What Tokyo Seimitsu does

Tokyo Seimitsu Co., Ltd., operating under the brand ACCRETECH, is a Japanese precision equipment manufacturer headquartered in Tokyo and publicly listed on the Tokyo Stock Exchange (TSE: 7729). The company operates two principal divisions: Semiconductor Manufacturing Equipment and Precision Measuring Instruments. The semiconductor equipment division produces dicing machines, probing machines, polish/grinders, high-rigidity grinding machines, CMP equipment, edge grinding machines, slice wafer demounting and cleaning machines, and consumables such as precision cutting blades and grinding stones. The precision measurement division produces 3D coordinate measuring machines, X-ray CT systems, surface roughness and contour measuring systems (both contact and non-contact optical), roundness and cylindrical shape measuring machines, optical shaft shape measuring machines, custom measuring machines, charge-discharge test systems, battery fixtures, and battery evaluation services, alongside sensor products including laser interferometric length meters, non-contact displacement sensors, air/electric micrometers/length meters, and dedicated software.

The company serves semiconductor manufacturers across wafer dicing, probing, polishing/grinding, CMP processing, edge grinding, wafer cleaning, and quality verification applications, as well as precision manufacturing industries requiring high-precision measurement and quality control (3D coordinate measurement, surface roughness, roundness, X-ray CT inspection, optical shaft measurement, laser interferometry). A third, smaller segment addresses battery manufacturers through testing, charge/discharge cycling, and outsourced evaluation services. Technology differentiation centers on proprietary precision engineering in metrology and semiconductor process equipment, with the integration of manufacturing equipment and measurement technology providing end-to-end capabilities for fab and precision-manufacturing customers.

Tokyo Seimitsu generates revenue through direct enterprise sales of capital equipment, supported by a global office and service network spanning Japan, China, Malaysia, Korea, Vietnam, Taiwan, Indonesia (Asia), the United States (Americas), and Germany, France, Hungary, the United Kingdom, Poland, Italy, and Turkey (Europe). Pricing is quote-based and not publicly disclosed. Recurring revenue is reinforced by consumables (precision cutting blades, grinding stones) and aftermarket service. The company operates three wholly-owned Japanese subsidiaries — Tosei Engineering Co., Ltd., Tosei Systems Co., Ltd., and Tokyo Seimitsu Box Co., Ltd. — covering engineering, systems, and manufacturing services.

Name

Tokyo Seimitsu

Legal name

Tokyo Seimitsu Co., Ltd.

Website

https://accretech.jp

Company type

Public

Founded year

1949

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Tokyo Seimitsu (ACCRETECH) is a Japanese precision equipment manufacturer serving semiconductor fabs and industrial manufacturers with semiconductor manufacturing equipment (dicing, probing, grinding, CMP) and precision measuring instruments (3D CMM, X-ray CT, surface roughness, roundness, laser interferometry) globally.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables (334513), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)

SIC

Laboratory Analytical Instruments (3826), Special Industry Machinery (No Metalworking Machinery) (3550), Metalworkg Machinery & Equipment (3540)

akta.pro primary industry

Metrology, Inspection & Process Control Equipment (HDAHAEAH)

akta.pro secondary industries

Metrology, Inspection & Machine Tool Accessories (CMMs, Probing, Gauging) (IMAHADAK), Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

Keywords

• Semiconductor manufacturing equipment
• Precision measuring instruments
• Wafer dicing machines
• Coordinate measuring machines
• Industrial metrology

Headquarters

HQ city

Hachioji

HQ country

Japan

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure

Distribution channels3 records

Marketing channels4 records

Core offering

Tokyo Seimitsu (ACCRETECH) manufactures and sells semiconductor manufacturing equipment including dicing machines, probing machines, polish/grinders, high-rigidity grinding machines, CMP equipment, edge grinding machines, and wafer demounting/cleaning machines. The company also manufactures precision measuring instruments such as 3D coordinate measuring machines, X-ray CT systems, surface roughness and contour measuring systems, roundness/cylindrical shape measuring machines, optical shaft measuring systems, laser interferometers, and non-contact displacement sensors, complemented by battery charge-discharge test systems and battery evaluation services.

Product overview

Tokyo Seimitsu (ACCRETECH) offers two main product divisions: Semiconductor Manufacturing Equipment and Precision Measuring Instruments. The semiconductor equipment division includes dicing machines, probing machines, polish/grinders, high-rigidity grinding machines, CMP devices, edge grinding machines, and slice wafer demounting/cleaning machines, along with consumables like precision cutting blades and grinding stones. The precision measuring instruments division encompasses 3D coordinate measuring machines, X-ray CT devices, surface roughness/contour shape measuring machines (both contact and non-contact), optical shaft shape measuring machines, roundness/cylindrical shape measuring machines, custom measuring machines, charge-discharge test systems, battery fixtures, and battery evaluation services. Both divisions share a common portfolio of sensors including laser interferometric length meters, non-contact displacement sensors, and air/electric micrometers, along with dedicated software and accessories.

