nepes

What nepes does

NEPES Co., Ltd. (네패스) is a South Korea-headquartered semiconductor back-end packaging specialist founded in 1990 by Lee Byeong-gu and listed on KOSDAQ under ticker 033640.KQ. The company's core offering is advanced packaging services spanning Copper Pillar Bumping (CPB), Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FOWLP), 600×600mm Panel Level Packaging (PLP), Fan-Out System-in-Package (FOW-SiP), and final test. NEPES was the first in Korea to mass-produce 600×600mm PLP and has developed proprietary Fan-Out Embedded Bridge Die Interposer technology for heterogeneous integration of NPUs and HBMs in AI and HPC applications, addressing the limitations of traditional silicon interposers.

The company operates through five business divisions: Semiconductor (the core), Artificial Intelligence (predictive maintenance, vision inspection, and AI/digital education through the Kocoafab brand), IT Materials (process chemicals and functional chemicals, marketed under the IRIDOS sub-brand), Rechargeable Battery (lead tabs for ESS/automotive and LIB anode electrodes), and Energy (green construction, Low-E film, smart film). Revenue is generated primarily through B2B direct enterprise sales of packaging services to semiconductor manufacturers — Samsung Electronics is the named anchor customer and supply chain partner — supplemented by AI education services, materials sales, and battery/energy product sales. The go-to-market is direct field sales combined with consortium participation in government-backed R&D and ESG programs (e.g., the 2026 Industrial Supply Chain Carbon Partnership Project with the Ministry of Trade, Industry and Energy, and Korea Energy Agency FEMS co-funding).

NEPES employs approximately 2,300 people across manufacturing campuses in Cheongju, Goesan (Cheongan Campus), Eumseong, and Ochang in South Korea, with overseas production via Jiangsu Nepes Semiconductor Co., Ltd. in China and Nepes Heim in the Philippines. The company reports annual revenue of approximately 4,800억 KRW (~$350M USD) and pursues active R&D, including publications and presentations at IEEE EPTC and ISMP conferences on next-generation AI packaging. Government recognition includes a Gold Tower Industrial Medal (2022) for the founder and a Presidential Commendation (2025) for the President of Semiconductor Business.

Name

nepes

Legal name

(주)네패스

Website

https://nepes.co.kr

Company type

Public

Founded year

1990

Operating status

Operating

Headcount range

501–1,000 employees

Short description

NEPES is a South Korea-based semiconductor back-end packaging specialist offering bumping, WLP, FOWLP, 600×600mm PLP, FOW-SiP, and test services — the first in Korea to mass-produce 600×600mm panel-level packaging — serving AI, HPC, and automotive chip manufacturers with Samsung Electronics as a named anchor customer.

Ownership category

akta.pro rank

Product category

Semiconductor Back-End Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

• Semiconductor packaging services
• Fan-out wafer level packaging
• Panel level packaging
• Copper pillar bumping
• Heterogeneous integration packaging

Headquarters

HQ city

Seocho

HQ country

South Korea

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain

Revenue model

1. Semiconductor Packaging Services: Core revenue from advanced semiconductor packaging including bumping, WLP, FOWLP, PLP, SiP, and test services. Revenue is generated through long-term contracts with semiconductor manufacturers requiring custom packaging solutions for AI chips, HPC, and automotive applications.
2. AI / Digital Education: Revenue from AI and digital education brand 'Kocoafab' providing customized learning solutions, educational content, and AI-based training programs for schools and teachers. Services include voice-based AI teaching aids and government/public education projects.
3. IT Materials (Electronic Materials): Process chemicals and functional chemicals for electronics manufacturing, including EM (electronic materials) products and IRIDOS brand materials.
4. Rechargeable Battery: Lead tabs for ESS and automotive applications, and LIB anode electrodes for battery manufacturing.
5. Energy Solutions: Green construction and smart window solutions including Low-E film and Smart Film products.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

NEPES manufactures and delivers advanced semiconductor back-end packaging services, including Copper Pillar Bumping (CPB), Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FOWLP), 600x600mm Fan-Out Panel Level Packaging (PLP), System-in-Package (SiP), and semiconductor test services for AI, HPC, and automotive applications. The company also produces electronic materials (EM/IRIDOS), rechargeable battery components (lead tabs, LIB anode electrodes), energy-saving films (Low-E and Smart Film), and AI-based digital education products under its Kocoafab brand.

Product overview

NEPES is a comprehensive semiconductor backend solutions provider operating through five core business divisions: Semiconductor (advanced packaging: PLP, FOWLP, WLP, bumping, test services), AI (predictive maintenance, vision inspection), IT Materials (process and functional chemicals), Rechargeable Battery (lead tabs, LIB anodes), and Energy (smart windows, smart films). Key sub-brands include kocoaFab for AI education, Nepes Ark for semiconductor testing, and IRIDOS for electronic materials. The company serves AI, HPC, automotive, and mobile device markets with heterogeneous integration and panel-level packaging capabilities.

