Korea Circuit

What Korea Circuit does

Korea Circuit Co., Ltd. (코리아써키트) is a South Korean printed circuit board manufacturer founded in 1964 as Samsung Metal & Chemistry and renamed to its current form in 1972. The company is publicly listed on KOSPI (ticker 007810) and operates as a subsidiary of Young Poong Group, which holds 50.12% of total shares including special relations. Headquartered in Ansan-si, Gyeonggi-do, Korea Circuit operates three manufacturing plants in Ansan and a 30%-owned joint venture (Ascent-K Circuit) with Amber Enterprises India for HDI PCB and semiconductor substrate production in Jewar, India. The company reports 1,208 employees and 2025 consolidated revenue of KRW 1,509.726 billion.

Korea Circuit's product portfolio spans three categories: HDI (High Density Interconnection) PCBs for smartphones, tablets, and wearables; Package Substrates including FC-BGA, FCCSP, CSP, PBGA, and SIP for semiconductor packaging; and Rigid-Flex PCBs for storage and smart devices. Underlying technology emphasizes miniaturization and high-density patterning, with a documented R&D roadmap advancing HDI line/space from 30/40um to 20/20um by 2025 and package substrate capabilities to 8/8um ETS with 100um bump pitch. The PKG P3 factory (established 2022) is dedicated to FC-BGA production for AI GPU, server, and high-performance computing applications. The company runs an in-house R&D center (established 1990) and vertically integrates through subsidiaries Interflex (FPC), Terranix (MLB), and Signetics (IC packaging/test).

The business model is direct enterprise B2B hardware sales with technical account management targeting major global electronics OEMs and semiconductor companies. Named customers include Samsung Electronics (Galaxy smartphone HDI boards, with majority first-vendor share for Galaxy S26), Amkor Technology (package substrates), Broadcom (FC-BGA for AI/networking), and Nvidia (SOCCAM and CXL PCB components for AI GPUs). Korea Circuit generates revenue through negotiated long-term supply contracts; pricing is not publicly disclosed. Distribution is direct from Korean plants to customer-designated locations globally, supported by regional sales offices in Scottsdale (USA), Singapore (Asia Pacific), and Augsburg (Germany). The 2025 operating profit turnaround to KRW 53.817 billion (from KRW -33.153 billion in 2024) was driven by FC-BGA capacity utilization and AI-related demand, particularly from Broadcom.

Name

Korea Circuit

Legal name

Korea Circuit Co., Ltd. (주식회사 코리아써키트)

Website

https://kcg.co.kr

Company type

Public

Founded year

1972

Operating status

Operating

Headcount range

501–1,000 employees

Short description

South Korean PCB and package substrate manufacturer serving global electronics and semiconductor OEMs including Samsung, Amkor, Broadcom, and Nvidia. Operates three plants in Ansan plus a 70:30 Indian JV with Amber Enterprises. Listed on KOSPI as a Young Poong Group subsidiary.

Ownership category

akta.pro rank

Product category

Printed Circuit Boards

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

akta.pro secondary industries

PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH), PCB Fabrication (Rigid PCBs) (HDAHAOAG)

Keywords

• Printed circuit boards
• HDI PCB manufacturing
• Semiconductor package substrates
• Flip-chip BGA substrates
• Rigid-flex PCBs

Headquarters

HQ city

Ansan

HQ country

South Korea

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure

Revenue model

1. PCB and Package Substrate Sales: Korea Circuit generates revenue primarily through the manufacture and sale of printed circuit boards and semiconductor package substrates to global electronics OEMs and semiconductor companies. The company operates both directly (standalone basis, 2025 sales: KRW 862.984 billion) and through consolidated group entities (2025: KRW 1,509.726 billion). Products include HDI PCBs for mobile devices, FC-BGA/FCCSP/CSP for semiconductor packaging, and rigid-flex PCBs.
2. Joint Venture Manufacturing (India): Through the 70:30 Ascent-K Circuit joint venture with Amber Enterprises India, Korea Circuit participates in PCB and semiconductor substrate manufacturing operations in India targeting the domestic market and export to US/Middle East. This represents a new revenue stream from international manufacturing partnerships.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels3 records

Core offering

Korea Circuit manufactures printed circuit boards (HDI mobile boards, memory module and SSD PCBs, display PCBs) and semiconductor package substrates (FC-BGA, FCCSP, SIP, CSP, PBGA) at three Ansan plants. Its rigid-flex PCB portfolio serves smart devices, wearables, and storage applications, while its FC-BGA capacity targets AI GPU and server semiconductor customers. Revenue is generated through direct sales to global electronics and semiconductor OEMs.

