Santier, Inc.

What Santier, Inc. does

Santier, Inc. is a San Diego-based designer and manufacturer of custom-engineered microelectronic housings and assemblies for high-reliability thermal management applications. Founded in 1991 and operating since February 2017 as a wholly-owned subsidiary of French electronics packaging group Egide SA (headquartered in Bollène, France), Santier serves defense, aerospace, telecom, medical, and photonics OEMs with build-to-spec thermal management materials — including copper-tungsten (CuW) and copper-molybdenum (CuMo) composites, CMC and Super-CMC laminates, aluminum-graphite, copper-graphite, and copper-diamond composites — as well as full ceramic, RF, power, and optical packages.

The company's technical core is a proprietary powder metallurgy process that produces near-net-shape MoCu and WCu matrices free of binders and voids, combined with diffusion-bonded Cu/Mo laminates (CMC, S-CMC) capable of up to 95% copper content and tightly controlled coefficients of thermal expansion (6–10 ppm). US Patent 6,727,117 (granted 2004 to Chief Material Scientist Dr. John McCoy) covers copper-diamond composite material and has been cited by 27 subsequent patents. Manufacturing is vertically integrated in a single facility: furnaces operating from 300°C to 1,000°C for brazing (silver and gold-based alloys), precision machining, a wet-chemistry plating lab for electroless and electrolytic nickel and gold, and assembly of components ranging from a few millimeters to over 120 mm. Quality is gated by AS 9100:D, ISO 9001:2015, ITAR registration, and Nadcap accreditation for chemical processing (granted November 2019).

Santier operates a sales-led, consultative B2B model with quote-based pricing, multi-year contracts typical, no published rates, and direct relationships supported by US regional sales representatives (DTECH & Associates for the East Coast; Bill Dinardo as Director of New Business Development; field RSMs covering the North-East, Mid-Atlantic and South, and West Coast). Customer end-markets are mission-critical: radar, infrared vision, smart weapons, and controllers for defense primes; lightweight housings for space and aerospace; laser, optical, and photonic systems; high-speed communications components; and life-critical medical electronics. As of March 2026, parent Egide Group has announced the April 2026 closure of the San Diego subsidiary and consolidation of US operations into its Cambridge, Maryland site, citing multi-year volume declines and the 2025 loss of several high-value customer programs.

Name

Santier, Inc.

Legal name

SANTIER, INC.

Website

https://santier.com

Company type

Private

Founded year

1991

Operating status

Operating

Short description

Santier, Inc. designs and manufactures custom-engineered microelectronic housings and thermal management materials, including CuW, CuMo, CMC laminates, and copper-diamond composites, for defense, aerospace, telecom, medical, and photonics OEMs. Wholly-owned subsidiary of France's Egide Group since 2017.

Ownership category

akta.pro rank

Product category

Electronic Packaging & Thermal Management Materials

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components, Nec (3679)

akta.pro industry

PRIMARYIMAGAJAL

Thermal Management Components (Heat sinks, TIMs, fans/blowers, thermal pads)

Industrials, Manufacturing & Construction/Electrical Equipment & Industrial Electronics/Electronic Components for Industrial Applications (Passive/active components, industrial-grade modules)

Keywords

• Thermal management materials
• Microelectronic housings
• Hermetic packaging
• Metal matrix composites
• Electronic assembly services

Headquarters

HQ city

San Diego

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D, Marketing or Sales

Revenue model

1. Custom Thermal Management Materials and Components: Santier manufactures custom-engineered thermal management materials including Tungsten Copper (CuW), Molybdenum Copper (CuMo), CPC, CMC, Super CMC, Aluminum Graphite, Copper Graphite, and provides these as components to customers in aerospace, defense, telecom, medical, and photonics markets. Products are build-to-spec and sold as components/packages for integration into customer products.
2. Precision Assembly and Integration Services: Provides assembly services including brazing, plating, and full package assembly for microelectronic housings. These are value-added services integrated into the product delivery.
3. Plating Services: Stand-alone plating services for metallic components done in-house in San Diego, California, helping customers drive their cutting-edge technologies.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels3 records

Core offering

Santier, Inc. designs and manufactures custom-engineered thermal management materials and hermetic microelectronic housings/assemblies, including Copper Tungsten (CuW), Copper Molybdenum (CuMo), CMC and S-CMC laminates, Aluminum Graphite, Copper Graphite, RF, power, optical, and ceramic packages. The vertically integrated facility in San Diego produces build-to-spec components and assemblies for aerospace, defense, telecom, medical, and photonics customers, supported by in-house plating, precision brazing, and material science capabilities.

Product overview

Santier, Inc. is a manufacturer of engineered microelectronic housings and assemblies for high-reliability applications. The company operates as a subsidiary of Egide Group and operates an integrated facility in San Diego, California. Their product portfolio centers on thermal management solutions using metal matrix composites (Copper Tungsten CuW, Copper Molybdenum CuMo) and ceramic packages (HTCC Al2O3 multilayer ceramic, AlN, BeO). The core product line includes hermetic microelectronic packages, RF packages, power packages, and optical packages, supported by in-house plating and coating services, assembly services (brazing, tooling), and thermal management engineering. Materials offered include CMC (Copper Molybdenum Copper) and S-CMC (Super CMC) laminates, Aluminum Graphite, and Copper Graphite composites. Applications span aerospace, defense, medical, telecom, photonics, lasers, and space markets.

