Logomatic

What Logomatic does

Logomatic GmbH is a German precision grinding machine manufacturer founded in 1974 by Dipl.-Ing. Gerhard Könnemann and headquartered in Mainaschaff, Germany. The company is a subsidiary of the Könnemann Gruppe and specializes in external cylindrical grinding machines designed for hard and brittle semiconductor materials, including Silicon Carbide (SiC), Sapphire, and Silicon. Originally focused on custom grinding solutions for the automotive and aerospace industries, Logomatic pivoted in the late 2000s toward semiconductor and photovoltaic applications, and was restructured in 2019 under current Managing Director Ronny Könnemann to focus on the SiC boule-to-puck grinding workflow.

The company's core product portfolio centers on the Q2 and Q2+ SiC Boule Grinders, complemented by the Surface Grinder RCplus and T501evo models that together implement Logomatic's proprietary ALL-IN-2 modular principle. This principle separates grinding applications to create manufacturing redundancy versus competing "All-in-1" systems. The Q2 and Q2+ machines feature innovative grinding kinematics using specially manufactured (non-conventional 1A1) grinding wheels, in-process measurement technology, body sound sensors for defect detection, a dialog-based Digital Twin HMI, and—on the Q2+—an optional integrated X-ray process and line scanner for automatic quality control. The Q2 won the Red Dot Design Award 2024. Technical specifications include a 2.56 m² footprint (the smallest in class, enabling three units in the space of one competitor) and more than 50% reduction in electricity and water consumption versus modified competitor systems.

Logomatic operates a direct, enterprise-focused sales model targeting semiconductor manufacturers globally. Revenue is generated through one-time capital equipment sales of grinding systems, with each installation valued above €1.5 million based on competitive benchmarks. The company has sold over 100 systems worldwide since founding, suggesting a niche, low-volume, high-value commercial profile. Customer engagement is consultative and technical, with no disclosed distributor or reseller network, and limited public pricing. The company remains privately held within the family-controlled Könnemann Gruppe with no disclosed external funding.

Name

Logomatic

Legal name

logomatic GmbH

Website

https://logomatic.de

Company type

Private

Founded year

1974

Operating status

Operating

Headcount range

11–50 employees

Short description

Logomatic GmbH is a German precision grinding machine manufacturer, founded in 1974 and part of the Könnemann Gruppe, that builds external cylindrical grinding systems (Q2, Q2+) for hard, brittle semiconductor materials including SiC, Sapphire, and Silicon, selling directly to global chip manufacturers.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Machine Tool Manufacturing (333517)

SIC

Metalworkg Machinery & Equipment (3540)

akta.pro primary industry

Grinding, Honing & Superfinishing Equipment (IMAHADAE)

Keywords

• Precision grinding machines
• Cylindrical grinding equipment
• Semiconductor material processing
• Silicon carbide grinding
• Capital equipment manufacturing

Headquarters

HQ city

Mainaschaff

HQ country

Germany

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. Precision Grinding Machine Sales: Logomatic generates revenue from the sale of precision external cylindrical grinding machines (Q2 and Q2+) specifically designed for semiconductor materials processing. These are high-value capital equipment systems sold directly to semiconductor manufacturers. The company also offers the ALL-IN-2 principle combining multiple machine models for comprehensive boule processing.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

Logomatic GmbH manufactures and sells precision external cylindrical grinding machines for the semiconductor industry, with primary focus on processing hard and brittle materials such as Silicon Carbide (SiC), Sapphire, and Silicon. The flagship offerings are the Q2 and Q2+ SiC Boule Grinders, complemented by the Surface Grinder RCplus and T501evo under the company's proprietary ALL-IN-2 modular principle. These high-value capital equipment systems (over 1.5 million EUR per system) are sold directly to semiconductor chip manufacturers for boule-to-puck production with integrated flat and notch functions.

Product overview

Logomatic GmbH is a precision grinding machine manufacturer specializing in cylindrical and surface grinding technology for the semiconductor industry. The company offers a portfolio of grinding machines centered on the Q2 and Q2+ SiC Boule Grinder models, complemented by the Surface Grinder RCplus and T501evo. These machines work together under the company's proprietary ALL-IN-2 principle, which separates grinding applications in the boule-to-puck production process to create manufacturing redundancy. The Q2 serves as the entry-level solution while the Q2+ provides advanced features including in-process scanning and optional X-ray integration.