Differentiator

Problem solved

Functional benefit

Products and services

• Advanced Semiconductor Back-End Packaging Services (FOWLP / PLP / WLP) End-to-end semiconductor back-end packaging including Fan-Out Wafer Level Packaging (FOWLP), 600x600mm Fan-Out Panel Level Packaging (PLP), Wafer Level Packaging (WLP), and related bumping and test services for AI accelerator, GPU, HPC, automotive, and mobile chip manufacturers.
• Bumping (Copper Pillar Bumping, CPB) Copper Pillar Bumping wafer-level interconnect services for AI data center power semiconductor and advanced logic packaging applications.
• System-in-Package (SiP) Fan-Out SiP integration services that combine multiple semiconductor dies into a single package for AI, HPC, and advanced mobile/IoT applications.
• Semiconductor Test Services (via NEPES Ark) Final and wafer-level semiconductor test services delivered through the NEPES Ark subsidiary for AI, HPC, and automotive packaging customers.
• Fan-Out Embedded Bridge Die Interposer Technology Proprietary FOWLP-based embedded bridge die interposer for heterogeneous integration of NPUs and HBMs in HPC and AI semiconductor systems, with NEPES-developed RDL and die bonding processes.
• Kocoafab AI / Digital Education Solutions AI-based personalized learning solutions, educational content, and teacher training programs for K-12 and special-needs students under the Kocoafab sub-brand; partners with Seoul National University's Future Education Innovation Center and IOTED.
• AI Geumjjoong-i (AI Goldduck) Voice AI Speaker Voice-recognition AI education speaker built on ChatGPT, deployed in classrooms for elementary and special-needs students to develop problem-solving skills.
• EM (Electronic Materials) Process chemicals and functional chemicals for semiconductor and electronics manufacturing, supplied under the EM (Electronic Materials) brand.
• IRIDOS Functional Electronic Materials Functional electronic materials under the IRIDOS sub-brand within the IT Materials business unit.
• Rechargeable Battery Components (Lead Tabs, LIB Anodes) Lead tabs for ESS and automotive battery cells, plus lithium-ion battery anode electrodes, manufactured by the NEPES Yahad subsidiary.
• Low-E Film (Energy Solutions) Low-emissivity (Low-E) energy-saving window film products distributed by the NEPES E&C subsidiary as part of green construction and energy-efficient building offerings.
• Smart Film Smart Film products (switchable glass films) for green construction and energy-efficient building applications sold through the NEPES E&C subsidiary.

Quantifiable outcome

• First in Korea to mass-produce 600×600mm panel-level packaging, enabling cost-effective large-area packaging for AI and HPC applications
• +2 more outcomes

Named customers1 record

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability8 records

Feature4 records

Partnerships

Eleven partnerships are on record, tiered core and minor.

• Seoul National University Future Education Innovation Center (서울대학교 미래교육혁신센터)coreStrategic or Co-development Partner · 23 June 2026NEPES Kocoafab and Seoul National University's Future Education Innovation Center signed an MOU for AI and digital-based education innovation and diffusion. The partnership covers joint development and operation of AI/digital education programs, government and local government education support projects, industry-academia-research joint research, and global cooperation projects.
• Samsung Electronics (삼성전자)coreStrategic or Co-development Partner · 1 January 2026Samsung Electronics and NEPES operate a supply chain carbon partnership consortium. As anchor enterprise, Samsung Electronics supports NEPES with ESG fund-based interest-free loans for carbon reduction facility construction. Samsung Electronics and NEPES jointly pursue government carbon reduction programs including industrial supply chain carbon partnership. NEPES also participates in Samsung-led Public Growth Fund initiatives and industry roundtables.
• Korean Energy Agency (한국에너지공단)coreStrategic or Co-development Partner · 1 January 2026NEPES was selected for the Korean Energy Agency's 2026 Industrial Energy Management System (EMS) Supply Promotion Project. The government agency supports partial funding for FEMS construction costs at NEPES's Cheongju facility, covering core utility equipment including power, chillers, CDA, PCW, and DI systems.
• Ministry of Trade, Industry and Energy (산업통상자원부)coreStrategic or Co-development Partner · 1 January 2026NEPES participates in the Ministry's 2026 Industrial Supply Chain Carbon Partnership Project as a Samsung Electronics consortium partner. The government funds up to 50% of carbon reduction facility construction costs, with NEPES receiving additional ESG fund-backed loans from Samsung Electronics.
• World Vision (월드비전)minorGTM or Marketing Partner · 1 January 2026NEPES partners with World Vision for child welfare programs including the 'Dreams for Children' program, gifting 100 children with educational and holiday gifts. Partnership involves NEPES employees forming 1:1 connections with children and providing support.
• Yeungnam University College of Science & Technology (영남이공대학교)minorStrategic or Co-development Partner · 19 December 2025NEPES Ark signed a work-learning parallel cooperative agreement with Yeungnam University for the semiconductor testing field. The partnership aims to systematically nurture field-practice talent in semiconductor testing, expand employment opportunities for young people, strengthen industry-academia networks, develop customized education and professional talent cultivation, link semiconductor testing specialized curriculum completers to recruitment, and develop and operate work-learning parallel based education curriculum.
• GIST (광주과학기술원)coreStrategic or Co-development Partner · 1 December 2025NEPES and GIST signed an MOU for strengthening competitive edge in heterogeneous integration advanced packaging. The partnership aims to build an advanced packaging ecosystem essential for on-device AI semiconductor era by combining GIST's AI semiconductor research capabilities (materials, processes, devices, circuits) with NEPES's semiconductor advanced packaging technology and industry know-how. Both parties will pursue establishment of a research branch at GIST's Advanced AI Semiconductor Fab Center, joint R&D, and talent development programs.
• Eumseong County Disability Welfare Center (음성군장애인복지관)minorStrategic or Co-development Partner · 11 March 2025NEPES EM Business Division's volunteer organization 'Na-numi' signed an MOU with the Eumseong Disability Welfare Center for welfare improvement and social value realization. The partnership covers planning and expanding disability support programs, providing human and material resources, and actively conducting social contribution activities.
• Korea Disabled People's Employment Promotion Agency (한국장애인고용공단)minorStrategic or Co-development Partner · 28 March 2023NEPES signed an MOU with the Korea Disabled People's Employment Promotion Agency to promote disabled employment. NEPES committed to creating cultural arts-based job positions for disabled people and spreading positive awareness about disabled individuals by establishing and expanding an orchestra composed of disabled members.
• Miral Welfare Foundation (밀알복지재단)minorGTM or Marketing Partner · 1 October 2022NEPES partners with Miral Welfare Foundation for employment of disabled persons, including selling donated goods at Goodwill Stores, supporting child welfare programs, and providing resources for disabled employee support.
• Korean Red Cross (대한적십자사)minorGTM or Marketing Partner · 1 September 2022NEPES joined the Korean Red Cross Red Cross Creating Shared Value (RCSV) Hall of Fame as Chungbuk #7 for continuous blood donation drives, social contribution activities, and lifetime cumulative donations exceeding 210 million KRW since 2013.

