Forlinx Embedded Technology Co.

What Forlinx Embedded Technology Co. does

Forlinx Embedded Technology Co., Ltd. is a Baoding, China-based designer and manufacturer of ARM-based System on Modules (SoMs), Single Board Computers (SBCs), and Embedded Computers founded in 2006. The company's portfolio spans processors from NXP, Texas Instruments, Rockchip, Allwinner, Renesas, Nuvoton, and RISC-V (StarFive), and includes edge AI accelerators and integrated Edge AI Boxes (e.g., FCU3501 with Hailo-8, FCU3011 with NVIDIA Jetson Orin Nano). Its signature platform is the proprietary Pin-to-Pin UP Series SoM family, which provides a standardized 40mm x 40mm form factor with 487 pins enabling seamless silicon migration without carrier board redesign, supported by a 10-15 year product longevity guarantee.

Forlinx operates an ISO 9001:2015 and ISO 13485 certified in-house manufacturing facility spanning 31,000 sqm with one million unit annual production capacity, advanced SMT lines, and EMC/vibration/aging testing labs. It holds NXP Gold Partner status (since 2020) providing early silicon access, dual IEC 62443 certifications for EU Cyber Resilience Act compliance, and additional ISO 14001, ISO 45001, CE, FCC, and RoHS certifications. The company sells through direct enterprise sales ([email protected], FAE stations in Seoul and Munich), a global distributor network across 80+ countries (DATA MODUL, Demsay, Computer Controls, AITECH), an Alibaba online store, and a Global Developer Program offering hardware sponsorship to content creators.

The company targets eight primary vertical segments: industrial automation and robotics (primary), medical and healthcare, transportation, smart city, smart retail, energy and utilities, smart agriculture, and edge AI/vision. Its 40,000+ enterprise customers and 80,000+ engineer users span 80+ countries, with applications ranging from motor control, machine vision, and PLCs to medical imaging, EV charging HMIs, and smart grid gateways. Customization, hardware/software design services, and ODM manufacturing round out the revenue mix, anchored on long product lifecycles (10-15 years) and industrial-grade temperature ranges (-40°C to 85°C).

Name

Forlinx Embedded Technology Co.

Legal name

Forlinx Embedded Technology Co., Ltd.

Website

https://forlinx.net

Company type

Private

Founded year

2006

Operating status

Operating

Headcount range

251–500 employees

Short description

Forlinx Embedded Technology Co. designs and manufactures ARM-based System on Modules, Single Board Computers, and Edge AI platforms for industrial automation, medical, transportation, energy, and IoT applications, serving 40,000+ enterprise customers across 80+ countries from its Baoding, China headquarters.

Ownership category

akta.pro rank

Product category

Embedded Computing Hardware

NAICS

Computer and Peripheral Equipment Manufacturing (33411)

SIC

Electronic Computers (3571)

akta.pro primary industry

Embedded & Compute Modules (SoMs, COM Express/SMARC, industrial SBC modules) (IMAGAJAK)

Keywords

• ARM System on Modules
• Embedded computing platforms
• Single board computers
• Edge AI accelerators
• Industrial embedded hardware

Headquarters

HQ city

Baoding

HQ country

China

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D

Revenue model

1. Hardware Sales - SoM/SBC/Embedded Computers: Primary revenue from sale of ARM-based System on Modules, Single Board Computers, and Embedded Computers. Products feature processors from NXP, Rockchip, TI, Allwinner, Renesas, RISC-V, and Nuvoton for industrial applications.
2. AI Accelerator Modules: Sale of AI acceleration cards including FAI-ARA240-M (40 eTOPS) and RK182X series computing cards for edge AI inference and large model deployment.
3. Customization & ODM Services: Hardware design services including carrier board design, SoM customization, and industry product customization. Software services covering kernel tailoring, driver development, and OS porting (Linux, Android, WinCE).
4. Manufacturing & ODM: Full-scale manufacturing with PCB production, SMT welding, and external processing. Mass production capabilities ensuring single shipment volumes over 10K units.

Pricing tiers

Go-to-market motion3 records

Distribution channels4 records

Marketing channels7 records

Core offering

Forlinx Embedded designs and manufactures ARM-based System on Modules (SoMs), Single Board Computers (SBCs), and Embedded Computers for industrial and edge AI applications, leveraging processor platforms from NXP, Rockchip, TI, Allwinner, Renesas, RISC-V, and Nuvoton. The company also provides pin-to-pin compatible SoM families, AI accelerator modules (e.g., FAI-ARA240-M at 40 eTOPS), carrier boards, and ODM/customization services including hardware design, software porting (Linux/Android/WinCE), and in-house manufacturing with 1 million unit annual capacity.

