What SSTech does

SSTech (浙江西斯特科技有限公司 / Zhejiang Sistech Technology Co., Ltd.) is a private Chinese precision-cutting and grinding tools manufacturer specializing in diamond superhard materials. Founded in Shenzhen in 2015 and headquartered in Jiaxing, Zhejiang from 2025, the company designs and produces a portfolio of consumable tooling used in semiconductor packaging, new-materials processing, and automotive component manufacturing. Its core product lines include wafer dicing blades (晶圆划片刀), electroplated soft blades (电镀软刀), resin soft blades (树脂软刀), metal soft blades (金属软刀), and diamond/CBN grinding wheels (砂轮), supported by accessories such as blade dressing plates. The underlying technology stack combines proprietary diamond superhard material preparation, precision grinding process optimization, and an AI-driven visual inspection plus real-time error compensation system that targets tight tolerances such as sub-0.005mm verticality in PCB cutting.

SSTech operates a sales-led go-to-market combining direct enterprise sales with a nationwide agent/distributor channel, reinforced by presence at major industry exhibitions (SEMI-e, CIOE, Semicon China, Semicon Malaysia) and a content-driven technical knowledge hub on its corporate website. Pricing is quote-based, with custom manufacturing and prototyping tailored to customer specifications. The company has obtained National High-Tech Enterprise (2021) and Shenzhen Specialized, Refined, and New Enterprise certifications, partnered with Peking University and Tsinghua University Shenzhen Research Institutes for industry-university-research collaboration, and closed a Series A round of approximately RMB 20 million in December 2024 led by investors including Jiaxing Long Investment, Sinowisdom, Yangtze River Delta G60 S&T Innovation, and Zhongguancun Capital. Its customer base spans semiconductor packaging manufacturers, automotive parts producers, and advanced-materials processors, positioning SSTech as a domestic alternative in the precision cutting-blade import-substitution market.

Name

SSTech

Legal name

浙江西斯特科技有限公司

Website

https://grind-system.com

Company type

Private

Founded year

2015

Operating status

Operating

Short description

SSTech is a Chinese precision-tooling manufacturer specializing in diamond superhard dicing blades, soft blades, and grinding wheels used by semiconductor packaging, automotive, and new-materials customers. The private company sells custom consumables via direct sales and nationwide agents to advance China's localization of semiconductor cutting tools.

Ownership category

akta.pro rank

Product category

Precision Cutting Tools and Grinding Wheels

NAICS

Cutting Tool and Machine Tool Accessory Manufacturing (333515)

SIC

Machine Tools, Metal Cutting Types (3541), Metalworkg Machinery & Equipment (3540)

akta.pro primary industry

Metal Cutting Tools, Tooling & Workholding (Cutters, Inserts, Chucks, Fixtures) (IMAHADAB)

akta.pro secondary industries

Grinding, Honing & Superfinishing Equipment (IMAHADAE), Industrial Saws & Cutting Systems (Band/Circular Saws, Abrasive Cutting) (IMAHADAL)

Keywords

• Wafer dicing blades
• Diamond grinding wheels
• Semiconductor cutting tools
• Superhard material tooling
• Precision grinding solutions

Headquarters

HQ city

Shenzhen

HQ country

China

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Product Sales: SSTech generates revenue primarily through the sale of precision cutting blades and grinding tools, including wafer dicing blades, resin soft blades, metal soft blades, electroplated soft blades, and grinding wheels. The company offers customized manufacturing and prototyping services.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels4 records

Core offering

SSTech manufactures and sells diamond-based precision cutting blades (wafer dicing blades, resin soft blades, metal soft blades, electroplated soft blades) and diamond/CBN grinding wheels for semiconductor wafer dicing, IC packaging substrate cutting, micro-crystalline glass and functional ceramic grinding, and automotive parts precision grinding. The company provides customized manufacturing and prototyping services, with integrated solutions covering product supply, technical service, after-sales support, and product training, supported by an AI visual inspection quality control system.

Product overview

SSTech (浙江西斯特科技有限公司) offers a comprehensive portfolio of precision cutting and grinding solutions centered around diamond superhard materials technology. The core product line includes wafer dicing blades (晶圆划片刀), electroplated soft blades (电镀软刀), resin soft blades (树脂软刀), and metal soft blades (金属软刀) for semiconductor IC packaging, as well as grinding wheels (砂轮) for precision grinding applications. The company also provides blade dressing accessories (修刀板) and integrated solutions for wafer dicing, glass, ceramics, and automotive precision grinding. The product architecture is organized around two main categories: dicing blades and grinding wheels, supported by accessory products for blade conditioning.

