ASE Group
ASE Group is a Taiwanese Outsourced Semiconductor Assembly and Test (OSAT) provider delivering advanced 2.5D/3D, fan-out, chiplet, and wide-bandgap power packaging services to fabless designers, foundries, and IDMs serving AI, HPC, automotive, 5G, EV, and data-center applications.
- Company typePrivate
- Founded1987
- HeadquartersOverland Park, United States
- Headcount—
- GTM typeB2B
- OfferingServices
What ASE Group does
ASE Group is an Outsourced Semiconductor Assembly and Test (OSAT) provider headquartered in Taiwan, offering advanced packaging and test services to fabless semiconductor designers, foundries, and integrated device manufacturers globally. Its core portfolio spans 2.5D/3D integration (including Through-Silicon Via), fan-out wafer-level packaging, chiplet heterogeneous integration, system-in-package (SiP), and advanced power packaging for wide-bandgap semiconductors (silicon carbide and gallium nitride). The technology stack targets high-performance applications in AI accelerators, HPC processors, automotive semiconductors, 5G telecom infrastructure, and emerging EV power electronics and AI data center power delivery.
The business model is B2B services revenue billed per wafer, unit, or project, with customers engaging through direct enterprise sales teams and long-term capacity commitments. ASE is positioned as one of the top ten global semiconductor packaging firms and is among the largest OSAT networks in the Taiwan-led Asia Pacific cluster, which holds 54% of the global packaging market. The August 2025 acquisition of WIN Semiconductors' facility for NT$6.5 billion materially expanded advanced packaging capacity for AI and HPC demand, and the company is concurrently building out SiC/GaN power packaging through a co-development partnership with Powertech Technology (PTI). Go-to-market relies on direct enterprise engagement with semiconductor design companies and foundries, supplemented by participation in industry conferences and technical publications.
ASE Group firmographics
Firmographics- Name
- ASE Group
- Legal name
- ASE Group
- Website
- https://ase-group.com
- Company type
- Private
- Founded year
- 1987
- Operating status
- Operating
- Short description
- ASE Group is a Taiwanese Outsourced Semiconductor Assembly and Test (OSAT) provider delivering advanced 2.5D/3D, fan-out, chiplet, and wide-bandgap power packaging services to fabless designers, foundries, and IDMs serving AI, HPC, automotive, 5G, EV, and data-center applications.
- Ownership category
- akta.pro rank
ASE Group industry classification
Industry- Product category
- Semiconductor Packaging Services (OSAT)
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (3344)
- SIC
- Services-Testing Laboratories (8734)
- akta.pro primary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
- akta.pro secondary industries
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD)
Keywords
Where ASE Group is headquartered
LocationHeadquarters
- HQ city
- Overland Park
- HQ country
- United States
- HQ region
- North America
Markets served
ASE Group business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Infrastructure, Supply Chain, Technology or R&D, Personnel, Operations
Revenue model
- Semiconductor Packaging and Test Services: ASE Group generates revenue through outsourced semiconductor assembly and test (OSAT) services, providing advanced packaging solutions for chips used across AI, automotive, telecommunications, consumer electronics, and IoT applications. Revenue is derived from manufacturing services billed per wafer, unit, or project depending on customer arrangements.
Go-to-market motion1 record
Distribution channels1 record
Marketing channels2 records
ASE Group product offering
Product offeringCore offering
ASE Group is an Outsourced Semiconductor Assembly and Test (OSAT) provider that packages and tests semiconductor chips on behalf of fabless designers, foundries, and integrated device manufacturers. Its offerings center on advanced packaging technologies—2.5D/3D integration, fan-out wafer-level packaging, chiplet integration, and system-in-package—plus advanced power packaging for wide-bandgap (SiC/GaN) semiconductors used in EVs, renewable energy, and AI data centers.
Product overview
ASE Group is an Outsourced Semiconductor Assembly and Test (OSAT) company offering a comprehensive portfolio of advanced semiconductor packaging services. The company provides 2.5D/3D integration packaging, fan-out wafer-level packaging, and chiplet technologies for AI and high-performance computing applications. In August 2025, ASE Group expanded its advanced packaging capacity through the acquisition of WIN Semiconductors' Taiwan facility for NT$6.5 billion. The company is also expanding into advanced power packaging for wide-bandgap semiconductors (SiC and GaN) targeting EVs, renewable energy, and AI data center applications.
Differentiator
Problem solved
Functional benefit
Companies that use ASE Group
Customer profileSegments6 records
Ideal customer profiles4 records
ASE Group technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
ASE Group partnerships and signals
Strategic signalPartnerships
Two partnerships are on record, tiered core.
- Powertech Technology (PTI)coreASE Group and Powertech Technology (PTI) are both expanding into advanced power packaging for wide-bandgap semiconductors (SiC and GaN), targeting applications in EVs, renewable energy, and AI-driven data centers. Both companies are key OSAT players in Taiwan leveraging the established foundry and packaging infrastructure to build capabilities in power electronics packaging.