Differentiator

Problem solved

Functional benefit

Brands

• SiC BOULE GRINDER Q2: Semi-automated, high-precision grinding machine for hard and brittle materials like SiC, sapphire, used in semiconductor industry. Features integrated flat and notch functions for 6 and 8 inch diameter workpieces.
• SiC BOULE GRINDER Q2+
• Surface Grinder RCplus
• T501evo

Products and services

• SiC BOULE GRINDER Q2 Entry-level semi-automated precision external cylindrical grinding machine designed for hard and brittle semiconductor materials such as Silicon Carbide (SiC), Sapphire, and Silicon. Features integrated flat and notch functions for 6-inch and 8-inch diameter workpieces, dialog-based digital twin HMI, in-process measurement technology, body sound sensors for defect detection, and the world's smallest footprint in its class at 2.56 m². Targets semiconductor manufacturers producing SiC boules for power electronics, sapphire components for LED/electronics, and silicon wafers. Won the Red Dot Design Award 2024.
• SiC BOULE GRINDER Q2+ Advanced precision external cylindrical grinding machine extending Q2 capabilities with a new machine bed, innovative notch unit for post-processing of profile depth, line scanner for direct fully automatic quality control, and optional integrated X-ray process for enhanced SiC boule axis accuracy measurement. Provides the highest accuracy among Logomatic's portfolio and is designed to directly compete with All-in-1 grinding systems through the ALL-IN-2 modular principle when combined with the Surface Grinder RCplus or T501evo.
• Surface Grinder RCplus Surface grinding machine used as part of Logomatic's ALL-IN-2 principle for SiC boule processing, combining with the Q2 or Q2+ to provide comprehensive Boule-to-Puck production with manufacturing redundancy instead of relying on a single All-in-1 system.
• T501evo Grinding machine model used in Logomatic's ALL-IN-2 principle for boule processing workflow, providing manufacturing redundancy and competing with All-in-1 grinding systems when combined with the Q2 or Q2+ cylindrical grinder.

Quantifiable outcome

• Electricity and water consumption reduced by over 50% compared to modified competitive products
• +3 more outcomes

Segments1 record

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• Könnemann GroupcoreOthers · 1 January 1974Logomatic GmbH is a subsidiary of the Könnemann Group. Founded in 1974 by Dipl.-Ing. Gerhard Könnemann, the group has evolved from custom grinding machine manufacturing for automotive and aerospace to precision grinding solutions for semiconductor and photovoltaic industries. The group structure provides organizational backing and historical expertise in grinding technology.

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Emerging players

• Revasum: Revasum manufactures silicon carbide and silicon wafer grinding and polishing equipment for the semiconductor industry. It is a focused emerging player in the SiC backend grinding process that competes directly with Logomatic's Q2 product family.
• Kemet International: Kemet manufactures precision lapping and polishing equipment for advanced materials including SiC and sapphire. Its equipment is used in semiconductor and optoelectronics material processing, partially overlapping with Logomatic's focus on hard, brittle materials.

Broad incumbents

• Wolfspeed: Wolfspeed is a leading SiC substrate manufacturer and a major buyer of SiC boule grinding equipment. While not a direct competitor, it is a key customer and ecosystem anchor that validates the market Logomatic serves.
• Buehler (Illinois Tool Works): Buehler is an established broad-line manufacturer of materials preparation and precision grinding/polishing equipment. As part of ITW, it serves R&D and industrial markets with broader scope than Logomatic's semiconductor-focused portfolio.
• Coherent (formerly II-VI): Coherent is a major SiC and compound semiconductor materials manufacturer with significant boule-to-wafer processing needs. It is a representative customer ecosystem player rather than a direct competitor to Logomatic's grinding machines.

Direct peers

• Okamoto Machine Tool Works: Okamoto is a major manufacturer of grinding machines, including surface and profile grinders used in semiconductor and electronics applications. Its precision grinding equipment directly competes with Logomatic's surface and cylindrical grinding machines.
• Mipox Corporation: Mipox produces polishing and grinding products for the semiconductor industry, including SiC wafer polishing films and specialty abrasives. It overlaps with Logomatic in semiconductor material processing consumables and equipment.
• DISCO Corporation: DISCO is the global leader in precision dicing, grinding, and polishing equipment for semiconductors, including SiC wafer back-grinding. It directly competes with Logomatic in semiconductor material grinding and is the most relevant comparable for SiC-related grinding equipment.
• Engis Corporation: Engis specializes in precision grinding, lapping, and polishing equipment for hard and brittle materials including semiconductors and advanced ceramics. It is a direct competitor in the grinding of hard, brittle materials that Logomatic serves.
• ACCRETECH (Tokyo Seimitsu): ACCRETECH manufactures semiconductor production equipment including wafer probing, dicing, and CMP/grinding systems. Its semiconductor machinery portfolio directly overlaps with Logomatic's precision grinding focus for the semiconductor industry.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/log-o-matic

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Logomatic