Differentiator

Problem solved

Functional benefit

Products and services

• Wafer Dicing Blades (晶圆划片刀) Diamond-based precision cutting blades used for dicing and singulation of semiconductor wafers in IC packaging processes. Targeted at semiconductor fabs and packaging substrate manufacturers.
• Resin Soft Blades (树脂软刀) Resin-bonded soft blades suitable for cutting soft materials like EMC (Epoxy Molding Compound), DFN, QFN, and BGA packages. Targeted at semiconductor IC packaging manufacturers.
• Metal Soft Blades (金属软刀) Metal-bonded soft blades known for high precision, stable cutting quality, long service life, and excellent cost-performance ratio, particularly effective for PCB cutting applications achieving <0.005mm verticality tolerance and <0.02mm cutting size error. Validated by Disco DAD3350 users in PCB cutting. Targeted at PCB and semiconductor packaging manufacturers.
• Electroplated Soft Blades (电镀软刀) Electroplated soft blades featuring ultra-thin design (0.025mm to 0.3mm thickness range) for deep cutting and grooving applications on semiconductor wafers, compound semiconductors, and ceramic substrates. Targeted at semiconductor and advanced materials manufacturers.
• Dicing Blades (划切刀片) Precision cutting blades for wafer dicing, glass cutting, and ceramic substrate cutting applications in semiconductor packaging. Targeted at semiconductor packaging manufacturers and advanced materials processors.
• Grinding Wheels (砂轮) Diamond and CBN grinding wheels for precision grinding of automotive parts, micro-crystalline glass, functional ceramics, and semiconductor materials. Targeted at automotive parts manufacturers, ceramics processors, and advanced materials manufacturers.
• Blade Dressing Plates (修刀板) Blade dressing/truing plates used to pre-condition new blades before installation to achieve better cutting quality and shorter run-in times. Targeted at customers of SSTech's precision cutting blades in semiconductor and PCB manufacturing.

Named customers2 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature3 records

Partnerships

One partnership is on record.

• 北大清华深圳研究院 (Peking University - Tsinghua University Shenzhen Research Institute)coreStrategic or Co-development PartnerDeep industry-university-research collaboration partnership with Peking University and Tsinghua University Shenzhen Research Institutes. The partnership focuses on joint research and development in precision grinding technology and diamond superhard materials applications.

Scale indicators3 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Tokyo Diamond Tools Mfg. Co., Ltd. Japanese specialist in diamond and CBN cutting/grinding tools for electronics, semiconductor, and precision applications; a direct comparable on dicing blade and grinding wheel product categories.
• Disco Corporation: Japan-based global leader in dicing blades and dicing saws for semiconductor packaging; the dominant incumbent SSTech is trying to substitute. Direct overlap in wafer dicing blade products and Disco equipment user base.
• Asahi Diamond Industrial: Japanese manufacturer of diamond and CBN grinding wheels plus dicing blades for electronics, ceramics, and automotive. Closely comparable product portfolio to SSTech across superhard material cutting and grinding.
• Kinik Company: Taiwan-based manufacturer of diamond and CBN grinding wheels, dicing blades, and precision tooling for semiconductor and electronics. Strong geographic and product overlap with SSTech.
• Henan Yicheng New Material Co., Ltd. China-based competitor in diamond superhard materials and precision cutting tools, serving semiconductor, electronics, and new materials customers with overlapping product portfolio.
• Shenzhen Shente Diamond Co., Ltd. China-based domestic peer producing diamond cutting and grinding tools for electronics and semiconductor applications. Directly comparable in localization thesis and product range.
• EHWA Diamond Industrial: Korean manufacturer of diamond tools, including dicing blades and grinding wheels, supplying semiconductor and precision machining customers. Comparable as another Asia-based superhard tool specialist.

Emerging players

• Element Six (De Beers Group): Global supplier of synthetic diamond and superhard materials used in cutting, grinding, and thermal management applications. Upstream materials adjacency to SSTech's core technology, with growing focus on CVD diamond thermal substrates.

Broad incumbents

• 3M (Abrasive Systems Division): Diversified global manufacturer of abrasive products including precision grinding wheels and cutting tools serving semiconductor, automotive, and industrial customers. Overlaps with SSTech in grinding wheel category at scale.
• Saint-Gobain (Surface Conditioning / Abrasives): Global materials group with extensive abrasive and superhard material product lines for industrial grinding and cutting. Comparable at the product-technology level though much broader in scope than SSTech.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds2 records

Investors4 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SSTech