What BGA Test and Technology does

BGA Test and Technology is a privately held US specialty services firm headquartered in Holbrook, New York, that provides precision electronic component modification and testing for military, aerospace, and defense (ADHP) customers. Its core services include Robotic Hot Solder Dip (RHSD) on 6-axis robots with controllable bath temperature, immersion depth, dwell time, and extraction speed; BGA reballing compliant with IEC/TS62647 (converting between Sn63Pb37 eutectic, Sn10Pb90 high-lead, and SAC305 Pb-free spheres); gold embrittlement mitigation via a robotic SnPb dynamic solder wave meeting IPC-J-STD-001 4.5.1; Column Grid Array attach through a partnership with TopLine Corporation; and supporting testing, XRF RoHS screening, micro-focus X-ray counterfeit detection, temperature up-screening (-75°C to +200°C), component harvesting from unused boards, bonded-warehouse inventory management/kitting/drop-ship, and lead forming. Operations are governed by a stacked quality posture of AS9100D, ISO9001:2015, ANSI/ESD-S20.20-2014, ITAR registration, and Nadcap Aerospace certification, and the CTO and Lead Engineer hold permanent seats on the IPC PERM Council. The company generates revenue through quote-based professional services engagements, sourced primarily via direct enterprise sales (website request-quote form, phone, and email) to defense and aerospace primes; a Lockheed Martin citation is documented on the Citations & Awards page. Founded in 2014 by Chairman John Bonlarron, the firm operates in the 101-250 employee band, is incorporated in New York, and operates a single US site serving North American customers with no disclosed international footprint, parent company, funding history, or revenue figures.

Name

BGA Test and Technology

Legal name

BGA Test & Technology

Website

https://bgatechnology.com

Company type

Private

Founded year

2014

Operating status

Operating

Headcount range

101–250 employees

Short description

BGA Test and Technology is a Holbrook, NY-based specialty services firm that performs precision electronic component modification — including Robotic Hot Solder Dip, reballing, gold embrittlement mitigation, Column Grid Array attach, and testing — for US military, aerospace, and defense (ADHP) primes under AS9100D, ITAR, Nadcap, and IPC-compliant processes.

Ownership category

akta.pro rank

Headquarters

HQ city

Holbrook

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D

Revenue model

1. Component Processing Services: Revenue generated from specialized electronic component modification services including RHSD (Robotic Hot Solder Dip), reballing, gold embrittlement mitigation, column grid array attach, testing, temperature up-screening, programming, component harvesting, inventory management, and lead forming. Services are quoted on a per-project basis and target military, aerospace, and defense customers requiring high-reliability electronics processing.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

BGA Test and Technology provides specialized electronic component modification and reliability services, including BGA reballing, robotic hot solder dipping (RHSD), gold embrittlement mitigation, column grid array attach, lead forming, component harvesting, and inventory management. The company serves military, aerospace, and defense customers with AS9100D, ISO 9001:2015, ITAR, and Nadcap certified processes for extending the lifecycle and reliability of electronic components.

Product overview

BGA Test & Technology is a specialized manufacturing services provider offering a comprehensive suite of electronic component modification and testing services for military, aerospace, and high-reliability electronics applications. The core offerings center on precision BGA (Ball Grid Array) processing technologies: RHSD Robotic Hot Solder Dip (for solder dipping to replace finishes), Reballing (for ball replacement and solder sphere attachment), Gold Embrittlement Mitigation (for gold removal from component leads), and Column Grid Array Attach (for CGA column replacement). Supporting these core services are Testing, Temperature Up-screening & Programming (XRF analysis, X-ray inspection, temperature cycling from -75°C to +200°C), Component Harvesting (recovery from unused circuit boards), Inventory Management (bonded warehouse and kitting), and Lead Forming. All processes comply with quality standards including GEIA-STD-0006, IEC/TS62647, IPC standards, and MIL STD specifications. The company operates from Holbrook, NY and serves aerospace and defense customers requiring high-reliability electronic assemblies.