Scale indicators5 records

Recent moves7 records

Expansion highlights5 records

Direct peers

• ASE Technology Holding: ASE is the world's largest OSAT provider, offering bumping, WLP, FOWLP, SiP, and test services for AI, HPC, automotive, and mobile applications. It is the closest global comparable to NEPES's core packaging services business and competes directly for advanced packaging programs.
• Amkor Technology: Amkor is a leading US-headquartered OSAT with major advanced packaging operations in Korea (K4 plant serving Samsung and other Korean customers), offering bumping, WLP, FOWLP, SiP, and 2.5D/3D integration. Direct competitor to NEPES in Korea for advanced packaging, particularly in serving Samsung.
• JCET Group: JCET is China's largest OSAT, offering bumping, WLP, FOWLP, SiP, and advanced packaging. Direct competitor to NEPES in advanced packaging and a regional peer given NEPES's Jiangsu, China operations and Chinese customer overlap.
• Powertech Technology Inc. PTI is a Taiwanese OSAT specializing in bumping, WLP, FOWLP, and advanced packaging for memory and logic devices. Comparable to NEPES in service mix and target customers (AI/HPC and mobile), with similar technology positioning in panel-level and wafer-level fan-out.
• ChipMOS Technologies: ChipMOS is a Taiwanese OSAT offering bumping, WLP, SiP, and test services with strong memory packaging exposure. Direct comparable to NEPES's back-end service stack and competes for similar customer programs in the broader Asia OSAT market.
• Tongfu Microelectronics: Tongfu Microelectronics is a Chinese OSAT providing bumping, WLP, FOWLP, SiP, and test services, and is a direct regional competitor to NEPES in mainland China with overlapping customer bases in AI, mobile, and automotive packaging.
• Hana Microelectronics: Hana Microelectronics is a Thai-headquartered OSAT with packaging and test operations across Southeast Asia and China. Comparable to NEPES as an Asia-based back-end services provider with similar service breadth and geographic diversification.

Emerging players

• Signetics Corporation: Signetics is a smaller Korean OSAT focused on memory packaging and test. While smaller in scale than NEPES, it operates in the same Korean back-end ecosystem with overlapping service offerings and competes for Korean semiconductor customers.

Broad incumbents

• TSMC (Advanced Packaging): TSMC's advanced packaging division (InFO, CoWoS, SoIC) is a broader incumbent that competes with NEPES for the most advanced AI/HPC packaging programs. While TSMC is primarily a foundry, its packaging offerings overlap with NEPES's fan-out and 2.5D integration capabilities and serve the same AI/HPC customer base.
• Samsung Electro-Mechanics: Samsung Electro-Mechanics operates a major packaging and component business (MLCC, substrates, advanced packaging modules). It is a broad incumbent in the Korean electronics packaging ecosystem and competes with NEPES as an internal Samsung-affiliated packaging option, particularly for substrate and module-level packaging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UCaND5WC0la5EfD7DRZHR2Yw
• Facebookfacebook.com/nepesgroup

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles13 records

Subsidiaries9 records

Funding overview

Funding rounds2 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about nepes