Xpeedic Technology

What Xpeedic Technology does

Xpeedic Technology (芯和半导体科技（上海）股份有限公司) is a privately held Chinese electronic design automation (EDA) software company founded in 2010 and headquartered in Shanghai's Zhangjiang Hi-Tech Park, with additional R&D centers in Suzhou, Wuhan, and Xi'an, sales offices in Beijing, Chengdu, Xi'an, and Shenzhen, and a Silicon Valley operations center established in 2017. The company specializes in multi-physics simulation engines that address signal integrity (SI), power integrity (PI), electromagnetic (EM) compatibility, electro-thermal coupling, and stress reliability across the full chip-to-system stack, positioning itself around the STCO (System-Technology Co-Optimization) methodology for AI-era hardware design.

Its product portfolio is organized as a platform-plus-modules architecture. At the chip level, IRIS provides on-chip EM simulation with Cadence Virtuoso integration and X3D handles quasi-static RLGC parasitic extraction. The packaging and system tier includes Metis for 2.5D/3DIC Chiplet advanced packaging, Hermes Layered/3D/Transient for full-wave FEM and FIT EM simulation, Notus for SI/PI/thermal/stress co-simulation, ChannelExpert for high-speed channel verification (DDR, LPDDR, PCIe), XDS for RF system design, and Boreas for CFD thermal analysis. The most recent additions are Janus for low-frequency EM in power electronics and the XAI Multi-Agent Platform (Modeling, Simulation, Interaction, Computation agents) introduced at DesignCon 2026. Supporting infrastructure includes Genesis XSCH/XPKG/XPCB/XLIB design entry tools, TmlExpert/ViaExpert/CableExpert/iModeler modeling utilities, and XPLM/LicenseManager/JobQueue/LibManager for enterprise deployment. The platform has achieved benchmarks of 10x simulation speedup and 20x lower memory consumption versus international gold-standard tools, with foundry certifications at Samsung (SAFE EDA partner, 8LPP), GLOBALFOUNDRIES (12LP, 22FDX, RFwave program), and TSMC (advanced packaging nodes).

Xpeedic generates revenue primarily through enterprise EDA software licensing (subscription/recurring) and related professional services, distributed via direct enterprise sales targeting semiconductor IDMs, fabless companies, packaging and testing houses, and system integrators globally. The company is recognized as a National-level 'Little Giant' enterprise by China's Ministry of Industry and Information Technology, has 400+ enterprise customers, has enabled 600+ independently developed RF chips and 10 billion+ IPD devices, and has received the 2023 National Science and Technology Progress Award First Prize and the 2025 CIIF Award (a first for a domestic EDA vendor). Its most recent funding round of over 100 million RMB was completed in March 2021 with SMIC Ningbo and Shanghai IoT VC Fund, and the company announced a major brand transformation to 'System Design Navigator in the AI Era' at SEMICON China 2026.

Name

Xpeedic Technology

Legal name

芯和半导体科技（上海）股份有限公司

Website

https://xpeedic.com

Company type

Private

Founded year

2010

Operating status

Operating

Headcount range

101–250 employees

Short description

Xpeedic Technology is a Shanghai-based EDA software company founded in 2010 that provides multi-physics simulation platforms (SI/PI/EM/thermal/stress) for advanced packaging, Chiplet, RF, and system-level chip design. It serves 400+ semiconductor and system customers globally, with foundry certifications at Samsung, GLOBALFOUNDRIES, and TSMC.

Ownership category

akta.pro rank

Product category

Electronic Design Automation (EDA) Software

NAICS

Software Publishers (5132), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Custom Computer Programming Services (541511), Computer Systems Design and Related Services (54151), Computer Systems Design Services (541512)

SIC

Services-Computer Programming Services (7371), Industrial Instruments For Measurement, Display, And Control (3823), Laboratory Analytical Instruments (3826), Services-Computer Integrated Systems Design (7373)

akta.pro primary industry

System-Level, Multi-Physics & Package/PCB Co-Design (EDA) (HDAHAFAD)

akta.pro secondary industries

EDA Software Platforms (Digital Implementation, Verification & Signoff) (HDAHAFAA), Analog/Mixed-Signal & RF EDA Tools (HDAHAFAB), Verification IP (VIP) & Protocol Compliance Suites (HDAHAFAG), Design Services & ASIC/SoC Implementation (EDA-Adjacent) (HDAHAFAL)

Keywords

• Electronic design automation
• Signal integrity simulation
• Multi-physics simulation
• RF system design
• Advanced packaging EDA

Headquarters

HQ city

Bellevue

HQ country

United States

HQ region

North America

Offices9 records

Markets served

GTM type

B2B

Offering type

Software

Cost components

Personnel, Technology or R&D, Marketing or Sales, Infrastructure, Operations

Revenue model

1. EDA Software Licenses: The company generates revenue primarily from licensing its EDA software tools. The software is distributed via perpetual licenses and potentially subscription models, targeting semiconductor design companies, packaging manufacturers, and system integrators globally.
2. Professional Services and Technical Support: Revenue generated from technical support services, training programs, and possibly custom engineering services associated with EDA tool deployment and optimization.

