What Skytech does

Skytech (天虹科技股份有限公司, TWSE: 6937) is a Taiwan-based semiconductor equipment manufacturer founded in 2002 and headquartered in Zhubei City, Hsinchu County. The company designs, manufactures, and sells proprietary-brand process equipment for both front-end wafer fabrication and back-end advanced packaging, with core platforms spanning Physical Vapor Deposition (PVD — Nexda, launched 2018), Atomic Layer Deposition (ALD — Atomila, launched 2019), Wafer Bonder & De-Bonder, Descum/Plasma Polish, Single Wafer Load Lock, PVD Carbon (for SiC MOSFET), Powder ALD, and — added in 2025 via the Enspection Technology acquisition — the SkyEU EUV inspection tool. In 2025, Skytech also launched panel-level packaging (PLP) PVD and Descum tools supporting panels up to 310x310mm, directly addressing CoWoS-style advanced packaging demand from AI and high-performance computing. Over 70% of parts and components are sourced locally in Taiwan, and the company holds more than 575 patent applications and 417 granted patents globally.

The company operates a direct enterprise field-sales model targeting global semiconductor foundries, IDMs, memory manufacturers, and compound-semiconductor / SiC-GaN / optoelectronic producers. Revenue is generated primarily through capital-equipment sales (ALD and PVD exceeded 50% of 2024 annual revenue), supplemented by high-value-added spare parts, equipment repair and refurbishment services, semiconductor manpower staffing, and customized monitoring, RAID backup, and wafer-yield-improvement systems (the latter installed in over 30,000 units across 95%+ of semiconductor fab equipment types). Named customers and qualifiers include Apple (ALD supply chain entry, 2021), UMC (Top 16 low-carbon supplier, 2025), and GlobalFoundries (Outstanding Supplier, 2016), with sales and service coverage in Taiwan, Japan (JTCK subsidiary, established October 2025), Singapore, China (Xiamen, Shanghai), the US, and Europe. Skytech completed its TWSE main board IPO in December 2023 at NT$115 per share, achieving a +85% first-day close, and surpassed 150 cumulative tools shipped globally by 2025.

Name

Skytech

Legal name

天虹科技股份有限公司

Website

https://skytech.com.tw

Company type

Public

Founded year

2002

Operating status

Operating

Short description

Skytech is a Taiwan-based, TWSE-listed semiconductor equipment manufacturer (ticker 6937) designing proprietary PVD, ALD, bonding, and EUV inspection tools for global foundries, memory fabs, and compound-semiconductor manufacturers across Asia, the US, and Europe.

Ownership category

akta.pro rank

Product category

Semiconductor Process Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Laboratory Analytical Instruments (3826), Electronic Components, Nec (3679)

akta.pro primary industry

Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)

akta.pro secondary industry

Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

Keywords

• Semiconductor process equipment
• Physical vapor deposition systems
• Atomic layer deposition tools
• Wafer bonding equipment
• EUV inspection tools

Headquarters

HQ city

Hsinchu

HQ country

Taiwan

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Equipment Sales: Skytech designs, manufactures, and sells proprietary-brand semiconductor process equipment including PVD, ALD, Bonder, De-Bonder, Descum, Panel-level PLP, EUV Inspection, Powder ALD, Single Wafer Load Lock, and PVD Carbon tools. Equipment sales constitute the majority of revenue. The company achieved the 100th machine delivery milestone in June 2024.
2. Semiconductor Parts and Components: Skytech produces and supplies high-value-added spare parts for semiconductor equipment, including wafer transfer components, vacuum plasma reaction chamber components, vacuum valves, plasma source systems, electronic systems, and custom ceramic/metal/quartz/engineering plastic components. Over 70% of parts and components are sourced locally in Taiwan.
3. Equipment Parts Repair and Maintenance: Engineering and maintenance services for semiconductor equipment and factory facility valves, including refurbishment, installation, and relocation of used equipment.
4. Semiconductor Manpower Services: Staffing and personnel services for semiconductor manufacturing, including second-hand equipment refurbishment, reinstallation, and relocation services.
5. Custom Equipment Monitoring and Back-up Systems: Custom-designed remote monitoring systems, equipment backup systems (RAID-1 disk arrays installed in over 30,000 sets), and wafer yield improvement systems including N2 purge systems, precision air systems, wafer heater leveling systems, redundant power systems, and CCD image monitoring systems.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels5 records

