales to enterprise customers, design-for-license engagements that embed proprietary technology in customer platforms, and custom integration services for mission-specific applications. Pricing is quote-based under multi-year contracts, and go-to-market is sales-led, reinforced by active participation in European space and defense industry events. The company is founder-controlled (Dr. Paolo Fioravanti, CEO; Dr. Ioannis Kontogiannopoulos, CTO), transitioned from an IKE to a Société Anonyme in April 2025 to facilitate equity investment, and reported revenue exceeding €2M annually after a 5x increase over two years. Strategic relationships include ESA BIC Greece incubation, European Defence Fund consortium participation (POWER FLEX, POWERPACK, AGAMI_EURIGAMI), Space South Central membership in the UK, and a 2026 multi-year MOU with Reach Power on wireless power and RF/mmWave co-development.

Name

Circuits Integrated

Legal name

Circuits Integrated Hellas

Website

https://circuitsintegrated.com

Company type

Private

Founded year

2018

Operating status

Operating

Headcount range

11–50 employees

Short description

Circuits Integrated designs proprietary RF, mmWave, and 3D AiP/SiP semiconductor chips and modules for satellite communications, defense, 5G, and IoT. Founded in 2018 in Athens, Greece, it serves global enterprise customers through direct sales, licensing, and custom integration.

Ownership category

akta.pro rank

Product category

RF and mmWave Semiconductor Chipsets

NAICS

Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing (334220)

SIC

Radio & Tv Broadcasting & Communications Equipment (3663)

akta.pro primary industry

Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS) (HDAHABAA)

akta.pro secondary industries

Satellite, GNSS & Positioning RF ICs (HDAHAMAJ), RF Front-End Modules (FEMs) & Integrated RF Modules (HDAHAMAA)

Keywords

• RF semiconductor design
• SatCom chip design
• MMIC design services
• GaAs GaN IC design
• Beamforming integrated circuits

Headquarters

HQ city

Athens

HQ country

Greece

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Chip Sales: Direct sales of proprietary semiconductor products including Kythrion platform chips and CI-ONE modules to satellite communications, defense, and aerospace customers.
2. Design-for-License: Flexible platform supporting design-for-license engagements where customers license proprietary technology for integration into their own products.
3. Custom Integration: Custom integration services into mission-specific applications for enterprise customers.
4. Design Services: RFIC design, turnkey solutions, layout services, modeling and consultancy services for telecommunications and satellite communications applications.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels4 records

Core offering

Circuits Integrated designs and sells RF, microwave and mmWave monolithic microwave integrated circuits (MMICs), chipset platforms and integrated modules for satellite communications, 5G and IoT applications. Flagship offerings include the Kythrion 3D Antenna-in-Package/System-in-Package chipset platform for flat panel antennas and the CI-ONE family of Ka-band integrated switch power amplifiers, complemented by standalone MMIC modules and turnkey RFIC design services.

Product overview

Circuits Integrated (CI) develops innovative solutions and products for SatCom, 5G & IoT industries. The core product portfolio centers on Kythrion™, a flagship 3D AiP/SiP chipset platform combining III-V compound semiconductors (GaAs, GaN) with silicon for flat panel antenna applications, and the newer CI-ONE family of Ka-band integrated switch power amplifiers. The company also offers standalone MMIC modules and comprehensive design services including RFIC design, layout, modeling, and consultancy across multiple foundry processes (CMOS, BiCMOS, FDSOI, GaAs, GaN). Kythrion serves as the unifying platform for transmit/receive/antenna integration, while CI-ONE extends the portfolio into power amplification and switching for Ka-band terminals.

Differentiator

Problem solved

Functional benefit

Brands

• Kythrion: Flagship Ka-band Antenna-in-Package (AiP) platform for SatCom. First integrated solution combining transmit, receive, and antenna functionality within a proprietary 3D AiP and SiP architecture, achieving 60%+ reduction in size, weight, power, and cost (SWaP-C) for flat panel antennas.
• CI-ONE

Products and services

• Kythrion Satcom Chipset Platform A chipset platform that unifies transmit, receive, and antenna functionality within a proprietary 3D antenna-in-package and system-in-package architecture, vertically integrating GaAs/GaN III-V compound semiconductors with silicon to deliver over 60% SWaP-C reduction for high-performance flat panel antenna systems used in LEO/MEO satellite communications.
• CI-ONE Family of Ka-Band Integrated Switch Power Amplifiers Small-form-factor integrated PA + SPDT modules for Ka-band applications, delivering ultra-fast 5 ns switching, reduced footprint, and lower total system cost for commercial, defense and emergency satellite communications across 5G/6G, radar and aerospace use cases.
• Standalone MMIC Modules (2.5W and 4W Ka-band) Surface-mount MMIC power amplifier modules for the 27.5 GHz to 30 GHz frequency range, delivering 2.5W or 4W Pout with P1dB of 34 dBm/36 dBm, output port isolation greater than 30 dB, ACPR of 25 dB at P1dB, 25 dB gain, 25% efficiency, and thermal resistance below 3 degrees/W. They replace three discrete MMICs (two PAs and one SPDT) with a single packaged module for Ka-band phased array terminals.
• RF and Semiconductor Design Services Turnkey RFIC and semiconductor design services including CMOS, BiCMOS, GaAs, and GaN circuit design; RFIC design for telecom applications; layout services for RF/analog and digital P&R; modeling and consultancy; and CAD/EDA hosting. Leverages a portfolio of 10+ IP products, 30+ tape-outs and experience across 20+ foundry processes for telecommunications and satellite communications customers.