Pricing tiers

Go-to-market motion3 records

Distribution channels4 records

Marketing channels8 records

Core offering

Xpeedic Technology develops and sells EDA software platforms for multi-physics simulation across chip, package, PCB, and system levels. Its portfolio covers signal integrity, power integrity, electromagnetic, electro-thermal, and stress analysis, with specialized platforms for 2.5D/3DIC Chiplet advanced packaging, RF system design, and high-speed channel verification, targeting semiconductor IDMs, fabless companies, packaging and testing houses, and system integrators globally.

Product overview

Xpeedic Technology (芯和半导体科技（上海）股份有限公司) offers a comprehensive platform-plus-modules EDA portfolio organized around a multi-physics simulation core. The product family spans three tiers: (1) Chip-level EM and circuit simulation (IRIS for on-chip RF, X3D for RLGC extraction, Janus for low-frequency electromagnetic); (2) Advanced packaging and system-level simulation (Metis for 2.5D/3D IC Chiplet SI/PI, Hermes Layered/3D/Transient for full-wave EM, Notus for SI/PI/thermal/stress co-simulation, Boreas for CFD thermal, ChannelExpert for high-speed channel verification, XDS for RF system design); (3) Design entry and layout (Genesis XSCH/XPKG/XPCB/XLIB for schematic, package, PCB, and library design, with TmlExpert, ViaExpert, CableExpert, and iModeler for transmission line, via, cable, and passive PDK modeling). The platform supports Python scripting, integrates AI through the XAI multi-agent system, and is unified by XPLM design lifecycle management, LicenseManager, JobQueue, and LibManager for enterprise-scale deployment. The full-stack portfolio addresses signal integrity, power integrity, electromagnetic compatibility, electro-thermal analysis, stress reliability, RF systems, and Chiplet advanced packaging across data center, automotive, 5G/communication, mobile, IoT, and smart terminal end markets.

