What Alltemated does

Alltemated Inc. is a privately held, U.S.-based value-added electronics-manufacturing services provider founded in 1993 and headquartered in Wheeling, Illinois. The company delivers component-preparation services — tape and reel packaging, IC programming for memory and logic devices, laser marking and engraving, lead trim and form, electro-mechanical assembly, drive duplication, and custom thermoforming — to electronic component distributors, EMS providers, and OEMs operating in medical, automotive, aerospace/defense, and consumer electronics verticals. It also manufactures and sells standardized carrier tape, tape-and-reel supplies, and its proprietary PLACE-N-BOND™ underfilm technology, a patented partial underfilm that delivers BGA/LGA solder-joint and shock-drop reliability as a reworkable alternative to dispensed underfill.

The business generates revenue through (i) per-line-item service fees with a $150 minimum order and 3-5 business day lead times, (ii) hardware sales of PLACE-N-BOND variants and tape-and-reel supplies, and (iii) quote-based custom-engineered solutions. Distribution is multi-tier: direct sales via the website and phone, manufacturers-rep partnership with Action IR (which is also the co-developer of PLACE-N-BOND and a strategic operating affiliate), and regional distributors pb tec Solutions in continental Europe and Industrial Production Processes (IPP) Ltd in the UK and Ireland, supported by global drop-ship logistics. Operations are certified to ISO 9001:2015 and comply with RoHS, REACH, and WEEE.

Alltemated runs an ISO 4 (class 10) clean room added in 2021, supports over 400 customer IC-programming programs, and processes millions of custom and standard components weekly. Demand generation is event-led (SMTAI, IPC APEX EXPO, IPC SummerCom, Productronica) and supplemented by digital channels and trade-press coverage. The company has executed multiple capacity expansions (2015, 2016 doubling of programming and tape rooms, 2017 third expansion in five years) and relocated its entire headquarters in 2019, and in 2022 it broadened its product surface through a partnership with SunRay Scientific for conductive adhesives.

Name

Alltemated

Legal name

Alltemated Inc.

Website

https://alltemated.com

Company type

Private

Founded year

1993

Operating status

Operating

Headcount range

101–250 employees

Short description

Alltemated Inc. is a U.S.-based electronics value-added services provider, founded 1993 in Wheeling, Illinois, delivering tape and reel packaging, IC programming, carrier tape manufacturing, thermoforming, and its patented PLACE-N-BOND underfilm to distributors, EMS providers, and OEMs in medical, automotive, aerospace, and consumer markets.

Ownership category

akta.pro rank

Product category

Electronics Manufacturing Services

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM), Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Electronics manufacturing services
• Component packaging services
• Tape and reel packaging
• IC programming services
• Underfill underfilm technology

Headquarters

HQ city

Wheeling

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Value-Added Services: Component preparation services including IC programming, tape and reel packaging, laser marking, lead trim and form, assembly, and drive duplication. Pricing based on minimum order of $150 per line item with 3-5 business day lead times.
2. Tape and Reel Supplies: Sale of tape and reel supplies including carrier tape, cover tape (PSA and Heat Seal), flanges, baking and dry packing supplies, and MSL packaging supplies.
3. PLACE-N-BOND Underfilms: Proprietary underfilm products sold as alternative to underfill. Multiple versions available including RP-113178, RP-113184 Multi-Purpose, RP-113179 Low Temperature, and RP-113186 Co-Laminate.

Pricing tiers

Go-to-market motion3 records

Distribution channels5 records

Marketing channels6 records

Core offering

Alltemated is a value-added services provider for the electronics industry, offering turnkey component preparation and packaging solutions since 1993. Core offerings include PLACE-N-BOND™ patented pre-formed thermoplastic underfilms (a pick-and-place underfill alternative for BGA/LGA/CSP packages), custom and standard carrier tape manufacturing, automated tape and reel packaging services, IC programming for memory and logic devices, laser marking and engraving, lead trim and form, electro-mechanical assembly, drive duplication, and thermoforming of 3D insulators from Kapton and Ultem for Mil/Aero applications.