Differentiator

Problem solved

Functional benefit

Brands

• FET (System on Modules): Product prefix for System on Module products (e.g., FET3588-C, FET3576-C)
• OK (Single Board Computers)
• FCU (Embedded Computers)
• FAI (AI Accelerators)
• UP Series
• UP4

Products and services

• FET3576-C System on Module ARM-based System on Module powered by Rockchip RK3576 with integrated 6 TOPS NPU supporting INT4/INT8/INT16/FP16/BF16/TF32 operations. Designed for industrial AI vision, object detection, machine vision, and HMI applications.
• FET3572-C System on Module Rockchip RK3572-based SoM with 4 TOPS NPU and DSMC bus, featuring octa-core heterogeneous ARM architecture (2x Cortex-A73 + 6x Cortex-A53). Targeted at mid-range HMI and embedded applications.
• FAI-ARA240-M Edge AI Accelerator Edge AI co-processor module with NXP Ara240 discrete NPU delivering 40 eTOPS, in standard M.2 2280 form factor. Uses decoupled AI architecture to add AI acceleration to existing platforms, supporting TensorFlow, PyTorch, and ONNX frameworks.
• FET1126Bx-S System on Module Rockchip RV1126B-based SoM targeted at industrial AI vision applications, integrating computer vision and machine vision capabilities.
• FET3588-C System on Module High-performance Rockchip RK3588-based SoM with 8K H.265 hardware decoding and real-time video analysis for edge AI inference in industrial automation, healthcare, smart transportation, and robotics.
• FET-MX9596-C System on Module NXP i.MX 95-based SoM featuring 8 eTOPS eIQ Neutron NPU for industrial edge AI and multi-modal applications.
• FCU3501 Embedded Computer (AI Edge Computing Box) Embedded AI Edge Computing Box supporting Hailo-8 26 TOPS M.2 AI accelerator card integration for edge AI inference applications. Designed for industrial AI workloads.
• UP Series Pin-to-Pin SoM Families Standardized pin-to-pin compatible SoM family in 40mm x 40mm form factor with 487-pin hybrid LCC/LGA interface. Enables seamless platform migration across NXP, Rockchip, and Allwinner SoCs without carrier board redesign, reducing time-to-market for industrial customers.
• Customization & ODM Services Hardware design services including carrier board design, SoM customization, and industry product customization, paired with software services covering kernel tailoring, driver development, and OS porting (Linux, Android, WinCE). Also includes full-scale manufacturing with PCB production, SMT welding, and external processing.
• Hardware Design Service Professional carrier board and custom hardware design service supporting customer-specific form factors, peripherals, and industrial product customization. Backed by 500+ successful PCB design cases.
• Software Design Service Software customization covering kernel tailoring, driver development, and OS porting (Linux, Android, WinCE) tailored to customer hardware platforms.

Quantifiable outcome

• Reduce product development cycle by 6-9 months through parallel hardware/software development
• +3 more outcomes

Named customers2 records

Segments8 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration7 records

AI capability7 records

Feature5 records

Partnerships

16 partnerships are on record, tiered core, major and strategic.