Core offering

Skytech designs, manufactures, and sells proprietary semiconductor process equipment including Physical Vapor Deposition (PVD), Atomic Layer Deposition (ALD), Wafer Bonder & De-Bonder, Descum/Plasma Polish, Panel-level PVD/Descum, EUV Inspection, Powder ALD, Single Wafer Load Lock, and PVD Carbon tools. The company also provides semiconductor equipment parts repair, custom component manufacturing, and semiconductor manpower services to global semiconductor manufacturers, foundries, and IDMs.

Product overview

Skytech Inc. (天虹科技) is a Taiwan-based semiconductor equipment manufacturer offering a diversified portfolio of proprietary-brand equipment and services for front-end and back-end semiconductor manufacturing. The core product line consists of PVD, ALD, Bonder, De-Bonder, Descum/Plasma Polish, Single Wafer Load Lock, PVD Carbon, and EUV Inspection tools — collectively covering deposition, etching, bonding/debonding, and metrology processes across silicon-based, compound semiconductor, optoelectronic, and advanced packaging applications. Supporting services include customized parts, equipment monitoring and backup systems, wafer yield improvement solutions, equipment repair, and semiconductor manpower services. The company achieved the 100th system delivery milestone in Q2 2024 and launched panel-level packaging (PLP) PVD/Descum and EUV inspection tools in 2025.

Differentiator

Problem solved

Functional benefit

Brands

• Nexda: First PVD (Physical Vapor Deposition) semiconductor wafer manufacturing equipment machine developed by Skytech, launched in 2018.
• Atomila
• SkyEU

Products and services

• PVD Tool (Nexda) Physical Vapor Deposition (PVD) semiconductor wafer manufacturing equipment with up to 6 chamber positions integrated with EFEM, supporting thin-showerhead architecture, ICP, degas, long throw, and in-situ pasting options. Used by semiconductor wafer fabs and IDMs for front-end and back-end processes.
• ALD Tool (Atomila) Atomic Layer Deposition (ALD) semiconductor equipment with up to 6 chamber positions integrated with EFEM, supporting thermal ALD and PEALD modes, with proprietary showerhead design for superior film uniformity. Used by semiconductor manufacturers for advanced node thin-film deposition.
• Bonder Tool Wafer bonding equipment integrated with EFEM, three load ports, two bonder stations, one coater with EBR function, and one pre-bake station; supports wax or glue bonding for GaAs, GaN, LED, and 3DIC applications. Used by semiconductor packaging and compound semiconductor manufacturers.
• De-Bonder Tool Wafer debonding equipment integrated with EFEM, four load ports, two thermal slide debonding stations, one robot/aligner, and one cleaner; can be combined with Bonder as a combo system. Used for GaAs, GaN, LED, and 3DIC advanced packaging applications.
• Powder ALD Tool Atomic Layer Deposition equipment designed for powder/substrate coating applications, featuring special gas flow design to fluidize powder, uniform chamber heating, optional ozone generator, and support for up to 3 precursor/co-precursor lines. Used for quantum dot passivation and powder protection applications.
• Descum / Plasma Polish Tool Dry etching equipment for descum (removing PR/PI residue after development), laser release layer removal, ABF dry etching, and SiC wafer plasma polishing to remove damage layers; supports up to 6 chambers on one transfer chamber. Used by semiconductor manufacturers for etching processes.
• Single Wafer Load Lock
• PVD Carbon Tool PVD carbon (carbon cap) deposition equipment for SiC MOSFET fabrication, preventing silicon sublimation during implanter processing; each system supports up to 6 process chambers integrated with EFEM and SECS/GEM automation. Used by compound semiconductor (SiC) device manufacturers.
• EUV Inspection Tool (SkyEU) Extreme Ultraviolet (EUV) inspection and transmittance/reflectance measurement equipment for EUV mask pellicle and thin-film characterization, using high-order harmonic generation (HHG) for coherent EUV light generation. Used by semiconductor manufacturers for EUV lithography process metrology.
• Panel PVD Tool Physical Vapor Deposition (PVD) equipment designed for panel-level packaging (PLP), supporting flexible panel sizes up to 310x310mm with dual-side processing capability, optional ICP and multi-slot degas configurations. Used by advanced packaging manufacturers for panel-level semiconductor packaging.
• Panel Descum Tool Descum (dry etching) equipment for panel-level packaging, supporting flexible panel sizes up to 310x310mm with up to 6 process gas chambers, dual plasma capability, and SECS/GEM/E84 automation integration. Used by advanced packaging manufacturers for panel-level descum processes.
• Semiconductor Equipment Parts Repair Repair and refurbishment services for semiconductor equipment parts including wafer transfer components, vacuum chamber components (ESC, electrostatic chuck, plasma source), vacuum valves, plasma source systems, and electronic systems. Serves semiconductor manufacturers across Taiwan, Singapore, Malaysia, China, USA, and Europe.
• Semiconductor Manpower Services Semiconductor fab manpower services covering PVD, CVD, Etch, RTP, Wet, and Metrology equipment; also provides used equipment refurbishment, reinstallation, and relocation services. Serves semiconductor fab operators.