Quantifiable outcome

• Over 60% reduction in antenna size, weight, power, and cost (SWaP-C)
• +4 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Six partnerships are on record, tiered core, regional and minor.

• Reach PowercoreStrategic or Co-development Partner · 5 March 2026Multi-year strategic MOU for joint development of integrated wireless power transmission and RF/mmWave technologies. CIH serves as specialized semiconductor design partner and chip supplier including RF/mmWave ICs, system-level beamforming architectures, and heterogeneous integration. Reach Power contributes wireless power-at-a-distance technology, AI-optimized power-beaming control algorithms, and system integration expertise. Targets Satcom, defense, energy transfer, and phased-array applications.
• ESA BIC GreececoreStrategic or Co-development PartnerAdmitted to ESA Business Incubation Centre Greece program starting April 1, 2022. Official recognition as startup company under ESA program marked onset of product-focused journey. During incubation, company defined IP roadmap, initiated internal platform development, and secured partnerships for scalable commercial offerings.
• Space South CentralregionalStrategic or Co-development PartnerUK space cluster membership joined in November 2025. One of the region's largest space clusters providing opportunities for collaboration and market expansion in the UK.
• European Defence Fund ProjectscoreStrategic or Co-development PartnerParticipates in EU and funding programs including European Defence Fund projects: POWER FLEX, POWERPACK, and AGAMI_EURIGAMI. Consortium partnerships leading next-generation GaAs and GaN implementations.
• European Commission / Horizon 2020coreStrategic or Co-development PartnerResearch partnerships under Horizon 2020 framework and ESPA ( Competitiveness Programme) for advanced semiconductor and telecommunications research.
• Industrial and Academic PartnersminorStrategic or Co-development PartnerPartnership network including Fraunhofer, Leonardo, Indra, Soitec, Thales, UMS, Democritus University of Thrace, NCSR Demokritos, and FORTH for R&D collaboration in compound semiconductor technologies.

Scale indicators8 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• Anokiwave: Anokiwave designs highly integrated mmWave silicon ICs for active antenna arrays used in SatCom, 5G, and radar — the same product/application wedge that Circuits Integrated is targeting with Kythrion and CI-ONE, making it the closest direct comparable.
• OMMIC: OMMIC (a MACOM company) is a GaAs and GaN MMIC specialist supplying mmWave ICs for SatCom, defense and instrumentation — closely comparable to Circuits Integrated's compound-semiconductor, mmWave design model.
• United Monolithic Semiconductors (UMS): UMS designs and manufactures GaAs, GaN and InP MMICs and foundry services for space, defense and telecoms — a near-perfect functional match to Circuits Integrated's technology stack, and notably a current R&D partner of the company.
• Sivers Semiconductors: Sivers Semiconductors (including the Mixcomm mmWave portfolio) develops mmWave and beamforming RFICs for 5G, SatCom and radar — closely comparable to CIH in technology, target applications, and end markets.

Broad incumbents

• Qorvo: Qorvo is a large-scale RF semiconductor supplier with deep GaAs and GaN MMIC portfolios serving defense, SatCom, and wireless infrastructure — a well-funded incumbent competing directly for the same Ka-band and phased-array socket opportunities as Circuits Integrated.
• MACOM Technology Solutions: MACOM is a broad-line RF, microwave, and GaN MMIC supplier serving communications, defense, and aerospace markets. Its portfolio overlaps materially with CIH's beamforming and power-amplifier roadmap, and it is a much larger, established competitor.
• Skyworks Solutions: Skyworks is a high-volume RF semiconductor incumbent specializing in front-end modules for wireless connectivity, and is broader but adjacent in product philosophy to CIH's integrated PA + SPDT CI-ONE approach.
• Renesas Electronics: Through its Steradian acquisition, Renesas now sells mmWave beamforming ICs for radar and SatCom, putting it in direct product competition with CIH's Kythrion platform while leveraging a much larger corporate balance sheet.
• Broadcom: Broadcom is a large diversified semiconductor incumbent whose RF/MMIC business historically employed CIH's CEO; it produces RF ICs and front-end modules that overlap with Circuits Integrated's SatCom and 5G roadmap.
• Thales Group: Thales is a major European defense and aerospace prime and one of CIH's R&D partners; it integrates RF/MMIC subsystems into satellite payloads and radar, representing a key customer/peer downstream of CIH's chip-level offering.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks7 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Circuits Integrated