Product overview

Alltemated is a value-added services company (since 1993) offering a portfolio of component preparation and packaging services for the electronics industry. The core product portfolio centers on PLACE-N-BOND™ patented underfilm technology (pre-formed thermoplastic films for BGA/LGA reliability), complemented by tape and reel packaging services, carrier tape manufacturing, IC programming, laser marking/engraving, lead trim and form, assembly services, drive duplication, and thermoforming. Products are supplied to distributors, EMS providers, and OEMs across medical, automotive, aerospace, military, and consumer electronics sectors.

Differentiator

Problem solved

Functional benefit

Brands

• PLACE-N-BOND™: Patented underfilm technology using pre-formed thermoplastic corner/edge bonds for BGA/LGA/CSP packages to PCB, serving as an underfill alternative for solder joint reliability and shock-drop protection
• Action IR

Products and services

• PLACE-N-BOND™ Underfilm Patented pre-formed thermoplastic corner/edge bond film packaged in EIA-481 carrier tape for pick-and-place application. Improves solder ball/joint reliability and shock-drop performance of BGA/LGA/CSP packages as an alternative to traditional underfill dispensing. Requires no secondary cure and is 100% re-workable. Multiple variants available including RP-113178, RP-113179 Low Temperature, RP-113184 Multi-Purpose, and RP-113186 Co-Laminate.
• Carrier Tape Custom and standard carrier tapes for packaging SMD components. Available in electrically dissipative and non-conductive varieties with PSA or heat seal cover tape. Manufactured to EIA and JEDEC standards for medical, automotive, aerospace, military, and consumer electronics applications. Quick-turn tooling available with open tools for production without tooling charges.
• Tape and Reel Services Automated and manual tape and reel packaging services for electronic components. Includes electrically dissipative and non-conductive tapes, custom manufactured tapes, PSA or heat seal cover tapes, and bake/dry packing services. Processes millions of custom and standard components weekly. Standard lead times of 3-5 business days after receipt of parts.
• Tape and Reel Supplies Sale of standard sized reels, carrier tape, cover tape (PSA and heat seal), baking and dry packing supplies, and flanges (plastic and cardboard). Sold as physical supplies to support customers' own component packaging operations.
• IC Programming Services IC programming services for memory and logic devices (PLD, CPLD, microcontroller, FPGA, PROM, EPROM, Flash) supporting all package types including BGA, DIP, QFP, QFN, PLCC, TSOP, and SOIC. Uses equipment from BP Microsystems, Data I/O, Dataman, and Microchip. Supports over 400 customer programs.
• Laser Marking and Engraving Laser cutting, marking, and engraving services on ICs, plastic, paper, coated metals, and rubber for component marking, industrial cutting, and ablation applications.
• Lead Trim and Form Trim and form processes for through-hole devices including axial and radial lead products. Services include DIP to surface mount conversion, gull-wing forming, lead wire processing, and coplanarity services such as lead straightening.
• Assembly Services Engineering and manufacturing services for wire leads and sets, cable and harness assemblies, customized interconnect solutions, electro-mechanical assemblies, box builds, and power cords. Also offers video game conversion kits.
• Drive Duplication Preloading services for hard drives, USB flash drives, SD cards, and CD/DVDs including operating systems, software, videos, presentations, and demos.
• Thermoforming Custom thermoforming of 3D insulators from sheets of Kapton and Ultem materials for electrical insulation applications. Supports transformers, capacitors, coil wire, magnet wire, wire and cable tapes, semiconductor components, and flexible printed circuits. Includes a clean room certified to ISO 4 (class 10) for medical projects.

Quantifiable outcome

• Significant improvement in solder ball/joint and shock-drop reliability verified through drop testing
• +2 more outcomes

Named customers7 records

Segments4 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Four partnerships are on record, tiered core.