- WIN SemiconductorscoreASE Group acquired WIN Semiconductors' facility in Taiwan for NT$6.5 billion in August 2025 to expand advanced packaging capacity for AI and high-performance computing demand. This acquisition strengthens ASE's capabilities in compound semiconductor processing for power electronics applications.
Scale indicators4 records
Recent moves5 records
Expansion highlights4 records
ASE Group competitors and assessment
Company assessmentBroad incumbents
- Intel Foundry: Intel Foundry offers advanced packaging capabilities (Foveros, EMIB) as part of its foundry and IDM business, representing a broad incumbent competitor to ASE in chiplet-based and 3D-stacked packaging for HPC and AI applications.
- Samsung Foundry: Samsung Foundry provides advanced packaging (I-Cube, H-Cube) as part of its integrated foundry offering, positioning it as a broad incumbent competitor to ASE for high-performance and AI chip packaging, particularly through 2.5D/3D solutions.
- TSMC: TSMC is the world's largest foundry and a broad incumbent increasingly offering advanced packaging services (3DFabric, InFO, CoWoS) directly to fabless customers, competing with ASE for AI/HPC packaging workloads and a key driver of the foundry vertical-integration threat to OSATs.
Direct peers
- Powertech Technology (PTI): Powertech Technology (PTI) is a Taiwan-based OSAT peer to ASE, directly competing in advanced packaging and parallel-investing in SiC/GaN power packaging for EVs, renewable energy, and AI data centers, with overlapping customer base and technology roadmap.
- Amkor Technology: Amkor Technology is one of the world's largest OSAT providers and ASE's most direct competitor, offering comparable advanced packaging (2.5D/3D, fan-out WLP) and test services for AI, automotive, and mobile semiconductor customers globally.
- UTAC Holdings: UTAC is a Singapore-based OSAT provider offering semiconductor assembly and test services with a focus on analog, mixed-signal, and power devices, competing with ASE in automotive and industrial semiconductor packaging segments.
- Powertech Technology (PTI): Powertech Technology is a Taiwan-based OSAT peer to ASE, with overlapping capabilities in advanced packaging and a parallel expansion into wide-bandgap (SiC/GaN) power packaging for EVs, renewable energy, and AI data center applications.
- Tongfu Microelectronics: Tongfu Microelectronics is a China-based OSAT peer offering semiconductor packaging and test services comparable to ASE's, including advanced packaging capabilities for memory and logic chips across consumer, automotive, and computing applications.
- JCET (Jiangsu Changjiang Electronics Technology): JCET is China's largest OSAT provider and a direct competitor to ASE in advanced packaging, serving similar semiconductor customer segments across AI, automotive, and consumer electronics with both traditional and advanced packaging services.
Regional players
- Hana Microelectronics: Hana Microelectronics is a Thailand-based OSAT provider serving consumer, automotive, and industrial semiconductor customers in Southeast Asia, offering a regional alternative to ASE's Taiwan-centered advanced packaging footprint.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat4 records
Key risks5 records
Key highlights6 records
Customer concentration
ASE Group social profiles
Digital presenceASE Group financial estimates
Financial estimateRevenue estimate
Valuation estimate
ASE Group leadership team
Management profileNumber of profiles
ASE Group funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
ASE Group M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about ASE Group
What does ASE Group do?
ASE Group is an Outsourced Semiconductor Assembly and Test (OSAT) provider that packages and tests semiconductor chips on behalf of fabless designers, foundries, and integrated device manufacturers. Its offerings center on advanced packaging technologies—2.5D/3D integration, fan-out wafer-level packaging, chiplet integration, and system-in-package—plus advanced power packaging for wide-bandgap (SiC/GaN) semiconductors used in EVs, renewable energy, and AI data centers.
Is ASE Group a public or private company?
ASE Group is a private company. It is classified as public and is currently operating.
When was ASE Group founded?
ASE Group was founded in 1987.
Where is ASE Group based?
ASE Group is headquartered in Overland Park, United States, in the North America region.
How does ASE Group make money?
One revenue line is on record: semiconductor Packaging and Test Services.
Who are ASE Group's main competitors?
Broad incumbents on record are Intel Foundry, Samsung Foundry and TSMC. Direct peers are Powertech Technology (PTI), Amkor Technology, UTAC Holdings, Powertech Technology (PTI), Tongfu Microelectronics and JCET (Jiangsu Changjiang Electronics Technology). Hana Microelectronics is listed as a regional player.
Does ASE Group have an API?
No public API is recorded for ASE Group.
What industry is ASE Group in?
ASE Group's product category is Semiconductor Packaging Services (OSAT). Its primary akta.pro industry code is HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets), with a secondary code of HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA). Its NAICS code is 3344 and its SIC code is 8734.