Differentiator

Problem solved

Functional benefit

Products and services

• Metis 3DIC multi-physics simulation platform for 2.5D and 3D IC Chiplet designs, enabling unified EM simulation of die, interposer, and substrate. Supports SI/PI and circuit co-analysis, hybrid bonding multi-die stacking, and signal/power integrity from chip to system.
• Notus Package and PCB multi-physics simulation platform providing SI/PI co-analysis, topology extraction, and electrical-thermal-stress analysis for high-speed and high-frequency designs. Includes PI DC analysis, decoupling optimization, and multi-board system support.
• Hermes Layered Package and PCB high-frequency EM simulation using 3D full-wave FEM from DC to THz for 2.5D planar structures, enabling accurate electromagnetic simulation across layered planar geometries.
• Hermes 3D 3D high-frequency EM simulation for arbitrary 3D structures using 3D full-wave FEM from DC to THz, supporting comprehensive EM analysis of chips, packages, boards, cables, connectors, and antennas.
• Hermes Transient System-level EMC simulation tool based on FIT (Finite Integration Technique) solver, supporting large-scale antenna, EMI/EMC, and transient analysis for electromagnetic compatibility verification.
• X3D RLGC parasitic extraction tool based on quasi-static Method of Moments (MoM) solver for fast extraction of interconnect RLGC parasitic parameters in packages, interposers, and printed circuit boards.
• XSBR System-level scattering analysis tool for analyzing electromagnetic scattering behavior across interconnected systems.
• Boreas System-level CFD thermal simulation platform supporting natural convection, forced convection, and fluid-structure coupled thermal analysis including laminar and turbulent flow modes for board-level to system-level thermal management.
• Janus 3D low-frequency electromagnetic simulation platform for motors, transformers, wireless charging, and power electronics, delivering 3D DC conduction and eddy current analysis with electric field, magnetic field, current density, and loss distribution results.
• ChannelExpert High-speed system verification platform for time-domain and frequency-domain full-link signal integrity analysis with embedded XSPICE high-speed circuit engine supporting DC, AC, transient, and eye diagram analysis, IBIS/AMI model simulation, and JEDEC-compliant DDR4/DDR5X/LPDDR4/LPDDR5X reports.
• XDS RF system design platform for chips, packages, modules, and PCBs supporting PDK-driven co-simulation workflows, integrating MoM and FEM EM solver engines and XSPICE RF circuit engine for DC OP, AC, S-parameters, noise, and HB nonlinear simulation, with RF filter design for IPD, SAW, and BAW.
• IRIS Fast on-chip EM simulation tool for RFIC design, featuring accelerated 3D EM solvers, advanced process support, and Cadence Virtuoso integration to enable first-pass silicon success for on-chip passive modeling.
• TmlExpert Transmission line modeling and simulation tool providing templates for characteristic impedance, insertion loss, return loss, and crosstalk assessment, supporting serpentine routing, tabbed routing, GCPW, glass weave, and grid ground line templates with 2D RLGC, 2.5D MoM, and 3D FEM solvers.
• ViaExpert High-speed via modeling tool for via-related electrical performance analysis, enabling rapid assessment of via impedance, capacitance, and inductance effects in high-speed interconnects.
• CableExpert Cable harness modeling tool for analyzing the electrical performance of cable interconnects in high-speed and high-frequency systems.
• iModeler Passive PDK modeling tool using high-precision accelerated EM solvers combined with neural network training algorithms to rapidly build parameterized layout and equivalent circuit models for specific semiconductor processes.
• Genesis XSCH Genesis schematic design entry tool for creating circuit schematics as the starting point for package and PCB design workflows.
• Genesis XPKG Genesis package design software for advanced packaging layout design, supporting interposer and substrate design for Chiplet and 2.5D/3D IC architectures.
• Genesis XPCB Genesis PCB design software for board-level system design, enabling schematic-driven PCB layout and verification.
• Genesis XLIB Genesis component library design tool for managing and creating reusable component libraries used across schematic and layout design environments.
• MeasureExpert Automated measurement and analysis tool for processing measurement data from physical test setups, enabling automated correlation between simulation and measurement results.
• XPLM Electronics design lifetime management platform for managing design data, simulation workflows, and results across the complete electronics product lifecycle from chip to system.
• XAI Multi-Agent Platform Multi-agent AI platform integrating four AI agents (modeling, simulation, interaction, computation) for AI-native EDA workflows, including AI parametric PDK creation, real-time EM/thermal prediction, LLM-based knowledge retrieval, and elastic distributed computing.

Quantifiable outcome

• 10x faster simulation with comparable accuracy vs. competitors in DDR5 packaging full-wave simulation
• +4 more outcomes

Named customers8 records

Segments8 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability9 records

Feature10 records

Partnerships

Ten partnerships are on record, tiered core, major and minor.

• 3D Glass Solutions (3DGS)coreStrategic or Co-development Partner · 19 April 2026Xpeedic is listed among ecosystem partners for 3DGS's Rs 1,943 crore advanced packaging and embedded glass substrate ATMP facility in Odisha, India. Xpeedic provides EDA design support alongside Marvell, Intel, Applied Materials, and Xscape Photonics, with aggregate offtake exceeding 100% of proposed capacity.
• Murata Manufacturing (村田制作所)coreStrategic or Co-development Partner · 10 April 2026Murata Manufacturing's President Nakajima visited Xpeedic Shanghai headquarters in April 2026. Both parties agreed to deepen strategic collaboration across four dimensions: (1) joint EDA+device solutions for AI servers and optical modules, (2) high-precision model collaboration for end-to-end digital workflow, (3) key customer co-expansion globally, and (4) global ecosystem brand building. Murata already provides encrypted models based on Xpeedic's Hermes platform for global HPC chip customers.
• Samsung Electronics (SAFE EDA Partner)coreTechnology or IntegrationXpeedic is a Samsung SAFE (Samsung Advanced Foundry Ecosystem) EDA partner. Xpeedic's IRIS platform has passed Samsung's 8LPP process certification. Collaboration enables mutual customers to use Xpeedic's EM simulation tools within Samsung's design enablement flow.
• GLOBALFOUNDRIEScoreTechnology or IntegrationXpeedic's IRIS EM simulation software has been certified for GLOBALFOUNDRIES' 12LP and 22FDX processes. Xpeedic also participates in GF's RFwave partner program to accelerate wireless connectivity, radar and 5G application time-to-market.
• Lenovo Group (联想集团)coreStrategic or Co-development PartnerLenovo and Xpeedic signed an EDA Agent strategic cooperation agreement in November 2025. The collaboration focuses on AI-driven intelligent terminal and system design, combining Xpeedic's multi-physics simulation engines with Lenovo's advanced system design workflow. Lenovo's VP of R&D co-authored a DesignCon 2026 paper on LPDDR5x signal integrity with Xpeedic engineers.
• Kylin Software (麒麟软件)majorStrategic or Co-development PartnerXpeedic completed product compatibility certification with Kylin Software's Galaxy Kylin Advanced Server OS V10 in August 2025. Five key EDA platforms (Metis, Notus, ChannelExpert, Hermes3D, XDS) are certified for domestic OS deployment, addressing the needs of Chinese enterprises for full-chain independent controllability.
• Chipletz (US)majorStrategic or Co-development PartnerChipletz adopted Xpeedic's Metis platform for smart substrate product design. The collaboration enabled Chipletz to achieve multi-scale EM simulation of die, interposer and substrate, addressing challenges in 2.5D/3D IC heterogeneous integration design.
• 芯原股份 (VeriSilicon)minorStrategic or Co-development PartnerVeriSilicon participated as an ecosystem partner in Xpeedic's 2025 user conference, representing the IP layer of the AI hardware supply chain ecosystem.
• UCIe ConsortiummajorStrategic or Co-development PartnerXpeedic became the first domestic EDA company to join the UCIe (Universal Chiplet Interconnect Express) Industry Alliance, supporting the development of open chiplet interconnect standards.
• ESD Alliance (电子系统设计联盟)minorStrategic or Co-development PartnerXpeedic joined the ESD (Electronic System Design) Alliance, participating in industry-wide collaboration on electronic system design standards and methodologies.