• SunRay ScientificcoreStrategic or Co-development Partner · 8 December 2022Alltemated/Action IR partnered with SunRay Scientific for conductive adhesives for complex applications. This partnership combines PLACE-N-BOND's non-conductive nature with SunRay's ZTACH ACE Z-Axis Pressure-less Anisotropic Conductive Adhesive to provide solutions for hybridized electronics, smaller form factors, 3-D Stacking, and printed electronics.
• Action IRcoreStrategic or Co-development Partner · 8 December 2022Action IR is Alltemated's Manufacturers Rep and Co-developer of PLACE-N-BOND. They signed the partnership agreement with SunRay Scientific on behalf of Alltemated to support introduction of SunRay materials.
• pb tec SolutionscoreChannel Partner/ Reseller/ Distributorpb tec Solutions provides sales and consulting services for PLACE-N-BOND products in Europe. They help customers enhance quality of electronic products and efficiency in SMD production with expertise in processes, systems, automatic optical inspection, feeder technology, marking and traceability.
• Industrial Production Processes (IPP) LtdcoreChannel Partner/ Reseller/ DistributorIPP Ltd is a technical distributor of manufacturing equipment doing business in electronics, pharmaceutical and medical device sectors across UK and Ireland. They distribute PLACE-N-BOND products in their territories.

Scale indicators5 records

Recent moves11 records

Expansion highlights6 records

Emerging players

• Hana Microelectronics: Hana Microelectronics is an Asia-based OSAT/EMS provider offering IC assembly, test, and PCB services. Comparable as a regional OSAT peer that overlaps with Alltemated's component preparation and packaging service offerings.

Broad incumbents

• ITW EAE: ITW EAE is the electronics assembly equipment group of Illinois Tool Works, providing surface mount, soldering, and component preparation equipment. Comparable as a broader incumbent supplying into the same SMT and electronics assembly ecosystem that Alltemated serves with tape-and-reel and IC programming.
• Sumitomo Bakelite (Carrier Tape): Sumitomo Bakelite is a major global producer of carrier tapes and electronic packaging materials. Comparable to Alltemated's carrier tape manufacturing and PLACE-N-BOND underfilm business as a large incumbent in electronic component packaging materials.
• ASE Technology Holding: ASE is a global leader in semiconductor assembly, packaging, and test services. Comparable as a broad incumbent in the same OSAT and electronic component packaging services category where Alltemated competes for component preparation work.
• Amkor Technology: Amkor is one of the world's largest OSAT providers offering semiconductor packaging and test services. Comparable to Alltemated's packaging/services role in the electronics value chain, though Amkor operates at vastly larger scale across advanced packaging.
• Henkel (Loctite Electronic Adhesives): Henkel is a major supplier of underfill, encapsulants, and electronic adhesives. Directly comparable as the incumbent whose capillary underfill products PLACE-N-BOND competes against in BGA/LGA reliability applications.

Others

• Besi: Besi is a leading supplier of semiconductor assembly equipment, including die attach and advanced packaging systems. Comparable as an equipment/infrastructure peer whose die-attach and packaging equipment competes in adjacent workflows to Alltemated's PLACE-N-BOND underfilm.

Direct peers

• Data I/O Corporation: Data I/O is a leading provider of IC programming systems and services for flash memory, microcontrollers, and secure elements. Comparable to Alltemated's IC programming service line — Alltemated uses Data I/O equipment alongside BP Microsystems and Dataman.
• Advantek: Advantek is a leading global manufacturer of carrier tape and cover tape for the semiconductor and electronics industries. Directly comparable to Alltemated's carrier tape manufacturing and tape-and-reel packaging business across overlapping customer types (OEMs, distributors, EMS).
• Leeno Industrial: Leeno Industrial is a Korean-headquartered provider of IC test and programming services and equipment, serving semiconductor and EMS customers globally. Comparable as a direct peer in IC programming services supporting high-volume customer programs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/alltematedinc
• YouTubeyoutube.com/AlltematedInc
• Facebookfacebook.com/alltemated
• LinkedInlinkedin.com/company/alltemated-inc

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Alltemated