Differentiator

Problem solved

Functional benefit

Products and services

• RHSD Robotic Hot Solder Dip Robotic hot solder dipping service used to mitigate tin whiskers and re-tin component leads, primarily for military and aerospace applications.
• Reballing BGA reballing service that removes and re-applies solder balls on Ball Grid Array components to restore or enhance solder joint reliability.
• Gold Embrittlement Mitigation Specialty service to mitigate gold embrittlement in solder joints by removing or treating gold-plated surfaces prior to soldering.
• Column Grid Array Attach Service that attaches column grid array columns/components for high-reliability defense and aerospace electronics.
• Testing, Temperature Up-screening, and Programming Bundle of electronic component testing services including temperature up-screening to military/aerospace grade and device programming.
• Component Harvesting Service to recover usable components from end-of-life boards or assemblies for reuse in defense and aerospace applications.
• Inventory Management Inventory management services for stored components, supporting long-lifecycle defense and aerospace programs.
• Lead Forming Precision lead forming service that reshapes component leads to customer-specified footprints and tolerances.

Quantifiable outcome

• Turn 2-year lead times into 2-3 week lead times through component harvesting
• +1 more outcomes

Segments3 records

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

One partnership is on record.

• TopLine CorporationcoreStrategic or Co-development PartnerBGA Technology and TopLine Corporation have engaged to provide Column Grid Attachment services. BGA Technology provides attachment of solder columns manufactured by TopLine for defense, aerospace, and other applications. BGA Technology removes solder balls from BGA components and replaces them with solder columns. TopLine manufactures Pb80/Sn20 copper wrapped solder columns, Pb90/Sn10 plain columns, and a newly patented braided copper solder column.

Scale indicators2 records

Recent moves5 records

Expansion highlights5 records

Direct peers

• STI Electronics: STI Electronics provides electronics contract manufacturing and rework services including BGA rework and training, directly overlapping with BGA Test & Technology's reballing, RHSD, and training-adjacent capabilities for high-reliability customers.
• Metelec: Metelec is a UK-based specialist in BGA/CGA rework, reballing, and RHSD for aerospace and defense primes, making it the closest non-US analogue to BGA Test & Technology's component modification offering.
• RoodMicrotec: RoodMicrotec supplies semiconductor and electronic component test services including reliability and qualification testing, mirroring BGA Test & Technology's testing, temperature up-screening, and XRF/X-ray inspection stack.
• Element Materials Testing (formerly NTS): Element provides laboratory testing, qualification, and failure analysis services to aerospace and defense customers, comparable to BGA Test & Technology's counterfeit detection, RoHS screening, and reliability testing services.

Broad incumbents

• Astronics Corporation: Astronics is a diversified aerospace electronics supplier serving commercial and defense markets; its aerospace test and interface products make it a broader incumbent serving the same primes BGA Test & Technology supports.
• HEICO Corporation: HEICO's aerospace parts and services segments supply FAA-approved replacement parts and electronic components to aerospace and defense operators, overlapping with BGA Test & Technology's high-reliability aftermarket positioning.
• Ducommun Incorporated: Ducommun provides engineered products and manufacturing services, including electronics assemblies, for aerospace and defense primes, comparable to BGA Test & Technology's specialized component processing for the same customer base.
• Curtiss-Wright Corporation: Curtiss-Wright's defense electronics and industrial divisions supply ruggedized electronic subsystems and testing solutions to aerospace/defense customers, sharing the same prime contractor buyers as BGA Test & Technology.
• Kimball Electronics: Kimball Electronics is a contract electronics manufacturing services provider with significant aerospace and defense exposure; its EMS offering competes for high-reliability assembly work that sits adjacent to BGA Test & Technology's modification services.
• TransDigm Group: TransDigm designs and manufactures proprietary aerospace components and subsystems, supplying the same commercial and defense aerospace ecosystem BGA Test & Technology serves with its high-reliability component processing.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/bga-test-and-technology

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about BGA Test and Technology