Differentiator

Problem solved

Functional benefit

Products and services

• Engineered Microelectronic Housings & Assemblies Hermetic microelectronic packages designed for thermal management in high-reliability defense, aerospace, telecom, medical, and photonics applications, integrating metal matrix composites with ceramic components.
• Copper Tungsten (CuW) Materials Tungsten Copper metal matrix composite materials produced via powder metallurgy for microelectronic packaging with excellent thermal conductivity and tailored thermal expansion coefficients.
• Copper Molybdenum (CuMo) Materials Molybdenum Copper metal matrix composite materials offering configurable CTE properties and thermal management for semiconductor, laser, and microelectronic applications.
• CMC and S-CMC Laminates (Copper Molybdenum Copper) Copper and Molybdenum laminates produced via diffusion bonding using copper and molybdenum foils, delivering high thermal conductivity (up to 95% copper) with restrained CTE values from 6-10 ppm for high-power applications.
• Aluminum Graphite Materials Lightweight thermal management composite materials used for aerospace and space applications where weight reduction is critical while maintaining effective heat dissipation.
• Copper Graphite Materials Composite materials combining copper and graphite properties for specialized heat sink and thermal spreading applications.
• Ceramic Packages (HTCC Al2O3, AlN, BeO) Full ceramic side wall packages and High Temperature Co-Fired Ceramic (HTCC) multilayer ceramic components used for hermetic electronic packaging.
• RF Packages Radio frequency packages with connectors designed for avionics, military, and communications markets requiring microwave/RF performance.
• Power Packages High-power packages with ceramic side walls engineered for power electronics applications requiring superior thermal management.
• Optical Packages Optoelectronic packages with ceramic feedthroughs designed for laser and optical system applications requiring precise thermal management.
• Plating and Coating Services Stand-alone in-house plating services including electroless and electrolytic nickel and gold plating, available to improve assembly processes, inhibit corrosion, alter conductivity, and increase product durability for aerospace, defense, lasers, photonics, optoelectronics, communications and telecommunications customers.
• Assembly Services Complete assembly services including brazing with silver and gold-based alloys operating from 300°C to 1000°C, plus tooling, ceramic (Al2O3, AlN, BeO), and various metal assemblies for microelectronic housings.

Named customers4 records

Segments5 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Two partnerships are on record, tiered minor.

• DTECH & AssociatesminorChannel Partner/ Reseller/ Distributor · 13 October 2016Sales representative agreement effective immediately for DTECH Associates to represent Santier product line on the East Coast of the US. Led by Dennis Hanley and Joe Couture with combined 40+ years of industry knowledge. Agreement represents Santier's expansion of sales coverage into East Coast markets.
• Bill DinardominorChannel Partner/ Reseller/ Distributor · 13 October 2016Bill Dinardo appointed as Director of New Business Development for the whole of the US. Brings over 25 years of experience in start-up ventures, M&A, sales, marketing, and business development in electronic advanced materials packaging, biotechnology, RF and microwave device manufacturing.

Scale indicators3 records

Recent moves6 records

Expansion highlights4 records

Broad incumbents

• NGK Insulators: Large Japanese ceramics manufacturer producing ceramic substrates, packages, and thermal management components for semiconductor, automotive, and power electronics customers. Overlaps with Santier's ceramic packaging and HTCC product lines as a broader incumbent.
• Egide Group: French electronics packaging manufacturer and Santier's parent company since 2017. Egide operates in France and Cambridge, Maryland, producing hermetic packages for similar defense, aerospace, and telecom customers. As the absorbing entity for the San Diego consolidation, it is the most operationally comparable peer.

Direct peers

• Rogers Corporation: US specialty materials company producing high-frequency circuit materials, power electronics substrates, and thermal management solutions. Santier's Northeast Regional Sales Manager Brian Kopp previously worked at Rogers; product portfolio overlaps in thermal management for RF and power electronics.
• Materion Corporation: US supplier of advanced engineered materials including beryllium composites, ceramic substrates, and thermal management materials. Comparable in advanced materials IP and in serving defense, aerospace, and semiconductor packaging customers.
• CoorsTek: Leading global manufacturer of technical ceramics including alumina, aluminum nitride, and beryllia packages for hermetic microelectronic packaging. Direct competitor in ceramic sidewall and power package categories serving defense and RF customers.
• Heraeus Electronics: German specialty materials and electronics division producing thick-film pastes, bonding wires, and substrate materials for power electronics and microelectronic packaging. Comparable in serving automotive, industrial, and high-reliability electronics packaging markets with thermal management focus.
• Kyocera: Japanese multinational that produces hermetic microelectronic packages, ceramic substrates, and packaging for defense, aerospace, and semiconductor customers. Multiple Santier executives (CEO Kevin Cotner, Director of Marketing Bill Ishii) previously worked at Kyocera America, and Kyocera is a direct competitor in the same hermetic packaging product category.
• Plansee Group: Austrian refractory metals manufacturer that originally owned Santier (then Plansee TMS) before divesting in 2012. Produces molybdenum and tungsten components for electronics, semiconductor, and lighting applications, directly comparable in materials and end markets.
• Ametek (HCC Industries / Hermetic Seal): US manufacturer of hermetic connectors, packages, and microelectronic housings for defense, aerospace, and space applications. Santier VP of Operations Mansoor Mosallaie was previously GM of Ametek HCC Industries; products and customer base overlap directly.

Emerging players

• Hi-Rel Connectors: US manufacturer of hermetic connectors and microelectronic packaging for defense and aerospace applications. Mansoor Mosallaie was previously Hermetic Division Manager at Hi-Rel Connectors; small specialty competitor serving overlapping defense and aerospace customer base.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/santier

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles15 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Santier, Inc.