Fasford Technology

What Fasford Technology does

Fasford Technology Co., Ltd. (ファスフォードテクノロジ株式会社) is a Japanese semiconductor manufacturing equipment company specializing in die bonder equipment for back-end semiconductor processes. The company designs, manufactures, and services die bonders used in the production of memory devices, particularly NAND-Flash and LPDRAM found in SD cards, smartphones, SSDs, and mobile PCs. Its product portfolio includes the DB850 Series (high-precision flagship), DB830plus+ Series (2-in-1 DAF/paste process), DB820 (small die bonding), DD100 Series (high-productivity dual lane), and the newly unveiled XERDIA next-generation die bonder (March 2026). Core proprietary technologies include low-stress die pickup (handling dies as thin as 25-50μm) and high-precision stacking enabling up to 16-layer die stacking for memory capacity increase and device miniaturization.

The company originated in 1963 as Ome Electronics Kogyousho Co., Ltd. under Hitachi's Semiconductor Division, passing through Hitachi and Renesas group structures before being spun off as an independent entity in March 2015. In August 2018, it joined FUJI Corporation's corporate group, operating as a strategic subsidiary. Fasford Technology achieved world #1 market share for die bonders in 2005 and has shipped 6,000+ units of 300mm compatible equipment by July 2022, holding a leading position in the memory die bonder segment. The company maintains ISO 9001 (quality) and ISO 14001 (environmental) certifications, has 221 employees as of March 2026, and operates from its headquarters and main manufacturing facility in Minami-Alps City, Yamanashi Prefecture, Japan.

Fasford Technology generates revenue primarily through hardware sales of die bonder machines and after-sales service and repair contracts. Distribution follows a hybrid model: direct sales for domestic Japanese customers and agency distributors internationally, with JIPAL covering Taiwan, China, Singapore, and Malaysia (via 10+ regional offices) and GYL Technology serving as exclusive Korea distributor. The company markets through participation in major global semiconductor exhibitions (SEMICON events across China, Taiwan, Korea, SEA, India, and productronica in Europe) and maintains a multilingual corporate website. Equipment is sold on a quote-based, negotiated enterprise pricing model to semiconductor manufacturers, with no public pricing disclosure.

Name

Fasford Technology

Legal name

Fasford Technology Co., Ltd. (ファスフォードテクノロジ株式会社)

Website

https://fasford-tech.com

Company type

Private

Founded year

2015

Operating status

Operating

Headcount range

101–250 employees

Short description

Fasford Technology Co., Ltd. is a Japanese FUJI Corporation subsidiary that designs, manufactures, and services die bonder equipment for semiconductor back-end manufacturing, primarily serving memory device manufacturers producing NAND-Flash and LPDRAM for consumer electronics.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Die bonder equipment
• Semiconductor manufacturing equipment
• Wafer die bonding
• Memory device packaging
• Back-end semiconductor equipment

Headquarters

HQ city

Minami

HQ country

Japan

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Die Bonder Equipment Sales: Design, manufacturing, and marketing of semiconductor fabrication equipment (die bonders). Primary revenue stream from sale of DB850, DB830plus+, DB820, and DD100 series die bonder machines.
2. After-sales Service and Repair: Repair and servicing of semiconductor fabrication equipment including maintenance contracts and spare parts.

Go-to-market motion1 record

Distribution channels3 records

Marketing channels4 records

Core offering

Fasford Technology designs, manufactures, and services die bonder equipment used in the back-end semiconductor manufacturing process. Its machines handle die pickup, placement, and stacking operations for memory devices (NAND-Flash, LPDRAM) and logic/analog chips, with capabilities including ultra-thin die handling (25-50μm), multi-layer stacking up to 16 layers, and support for both DAF and paste bonding processes. The company also provides after-sales repair, maintenance contracts, and spare parts for its equipment installed at semiconductor fabs worldwide.

Product overview

Fasford Technology is a semiconductor manufacturing equipment company specializing in die bonder (ダイボンダ) equipment for the back-end process of semiconductor manufacturing. The company offers a portfolio of die bonder products including the DB850 Series (high-precision, DB830plus+ successor), DB830plus+ Series (2-in-1 concept supporting both DAF and paste processes), DB820 (small die bonding for paste process), and DD100 Series (high productivity with dual lane technology). The company also announced XERDIA as its next-generation die bonder in 2026. These products serve memory manufacturers producing NAND-Flash and LPDRAM for applications in SD cards, smartphones, SSDs, and mobile PCs. Fasford Technology maintains world-top market share in memory die bonders and operates as a member of the FUJI Group.