Scale indicators5 records

Recent moves9 records

Expansion highlights6 records

Broad incumbents

• Keysight Technologies: Keysight is the test-and-measurement incumbent (ADS, PathWave EM) and an EDA adjacent player in RF and SI workflows. Xpeedic lists Rohde & Schwarz/Keysight as an integration partner, marking Keysight as a complementary rather than fully overlapping vendor in RF/Si design tools.
• Synopsys: Synopsys is the global EDA market leader in digital implementation and verification (ICC, VCS, PrimeTime). Its chip-package-system push overlaps with Xpeedic's multi-physics SI/PI offerings, and its PrimeSim/PrimeWave and recent Ansys-asset acquisition expand into thermal/EM areas that directly impinge on Xpeedic's roadmap.
• Siemens EDA: Siemens EDA (formerly Mentor Graphics) provides HyperLynx, Xpedition and Calibre — legacy PCB/SI/PI and physical verification tools incumbent in aerospace, automotive and large system houses. Xpeedic's Notus/ChannelExpert target the same SI/PI workflow category.
• Cadence Design Systems: Cadence is the second-largest global EDA vendor with broad chip, package and system design tooling, including Virtuoso, Spectre and the Clarity/AWR RF suites. Xpeedic's IRIS platform integrates with Cadence Virtuoso, indicating Cadence as both a partner and the principal incumbent it competes against in RF EDA.
• Ansys: Ansys is the dominant multi-physics simulation vendor (HFSS, Maxwell, SIwave, Icepak). Its HFSS/SIwave platform is the international gold standard for full-wave EM and PI that Xpeedic benchmarks itself against, and it has EDA-touching flows via foundry partnerships and AVL.

Emerging players

• Zuken: Zuken is a Japanese-headquartered PCB/package design EDA vendor (CR-8000, DFM). It is comparable to Xpeedic's Genesis XPKG/XPCB offerings for advanced package and board layout, though smaller in scale and predominantly regional.
• Altair Engineering: Altair (now part of Siemens) provided FEKO and other multi-physics solvers including electrical-thermal workflows relevant to package and PCB design. It competes in adjacent simulation categories (electromagnetic, thermal, mechanical) where Xpeedic's Janus and Boreas also play.
• COMSOL: COMSOL offers a general-purpose multi-physics simulation environment (COMSOL Multiphysics) used in academic and R&D settings. It overlaps thematically with Xpeedic's multi-physics engine strategy (EM, thermal, stress) but lacks the PCB/IC packaging-specific tooling that Xpeedic packages.

Direct peers

• Primarius Technologies: Primarius (概伦电子) is a Chinese EDA peer focused on device modeling, circuit simulation and parallel SPICE — overlapping with Xpeedic on foundry PDK modeling (iModeler) and high-speed circuit verification (XSPICE/ChannelExpert), and competing for similar Chinese semiconductor customers.
• Empyrean Technology: Empyrean (华大九天) is China's largest domestic EDA company, listed on STAR Market. It directly competes with Xpeedic in analog/mixed-signal, flat-panel and RF EDA tools, and is the principal domestic incumbent in the same chip-to-system design niche Xpeedic is targeting.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/channel/UCZ1l2CoidNuHzAw8J_rbElA/about
• LinkedInlinkedin.com/company/xpeedic-technology-inc-

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Xpeedic Technology