Differentiator

Problem solved

Functional benefit

Products and services

• Dicing Machines (ダイシングマシン) Precision dicing machines used in semiconductor wafer singulation during test, assembly, and wafer manufacturing stages.
• Probing Machines (プロービングマシン) Probing machines for semiconductor wafer electrical testing and inspection during wafer manufacturing.
• Polish/Grinders (ポリッシュ・グラインダ) Polishing and grinding equipment for semiconductor wafer surface preparation in wafer manufacturing.
• High-Rigidity Grinding Machines (高剛性研削盤) High-rigidity grinding machines for precision semiconductor wafer processing.
• CMP Devices (CMP装置) Chemical Mechanical Planarization (CMP) equipment for semiconductor wafer surface flattening and finishing.
• Edge Grinding Machines (エッジグラインディングマシン) Edge grinding machines for processing semiconductor wafer edges.
• Slice Wafer Demounting and Cleaning Machines (剥離洗浄機) Equipment for demounting sliced wafers and cleaning semiconductor wafers.
• Precision Cutting Blades (精密切断ブレード) Precision cutting blades used as consumables in semiconductor wafer dicing operations.
• Grinding Stones (研削砥石) Grinding stones used as consumables for precision grinding in semiconductor manufacturing.
• 3D Coordinate Measuring Machines (三次元座標測定機) Three-dimensional coordinate measuring systems for high-precision dimensional inspection of industrial components.
• X-ray CT Devices (X線CT装置) X-ray computed tomography systems for non-destructive internal inspection of components and assemblies.
• Surface Roughness/Contour Shape Measuring Machines (表面粗さ・輪郭形状測定機) Contact-type systems for measuring surface roughness and contour shape on precision components.
• Non-contact Surface Roughness/Contour Shape Measuring Machines (非接触表面粗さ・輪郭形状測定機) Optical non-contact systems for surface roughness and contour shape measurement.
• Optical Shaft Shape Measuring Machines (光学式シャフト形状測定機) Optical measuring systems designed for inspection of shaft-shaped precision components.
• Roundness/Cylindrical Shape Measuring Machines (真円度・円筒形状測定機) Precision systems for measuring roundness and cylindrical shape accuracy of components.
• Custom Measuring Machines (専用測定機) Customized measurement systems tailored to specific customer requirements and applications.
• Charge-Discharge Test Systems (充放電試験システム) Testing systems for evaluating battery charge and discharge characteristics.
• Battery Fixtures (電池治具) Custom fixtures and jigs for battery testing and evaluation.
• Battery Evaluation Services (電池評価受託サービス) Outsourced battery evaluation and testing services performed for customers.
• Laser Interferometric Length Meters (レーザー干渉測長器) High-precision laser interferometer-based length measurement sensors.
• Non-contact Displacement Sensors (非接触変位センサ) Non-contact displacement sensors for precision measurement applications.
• Grinding Machine/Lathe Products (研削盤・旋盤組用製品) Measurement products designed for integration with grinding machines and lathes.
• Machining Center Products (マシニングセンタ用製品) Measurement products for machining center integration.
• Air/Electric Micrometers/Length Meters (空気・電気マイクロメータ/測長器) Air and electric-powered micrometers and length measurement devices.
• Software (ソフトウェア) Software solutions for precision measuring instruments.
• Accessories (アクセサリ) Accessories and peripheral equipment for precision measuring instruments.

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature12 records

Recent moves5 records

Expansion highlights4 records

Direct peers

• FormFactor: FormFactor supplies probe cards and probing systems for semiconductor wafer test, directly competing with Tokyo Seimitsu's probing machines at logic, memory, and advanced-packaging test points.
• Mitutoyo Corporation: Mitutoyo is a Japanese leader in precision metrology — CMMs, surface roughness, roundness, and form-measurement instruments — competing head-to-head with Tokyo Seimitsu's precision measuring instruments division across industrial customers.
• KLA Corporation: KLA is the dominant player in semiconductor process control and inspection, directly comparable to Tokyo Seimitsu's probing machines and other wafer-inspection offerings for fab customers worldwide.
• DISCO Corporation: DISCO is the global leader in precision dicing and grinding equipment for semiconductor wafers — directly competitive with Tokyo Seimitsu's dicing machines, polish/grinders, high-rigidity grinding machines, and edge grinding machines serving the same fab customers.
• Renishaw plc: Renishaw provides high-precision measurement, motion control, and probing systems, competing directly with Tokyo Seimitsu in CMM probing, laser interferometry, and machine-tool measurement sensor markets.

Broad incumbents

• Hexagon AB: Hexagon is a large industrial metrology group (CMMs, optical metrology, software) competing broadly with Tokyo Seimitsu's precision measuring instruments in automotive, aerospace, and general industrial quality-control applications.
• Applied Materials: Applied Materials is the largest diversified semiconductor equipment maker globally. Its CMP and inspection portfolios directly overlap with Tokyo Seimitsu's CMP devices and probing machines, and it sets the benchmark for scale and R&D intensity in the industry.
• Lam Research: Lam Research is a major semiconductor equipment manufacturer focused on etch and deposition, competing for fab capex allocations alongside Tokyo Seimitsu's dicing, probing, and grinding equipment at the same set of global customers.
• Carl Zeiss (ZEISS Industrial Metrology): ZEISS Industrial Metrology offers CMMs, optical and CT-based inspection systems — directly comparable to Tokyo Seimitsu's X-ray CT devices, coordinate measuring machines, and optical/non-contact surface measurement product lines.
• Tokyo Electron (TEL): TEL is a much larger Japanese semiconductor equipment incumbent serving fabs globally across deposition, etch, lithography track, and related areas; while not a direct overlap in dicing or metrology, it competes for the same customer capex dollars and supply-chain slots.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UC3yV3WriCJ6Shaxl6vsD4MA
• LinkedInlinkedin.com/company/accretech

Revenue estimate

Valuation estimate

Number of profiles

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Tokyo Seimitsu