Product overview

Korea Circuit is a leading Korean PCB (Printed Circuit Board) manufacturer with over 50 years of industry experience since its founding in 1972. The company operates three manufacturing facilities in Ansan, Gyeonggi Province, and offers three main product categories: (1) HDI PCBs for mobile devices including smartphones and tablets; (2) Package Substrates including FCBGA, FCCSP, SIP, CSP, and PBGA for semiconductor packaging and applications; and (3) Rigid-Flex PCBs for smart devices, wearables, and storage applications. The company serves customers in electronics, IT, automotive, and semiconductor industries worldwide.

Differentiator

Problem solved

Functional benefit

Products and services

• HDI (High Density Interconnection) PCB - Smart Phone/Tablet High-density interconnect PCB applying fine pattern and micro-via technology as main boards for smartphones and tablet PCs, enabling miniaturization and high functionality in mobile devices (4–12 layers, 0.3–1.6mm board thickness).
• Memory Module PCB (DIMM/SODIMM) PCBs for memory modules in DIMM and SODIMM formats used in desktop PCs, notebooks, workstations, and servers for DRAM assembly and data-processing expansion.
• SSD PCB Multi-layer, high-quality PCB designed for solid-state drives (SSDs), supporting low power consumption and fast processing speeds in storage applications including data center SSDs.
• Display PCB (LCD/OLED) High-density PCB for LCD and OLED displays used in OLED TVs, monitors, notebooks, and mobile devices, with high resolution and thin form factors.
• FCBGA (Flip Chip Ball Grid Array) Substrate Flip chip package substrate connecting semiconductor chips to PCB via fine circuit miniaturization and multi-layer technology, with large body size, high layer count, 9/12µm SAP/ISAP fine patterning, 60/85µm laser-drilled via/land, and 130µm bump pitch. Designed for automotive, server, AI, and high-performance computing applications (AI GPUs, microprocessors).
• FCCSP (Flip Chip Chip Size Package) Substrate Flip chip CSP substrate where chips are mounted face-down using bumps rather than wire bonding, enabling smaller size and improved performance for smartphones, laptops, and portable devices.
• SIP (System In Package) Substrate System-in-package substrate integrating multiple chips (microprocessor, memory, analog) in a single package with short development cycles, low cost, and high yield. Supports RF/wireless, consumer, networking, and graphics processor applications.
• CSP (Chip Size Package) / UT-CSP Substrate Chip size package substrate where package size does not exceed 120% of chip size, including ultra-thin UT-CSP variants (≤0.12mm thickness, 0.35mm ball pad pitch, Cu Fill via) for MCP applications. Designed for memory, analog, ASICs, logic, and RF devices in notebooks and wireless systems.
• PBGA (Plastic Ball Grid Array) Substrate Plastic ball grid array package substrate with solder balls for connecting substrates to main boards, used in ASICs, DSPs, microprocessors, and graphics processors.
• Rigid-Flex PCB (Smart Device) Multi-layer PCB combining rigid (4–12L, 0.3–0.8T) and flexible (2–6L, 0.08–0.25T) sections with 30µm line/space, enabling 3D design and signal loss reduction for wearable devices and displays.
• Rigid-Flex PCB (Storage) High multi-layer, high-reliability rigid-flex PCB for server and data center SSD applications, featuring high capacity and high-speed performance.

Quantifiable outcome

• India JV aims to replace INR 40,000 crore (~$4.8 billion) of annual PCB imports into India through domestic manufacturing
• +3 more outcomes

