What Datacon Technology AG does

Datacon Technology AG operates as a semiconductor assembly equipment brand within the portfolio of BE Semiconductor Industries N.V. (Besi), a Dutch public company listed on Euronext Amsterdam (ticker: BESI). The Datacon brand is focused on advanced die attach equipment, with principal product families including the Datacon 8800 FC QUANTUM series for high-speed and advanced flip chip bonding, the Datacon 8800 CHAMEO series for hybrid bonding, the Datacon 2200 evo family for multi-module attach and die bonding, and the 9800 TC next platform for thermo compression bonding. Together these platforms address the most demanding interconnect requirements in advanced semiconductor packaging, where chip-to-chip and chiplet integration are driving demand for sub-micron placement accuracy and high-throughput bonding.

The underlying technology stack emphasizes accuracy, precision, and throughput differentiation across leadframe, substrate, and wafer-level packaging applications. Datacon-branded equipment is deployed in conjunction with Besi's broader portfolio — Esec die bonders, Fico molding/trim/sawing systems, and Meco plating/cleaning tools — to provide semiconductor manufacturers with a comprehensive back-end packaging line. End-market exposure is broad and horizontal, spanning Electronics, Mobile Internet, Cloud Server, Computing, Automotive, Industrial, LED, and Solar Energy applications.

Datacon's business model operates as part of Besi's direct enterprise sales channel serving global semiconductor manufacturers, with after-sales support delivered through spares & tooling, customer support, and a webshop. Pricing is not publicly disclosed. The company participates in EU-funded collaborative research projects and operates a Smart Manufacturing initiative focused on intelligent process control and equipment connectivity, indicating strategic engagement with Industry 4.0 frameworks alongside its core equipment business.

Name

Datacon Technology AG

Legal name

Datacon Technology AG

Website

https://datacon.at

Company type

Private

Founded year

1986

Operating status

Unknown

Headcount range

251–500 employees

Short description

Datacon Technology AG is a semiconductor assembly equipment brand within Besi, specializing in advanced die attach systems including flip chip, hybrid bonding, thermo compression, and multi-module attach equipment for global semiconductor manufacturers.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Semiconductor assembly equipment
• Die bonding equipment
• Flip chip bonding
• Hybrid bonding systems
• Thermo compression bonding

Headquarters

HQ city

Osterreicher

HQ country

Austria

HQ region

Europe

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales

Distribution channels1 record

Marketing channels5 records

Core offering

Datacon Technology AG sells semiconductor assembly equipment under the Datacon brand, including advanced flip chip bonders (Datacon 8800 FC QUANTUM), hybrid bonding equipment (Datacon 8800 CHAMEO), thermo compression bonders (9800 TC next), and multi module attach platforms (Datacon 2200 evo series). These systems serve semiconductor manufacturers performing leadframe, substrate, and wafer level packaging for end markets such as electronics, mobile, cloud servers, computing, automotive, industrial, LED, and solar. The portfolio is positioned as leading-edge assembly equipment for advanced packaging applications.

Product overview

BE Semiconductor Industries N.V. (Besi) is a semiconductor assembly equipment company with a multi-brand portfolio organized into three main product categories: Die Attach (including Datacon and Esec branded die bonders for hybrid bonding, thermo compression bonding, multi module attach, die bonding, soft solder die bonding, and flip chip applications), Packaging (including Fico branded molding systems, trim and form equipment, and sawing lines), and Plating & Cleaning (including Meco branded leadframe wet processing, leadframe plating, connector plating, solar plating, film and foil plating, and chemistry/tooling solutions). The Datacon brand (Datacon 8800 FC QUANTUM, Datacon 8800 CHAMEO, Datacon 2200 evo) focuses on advanced flip chip and hybrid bonding equipment. The Esec brand (Esec 2100 series, Esec 2009 series) provides die bonding solutions. The Fico brand (AMS-X, MMS-X, molding lines, trim and form, sawing lines) handles packaging equipment. The Meco brand (CDL, FXL, ACP, RTR, EPL, FAP, solar plating, chemistry) provides plating and cleaning solutions.

Differentiator

Problem solved

Functional benefit

Products and services

• Datacon 8800 FC QUANTUM advX Advanced flip chip manufacturing equipment for semiconductor packaging applications.
• Datacon 8800 FC QUANTUM hS High-speed flip chip equipment for semiconductor packaging operations.
• Datacon 8800 FC QUANTUM advanced Advanced flip chip equipment for semiconductor packaging production lines.
• Datacon 8800 CHAMEO advanced Advanced CHAMEO hybrid bonding equipment for die attach applications in semiconductor packaging.
• Datacon 8800 CHAMEO ultra plus AC Ultra plus AC hybrid bonding equipment for advanced die attach applications in semiconductor manufacturing.
• Datacon 2200 evo Multi module attach equipment for semiconductor die bonding applications.
• Datacon 2200 evo plus Enhanced multi module attach equipment for semiconductor die bonding.
• Datacon 2200 evo hF High-speed multi module attach equipment for semiconductor die bonding applications.
• Datacon 2200 evo hS High-speed multi module attach equipment variant for semiconductor applications.
• Datacon 2200 evo advanced Advanced multi module attach equipment for semiconductor die bonding applications.
• 9800 TC next Thermo compression bonding equipment for advanced semiconductor packaging applications.

Segments8 records

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Recent moves6 records

Expansion highlights4 records

Peers

• Tokyo Electron Limited:

Direct peers

• Kulicke & Soffa Industries: U.S.-headquartered semiconductor and LED packaging equipment manufacturer with leading positions in wire bonding and a growing advanced packaging portfolio. Direct competitor in die bonding and adjacent to Besi's Esec and Datacon product lines.
• TOWA Corporation: Japan-based specialist in semiconductor molding equipment and compression molding technology. Competes directly with Besi's Fico molding line (AMS-X, MMS-X, AMS-LM) for advanced packaging and QFN/QFN-mP molding slots at OSAT customers.
• ASMPT Limited: Hong Kong-headquartered and the world's largest supplier of die attach, flip chip, and packaging equipment. ASMPT competes head-to-head with Besi's Datacon 8800 FC QUANTUM and Esec 2100 series at virtually every major IDM, foundry, and OSAT customer.

Market position

Strengths1 record

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Customer concentration

• LinkedInlinkedin.com/company/datacon-technology

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Datacon Technology AG