Differentiator

Problem solved

Functional benefit

Products and services

• DB850 Series Die Bonder High-precision die bonder series for semiconductor memory device manufacturing. Features 2-in-1 concept supporting both DAF process for stacked die packaging and general-purpose paste process. Includes DB850H model with improved bonding placement accuracy, integrated vision system with position correction, and thin die bonding technology with multi-stage pickup capability. Designed for high-precision stacked die packaging in NAND-Flash and LPDRAM production.
• DB830plus+ Series Die Bonder High-accuracy die bonder with 2-in-1 concept supporting both DAF process for stacked die packaging and general-purpose paste process. Easy switching between direct mode and parallel mode enables flexible production. Available models include DB830plus+D, DB830plus+, DB830plusH, and DB830plusS. Designed for semiconductor manufacturers producing memory and logic devices.
• DB820 Die Bonder Small die bonder based on the DB830plus+ series, targeting paste process applications. Supports ASIC logic and analog products with high-speed small die bonding capability. Achieves stable small die handling down to 0.3mm minimum with high-resolution optical system for precise paste inspection. Also supports DAF process for multi-die stacking.
• DD100 Series Die Bonder High productivity die bonder featuring newly developed Dual pickup & bond head unit and Dual lane for wafer categorization. Supports various production formats and enables different product types on the same line. Single lane model DS100 also available. Combines intermediate stage technology for high quality and high productivity with versatile bonding sequence control and thin die pickup capability.
• XERDIA Next-Generation Die Bonder Next-generation die bonder representing the company's latest technological advancement in semiconductor back-end manufacturing equipment. Unveiled at SEMICON China 2026 for die bonding processes.
• After-Sales Equipment Service and Repair Repair and servicing of semiconductor fabrication equipment including maintenance contracts and spare parts. Provided to semiconductor manufacturers with installed die bonder equipment for ongoing operational support.

Quantifiable outcome

• Die stacking capability of up to 16 layers with 25μm thin dies in mass production
• +1 more outcomes

Named customers2 records

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability1 record

Feature6 records

Partnerships

Five partnerships are on record, tiered minor, strategic, flagship and core.

• RRP Electronics LimitedminorChannel Partner/ Reseller/ Distributor · 2 September 2025RRP Electronics Limited displayed Fasford's DB830plus+ die bonder at their booth during SEMICON INDIA 2025 exhibition, demonstrating the equipment in use at their facility.
• DISCO CorporationstrategicStrategic or Co-development Partner · 29 January 2025Fasford Technology installed DB850H die bonder at DISCO's Mid-Process Research Center in Kumamoto Prefecture to support R&D of DISCO's wafer automatic transport system 'RoofWay'. The collaboration aims to achieve production processes minimizing operator involvement from wafer grinding to dicing processes.
• FUJI CorporationflagshipStrategic or Co-development Partner · 1 August 2018Fasford Technology became part of the FUJI Corporation group in August 2018. FUJI Corporation is a major Japanese manufacturing company, and Fasford Technology operates as a subsidiary within this group structure.
• JIPALcoreChannel Partner/ Reseller/ DistributorJIPAL serves as the primary agency distributor for Fasford Technology in Taiwan, China, Singapore, and Malaysia. They maintain multiple offices across these regions including JIPAL Head Office (Hsinchu), Taichung Office, Kaohsiung Office (Taiwan), JIPAL Shanghai Office, Hong Kong Office, Tianjin Office, Leshan Office, Shenzhen Office, Suzhou Office (China), Singapore Office, and Penang Office (Malaysia).
• GYL Technology Co., Ltd.coreChannel Partner/ Reseller/ DistributorGYL Technology Co., Ltd. serves as the exclusive agency distributor for Fasford Technology in Korea with office in Cheonan.

Scale indicators4 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• Kulicke & Soffa Industries: Diversified semiconductor and LED assembly equipment supplier with a die bonder product line that overlaps with Fasford's offerings. Targets similar memory and logic packaging customers globally with wedge and ball bonding plus die bonder solutions.
• Toray Engineering: Japanese semiconductor equipment manufacturer offering die bonders and other back-end process tools. Competes directly with Fasford in the Japanese and broader Asian markets for memory and logic packaging equipment.
• Hanmi Semiconductor: Korean semiconductor equipment company specializing in die bonders, particularly for HBM memory stacking — a direct competitor to Fasford in the memory die bonding segment where Fasford currently leads in market share.
• Shinkawa (Kaijo / Shinkawa legacy): Japanese die bonder and wire bonder equipment manufacturer targeting memory and logic back-end packaging. Comparable to Fasford in product scope, customer type, and geographic footprint with extensive Japanese heritage.
• BE Semiconductor Industries (Besi): Besi is the global market leader in die bonding equipment and directly competes with Fasford in advanced packaging and memory die bonding. Both companies target logic and memory semiconductor manufacturers with high-precision hybrid bonding and stacking solutions.
• ASMPT (ASMPT Limited): ASMPT is a major direct competitor in die bonder and advanced packaging equipment, serving memory and logic customers globally. Both companies compete on throughput, precision, and support for emerging advanced packaging applications.

Broad incumbents

• FUJI Corporation: Parent company of Fasford Technology and a major Japanese manufacturer of SMT and automation equipment. Comparable as a semiconductor-adjacent industrial equipment manufacturer with complementary product portfolios and shared customer base.
• Yamaha Motor Robotics (YMA): Offers die bonder and surface mount equipment serving semiconductor packaging customers, overlapping with Fasford's product scope. Larger, diversified parent with broader industrial automation capabilities enabling competitive SMD and die bonding solutions.
• DISCO Corporation: Japanese global leader in dicing and grinding equipment, currently a Fasford strategic partner integrating DB850H into its RoofWay wafer transport system. Larger and broader incumbent in adjacent back-end semiconductor processes with overlapping fab customer relationships.

Others

• Amkor Technology: Global OSAT provider that is primarily a customer of die bonding equipment (including Fasford's competitors). Adjacent ecosystem participant — drives demand for die bonder tools but does not directly compete with Fasford.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks7 records

Key highlights7 records

Customer concentration

• Facebookfacebook.com/profile.php
• Instagraminstagram.com/fasfordtech

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Fasford Technology