Quantifiable outcome

• PVD equipment first order from European customer secured, shipments began August 2024
• +4 more outcomes

Named customers6 records

Segments7 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration2 records

Feature9 records

Partnerships

One partnership is on record.

• Enspection Technology (映思科技)coreTechnology or Integration · 1 June 2025Skytech acquired Enspection Technology through its subsidiary to enter the EUV market and expand into advanced packaging processes similar to CoWoS. This acquisition extends Skytech's technology portfolio to include EUV inspection equipment, supporting the company's strategic expansion into the advanced semiconductor packaging segment driven by AI chip demand.

Scale indicators10 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Jusung Engineering: Korean semiconductor equipment specialist focused on ALD, CVD, and epitaxy. Jusung is a direct peer to Skytech in the ALD equipment space and a comparable Asia-based alternative to Western/Japanese incumbents.
• ULVAC: Japanese manufacturer of vacuum and deposition equipment for semiconductors, flat panel displays, and solar cells. ULVAC's PVD and related thin-film equipment directly competes with Skytech's Nexda PVD system in advanced packaging and display applications.
• ASM International: Specialist in ALD, epitaxy, and PECVD equipment for semiconductor manufacturing. ASM is the closest pure-play ALD competitor globally and represents the most direct technical competition to Skytech's Atomila ALD tool.
• NAURA Technology Group: China's largest semiconductor equipment manufacturer with broad portfolio including PVD, ALD, etch, and cleaning. NAURA is a comparable China-region competitor with similar localization value proposition, though serving different end markets.
• Advanced Micro-Fabrication Equipment (AMEC): China-based semiconductor equipment company specializing in etch and CVD equipment. AMEC represents another Asia-based equipment challenger with similar positioning to Skytech in serving domestic semiconductor ecosystems.
• ACM Research: US-listed semiconductor equipment company specializing in cleaning, PVD, ALD, and ECD equipment. ACM has a comparable profile to Skytech as a non-incumbent equipment challenger with a focus on serving Asia-based semiconductor manufacturers.

Broad incumbents

• SPTS Technologies (KLA): KLA's SPTS division manufactures PVD, CVD, and etch equipment for advanced packaging and MEMS. SPTS is a relevant peer in the advanced packaging equipment space where Skytech is expanding with PLP PVD/Descum tools.
• Tokyo Electron: Major Japanese semiconductor equipment manufacturer with broad portfolio including deposition, etch, and cleaning equipment. TEL is one of the four incumbents (alongside AMAT, Lam, and ASM) that Skytech explicitly cites as the target to displace in the Taiwan market.
• Applied Materials: Global leader in semiconductor manufacturing equipment with dominant share in PVD, CVD, ALD, etch, and inspection. Skytech's leadership team (iron triangle) all came from Applied Materials Taiwan, and Skytech explicitly positions itself as a domestic alternative to Applied Materials in Taiwan.
• Lam Research: Leading semiconductor equipment manufacturer specializing in etch and deposition. Lam is one of the four global incumbents Skytech targets, particularly competing in deposition equipment for memory and logic fabs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries5 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Skytech