Named customers4 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Amber Enterprises India / Ascent-K CircuitcoreStrategic or Co-development Partner · 11 October 202470:30 joint venture between Amber Enterprises India and Korea Circuit, trading as Ascent-K Circuit. Korea Circuit contributes PCB and package substrate technology; Amber provides Indian manufacturing infrastructure and market access. The JV is constructing a Rs 3,250 crore HDI PCB and semiconductor substrate facility in Jewar, Uttar Pradesh, India, expected to generate 3,000 jobs. Supported under India's Electronics Component Manufacturing Scheme. Initial domestic sales to Indian mobile/laptop manufacturers, with future exports to US and Middle East.
• Amkor TechnologycoreStrategic or Co-development Partner · 1 January 2021Package substrate customer and strategic partner. Amkor recognized Korea Circuit as an Outstanding Supplier in 2021. Korea Circuit supplies package substrates for Amkor's semiconductor packaging operations serving global chipmakers.
• Interflex Co., Ltd. (주식회사 인터플렉스)coreTechnology or Integration · 1 January 1994Subsidiary of Korea Circuit established 1994, manufacturing flexible PCBs (FPC). Located at Plant 3 address in Seonggok-dong, Ansan. CEO: Il-Woon Shin. Provides in-house flexible PCB supply capability complementary to Korea Circuit's rigid and rigid-flex PCB portfolio.
• Samsung ElectronicscoreStrategic or Co-development PartnerLong-standing strategic partnership as HDI PCB supplier for Samsung Galaxy smartphone series. Korea Circuit and DAP jointly hold over 50% first-vendor development share for Samsung Galaxy S26 HDI components, surpassing Chinese competitors. Also recognized as Samsung Electronics Best Partner (2017) and Innovation Proposal Award winner (2021).
• BroadcomcoreStrategic or Co-development PartnerFC-BGA substrate supplier to Broadcom for AI, networking, and communications semiconductor products. The 'Broadcom effect' cited as a key driver of Korea Circuit's Q1 2025 profit turnaround. Deep partnership for next-generation chip packaging technologies.
• NvidiacoreStrategic or Co-development PartnerTarget and existing supplier of SOCCAM and CXL PCB components for Nvidia AI GPU and server products. Korea Circuit actively pursuing expanded supply share with Nvidia for AI chip ecosystem.
• Korea PCB Association (KPCA) / Industry ConsortiumminorStrategic or Co-development PartnerActive member of the Korea PCB Association. Participates in industry-wide technology development initiatives and government-supported R&D programs including projects with ETRI, KETI, and other national research institutes.

Scale indicators7 records

Recent moves9 records

Expansion highlights5 records

Direct peers

• Tripod Technology: Taiwanese multi-layer and HDI PCB manufacturer serving computing, networking, and automotive markets. Comparable in HDI and multi-layer PCB offerings.
• Samsung Electro-Mechanics: Major Korean PCB/substrate manufacturer producing HDI, FC-BGA, and rigid-flex PCBs for Samsung and other global OEMs. Direct competitor in mobile HDI and package substrates, with deeper vertical integration and scale.
• Unimicron Technology: Taiwanese PCB and substrate manufacturer producing HDI, FC-BGA, and rigid-flex PCBs. Direct competitor across multiple product categories including mobile HDI and package substrates.
• LG Innotek: Korean manufacturer of HDI, substrate, and rigid-flex PCBs serving smartphone, automotive, and semiconductor customers. Direct competitor in Korean mobile HDI and advanced substrate segments.
• Shinko Electric Industries: Major Japanese FC-BGA and flip-chip substrate manufacturer serving semiconductor and AI customers. Direct competitor in package substrates, particularly for high-end computing and AI accelerators.
• Ibiden: Japanese leader in FC-BGA package substrates for AI and high-performance computing applications. Direct competitor in the advanced AI/semiconductor substrate space Korea Circuit is scaling into.
• AT&S (Austria Technologie & Systemtechnik): European-headquartered manufacturer of HDI, substrate, and IC substrate PCBs for AI, mobile, and automotive applications. Comparable in advanced substrate capability and scale.
• Kinsus Interconnect Technology: Taiwanese substrate producer (IC substrates and PCBs) supplying semiconductor and AI customers. Direct competitor in FC-BGA and flip-chip substrate markets.
• Nan Ya PCB (Formosa Plastics Group): Taiwanese substrate manufacturer specializing in FC-BGA and HDI PCBs for computing and AI applications. Direct competitor in advanced package substrates for AI/server chips.

Regional players

• Young Poong Electronics (YP Electronics): Korean FPC (flexible PCB) manufacturer affiliated with Korea Circuit's parent Young Poong Group. Adjacent peer in flex PCB and a fellow group affiliate, though product overlap is partial.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• Facebookfacebook.com/koreacircuit
• LinkedInlinkedin.com/company/korea-circuit-co-ltd

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Korea Circuit