• NXP SemiconductorscoreTechnology or IntegrationNXP Gold Partner status providing exclusive early access to next-gen processing and Edge AI technologies. Collaboration since 2014 developing over 20 embedded solutions. Partnership enables Forlinx to offer early silicon access, priority support, and product longevity.
• RockchipcoreTechnology or IntegrationRockchip Ecosystem partner with deep mastery of high-performance Rockchip architectures for optimized and scalable compute solutions.
• Texas InstrumentscoreTechnology or IntegrationPartnership delivering ultra-reliable TI platforms for real-time control applications.
• AllwinnercoreTechnology or IntegrationPartnership providing highly integrated Allwinner architectures for scalable, cost-effective HMI computing.
• DATA MODUL AGmajorChannel Partner/ Reseller/ DistributorEuropean distributor based in Munich, Germany providing local sales and support for Forlinx products in the DACH region.
• Demsay ElektronikmajorChannel Partner/ Reseller/ DistributorEuropean distributor based in Istanbul, Turkey providing regional sales and technical support.
• Computer Controls AGmajorChannel Partner/ Reseller/ DistributorSwiss distributor based in Otelfingen, Switzerland providing regional distribution and support.
• AITECH INCmajorChannel Partner/ Reseller/ DistributorKorean distributor based in Seoul, South Korea providing authorized distribution in APAC region. Announced December 2025.
• Phoenix ContactstrategicStrategic or Co-development PartnerCollaboration with Phoenix Contact on enhanced automation solutions. Forlinx invited to Phoenix Contact technology seminar exploring open automation software.
• HailocoreTechnology or IntegrationPartnership for AI acceleration with Hailo-8 26 TOPS M.2 AI accelerator card integration in FCU3501 Embedded Computer.
• NVIDIAcoreTechnology or IntegrationPartnership for Jetson Orin Nano integration in FCU3011 AI Edge Computing Box.
• Renesas ElectronicscoreTechnology or IntegrationPartnership for RZ/G2L Series SoM products with industrial-grade reliability.
• NuvotoncoreTechnology or IntegrationPartnership for MA35 Series SoM products.
• StarFivecoreTechnology or IntegrationPartnership for RISC-V JH7110 SoM products.
• SGET (Standardization Group for Embedded Systems)strategicTechnology or IntegrationForlinx joined SGET in 2025 to strengthen commitment to open standards with SMARC solutions for industrial automation, IoT, and smart applications.
• MECHATROLINK AssociationstrategicStrategic or Co-development PartnerPartnership to build new ecosystem for motion control industry announced December 2025.

Scale indicators8 records

Recent moves8 records

Expansion highlights7 records

Direct peers

• Kontron: European-based manufacturer of ARM and x86 System on Modules, Single Board Computers, and embedded computing platforms targeting industrial automation, medical and transportation. Direct competitor to Forlinx in SoM/SBC form factors with overlapping processor portfolios (NXP i.MX, TI).
• SECO: Italian embedded computing vendor offering SoMs, SBCs and edge AI modules (including NXP i.MX 8 and Rockchip lines) across industrial and medical segments. Comparable scale and vertical mix to Forlinx.
• Toradex: Swiss specialist in ARM-based System on Modules focused on NXP i.MX and TI Sitara families, with pin-compatible families and a long-lifecycle industrial offering. Closest direct head-to-head with Forlinx on NXP SoMs and Pin-to-Pin migration architectures.
• iWave Systems: India-based ARM SoM/SBC designer leveraging NXP i.MX, Renesas RZ/G and Rockchip families for industrial, automotive and medical applications. Closely comparable product mix and engineering-services depth.
• PHYTEC: German manufacturer of ARM-based System on Modules and SBCs with NXP, TI and Renesas processors, emphasizing long-lifecycle industrial and medical deployments. Direct peer with similar Pin-to-Pin philosophy and longevity commitments.

Broad incumbents

• Advantech: Large Taiwanese embedded computing platform vendor offering SoMs, SBCs, edge AI boxes, and industrial motherboards across factory automation, healthcare and transportation. Overlaps with Forlinx on NXP/Rockchip-based SoMs but with a much broader product and services portfolio.
• Digi International: US-based provider of embedded modules, SBCs and IoT connectivity (including the ConnectCore line on NXP i.MX) serving industrial, medical and energy customers. Comparable in module-level hardware and edge connectivity, with broader networking stack.
• Avnet Embedded (MSC Technologies): Global distributor and value-added integrator of NXP, TI and Renesas SoMs/SBCs serving industrial customers in Europe. Competes with Forlinx's distribution-and-integration model and shares the NXP i.MX ecosystem.

Emerging players

• Boundary Devices: US-based ARM SoM/SBC specialist on NXP i.MX and other application processors for industrial and medical customers. Comparable form factors and customization services to Forlinx on a smaller scale.
• ARIES Embedded: European embedded systems house focused on NXP i.MX SoMs and industrial SBCs with custom firmware/FPGA integration. Adjacent direct competitor in mid-volume industrial projects.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks5 records

Key highlights7 records

Customer concentration

• Xx.com/Forlinx3
• YouTubeyoutube.com/@forlinxembedded
• Facebookfacebook.com/forlinx
• LinkedInlinkedin.com/company/forlinx-embedded-technology-co-ltd
• Instagraminstagram.com/forlinx_embedded
• TikToktiktok.com/@forlinxembedded
• Pinterestpinterest.com/forlinxembedded

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Forlinx Embedded Technology Co.